CN209045505U - Wet processing apparatus - Google Patents
Wet processing apparatus Download PDFInfo
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- CN209045505U CN209045505U CN201822028252.1U CN201822028252U CN209045505U CN 209045505 U CN209045505 U CN 209045505U CN 201822028252 U CN201822028252 U CN 201822028252U CN 209045505 U CN209045505 U CN 209045505U
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Abstract
The utility model provides a kind of wet processing apparatus, by adding a resorption pipeline on the feed liquid pipeline to nozzle liquid supply, and a suck back valve is set on the resorption pipeline, so that when stopping nozzle hydrojet, suck back valve can further be opened, to generate negative pressure, make residual liquid resorption in nozzle and its neighbouring feed liquid pipeline, a possibility that effectivelying prevent these remaining chemical liquids to drip from nozzle, and then it eliminates the chemical liquids at nozzle and steals the line defect generated due to drop, improve product yield, improve the treatment effeciency of wet processing apparatus and promotes the output yield of wet processing apparatus.
Description
Technical field
The utility model relates to semiconductor production manufacturing technology field, in particular to a kind of wet processing apparatus.
Background technique
Currently, integrated level is continuously improved, to each step as the device feature size of super large-scale integration constantly reduces
More stringent requirements are proposed for the accuracy of the control of technique and its process results.Wherein, wet etching (including wet-cleaning) work
Skill mainly has following effect in ic manufacturing process: one is using chemical liquids (including soda acid medical fluid, organic solution and
Deionized water) cleaning wafer, to reduce the pollution and defect of wafer；The second is certain specific films are isotropically etched,
To obtain required shape.
It is a kind of using one chip wet process board carry out wet etching (including wet-cleaning) process include:
Firstly, please referring to Figure 1A, wafer 200 is placed on plummer 100, at this time for spraying the nozzle 102 of chemical liquids
It is now in 200 outside of wafer；
Then, wet etching (including wet-cleaning) is carried out, please refers to Figure 1B, chemical liquids 103 are sprayed from nozzle 102, brilliant
Circle 200 makes rotating motion around own central axis line, and nozzle 102 is rotated around nozzle driving assembly 101, along 200 surface of wafer
Reciprocating rotation is done, to complete uniform to the cleaning of crystal column surface；
Later, at the end of to wet etching (including wet-cleaning), Fig. 1 C is please referred to, nozzle 102 stops spraying chemical liquids,
And the side of wafer 200 is turned to around nozzle driving assembly 101, wafer 200 continues spin for some time, to dry on surface
Chemical liquids.
However, the crystal column surface of above-mentioned one chip wet process board output is frequent referring to FIG. 2, utility model people has found
It will appear line defect (line defect) 201.Fig. 1 C and Fig. 2 are please referred to, utility model people is the study found that generate the threadiness
The reason of defect is mainly: the nozzle 102 of the one chip wet process board does not have resorption function, after stopping to 102 feed flow of nozzle,
Since the outlet of nozzle 102 is downward, remaining chemical liquids are due to certainly in the sagging pipeline (not shown) of nozzle 102 and its connection
The gravity of body and the ductility of liquid, will be along the naturally lower drop in the edge of nozzle 102, until sagging pipeline and nozzle 102
In chemical liquids drip off and can just stop, here it is chemical liquids to steal the phenomenon that dripping, when nozzle 102 leaves wafer table completely not yet
When above face, these are stolen these drops 103a for oozing and and will certainly fall on 200 surface of wafer, are dropped in 200 table of wafer
These drops 103a in face is subject to centrifugal forces during wafer 200 is rotated and dried, can be along 200 surface of wafer
It streaks and its place of arrival will continue to react with the surface of wafer 200, and then generate the line defect 201, the line defect
201 very likely cause waste paper, reduce product yield.
Utility model content
The purpose of this utility model is to provide a kind of wet processing apparatus, it can prevent from stealing drop phenomenon at nozzle, improve
The treatment effeciency of wet processing apparatus and the output yield for promoting wet processing apparatus.
In order to solve the above technical problems, the utility model provides a kind of wet processing apparatus, comprising:
Nozzle；
Feed liquid pipeline is connected to the nozzle；
Supplying valve is arranged on the feed liquid pipeline；
Resorption pipeline is connected to the feed liquid pipeline；And
Suck back valve is arranged on the resorption pipeline.
Optionally, the suck back valve is air valve, and the gas flow of the air valve is adjustable.
Optionally, the wet processing apparatus further include: for controlling the solenoid valve of the resorption threshold switch, the electricity
Magnet valve connects the suck back valve.
Optionally, the feed liquid pipeline includes sequentially connected bending section, shunting section and liquid input section, and the bending section connects
Lead to the nozzle and there is bending；The junction of the liquid input section and the shunting section, the resorption is arranged in the supplying valve
Pipeline is connected to the shunting section.
Optionally, the resorption pipeline and the feed liquid pipeline are hose.
Optionally, it is 10mm that the length of the bending section, which is not less than,.
Optionally, the wet processing apparatus further includes liquid supply assembly, and the liquid supply assembly includes reservoir and pumping
Water pump, the suction pump are arranged between the reservoir and the feed liquid pipeline, and by the reservoir and the liquid supply pipe
Road connection；Alternatively, the liquid supply assembly is factory service liquid-supplying system.
Optionally, the wet processing apparatus further include: the plummer below the nozzle is set and for branch
It supports the plummer and makes the plummer rotary components of the plummer rotation, the plummer is for carrying wafer.
Optionally, the wet processing apparatus further include: connect the nozzle and/or the feed liquid pipeline and drive institute
State the nozzle driving assembly of nozzle rotation.
Optionally, the wet processing apparatus is wet clean equipment, wet-method etching equipment or wet process electroplating device.
Compared with prior art, the wet processing apparatus of the utility model, by the feed liquid pipeline to nozzle liquid supply
A resorption pipeline is added, and a suck back valve is set on the resorption pipeline, so that when stopping nozzle hydrojet, it can be further
Open suck back valve makes residual liquid resorption in nozzle and its neighbouring feed liquid pipeline, effectively prevent these residual to generate negative pressure
A possibility that chemical liquids stayed are dripped from nozzle, and then eliminate the chemical liquids at nozzle and steal the line defect generated due to drop, it mentions
High product yield improves the treatment effeciency of wet processing apparatus and promotes the output yield of wet processing apparatus.
Detailed description of the invention
Figure 1A to Fig. 1 C is that the plan structure on the wet process board during a kind of wet etching (including wet-cleaning) is shown
It is intended to.
Fig. 2 is surface defect schematic diagram of the wafer after wet etching (including wet-cleaning).
Fig. 3 is the structural schematic diagram of the wet processing apparatus of an embodiment of the present invention.
Fig. 4 is resorption rear nozzle and its schematic diagram the case where surrounding in an embodiment of the present invention.
Fig. 5 is the overlooking structure diagram of the wet processing apparatus of another embodiment of the utility model.
Fig. 6 is the structural schematic diagram of the wet processing apparatus of another embodiment of the utility model.
Wherein, appended drawing reference is as follows:
100,300- plummer, 101,308- nozzle driving assembly；102,302- nozzle；103- chemical liquids；103a- liquid
Drop；200- wafer；201- line defect；302- liquid supply assembly；303- feed liquid pipeline；The liquid input section of 3031- feed liquid pipeline；
The shunting section of 3032- feed liquid pipeline；The bending section of 3033- feed liquid pipeline；304- supplying valve；305- resorption pipeline；306- resorption
Valve；307- solenoid valve.
Specific embodiment
To be clearer and more comprehensible the purpose of this utility model, feature, with reference to the accompanying drawing to the technical side of the utility model
Case is described in detail, however, the utility model can be realized with different forms, it should not be to be confined to the implementation
Example.It should be noted that attached drawing is all made of very simplified form and using non-accurate ratio, only to conveniently, lucidly
Aid in illustrating the purpose of the utility model embodiment.
Referring to FIG. 3, an embodiment of the present invention provides a kind of wet processing apparatus, comprising: liquid supply assembly 301, spray
Mouth 302, feed liquid pipeline 303, supplying valve 304, resorption pipeline 305 and suck back valve 306.
In the present embodiment, the liquid supply assembly 301 is factory service liquid-supplying system, can directly be led to after opening supplying valve 304
Feed liquid pipeline 303 is crossed to 302 feed flow of nozzle.In other embodiments of the invention, the liquid supply assembly 301 is also possible to
For the ad hoc dedicated liquid-supplying system of nozzle 302 comprising reservoir (not shown) and suction pump (not shown), the suction pump
Setting is connected between the reservoir and the feed liquid pipeline 303, and by the reservoir with the feed liquid pipeline 303.
The feed liquid pipeline 303 includes sequentially connected bending section 3033, shunting section 3032 and liquid input section 3031, described
Bending section 3033 is connected to the nozzle 302 and has bending.The liquid input section 3031 is connected to drawing water for the liquid supply assembly 301
The junction of the liquid input section 3031 and the shunting section 3032 is arranged in pump, the supplying valve 304, makes feed flow when opening
Pipeline 303 continues feed flow to the nozzle 302, when closed, so that stopping feed liquid pipeline 303 to 302 feed flow of nozzle.
The resorption pipeline 305 is connected to by a three-way interface with the shunting section 3032.Preferably, the suction pipe
Road 305 and the feed liquid pipeline 303 are hose, are on the one hand conducive to the installation site for adjusting pipeline, are on the other hand conducive to adjust
The length and camber of whole bending section 3033.
The suck back valve 306 is arranged on the resorption pipeline 305, for stopping in feed liquid pipeline 303 to the nozzle
It is opened after 302 feed flows, by the liquid resorption at nozzle 302 into bending section 3033.The length of the bending section 3033 is not small
In 10mm, so that the liquid of resorption can be lower than the highest point of the bending section 3033.Fig. 3 and 4 are please referred to, in the present embodiment
In, shunting section 3032 is horizontal pipe, and the bending section 3033 is the arc pipe higher than the shunting section 3032, wherein resorption
Liquid column (not shown) with respect to shunting section 3032 height H be 25mm.
The suck back valve 306 and supplying valve 304 can be the mechanical valve manually controlled, and the mechanical valve is, for example, common
Needle valve, shut-off valve, gate valve, plug valve, ball valve or butterfly valve etc., or the electronic valve of automatic control, for example, solenoid valve
Or the electronic valve with sensor.Referring to FIG. 6, the suck back valve 306 uses air in an embodiment of the utility model
Valve, gas flow be it is adjustable, the suck back valve 306 includes the gate (not shown) that is arranged in the resorption pipeline 305,
The switch of the gate is controlled by the gas flow in the suck back valve 306, and the switch of the suck back valve 306 is controlled by described return
The solenoid valve 308 that valve 306 connects is inhaled, i.e., the described solenoid valve 308 can control the flow of the gas flowed into the suck back valve 306
Size, and then the gate of the suck back valve 306 is opened or closed, so that resorption pipeline 305 is connected to nozzle 302 or disconnection and nozzle
302 connection.
Referring to FIG. 5, the wet processing apparatus of the present embodiment further includes that plummer 300, plummer rotary components (are not schemed
Show) and nozzle driving assembly 308.The plummer 300 is arranged below the nozzle 302, for carrying and fixing wafer
200；The plummer rotary components are used to support the plummer 300 and rotate the plummer 300, so that plummer
The chemical liquids of the ejection of nozzle 302 can be touched on the surface of the wafer 200 of 300 carryings；The nozzle driving assembly 308 connects
The nozzle 302 is connect, the bending section 3033 of the feed liquid pipeline 303 is perhaps connected or connects the nozzle 302 and institute simultaneously
The bending section 3033 of feed liquid pipeline 303 is stated, (is sprayed with driving the nozzle 302 to do linear reciprocating motion on 200 surface of wafer
Mouth 302 is straight line with respect to the motion profile on ground) or crankmotion (such as nozzle 302 is with respect to the motion profile on ground
Camber line).
The embodiment of the present invention wet processing apparatus be suitable for the wet clean process such as washing process, wet-etching technology and
Wet process electroplating technology, this liquid for depending primarily on feed liquid pipeline conveying is the cleaning solutions such as water, etching liquid or electroplate liquid, therefore
The embodiment of the present invention wet processing apparatus can be wet clean equipment, wet-method etching equipment or wet process electroplating device.Below
By taking wet-cleaning as an example, the application method of the wet processing apparatus of the present embodiment is described in detail, please refers to Fig. 3 to Fig. 5, specifically such as
Under:
Firstly, the step of being put into wafer 200, specifically, by mechanical arm crawl wafer 200 (not shown), and will be brilliant
Circle 200 is placed on plummer 300, is now in 200 outside of wafer, supplying valve 304 for spraying the nozzle 302 of chemical liquids at this time
It closes, suck back valve 306 is closed；
Then, the step of carrying out wet-cleaning, opens supplying valve 304, and liquid supply assembly 301 is conveyed by feed liquid pipeline 305
The chemical liquids such as deionized water 400 are sprayed from nozzle 302, and wafer 200, which is done under the drive of plummer 300 around own central axis line, to be rotated
Movement, and nozzle driving assembly 308 drives 302 reciprocating rotation of nozzle or linear reciprocating motion, with multiple inswept 200 table of wafer
Face, to complete uniform to the cleaning on 200 surface of wafer；
Later, at the end of to wet etching (including wet-cleaning), continue that wafer 200 is kept to rotate, and close supplying valve
304, so that nozzle 302 stops spraying chemical liquids, and dry 200 surface of wafer.Closing 304 a period of time of supplying valve (i.e.
The time of 306 Time Delay Opening of suck back valve, such as 0.4 second) after, suck back valve 306 is opened, generates negative pressure in resorption pipeline 305, in turn
So that the residual liquid resorption in nozzle 302 and bending section 3033, during suck back valve 306 is persistently opened, bending section
Liquid column in 3033 continues to be retracted toward at suction pipe road 305 until the liquid column retracts close to one end of nozzle 302 to folding
Hereinafter, closing suck back valve 306 at this time, the liquid column in bending section 300 can not be worn because of self gravity for the highest point of curved segment 3033
The more highest point of bending section 3033 thus avoids chemical residue liquid to can not drip under the edge nature along nozzle 302
A possibility that being dripped from nozzle, and then eliminate the chemical liquids at nozzle and steal the line defect generated due to drop in crystal column surface, it mentions
High product yield improves the treatment effeciency of wet processing apparatus and promotes the output yield of wet processing apparatus.In the present embodiment,
The time that suck back valve 306 is persistently opened is 0.9s, and the liquid column that bending section 3033 stores is with respect to the height H of shunting section 3032
25mm.In the other embodiments of the utility model, at the time of closing at the time of suck back valve 306 is opened with respect to supplying valve 304 also
It can postpone 0~3s, the duration that suck back valve 306 is persistently opened can also be 0.3s~10s, wet even up to wafer 200 from this
It is taken away in method processing equipment.
In conclusion the wet processing apparatus of the utility model, by adding one on the feed liquid pipeline to nozzle liquid supply
Resorption pipeline, and a suck back valve is set on the resorption pipeline, so that can further be opened back when stopping nozzle hydrojet
Inhale valve makes residual liquid resorption in nozzle and its neighbouring feed liquid pipeline, effectively prevent these remainingization to generate negative pressure
A possibility that liquid drips from nozzle is learned, and then eliminates the chemical liquids at nozzle and steals the line defect generated due to drop, improves product
Yield improves the treatment effeciency of wet processing apparatus and promotes the output yield of wet processing apparatus.
Foregoing description is only the description to the utility model preferred embodiment, not to any limit of the scope of the utility model
Fixed, any change, the modification that the those of ordinary skill in the utility model field does according to the disclosure above content belong to right and want
Seek the protection scope of book.
Claims (10)
1. a kind of wet processing apparatus characterized by comprising
Nozzle；
Feed liquid pipeline is connected to the nozzle；
Supplying valve is arranged on the feed liquid pipeline；
Resorption pipeline is connected to the feed liquid pipeline；And
Suck back valve is arranged on the resorption pipeline.
2. wet processing apparatus as described in claim 1, which is characterized in that the suck back valve is air valve, the gas of the air valve
Body flow is adjustable.
3. wet processing apparatus as claimed in claim 2, which is characterized in that further include: for controlling the resorption threshold switch
Solenoid valve, the solenoid valve connects the suck back valve.
4. wet processing apparatus as described in claim 1, which is characterized in that the feed liquid pipeline includes sequentially connected bending
Section, shunting section and liquid input section, the bending section are connected to the nozzle and have bending；The supplying valve is arranged in the feed liquor
The junction of section and the shunting section, the resorption pipeline are connected to the shunting section.
5. wet processing apparatus as claimed in claim 4, which is characterized in that the resorption pipeline and the feed liquid pipeline are soft
Pipe.
6. wet processing apparatus as claimed in claim 4, which is characterized in that the length of the bending section is not less than 10mm.
7. wet processing apparatus as described in claim 1, which is characterized in that further include liquid supply assembly；The liquid supply assembly packet
Include reservoir and suction pump, the suction pump is arranged between the reservoir and the feed liquid pipeline, and by the liquid storage
Slot is connected to the feed liquid pipeline；Alternatively, the liquid supply assembly is factory service liquid-supplying system.
8. wet processing apparatus as described in claim 1, which is characterized in that further include: holding below the nozzle is set
Microscope carrier and the plummer rotary components for being used to support the plummer and rotating the plummer, the plummer is for holding
Carry wafer.
9. wet processing apparatus as described in claim 1, which is characterized in that further include: connect the nozzle and/or the confession
Liquid pipe road and the nozzle driving assembly for driving the nozzle rotation.
10. wet processing apparatus as claimed in any one of claims 1-9 wherein, which is characterized in that the wet processing apparatus is
Wet clean equipment, wet-method etching equipment or wet process electroplating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822028252.1U CN209045505U (en) | 2018-11-30 | 2018-11-30 | Wet processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822028252.1U CN209045505U (en) | 2018-11-30 | 2018-11-30 | Wet processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209045505U true CN209045505U (en) | 2019-06-28 |
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ID=67044128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822028252.1U Active CN209045505U (en) | 2018-11-30 | 2018-11-30 | Wet processing apparatus |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110508545A (en) * | 2019-09-24 | 2019-11-29 | 武汉新芯集成电路制造有限公司 | Wafer cleaning device and method |
| CN112309888A (en) * | 2019-07-29 | 2021-02-02 | 芯恩（青岛）集成电路有限公司 | Wet etching method |
| CN112452000A (en) * | 2020-11-03 | 2021-03-09 | 李林耀 | Organic silicon production is with deposiing cauldron |
| CN112735984A (en) * | 2020-12-30 | 2021-04-30 | 上海至纯洁净系统科技股份有限公司 | Wafer surface cleaning assembly |
| WO2021223586A1 (en) * | 2020-05-06 | 2021-11-11 | 长鑫存储技术有限公司 | Wet treatment device and control method therefor, storage medium, and electronic device |
| US20220349408A1 (en) * | 2021-04-29 | 2022-11-03 | Changxin Memory Technologies, Inc. | Liquid suck-back system and liquid suck-back method |
-
2018
- 2018-11-30 CN CN201822028252.1U patent/CN209045505U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309888A (en) * | 2019-07-29 | 2021-02-02 | 芯恩（青岛）集成电路有限公司 | Wet etching method |
| CN110508545A (en) * | 2019-09-24 | 2019-11-29 | 武汉新芯集成电路制造有限公司 | Wafer cleaning device and method |
| WO2021223586A1 (en) * | 2020-05-06 | 2021-11-11 | 长鑫存储技术有限公司 | Wet treatment device and control method therefor, storage medium, and electronic device |
| CN112452000A (en) * | 2020-11-03 | 2021-03-09 | 李林耀 | Organic silicon production is with deposiing cauldron |
| CN112735984A (en) * | 2020-12-30 | 2021-04-30 | 上海至纯洁净系统科技股份有限公司 | Wafer surface cleaning assembly |
| CN112735984B (en) * | 2020-12-30 | 2023-01-06 | 上海至纯洁净系统科技股份有限公司 | Wafer surface cleaning assembly |
| US20220349408A1 (en) * | 2021-04-29 | 2022-11-03 | Changxin Memory Technologies, Inc. | Liquid suck-back system and liquid suck-back method |
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