CN115579308A - Bonding equipment suitable for multi-size wafers - Google Patents
Bonding equipment suitable for multi-size wafers Download PDFInfo
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- CN115579308A CN115579308A CN202211121444.1A CN202211121444A CN115579308A CN 115579308 A CN115579308 A CN 115579308A CN 202211121444 A CN202211121444 A CN 202211121444A CN 115579308 A CN115579308 A CN 115579308A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Abstract
The invention discloses bonding breaking equipment applicable to multi-size wafers, which comprises a base, wherein a support frame is fixedly arranged at the top of the base, a separation box is fixedly arranged at the top of the support frame, a pressing mechanism is arranged at the top of the support frame, a clamping plate is fixedly arranged at the output end of the pressing mechanism, a groove is formed in the bottom of the clamping plate, a supporting seat is fixedly arranged at the top of the base, a heating plate is arranged at the top of the supporting seat, and an adsorption mechanism and an air drying mechanism are arranged at the top of the base. The bonding glue dissolving agent or the water purification is convenient to let in to the separator box through first feed liquor pipe and second feed liquor pipe to the bonding is separated to the great wafer of size, and washs after separating the bonding, heats the separator box through the hot plate, makes the inside water purification of separator box heat up, to the junction transmission heat of slide glass and wafer, thereby separates the bonding to the less wafer of size, avoids the bonding between the long influence wafer of heat time.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a bonding removing device suitable for wafers with multiple sizes.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the wafer bonding is to combine and fix two chips by chemical and physical actions, after the bonding is completed, the wafer needs to be separated from a carrier for supporting the bottom, and the wafer and the carrier are generally fixed by bonding glue.
However, due to different sizes of the wafers, the same debonding method is easy to increase the scrap rate, and if the wafers are separated from the carrier by dragging, the carrier may scratch the bottom surface of the wafers.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the bonding removing equipment applicable to the wafers with multiple sizes, and solves the problems in the background art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides an applicable bonding equipment of separating in many sizes wafer, includes the base, the top fixed mounting of base has the support frame, the top fixed mounting of support frame has the separator box, the top of support frame is provided with pressing means, pressing means's output fixed mounting has splint, the bottom of splint is seted up flutedly, the top fixed mounting of base has the supporting seat, the top of supporting seat is provided with the hot plate, the top of base is provided with adsorption apparatus and air-drying mechanism, the top fixed mounting of base has puts the thing platform.
Preferably, the inside of separator box is provided with temperature sensor and level sensor, the first feed liquor pipe of fixed plate fixedly connected with and second feed liquor pipe are passed through at the top of separator box, the bottom fixedly connected with drain pipe of separator box, logical groove has been seted up at the top of base, and leads to the below that the groove is located the drain pipe, is convenient for discharge the inside liquid of separator box fast through the drain pipe.
Preferably, pressing means includes first electric putter, sliding sleeve, first motor, threaded rod, slider, connecting rod, the top fixed mounting of support frame has first electric putter, first electric putter's free end has the sliding sleeve through connecting seat fixed mounting, a lateral wall fixed mounting of sliding sleeve has first motor, the output fixedly connected with threaded rod of first motor, the surface thread of threaded rod installs the slider, the preceding lateral wall fixed mounting of slider has the connecting rod.
Preferably, the middle part both sides screw thread of threaded rod is revolved to on the contrary, the quantity of slider is two sets of, and two sets of sliders are the symmetry setting about the threaded rod, the slider is the laminating setting with the inner wall of sliding sleeve, and the two sets of sliders of control of being convenient for stably carry out the relative motion in the sliding sleeve.
Preferably, the supporting seat is located the below of separator box, and the top of hot plate is the laminating setting with the bottom of separator box for the hot plate transmits the heat to the separator box fast.
Preferably, the adsorption mechanism includes vacuum pump, first pipeline, second motor, second electric putter, the top of base is provided with the vacuum pump, the first pipeline of output fixedly connected with of vacuum pump, the free end fixedly connected with second pipeline of first pipeline, the free end of second pipeline is provided with adsorbs the cover, the top fixed mounting of base has the second motor, the output fixedly connected with second electric putter of second motor, second electric putter is the fixed connection setting through spacing ring and second pipeline, and the control of being convenient for adsorbs the cover and removes, takes out the wafer.
Preferably, air-dry mechanism includes bellows, protection network, fan, third pipeline, the top fixed mounting of base has bellows, the protection network is installed to the preceding lateral wall of bellows inlays, the inside of bellows is provided with the fan, the back lateral wall fixedly connected with third pipeline of bellows.
Preferably, first pipeline is soft pipeline, avoids first pipeline to influence the operation of second electric putter and second motor, second pipeline and third pipeline are the stereoplasm pipeline, and first pipeline, second pipeline and third pipeline surface all are provided with the valve, are convenient for regulate and control opening and shutting of first pipeline, second pipeline, third pipeline.
Compared with the prior art, the invention has the beneficial effects that: this be applicable in bonding equipment that separates of many sizes wafer, through temperature sensor and level sensor real-time supervision separating box in the temperature and the liquid level height of solution, thereby control solution submergence slide glass and the junction of wafer just, be convenient for let in bonding glue dissolving agent or water purification to the separating box through first feed liquor pipe and second feed liquor pipe, thereby to the bonding is separated to the great wafer of size, and wash after the bonding is separated, drive the sliding sleeve through first electric putter and remove, and drive the threaded rod through first motor and rotate, the threaded rod drives the threaded rod and slides in the sliding sleeve, thereby control two sets of splint to remove, carry out centre gripping fixed and press spacing to the slide glass of equidimension not, heat the separating box through the hot plate, make the inside water purification of separating box heat up, to the junction transmission slide glass heat of slide glass and wafer, thereby to the bonding is separated to the less wafer, avoid heating the overlength to influence the bonding between the wafer, the air flow is pumped through the vacuum pump, make the adsorption cover of second pipeline department adsorb the wafer and fix the wafer, and lead to the lifting to the second electric push rod to the slide glass, thereby make the thing to air-drying by the air-blowing platform, make the wafer air-drying under the wafer stably, make the fish tail.
Drawings
FIG. 1 is a schematic diagram of an isometric configuration of the present invention;
FIG. 2 is a side view of the present invention;
FIG. 3 is a first partial cross-sectional structural view of the present invention;
fig. 4 is a second partial sectional structural schematic view of the present invention.
In the figure: 1. a base; 2. a support frame; 3. a separation tank; 4. a temperature sensor; 5. a liquid level sensor; 6. a first liquid inlet pipe; 7. a second liquid inlet pipe; 8. a liquid outlet pipe; 9. a first electric push rod; 10. a sliding sleeve; 11. a first motor; 12. a threaded rod; 13. a slider; 14. a connecting rod; 15. a splint; 16. a groove; 17. a supporting seat; 18. heating plates; 19. a vacuum pump; 20. a first conduit; 21. a second conduit; 22. a second motor; 23. a second electric push rod; 24. a placing table; 25. an air box; 26. a protective net; 27. a fan; 28. a third conduit.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Example (b): referring to fig. 1-4, a bonding removal device suitable for multi-size wafers comprises a base 1, a support frame 2 is fixedly installed at the top of the base 1, a separation box 3 is fixedly installed at the top of the support frame 2, a temperature sensor 4 and a liquid level sensor 5 are arranged inside the separation box 3, the temperature and the liquid level height of a solution in the separation box 3 are monitored in real time through the temperature sensor 4 and the liquid level sensor 5, so that the solution just submerges the connection part of a slide glass and the wafer, the top of the separation box 3 is fixedly connected with a first liquid inlet pipe 6 and a second liquid inlet pipe 7 through a fixing plate, a bonding glue dissolving agent or purified water is conveniently introduced into the separation box 3 through the first liquid inlet pipe 6 and the second liquid inlet pipe 7, so that bonding removal is performed on the wafer with a larger size, cleaning is performed after the bonding removal, a liquid outlet pipe 8 is fixedly connected to the bottom of the separation box 3, the top of the base 1 is provided with a through groove which is positioned below the liquid outlet pipe 8 and facilitates the rapid discharge of liquid inside the separation box 3 through the liquid outlet pipe 8, the top of the support frame 2 is provided with a pressing mechanism, the pressing mechanism comprises a first electric push rod 9, a sliding sleeve 10, a first motor 11, a threaded rod 12, a sliding block 13 and a connecting rod 14, the top of the support frame 2 is fixedly provided with the first electric push rod 9, the free end of the first electric push rod 9 is fixedly provided with the sliding sleeve 10 through a connecting seat, one side wall of the sliding sleeve 10 is fixedly provided with the first motor 11, the output end of the first motor 11 is fixedly connected with the threaded rod 12, the thread turning directions of two sides of the middle part of the threaded rod 12 are opposite, the surface threads of the threaded rod 12 are provided with the sliding blocks 13, the number of the sliding blocks 13 is two, the two groups of sliding blocks 13 are symmetrically arranged about the threaded rod 12, and the sliding blocks 13 are arranged in a fit with the inner wall of the sliding sleeve 10, the slide clamping mechanism is convenient to control two groups of sliders 13 to stably move in the sliding sleeve 10 in the opposite direction, a connecting rod 14 is fixedly installed on the front side wall of each slider 13, a clamping plate 15 is fixedly installed at the output end of the pressing mechanism, the sliding sleeve 10 is driven to move through a first electric push rod 9, a threaded rod 12 is driven to rotate through a first motor 11, the threaded rod 12 drives the sliders 13 to slide in the sliding sleeve 10, so that the two groups of clamping plates 15 are controlled to move, slides with different sizes are clamped and fixed and limited in pressing, a groove 16 is formed in the bottom of each clamping plate 15, a supporting seat 17 is fixedly installed at the top of the base 1, a heating plate 18 is arranged at the top of each supporting seat 17, the supporting seats 17 are located below the separation box 3, the top of each heating plate 18 is attached to the bottom of the separation box 3, the heating plates 18 are used for rapidly transferring heat to the separation box 3, the separation box 3 is heated through the heating plates 18, and the purified water in the separation box 3 is heated, the heat is transferred to the joint of the slide glass and the wafer, so as to perform debonding on the wafer with smaller size, and avoid the influence of overlong heating time on bonding between the wafers, the top of the base 1 is provided with an adsorption mechanism and an air drying mechanism, the adsorption mechanism comprises a vacuum pump 19, a first pipeline 20, a second pipeline 21, a second motor 22 and a second electric push rod 23, the top of the base 1 is provided with the vacuum pump 19, the output end of the vacuum pump 19 is fixedly connected with the first pipeline 20, the free end of the first pipeline 20 is fixedly connected with the second pipeline 21, the free end of the second pipeline 21 is provided with an adsorption cover, the top of the base 1 is fixedly provided with the second motor 22, the output end of the second motor 22 is fixedly connected with the second electric push rod 23, the second electric push rod 23 is fixedly connected with the second pipeline 21 through a limiting ring, so as to control the movement of the adsorption cover, the wafer is taken out, the air drying mechanism comprises an air box 25, a protective net 26, a fan 27 and a third pipeline 28, the air box 25 is fixedly installed at the top of the base 1, the protective net 26 is installed on the front side wall of the air box 25 in an embedded mode, the fan 27 is arranged inside the air box 25, the third pipeline 28 is fixedly connected to the rear side wall of the air box 25, the first pipeline 20 is a soft pipeline, the first pipeline 20 is prevented from influencing the operation of the second electric push rod 23 and the second motor 22, the second pipeline 21 and the third pipeline 28 are both hard pipelines, the surfaces of the first pipeline 20, the second pipeline 21 and the third pipeline 28 are both provided with valves, the first pipeline 20 is convenient to regulate and control, the second pipeline 21 and the third pipeline 28 are opened and closed, air flows through the fan 27, air is dried on the wafer through the third pipeline 28, the object placing table 24 is fixedly installed at the top of the base 1, air flows through the vacuum pump 19, the adsorption cover at the position of the second pipeline 21 adsorbs and fixes the wafer, the wafer is lifted by the second electric push rod 23, the second motor 22 enables the second push rod 23 to rotate, the wafer is prevented from being scratched and moving to the wafer placing table 24, and the wafer is prevented from being moved to the wafer loading table.
The electrical components in the document are electrically connected with an external master controller and 220V mains supply, and the master controller can be a computer or other conventional known devices for playing a role in control.
When in use: a worker places a slide glass and a wafer into a separation box 3, drives a sliding sleeve 10 to move through a first electric push rod 9, drives a threaded rod 12 to rotate through a first motor 11, the threaded rod 12 drives a sliding block 13 to slide in the sliding sleeve 10, so that two groups of clamping plates 15 are controlled to move, the slide glass is attached to the inner portion of a groove 16 of each clamping plate 15, clamping, fixing and pressing limiting are carried out on slide glasses with different sizes, if the size of the wafer is small, purified water is introduced into the separation box 3, a liquid level sensor 5 detects the liquid level height, the separation box 3 is heated through a heating plate 18, the purified water in the separation box 3 is heated, heat is transferred to the joint of the slide glass and the wafer, a temperature sensor 4 detects the water temperature in real time, the wafer is rapidly debonded, and the wafer is separated from the slide glass, and liquid is discharged through a liquid outlet pipe 8, air flow is pumped through the vacuum pump 19, so that the adsorption cover at the position of the second pipeline 21 adsorbs and fixes the wafer, the second pipeline 21 is lifted through the second electric push rod 23, the second electric push rod 23 rotates through the second motor 22, the wafer is taken down from the top of the slide glass, the bottom surface of the wafer is prevented from being scratched, the wafer is stably moved onto the object placing table 24, the fan 27 is started to blow air flow, air is dried on the object placing table 24 through the third pipeline 28, if the size of the wafer is large, a bonding glue dissolving agent is introduced into the separation box 3, the wafer is soaked for a long time until being bonded, after the wafer is separated from the slide glass, the bonding glue dissolving agent is discharged, purified water is introduced for cleaning, and after waste water is discharged, the wafer is moved onto the object placing table 24 and is dried.
To sum up, this be applicable in bonding equipment that separates of many sizes wafer, through temperature sensor 4 and level sensor 5 real-time supervision separating box 3 in the temperature and the liquid level height of solution, thereby control solution submergence slide glass and the junction of wafer just, be convenient for let in bonding glue dissolving agent or pure water to separating box 3 through first feed liquor pipe 6 and second feed liquor pipe 7, thereby to the bonding is separated to the wafer that the size is great, and wash after the bonding is separated, drive sliding sleeve 10 through first electric putter 9 and remove, and drive threaded rod 12 through first motor 11 and rotate, threaded rod 12 drives slider 13 and slides in sliding sleeve 10, thereby control two sets of splint 15 and remove, carry out centre gripping fixed and press spacing to the slide glass of equidimension not, heat separating box 3 through hot plate 18, make separating box 3 inside intensification, to the junction transfer the heat of slide glass and wafer, thereby to the bonding is separated to the wafer that the size is less wafer, avoid heating the time to influence the bonding between the wafer, draw air flow through vacuum pump 19, make the absorption cover of second pipeline 21 department adsorb the wafer fixed, and air-dry to the wafer through second push rod 23, make the air-blow air slide glass by second electric putter and remove the air drying the wafer 24, thereby the air-blowing air pipeline 24, thereby the wafer is solved the problem of moving the wafer and is removed the air-drying the wafer and is solved the wafer and is carried out the air-drying technology and is carried out the air-drying problem by the second air-slide glass by the second air slide glass, thereby the second air slide glass 21, thereby the wafer bottom surface 23, thereby the air-drying technology is carried out the air-carrying out the air-off technology and is carried out the wafer, thereby the wafer is carried out the air-off technology is carried out the problem of the air-drying technology is solved.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides an applicable bonding equipment of separating in many sizes wafer, includes base (1), its characterized in that, the top fixed mounting of base (1) has support frame (2), the top fixed mounting of support frame (2) has separator box (3), the top of support frame (2) is provided with pressing means, pressing means's output fixed mounting has splint (15), splint (15) are seted up to the bottom has recess (16), the top fixed mounting of base (1) has supporting seat (17), the top of supporting seat (17) is provided with hot plate (18), the top of base (1) is provided with adsorption apparatus and air-drying mechanism, the top fixed mounting of base (1) has puts thing platform (24).
2. The debonding and bonding apparatus applicable to wafers of multiple sizes according to claim 1, wherein a temperature sensor (4) and a liquid level sensor (5) are disposed inside the separation box (3), the top of the separation box (3) is fixedly connected with a first liquid inlet pipe (6) and a second liquid inlet pipe (7) through a fixing plate, the bottom of the separation box (3) is fixedly connected with a liquid outlet pipe (8), the top of the base (1) is provided with a through groove, and the through groove is located below the liquid outlet pipe (8).
3. The debonding apparatus applicable to multi-size wafers of claim 1, characterized in that the pressing mechanism includes a first electric push rod (9), a sliding sleeve (10), a first motor (11), a threaded rod (12), a slider (13), and a connecting rod (14), the top fixed mounting of the support frame (2) has the first electric push rod (9), the free end of the first electric push rod (9) has the sliding sleeve (10) through a connecting seat fixed mounting, a side wall fixed mounting of the sliding sleeve (10) has the first motor (11), the output end fixed connection of the first motor (11) has the threaded rod (12), the surface thread of the threaded rod (12) is installed with the slider (13), and the front side wall fixed mounting of the slider (13) has the connecting rod (14).
4. The debonding and bonding apparatus applicable to multi-sized wafers according to claim 3, wherein the thread directions of the two sides of the middle portion of the threaded rod (12) are opposite, the number of the sliding blocks (13) is two, the two sets of sliding blocks (13) are symmetrically disposed about the threaded rod (12), and the sliding blocks (13) are attached to the inner wall of the sliding sleeve (10).
5. The debonding apparatus for wafers with different sizes according to claim 1, wherein the supporting base (17) is located below the separation box (3), and the top of the heating plate (18) is attached to the bottom of the separation box (3).
6. The debonding apparatus applicable to multi-size wafers according to claim 1, wherein the adsorption mechanism includes a vacuum pump (19), a first pipeline (20), a second pipeline (21), a second motor (22), and a second electric push rod (23), the vacuum pump (19) is disposed at the top of the base (1), the first pipeline (20) is fixedly connected to the output end of the vacuum pump (19), the second pipeline (21) is fixedly connected to the free end of the first pipeline (20), the adsorption cover is disposed at the free end of the second pipeline (21), the second motor (22) is fixedly mounted at the top of the base (1), the second electric push rod (23) is fixedly connected to the output end of the second motor (22), and the second electric push rod (23) is fixedly connected to the second pipeline (21) through a limit ring.
7. The debonding apparatus applicable to multi-sized wafers according to claim 6, wherein the air drying mechanism comprises a bellows (25), a protective net (26), a fan (27) and a third pipeline (28), the bellows (25) is fixedly mounted at the top of the base (1), the protective net (26) is mounted on a front side wall of the bellows (25) in an embedded manner, the fan (27) is disposed inside the bellows (25), and the third pipeline (28) is fixedly connected to a rear side wall of the bellows (25).
8. The debonding apparatus applicable to multiple-size wafers according to claim 7, wherein the first pipe (20) is a soft pipe, the second pipe (21) and the third pipe (28) are both hard pipes, and valves are disposed on the surfaces of the first pipe (20), the second pipe (21) and the third pipe (28).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211121444.1A CN115579308A (en) | 2022-09-15 | 2022-09-15 | Bonding equipment suitable for multi-size wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211121444.1A CN115579308A (en) | 2022-09-15 | 2022-09-15 | Bonding equipment suitable for multi-size wafers |
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| Publication Number | Publication Date |
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| CN115579308A true CN115579308A (en) | 2023-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211121444.1A Pending CN115579308A (en) | 2022-09-15 | 2022-09-15 | Bonding equipment suitable for multi-size wafers |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117293063A (en) * | 2023-11-22 | 2023-12-26 | 迈为技术(珠海)有限公司 | Wafer debonding apparatus and debonding method |
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2022
- 2022-09-15 CN CN202211121444.1A patent/CN115579308A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117293063A (en) * | 2023-11-22 | 2023-12-26 | 迈为技术(珠海)有限公司 | Wafer debonding apparatus and debonding method |
| CN117293063B (en) * | 2023-11-22 | 2024-03-08 | 迈为技术(珠海)有限公司 | Wafer debonding apparatus and debonding method |
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