CN207389773U - A kind of automatic film stripping machine of silicon chip - Google Patents

A kind of automatic film stripping machine of silicon chip Download PDF

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Publication number
CN207389773U
CN207389773U CN201721166450.3U CN201721166450U CN207389773U CN 207389773 U CN207389773 U CN 207389773U CN 201721166450 U CN201721166450 U CN 201721166450U CN 207389773 U CN207389773 U CN 207389773U
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CN
China
Prior art keywords
adhesive tape
film stripping
stripping machine
lampshade
irradiation means
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Active
Application number
CN201721166450.3U
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Chinese (zh)
Inventor
武鹏
王彦君
孙晨光
徐长坡
刘闯
王万礼
张晋英
李子科
杜宏强
王志明
赵杨
杜晓辉
张新玲
刘丽媛
董子旭
刘文彬
乔智
印小松
刘晓芳
张建
张喆
徐阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TIANJIN HUANXIN TECHNOLOGY DEVELOPMENT Co Ltd
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TIANJIN HUANXIN TECHNOLOGY DEVELOPMENT Co Ltd
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Application filed by TIANJIN HUANXIN TECHNOLOGY DEVELOPMENT Co Ltd filed Critical TIANJIN HUANXIN TECHNOLOGY DEVELOPMENT Co Ltd
Priority to CN201721166450.3U priority Critical patent/CN207389773U/en
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Publication of CN207389773U publication Critical patent/CN207389773U/en
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Abstract

The utility model provides a kind of automatic film stripping machine of silicon chip, including board, board is equipped with manipulator, UV irradiation means, microscope carrier and film stripping machine structure, film stripping machine structure is arranged on the top of microscope carrier, and film stripping machine structure includes adhesive tape feeding mechanism and adhesive tape laminating mechanism, adhesive tape is wound on adhesive tape feeding mechanism, adhesive tape laminating mechanism is arranged on the upside of the adhesive tape above microscope carrier, UV irradiation means include UV lamp and lampshade, and UV lamp is arranged in lampshade, and the bottom of lampshade can open.The film stripping machine high degree of automation, irradiation means are rational in infrastructure, to silicon chip irradiation completely, without dead angle, high treating effect takes off that film difficulty is low, and irradiation means heat can be drawn from irradiation means in time, and equipment damage rate is low.

Description

A kind of automatic film stripping machine of silicon chip
Technical field
The utility model is related to semiconductor device manufacturing equipment technical fields, and film is taken off automatically more particularly, to a kind of silicon chip Machine.
Background technology
Semiconductor devices is when progress back metal technique is such as ground, since wafer frontside and the back side have connecing for physics It touches, so the front of the wafer to having completed front metal technique is needed to protect, with tamper-proof front metal pattern.
Before semiconductor devices back metal technique common at present, generally use UV films or non-UV films are to front metal It is protected, after thinning back side and Wafer Backside Cleaning technique, removes protective film, and when removing protective film, in the prior art Have using taking off film manually and take off film two ways automatically using film stripping machine, it is low to take off membrane efficiency manually, and easily leads to silicon chip fragment.And Existing automatic film stripping machine the degree of automation is relatively low, some steps still need manually to aid in, and existing takes off film automatically Machine makes to take off in membrane process that silicon chip treatment effect is limited since the structure setting of irradiation means is unreasonable, and taking off film, there are still certain tired Difficulty is taken off film fragment and is easily occurred, and the amount of heat that irradiation means generate during being irradiated to silicon chip can not also be drawn in time Go out irradiation means, easily make equipment damage.
The content of the invention
Problem to be solved in the utility model is to provide a kind of automatic film stripping machine of silicon chip, high degree of automation, irradiation means Rational in infrastructure, silicon chip high treating effect takes off that film difficulty is low, and irradiation means heat can be drawn from irradiation means in time, equipment Spoilage is low.
In order to solve the above technical problems, the technical solution adopted in the utility model is:A kind of automatic film stripping machine of silicon chip, including Board, board are equipped with manipulator, UV irradiation means, microscope carrier and film stripping machine structure, and film stripping machine structure is arranged on the top of microscope carrier, film stripping machine Structure includes adhesive tape feeding mechanism and adhesive tape laminating mechanism, and adhesive tape is wound on adhesive tape feeding mechanism, and adhesive tape laminating mechanism is arranged on microscope carrier The upside of the adhesive tape of top.
In technical solution, it is preferred that UV irradiation means include UV lamp and lampshade, and UV lamp is arranged in lampshade, the bottom of lampshade It can open.
In technical solution, it is preferred that lampshade includes cover body and bottom plate, and bottom plate is moved arranged on cover body bottom, bottom plate and water One end connection of flat telescopic rod, horizontal telescopic rod are fixed on board.
In technical solution, it is preferred that lampshade is equipped with exhaust pipeline, and exhaust pipeline is equipped with hot exhaust blower.
In technical solution, it is preferred that adhesive tape feeding mechanism includes adhesive tape supply roll shaft, adhesive tape guide roller group and waste tape and receives Collect roll shaft, waste tape collects one end of roll shaft and the output axis connection of the first motor, and the first motor is fixed on board, and adhesive tape supplies Tape roll is equipped with to roll shaft, one end of tape roll is around adhesive tape guide roller group and waste tape collecting drum axis connection.
In technical solution, it is preferred that adhesive tape laminating mechanism includes adhesive tape pressing block and lifting cylinder, and lifting cylinder is fixed on On board, one end of adhesive tape pressing block and the telescopic arm of lifting cylinder connect.
In technical solution, it is preferred that adhesive tape laminating mechanism is arranged on the one side of the upstream of the stroke of close adhesive tape above microscope carrier.
In technical solution, it is preferred that further include pallet and the second motor, pallet is arranged on the lower section of UV irradiation means, and second Motor is fixed below pallet on board, and the output shaft of the second motor is connected with tray bottom.
The utility model has the advantages and positive effects of:
1. high degree of automation takes off in membrane process without manually aiding in, takes off film operational process stabilization, take off membrane efficiency It is high;
2. irradiation means irradiation is complete, no dead angle, high treating effect, it is low to take off film difficulty rate, and it is low to take off film glue residua rate;
3. the heat generated in irradiation means can discharge in time, the damage to equipment is reduced, increases the service life of equipment.
Description of the drawings
Fig. 1 is the structure diagram of the automatic film stripping machine of the utility model.
Fig. 2 is the structure diagram of the film stripping machine structure in the automatic film stripping machine of the utility model.
Fig. 3 is the structure diagram of UV irradiation means in the automatic film stripping machine of the utility model.
In figure:
1st, board 2, manipulator 3, UV irradiation means
4th, microscope carrier 5, film stripping machine structure 6, bearing basket
7th, adhesive tape 8, pallet 9, motor
11st, platform 12, riser 31, UV lamp
32nd, lampshade 51, adhesive tape feeding mechanism 52, adhesive tape laminating mechanism
321st, cover body 322, bottom plate 323, horizontal telescopic rod
324th, exhaust pipeline 325, hot exhaust blower 511, adhesive tape supply roll shaft
512nd, adhesive tape guide roller 513, waste tape collect roll shaft 514, motor
515th, motor 521, adhesive tape pressing block 522, lifting cylinder
Specific embodiment
The utility model embodiment is described further below in conjunction with the accompanying drawings:
As shown in Figure 1, the automatic film stripping machine of a kind of silicon chip described in the present embodiment, including board 1, board 1 includes platform 11 With riser 12, arrangement is equipped with bearing basket 6, manipulator to riser 12 on the one side of 11 top of platform, the platform 11 of board 1 vertically 2nd, UV irradiation means 3, microscope carrier 4 and film stripping machine structure 5, film stripping machine structure 5 are arranged on riser 12, and positioned at the top of microscope carrier 4, take off film Mechanism 5 includes adhesive tape feeding mechanism 51 and adhesive tape laminating mechanism 52, and adhesive tape 7, adhesive tape pressing machine are wound on adhesive tape feeding mechanism 51 Structure 52 is arranged on the upside of the adhesive tape 7 of 4 top of microscope carrier.The silicon chip of film to be taken off is sent to automatic film stripping machine and is placed in bearing basket 6, Manipulator 2 once takes out a piece of silicon chip from bearing basket 6, and places it in the lower section of UV irradiation means 3, through UV irradiation means 3 After irradiation, make the adhesive curing on the UV films adhered on silicon chip, lose adhesiveness, then manipulator 2 send silicon chip to microscope carrier 4, Microscope carrier 4 adsorbs silicon chip, and silicon chip is heated, and the adhesive tape laminating mechanism 52 above microscope carrier 4 will be located on silicon chip The adhesive tape of side is pressure bonded on the UV films on silicon chip, and adhesive tape is made to cling UV films, and then adhesive tape feeding mechanism 51 drives adhesive tape backward Transmission, adhesive tape drive one end of UV films to move backward, so as to which UV films be started from silicon chip, and take off, and film is taken off in completion.
As shown in Fig. 2, in preferred embodiment, adhesive tape feeding mechanism 51 includes adhesive tape supply roll shaft 511, multiple adhesive tape guide rollers 512 and waste tape collect roll shaft 513, adhesive tape supply roll shaft 511, adhesive tape guide roller 512 and waste tape collect one end of roll shaft 513 It is connected with riser 12, tape roll is cased on adhesive tape supply roll shaft 511, one end of tape roll after each adhesive tape guide roller 512 around twining It is wound on waste tape to collect on roll shaft 513, the settings of multiple adhesive tape guide rollers 512, and will for changing the direction of transfer of adhesive tape Adhesive tape is tensioned, and waste tape collects one end of roll shaft 513 and the output axis connection for the motor 514 being fixed on riser 12, waste tape It collects roll shaft 513 to rotate under the drive of motor 514, and drives being fed forward for adhesive tape, in preferred embodiment, adhesive tape supply roll shaft 511 may be configured as the output axis connection with another motor 515, and motor 515 is fixed on riser 12, and motor 515 is same with motor 514 Step driving makes the receipts glue rate synchronization that roll shaft 513 is collected for glue and waste tape of adhesive tape supply roll shaft 511, it is more steady to take off membrane process It is fixed.
Wherein, adhesive tape laminating mechanism 52 includes adhesive tape pressing block 521 and lifting cylinder 522, and lifting cylinder 522 is fixed on machine On the riser 12 of platform 1, one end of adhesive tape pressing block 521 is connected with the telescopic arm of lifting cylinder 522, and lifting cylinder 522 stretches Armband moves the lifting of fast 521 interruption of adhesive tape pressing, after the conveying of adhesive tape feeding mechanism 51 carrys out new adhesive tape, adhesive tape pressing block 521 It moves under phase, be pressed together on silicon chip surface and bonded with UV films, then adhesive tape pressing block 521 rises, adhesive tape feeding mechanism 51 Continue to be fed forward, so that adhesive tape takes UV films off, take off film high degree of automation, and it is stable.In preferred embodiment, adhesive tape Laminating mechanism 52 is arranged on 4 top of microscope carrier close to the one side of the upstream of the stroke of adhesive tape, so takes off film direction and adhesive tape conveying direction Unanimously, make to take off film and be more easy to, it is more preferable to take off film effect.
As shown in figure 3, in preferred embodiment, UV irradiation means 3 include UV lamp 31 and lampshade 32, and UV lamp 31 is arranged on lampshade 32 Interior, the bottom of lampshade 32 can open, and when UV irradiation means 3 irradiate the UV films of silicon chip surface, 32 bottom of lampshade is opened completely, is made The illumination of UV films is more complete, the dead angle that can not be irradiated to.In preferred embodiment, lampshade 32 includes cover body 321 and bottom plate 322, cover Body 321 is equipped with side and top surface, does not set bottom surface, bottom plate 322 is removable arranged on the bottom of cover body 321, and bottom plate 322 can be stretched with level One end connection of contracting bar 323, horizontal telescopic rod 323 are fixed on the riser 12 of board 1.It is horizontal when being irradiated to UV films 323 automatic telescopic of telescopic rod, bottom plate 322 is pulled open, and the bottom of lampshade 32 is opened completely, reduces the lamp hole of UV irradiation means 3 The limitation of scope carries out UV films more complete irradiation, ensures that the degree of illumination on UV films at different position approaches, so that taking off Film difficulty rate declines, and takes off the decline of film glue residua rate.
In preferred embodiment, which further includes pallet 8 and motor 9, and pallet 8 is arranged on the lower section of UV irradiation means 3, motor 9 are fixed on the platform 11 of 8 lower section board 1 of pallet, and the output shaft of motor 9 is connected with the bottom of pallet 8, and manipulator 2 is from carrying It takes after upper silicon chip, is placed it on pallet 8 on basket 6, motor 9 drives pallet 8 to be rotated around the center of circle, makes UV irradiation means to silicon Evenly, different position radiation situation indifference, no dead angle, it is better to make to take off film, takes off film and is stranded for the irradiation of the UV films on piece surface Difficult rate declines.
In preferred embodiment, the top of lampshade 32 is additionally provided with exhaust pipeline 324, and exhaust pipeline 324 is equipped with hot exhaust blower 325, it constantly takes the hot-air in lampshade 32 away during UV irradiation means 3 are run, strengthens the heat exchange inside and outside lampshade 32, subtract Few heat generated due to UV lamp makes the damage that board is subject to, and extends equipment life.
The automatic film stripping machine of silicon chip described in the present embodiment has the advantage that:High degree of automation takes off film In the process without manually aiding in, film operational process stabilization is taken off, takes off membrane efficiency height;Irradiation means irradiation is complete, no dead angle, place It is good to manage effect, it is low to take off film difficulty rate, and it is low to take off film glue residua rate;The heat generated in irradiation means can discharge in time, and reduction pair is set Standby damage increases the service life of equipment.
One embodiment of the utility model is described in detail above, but the content is only the utility model Preferred embodiment, it is impossible to be construed as limiting the scope of the utility model.It is all to be made according to application scope of the utility model All the changes and improvements etc., should all still belong within the patent covering scope of the utility model.

Claims (8)

1. a kind of automatic film stripping machine of silicon chip, including board, it is characterised in that:The board be equipped with manipulator, UV irradiation means, Microscope carrier and film stripping machine structure, the film stripping machine structure be arranged on the microscope carrier top, the film stripping machine structure include adhesive tape feeding mechanism and Adhesive tape laminating mechanism, adhesive tape is wound on the adhesive tape feeding mechanism, and the adhesive tape laminating mechanism is arranged on the institute above the microscope carrier State the upside of adhesive tape.
2. automatic film stripping machine according to claim 1, it is characterised in that:The UV irradiation means include UV lamp and lampshade, The UV lamp is arranged in the lampshade, and the bottom of the lampshade can open.
3. automatic film stripping machine according to claim 2, it is characterised in that:The lampshade includes cover body and bottom plate, the bottom Plate is moved arranged on the cover body bottom, and the bottom plate is connected with one end of horizontal telescopic rod, the horizontal telescopic rod The other end is fixed on the board.
4. automatic film stripping machine according to claim 2, it is characterised in that:The lampshade is equipped with exhaust pipeline, the row Air pipe line is equipped with hot exhaust blower.
5. according to any automatic film stripping machines of claim 1-4, it is characterised in that:The adhesive tape feeding mechanism includes adhesive tape Supply roll shaft, adhesive tape guide roller group and waste tape collect roll shaft, the waste tape collects the defeated of one end of roll shaft and the first motor Go out axis connection, first motor is fixed on the board, and the adhesive tape supply roll shaft is equipped with tape roll, the tape roll One end around the adhesive tape guide roller group and the waste tape collecting drum axis connection.
6. according to any automatic film stripping machines of claim 1-4, it is characterised in that:The adhesive tape laminating mechanism includes adhesive tape Pressing block and lifting cylinder, the lifting cylinder are fixed on the board, one end and the lifting of the adhesive tape pressing block The telescopic arm connection of cylinder.
7. according to any automatic film stripping machines of claim 1-4, it is characterised in that:The adhesive tape laminating mechanism is arranged on described The one side of the upstream of the stroke of the close adhesive tape above microscope carrier.
8. according to any automatic film stripping machines of claim 1-4, it is characterised in that:Further include pallet and the second motor, institute The lower section that pallet is arranged on the UV irradiation means is stated, second motor is fixed below the pallet on the board, described The output shaft of second motor is connected with the tray bottom.
CN201721166450.3U 2017-09-12 2017-09-12 A kind of automatic film stripping machine of silicon chip Active CN207389773U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721166450.3U CN207389773U (en) 2017-09-12 2017-09-12 A kind of automatic film stripping machine of silicon chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721166450.3U CN207389773U (en) 2017-09-12 2017-09-12 A kind of automatic film stripping machine of silicon chip

Publications (1)

Publication Number Publication Date
CN207389773U true CN207389773U (en) 2018-05-22

Family

ID=62417190

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721166450.3U Active CN207389773U (en) 2017-09-12 2017-09-12 A kind of automatic film stripping machine of silicon chip

Country Status (1)

Country Link
CN (1) CN207389773U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109781617A (en) * 2019-01-17 2019-05-21 威士达半导体科技(张家港)有限公司 A kind of UV scribing film easily tears the appraisal procedure of effect with counterdie
CN110641794A (en) * 2019-09-27 2020-01-03 珂尔默(东莞)制造技术有限公司 Automatic film uncovering method for surface protection film of plate material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109781617A (en) * 2019-01-17 2019-05-21 威士达半导体科技(张家港)有限公司 A kind of UV scribing film easily tears the appraisal procedure of effect with counterdie
CN110641794A (en) * 2019-09-27 2020-01-03 珂尔默(东莞)制造技术有限公司 Automatic film uncovering method for surface protection film of plate material

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