CN205406498U

CN205406498U - Wafer etching apparatus

Info

Publication number: CN205406498U
Application number: CN201620238587.4U
Authority: CN
Inventors: 蒋新; 施利君; 窦福存
Original assignee: Suzhou Kzone Equipment Technology Co Ltd
Current assignee: Suzhou Kzone Equipment Technology Co Ltd
Priority date: 2016-03-25
Filing date: 2016-03-25
Publication date: 2016-07-27
Anticipated expiration: 2026-03-25

Abstract

The utility model relates to a wafer etching apparatus, it includes material loading subassembly, sculpture subassembly, washing subassembly, air -dry subassembly and the unloading subassembly that sets gradually, the material loading subassembly is corresponding with the structure of unloading subassembly, but the material loading subassembly including the slide track seat of oscilaltion, install the slidable fixing base on the slide track seat, install wafer clamping on the fixing base, set up in the transmission roller of wafer clamping one side, with the transmission roller be connected be used for driving its pivoted drive mechanism and be used for with wafer in the wafer clamping get to the epaxial arm mechanism of driving roller. Automatic material loading subassembly and the unloading subassembly of going up the unloading is adopted, automated production can be realized through adjusting technological parameter, need not carry the wafer midway, the security is high, sculpture subassembly, washing subassembly, air -dry the subassembly with each process separately, can not influence mutually, technological efficiency is good, simple structure, maintain easily, low in manufacturing cost.

Description

A kind of wafer etching apparatus

Technical field

The invention belongs to field of semiconductor processing, relate to a kind of etching apparatus, more particularly to a kind of wafer etching apparatus.

Background technology

Wafer refers to the silicon wafer used by silicon semiconductor production of integrated circuits, owing to it is generally circular in shape, therefore is called wafer.Various circuit component structure can be manufactured on silicon, and become the IC product having certain electric sexual function, be widely used in modern various electronic.

In wafer manufacturing process, after exposed and developed, when ensuing etching work procedure adopts wet method, it is adopt Fluohydric acid. (HF) buffer solution to remove not protected SiO₂Aspect, then in later process, form circuit.This procedure current market is generally employing single-wafer etching apparatus, by mechanical hand feeding, wafer adsorption at rotation platform, is sequentially completed etching, clean, dry, then by mechanical hand rewinding, equipment structure is complicated, cost is high, production capacity is low to cause whole.

Summary of the invention

This utility model is in order that overcome the deficiencies in the prior art and a kind of wafer etching apparatus.

For reaching above-mentioned purpose, the technical solution adopted in the utility model is: a kind of wafer etching apparatus, it includes the loading assemblies set gradually, etching assembly, washing component, air-dry assembly and blanking assembly, loading assemblies is corresponding with the structure of blanking assembly, described loading assemblies includes can the slide track seat of oscilaltion, it is slidably mounted in the fixing seat on described slide track seat, it is arranged on the wafer clip on described fixing seat, it is arranged at the transmission roll shaft of described wafer clip side, it is connected with described transmission roll shaft for driving the drive mechanism of its rotation and the mechanical arm mechanism for being taken by the wafer in described wafer clip to described transmission roll shaft.

Optimally, described etching assembly include the first cell body, be arranged on described first cell body in and first conveying roller axially corresponding with described live-roller, the least one set liquid cutter being arranged in described first cell body, least one set jet pipe and least one set the first Air knife mechanism and the processing solution tank that is connected with described first cell body and described liquid cutter respectively.

Further, described jet pipe is installed in rotation in described first cell body by swing mechanism.

Further, eccentric that the swing arm that described swing mechanism includes being arranged on described jet pipe connector, the drive link being arranged on described connector are connected with described drive link end phase pivot is connected with described swing arm end phase pivot and the rotary actuator being connected with described eccentric.

Further, described washing component includes the second cell body, be arranged on described second cell body in and second conveying roller axially corresponding with described live-roller, the many groups sparge pipe group being arranged in described second cell body and many groups the second Air knife mechanism and the lower groove that connect corresponding with the described sparge pipe group of many groups respectively, described lower groove is made up of multiple grading overflow unit being arranged in series.

Further, described air-dry assembly includes the 3rd cell body and is arranged in described 3rd cell body and threeth conveying roller axially corresponding with described live-roller and be arranged on many groups of the 3rd Air knife mechanisms in described 3rd cell body.

Further, it also includes sewer pipe and water inlet pipe, and described sewer pipe is all connected with described processing solution tank and described lower groove with water inlet pipe.

Further, it also includes the air inlet pipe that is connected respectively with described first Air knife mechanism, described second Air knife mechanism and described 3rd Air knife mechanism.

Optimally, it also includes covering at the outer housing outside described loading assemblies, etching assembly, washing component, air-dry assembly and blanking assembly.

Owing to technique scheme is used, this utility model compared with prior art has the advantage that this utility model wafer etching apparatus, adopts loading assemblies and the blanking assembly of automatic loading/unloading, can realize automated production by regulating technological parameter；Wafer need not be carried in midway, and safety is high；Etching assembly, washing component, air-dry assembly by each operation separately, will not interact, technological effect is good, simple in construction, easily safeguard, low cost of manufacture.

Accompanying drawing explanation

Accompanying drawing 1 is the structural representation of this utility model wafer etching apparatus；

Accompanying drawing 2 is the structural representation of this utility model wafer etching apparatus loading assemblies；

Accompanying drawing 3 is the structural representation of this utility model wafer etching apparatus swing mechanism；

Wherein, 1, loading assemblies；10, the 4th cell body；11, slide track seat；12, fixing seat；13, wafer clip；14, transmission roll shaft；15, drive mechanism；151, driving shaft；152, transmission band；153, guide roller；16, mechanical arm mechanism；17, elevating mechanism；171, vertical rod；172, gripper shoe；173, cylinder；2, etching assembly；21, the first cell body；22, the first conveying roller；23, processing solution tank；24, jet pipe；25, liquid cutter；26, the first Air knife mechanism；27, swing mechanism；271, connector；272, drive link；273, swing arm；274, eccentric；275, rotary actuator；3, washing component；31, the second conveying roller；32, sparge pipe group；33, lower groove；331, overflow unit；34, the second Air knife mechanism；4, air-dry assembly；41, the 3rd cell body；42, the 3rd conveying roller；43, the 3rd Air knife mechanism；5, blanking assembly；6, sewer pipe；7, water inlet pipe；8, air inlet pipe；9, outer housing.

Detailed description of the invention

Below in conjunction with accompanying drawing, this utility model preferred embodiment is described in detail:

Wafer etching apparatus as shown in Figure 1, mainly includes the parts such as loading assemblies 1, etching assembly 2, washing component 3, air-dry assembly 4 and blanking assembly 5.

Wherein, loading assemblies 1 is as in figure 2 it is shown, include the mechanisms such as slide track seat 11, fixing seat 12, wafer clip 13, transmission roll shaft 14, drive mechanism 15 and mechanical arm mechanism 16.Slide track seat 11 can realize oscilaltion by elevating mechanism 17, elevating mechanism 17 adopts the technology of routine, as it can include vertical rod 171, gripper shoe 172, cylinder 173 and fixing plate etc., cylinder 173 is adopted to drive the fixing plate relative support plate 172 being fixed on vertical rod 171 upper end to move up and down.Fixing seat 12 is slidably mounted on slide track seat 11, adopt conventional technology, as arranged the structure matched with slide track seat 11 on fixing seat 12, and the driving structure being connected with fixing seat 12 can be installed on fixing plate, thus pulling fixing seat 12 to slidably reciprocate on slide track seat 11, and drive structure that the parts such as cylinder can be set according to actual needs.Wafer clip 13 is removably mounted on fixing seat 12 (as being arranged on fixing seat 12 by air-actuated jaw), is used for placing more wafers (adjacent wafer interval is arranged, to leave the work space of mechanical arm mechanism 16)；It has two, a preparation and a use, so only needs manually to be placed on loading assemblies 1 by the wafer clip 13 of storing wafer.Transmission roll shaft 14 is arranged at the side (i.e. the downstream of wafer clip 13, it and mechanical arm mechanism 16, drive mechanism 15 are arranged in the 4th cell body 10) of wafer clip 13, is used for driving wafer move downstream；In the present embodiment, transmission roll shaft 14 is divided into spaced two groups (often organize and all comprise multiple transmission roll shaft 14 according to actual needs)；Mechanical arm mechanism 16 is then arranged between two groups of transmission roll shafts 14, and it includes arm for taking material and driving mechanism, and driving mechanism can drive arm for taking material to make it put in wafer clip 13, and after driving it to rise, feeding, retrogressing decline and can be placed on transmission roll shaft 14 by wafer 7.Drive mechanism 15 is connected with transmission roll shaft 14, for driving the rotation of transmission roll shaft 14, the driving shaft 151(driving shaft 151 that it includes being meshed with transmission roll shaft 14 is perpendicular with transmission roll shaft 14, they can be meshed by angular wheel), motor (not shown), connect the transmission of driving shaft 151 and motor with 152 and with transmission with 152 guide rollers 153 matched, guide roller 153 is additionally operable to ensure that transmission keeps suitable tension force with 152, it is possible to control the speed of wafer downstream by controlling the rotating speed of motor.Blanking assembly 5 is substantially similar with the structure of loading assemblies 1, feeding after its arm for taking material rising, advances, declines, is placed on by wafer in wafer clip, then retreats to home position；Elevating mechanism drives wafer clip to decline, and will vacate position successively for storing wafer, when wafer card clamps full, moves empty wafer clip to rewinding position, for continuing rewinding；Manually can take down the wafer clip of full material, load onto sky.

Etching assembly 2 mainly includes the parts such as first cell body the 21, first conveying roller 22, processing solution tank 23, jet pipe 24 and liquid cutter 25.First conveying roller 22 is by multiple or/and many groups, and they are arranged in the first cell body 21 and with transmission roll shaft 14 to corresponding (being in same level height), and the rotating manner of the first conveying roller 22 is consistent with the rotating manner of transmission roll shaft 14 in loading assemblies 1.Jet pipe 24(it have multiple nozzle separately above) have at least one group, be installed in rotation in the first cell body 21 by swing mechanism 27, to form equally distributed liquid stream to crystal column surface, complete etching technics；In the present embodiment, swing mechanism 27 includes connector 271, drive link 272, swing arm 273, eccentric 274 and rotary actuator 275, connector 271 correspondence is arranged on jet pipe 24, drive link 272 is arranged on connector 271 to drive its synchronous axial system, swing arm 273 is connected with drive link 272 end phase pivot, eccentric 274 is connected with swing arm 273 end phase pivot, rotary actuator 275 is connected with eccentric 274, so utilize rotary actuator 275 to drive eccentric 274 to rotate, and then drive swing arm 273 swings back and forth and finally realizes the swing of jet pipe 24.Liquid cutter 25 has at least one group, and in the present embodiment, it is two groups and is separately positioned on the upstream and downstream of jet pipe 24, to form uniform water layer, promotes etching uniformly.First Air knife mechanism 26 also has at least one group, in the present embodiment, it is two groups and is arranged on the upstream of one group of liquid cutter 25 and the downstream (as it is shown in figure 1, being defined according to the conveying direction of wafer about the concept of upstream and downstream in this patent) of another liquid cutter 25；First Air knife mechanism 26 includes air knife, pipeline and control valve, to form uniform gas curtain, stops that the medicinal liquid of crystal column surface flow in adjacent assembly.Processing solution tank 23 is positioned at the lower section of the first cell body 21, it is connected with the first cell body 21, jet pipe 24 and liquid cutter 25 respectively, importing in liquid cutter 25 and jet pipe 24 by pumping and pipeline by medicinal liquid on the one hand, the medicinal liquid after etching is back in processing solution tank 23 from the first cell body 21 on the other hand；Processing solution tank 23 is provided with heater, cooler pan, temperature sensor and liquid in-out pipeline, and heater, cooler pan and temperature sensor can control the temperature of medicinal liquid under the drive of automatic control module；Liquid in-out pipeline is used for inputting medicinal liquid, tap water and discharge medicinal liquid.In the present embodiment, it is possible on the first cell body 21, connect air draft pipeline, its interior steam is extracted out, forms negative pressure, it is prevented that gas leak.

The 26S Proteasome Structure and Function that washing component 3 includes second cell body the 30, second conveying roller 31, sparge pipe group the 32, second Air knife mechanism 34, the second conveying roller 31 and the structure of the second Air knife mechanism 34 corresponding with etching assembly 2 is similar.Sparge pipe group 32 has many groups, and is correspondingly arranged up and down it is thus possible to the upper and lower surface of wafer is sprayed water；It can also be arranged to shuttle-type according to the structure of jet pipe 24.Lower groove 33 is connection corresponding with many group sparge pipe groups 32 respectively, it includes multiple (in the present embodiment being 3, it is with sparge pipe group 32 one_to_one corresponding) the grading overflow unit 331 that is arranged in series, the overflow height of grading overflow unit 331 is incremented by successively, the grading overflow unit 331 that overflow height is the highest is connected with the sparge pipe group 32 of most downstream, cleaning degree in road after guarantee, cleaning performance is good.

Air-dry assembly 4 includes the 3rd cell body the 41, the 3rd conveying roller 42 and the 3rd Air knife mechanism 43, and the 26S Proteasome Structure and Function that the 3rd cell body the 41, the 3rd conveying roller 42 is corresponding with etching assembly 2 with the structure of the 3rd Air knife mechanism 43 is similar.Corresponding quantity can be selected according to the actual needs with general knowledge known in this field, and the position of correspondence is set.

In the present embodiment, wafer etching apparatus also includes sewer pipe 6, water inlet pipe 7 and feed tube (namely above-mentioned liquid in-out pipeline), they are connected with processing solution tank 23, lower groove 33 respectively, so that etching assembly 2 and washing component 3 share same liquid in-out pipeline, simplify structure, it is simple to centralized and automatic controls.First Air knife mechanism the 26, second Air knife mechanism 34 is connected with same air inlet pipe 8 with the 3rd Air knife mechanism 43, so can be supplied by central compressed air, form uniform gas curtain, blow the water of crystal column surface off, is conducive to simplifying structure, it is simple to centralized and automatic controls.Above-mentioned all structures can be connected with controller, thus realizing the Automated condtrol of wafer etching apparatus.Owing to etching assembly 2 needing corrosive chemicals HF, it is therefore desirable to arrange outer housing 9 outside loading assemblies 1, etching assembly 2, washing component 3, air-dry assembly 4 and blanking assembly 5, to guarantee the safety of production environment.

Above-described embodiment is only for illustrating technology of the present utility model design and feature; its object is to allow person skilled in the art will appreciate that content of the present utility model and to implement according to this; protection domain of the present utility model can not be limited with this; all equivalences made according to this utility model spirit change or modify, and all should be encompassed within protection domain of the present utility model.

Claims

null1. a wafer etching apparatus，It includes the loading assemblies (1) set gradually、Etching assembly (2)、Washing component (3)、Air-dry assembly (4) and blanking assembly (5)，Described loading assemblies (1) is corresponding with the structure of described blanking assembly (5)，It is characterized in that: described loading assemblies (1) includes can the slide track seat (11) of oscilaltion、It is slidably mounted in the fixing seat (12) on described slide track seat (11)、It is arranged on the wafer clip (13) on described fixing seat (12)、It is arranged at the transmission roll shaft (14) of described wafer clip (13) side、It is connected with described transmission roll shaft (14) for the drive mechanism (15) driving its rotation and the mechanical arm mechanism (16) for the wafer in described wafer clip (13) is taken to described transmission roll shaft (14).
2. wafer etching apparatus according to claim 1, it is characterised in that: described etching assembly (2) includes the first cell body (21), be arranged on described first cell body (21) in and with described transmission roll shaft (14) to corresponding the first conveying roller (22), least one set liquid cutter (25) being arranged in described first cell body (21), least one set jet pipe (24) and least one set the first Air knife mechanism (26) and the processing solution tank (23) that is connected with described first cell body (21) and described liquid cutter (25) respectively.
3. wafer etching apparatus according to claim 2, it is characterised in that: described jet pipe (24) is installed in rotation in described first cell body (21) by swing mechanism (27).
4. wafer etching apparatus according to claim 3, it is characterised in that: eccentric (274) that the swing arm (273) that connector (271) that described swing mechanism (27) includes being arranged on described jet pipe (24), the drive link (272) being arranged on described connector (271) are connected with described drive link (272) end phase pivot is connected with described swing arm (273) end phase pivot and the rotary actuator (275) being connected with described eccentric (274).
5. wafer etching apparatus according to claim 2, it is characterized in that: described washing component (3) includes the second cell body (30), be arranged on described second cell body (30) in and with described transmission roll shaft (14) to corresponding the second conveying roller (31), many groups sparge pipe group (32) being arranged in described second cell body (30) and many groups the second Air knife mechanism (34) and the corresponding lower groove (33) connected of the described sparge pipe group (32) of group with how respectively, described lower groove (33) is formed (331) by multiple grading overflow unit being arranged in series.
6. wafer etching apparatus according to claim 5, it is characterised in that: described air-dry assembly (4) includes the 3rd cell body (41), be arranged on described 3rd cell body (41) in and to the 3rd corresponding conveying roller (42) and be arranged on many groups of the 3rd Air knife mechanisms (43) in described 3rd cell body (41) with described transmission roll shaft (14).
7. wafer etching apparatus according to claim 6, it is characterised in that: it also includes sewer pipe (6) and water inlet pipe (7), and described sewer pipe (6) is all connected with described processing solution tank (23) and described lower groove (33) with water inlet pipe (7).
8. wafer etching apparatus according to claim 6, it is characterised in that: it also includes the air inlet pipe (8) being connected respectively with described first Air knife mechanism (26), described second Air knife mechanism (34) and described 3rd Air knife mechanism (43).
9. wafer etching apparatus according to claim 1, it is characterised in that: it also includes covering at described loading assemblies (1), etching assembly (2), washing component (3), air-dry assembly (4) and blanking assembly (5) outer housing (9) outward.