CN112735984B - Wafer surface cleaning assembly - Google Patents
Wafer surface cleaning assembly Download PDFInfo
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- CN112735984B CN112735984B CN202011630206.4A CN202011630206A CN112735984B CN 112735984 B CN112735984 B CN 112735984B CN 202011630206 A CN202011630206 A CN 202011630206A CN 112735984 B CN112735984 B CN 112735984B
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- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a wafer surface cleaning assembly, comprising: one end of the supporting arm is fixedly connected with the upper end of the supporting rod, and the other end of the supporting arm is fixedly connected with a cleaning spray head; the cleaning spray head is provided with a first spray component, a second spray component and a third spray component; the first spraying member is communicated with a first conveying pipeline for conveying a first cleaning agent, the second spraying member is communicated with a second conveying pipeline for conveying a second cleaning agent, and the third spraying member is communicated with a third conveying pipeline for conveying a third cleaning agent; the lower end of the supporting rod is connected with a driving mechanism for driving the supporting rod to do lifting motion or rotating motion. Simple and compact structure, realizes the collocation and mixed use of a plurality of cleaning agents, also can use alone, improves cleaning efficiency and cleaning ability.
Description
Technical Field
The invention relates to the technical field of wafer manufacturing, in particular to a wafer surface cleaning assembly.
Background
Wafer refers to the process of cleaning the wafer used for manufacturing silicon semiconductor circuit, and removing the pollutants generated by contacting with various organic matters, particles and metals in the process of continuously processing, shaping and polishing the wafer. Is an important process step in the wafer manufacturing process.
In a semiconductor cleaning process, particularly in a high-level wafer product such as a wafer product related to a logic integrated circuit, a memory, a power device and the like, in a manufacturing process, a process related to various complicated photolithography, a wet process, deposition, oxidation and the like is performed, and a process of cleaning a substrate is performed before or after each process to remove foreign matters and particles generated in each process, thereby ensuring the accuracy and reproducibility of the subsequent process yield.
When a wafer is cleaned, various cleaning agents are often used in combination, however, in the prior art, the cleaning assembly for matching the cleaning agents is complex in structure, the matching of various cleaning agents cannot be realized, and the cleaning efficiency is not high.
Disclosure of Invention
The invention provides a wafer surface cleaning assembly, and aims to solve the technical problems that the cleaning assembly in the prior art is complex in structure, cannot realize the collocation of multiple cleaning agents, is low in cleaning efficiency and the like.
A wafer surface cleaning assembly comprising:
a support bar;
one end of the supporting arm is fixedly connected with the upper end of the supporting rod, and the other end of the supporting arm is fixedly connected with a cleaning spray head;
the cleaning spray head is positioned above the wafer, and a first spraying component, a second spraying component and a third spraying component are arranged on the cleaning spray head;
the first spraying member is communicated with a first conveying pipeline for conveying a first cleaning agent and is used for spraying the first cleaning agent to the wafer, the second spraying member is communicated with a second conveying pipeline for conveying a second cleaning agent and is used for spraying the second cleaning agent to the wafer, and the third spraying member is communicated with a third conveying pipeline for conveying a third cleaning agent and is used for spraying the third cleaning agent to the wafer;
the lower end of the supporting rod is connected with a driving mechanism for driving the supporting rod to do lifting motion to enable the cleaning nozzle to reach a preset height before use, or driving the supporting rod to do rotating motion to enable the cleaning nozzle to swing back and forth to clean the wafer when in use.
Furthermore, the first conveying pipeline, the second conveying pipeline and the third conveying pipeline are all located inside the supporting rod and the supporting arm.
Furthermore, a wire outlet component is arranged at the joint of the cleaning spray head and the supporting arm, three through holes are formed in the component, the first conveying pipeline, the second conveying pipeline and the third conveying pipeline are in one-to-one correspondence with the three through holes, the first conveying pipeline penetrates through the corresponding through holes to be communicated with the first spraying component, the second conveying pipeline penetrates through the corresponding through holes to be communicated with the second spraying component, and the third conveying pipeline penetrates through the corresponding through holes to be communicated with the third spraying component.
Further, the ejection port of the third ejection member faces the wafer surface.
Furthermore, the jet orifice of the first part of the jet component is obliquely arranged with the surface of the wafer and is inclined towards the jet orifice of the third jet component;
wherein the injection range of the third injection member is larger than the injection range of the first injection member.
Furthermore, the jet orifice of the second part of the jet component is obliquely arranged with the surface of the wafer and is inclined towards the jet orifice of the third jet component;
wherein the injection range of the third injection member is larger than the injection range of the second injection member.
Further, the third injection member includes:
the top view of the injection channel is a circle, and the injection channel is communicated with the third conveying pipeline;
the injection channel comprises a first area, a second area, a third area and a fourth area;
the first area is circular, the second area is an annular area surrounding the first area, the third area is an annular area surrounding the second area, and the fourth area is an annular area surrounding the third area;
wherein, evenly set up a plurality of injection holes that are used for spouting third cleaning agent on second region and the fourth region, every injection hole all communicates with the injection passageway.
Further, each injection hole is in a needle shape, a needle head of the injection hole is communicated with the injection channel, and a needle tip of the injection hole) faces the surface of the wafer.
Further, the third spraying member further comprises a megasonic oscillating plate for generating megasonic waves when the third cleaning agent is sprayed.
Furthermore, the injection channel is also communicated with a recovery pipeline for recovering the third cleaning agent.
The beneficial technical effects of the invention are as follows: the cleaning assembly is simple and compact in structure, can be matched and mixed with various cleaning agents, and can be used independently, so that the cleaning efficiency and the cleaning capacity are improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a wafer surface cleaning assembly according to the present invention;
FIG. 2 is a schematic view of a wafer surface cleaning assembly according to the present invention;
FIG. 3 is a schematic view of a wafer surface cleaning assembly according to the present invention;
FIG. 4 is a schematic view of an embodiment of a wafer surface cleaning assembly according to the present invention;
FIGS. 5-6 illustrate the use of another embodiment of a wafer surface cleaning assembly in accordance with the present invention;
FIGS. 7-8 are schematic structural views of a third spraying member of a wafer surface cleaning assembly according to the present invention;
FIG. 9 is a schematic diagram of another embodiment of a wafer surface cleaning assembly according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
Referring to fig. 1-9, the present invention provides a wafer surface cleaning assembly, comprising:
a support bar (1);
one end of the supporting arm (2) is fixedly connected with the upper end of the supporting rod (1), and the other end of the supporting arm (2) is fixedly connected with a cleaning spray head (3);
the cleaning sprayer (3) is positioned above the wafer, and a first spraying component (4), a second spraying component (5) and a third spraying component (6) are arranged on the cleaning sprayer (3);
the first spraying member (4) is communicated with a first conveying pipeline for conveying a first cleaning agent and is used for spraying the first cleaning agent to the wafer, the second spraying member (5) is communicated with a second conveying pipeline for conveying a second cleaning agent and is used for spraying the second cleaning agent to the wafer, and the third spraying member (6) is communicated with a third conveying pipeline for conveying a third cleaning agent and is used for spraying the third cleaning agent to the wafer;
the lower end of the supporting rod (1) is connected with a driving mechanism and used for driving the supporting rod (1) to move so that the cleaning spray head (3) reaches a preset height before being used, or driving the supporting rod (1) to rotate so that the cleaning spray head (3) swings back and forth to clean the wafer when being used.
Specifically, the supporting rod (1) is arranged perpendicular to the surface of the wafer and beside the wafer bearing platform, the supporting arm (2) is arranged perpendicular to the supporting rod (1), namely horizontally arranged and parallel to the surface of the wafer, and the cleaning spray head (3) is connected to the other end of the supporting arm (2).
Specifically, the cleaning spray head (3) is a bending member and comprises a first section, a second section and a third section which are sequentially connected, the first section is horizontally arranged and connected with the supporting arm (2), the second section is vertically arranged, one end of the second section is connected with the first section, and the other end of the second section is connected with the third section. The third section is horizontally arranged, and the first injection member (4), the second injection member (5) and the third injection member (6) are arranged in the third section.
Specifically, the driving mechanism can be a servo motor, and the driving mechanism controls the supporting rod (1) to move up and down so as to adjust the distances between the first spraying component (4), the second spraying component (5) and the third spraying component (6) and the surface of the wafer. The driving mechanism is also used for controlling the supporting rod (1) to rotate when the cleaning assembly sprays the cleaning agent, so that the cleaning nozzle (3) can swing back and forth to clean the wafer when in use.
Furthermore, the first conveying pipeline, the second conveying pipeline and the third conveying pipeline are located inside the supporting rod (1) and the supporting arm (2).
Specifically, first pipeline, second pipeline and third pipeline are located bracing piece (1), support arm (2) inside to do not expose outside, make the structure look regular generous.
Furthermore, the cleaning nozzle is provided with a wire outlet member (31) at the joint of the cleaning nozzle and the support arm (2), three through holes are formed in the wire outlet member (31), a first conveying pipeline, a second conveying pipeline and a third conveying pipeline are in one-to-one correspondence with the three through holes, the first conveying pipeline penetrates through the corresponding through holes to be communicated with the first spraying member (4), the second conveying pipeline penetrates through the corresponding through holes to be communicated with the second spraying member (5), and the third conveying pipeline penetrates through the corresponding through holes to be communicated with the third spraying member (6).
Specifically, three through holes are arranged in a row.
Specifically, the wire outlet member (31) is arranged at a first section of the cleaning spray head (3).
Specifically, the outlet member (31) serves as an outlet of the pipeline, so that the pipeline is conveniently connected with the injection mechanism.
Further, the jet port of the third jet member (6) faces the surface of the wafer.
Furthermore, the jet orifice of the first part jet component (4) is obliquely arranged with the surface of the wafer and is obliquely arranged towards the jet orifice of the third jet component (6);
wherein the injection range of the third injection member (6) is larger than the injection range of the first injection member (4).
Furthermore, the jet orifice of the second part jet component (5) is obliquely arranged with the surface of the wafer and is obliquely arranged towards the jet orifice of the third jet component (6);
wherein the injection range of the third injection member (6) is larger than the injection range of the second injection member (5).
Specifically, the first injection member (4), the second injection member (5) and the third injection member (6) enclose a triangle when viewed from top to bottom.
Referring to fig. 7-8, further, the third injection member (6) comprises:
the injection channel (64), the top view of the injection channel (64) is a circle, and the injection channel (64) is communicated with the third conveying pipeline;
the injection channel comprises a first region (641), a second region (642), a third region (643) and a fourth region (644);
the first region (641) is circular, the second region (642) is an annular region surrounding the first region (641), the third region (643) is an annular region surrounding the second region (642), and the fourth region (644) is an annular region surrounding the third region (643);
wherein, a plurality of injection holes (65) for injecting the third cleaning agent are uniformly arranged on the second area (642) and the fourth area (644), and each injection hole (65) is communicated with the injection channel (64).
Further, each injection hole (65) is in a needle shape, the needle head of each injection hole (65) is communicated with the injection channel (64), and the needle tip of each injection hole (65) faces the surface of the wafer.
Further, the third spraying member (6) further comprises a megasonic oscillating plate (63) for generating megasonic waves when the third cleaning agent is sprayed.
Furthermore, the injection channel (64) is communicated with a recovery pipeline (62) for recovering the third cleaning agent.
Specifically, in one embodiment of the present invention, the first cleaning agent is nitrogen gas. The first conveying pipeline is a gas conveying pipeline, and the first injection member (4) is used for injecting nitrogen.
Specifically, the second cleaning agent and the third cleaning agent can be replaced according to different needs, and only the corresponding delivery pipeline needs to be connected to the supply pipeline of the required cleaning agent.
Specifically, as an embodiment of the present invention, the first cleaning agent is nitrogen gas, the first delivery pipe is a gas delivery pipe, and the first injection member (4) is used for injecting nitrogen gas. The second cleaning agent is SC1, for example, a mixed solution of macromolecular solution such as ammonia water and hydrogen peroxide, and the third cleaning agent is a mixed solution of micromolecular solution such as nano-level ammonia water and hydrogen peroxide.
Specifically, different cleaning agents can be selected during different cleaning processes, or two cleaning agents or three cleaning agents can be selected for combination, so as to clean the surface of the wafer.
Specifically, referring to fig. 4, as an embodiment of the present invention, when cleaning the surface of a wafer, a cleaning head (3) sprays a cleaning agent while rotating the wafer, and the wafer also rotates, and a first spray member (4) sprays nitrogen gas, a second portion spray member (5) sprays large droplets of SC1, and a third spray member (6) sprays nano-scale SC1 in a large range, thereby forming an effective diffusion radius and a cleaning agent diffusion ring on the surface of the wafer.
Specifically, as a specific embodiment of the present invention, referring to fig. 5 to 6, when the first spraying member (4) sprays nitrogen and the third spraying member (6) sprays the nano-scale SC1 in a wide range, since the spraying port of the first spraying member (4) is inclined from the wafer surface and inclined toward the spraying port of the third spraying member (6), the nano-scale SC1 is oscillated by megasonic wave, the third spraying member (6) sprays SC1 droplets with a certain radius, before the SC1 droplets enter the wafer surface, the nitrogen is sprayed onto the SC1 droplets to coat the SC1 droplet surface, so as to form a nano-scale water film, block the molecules of the SC1 droplets from agglomerating, and improve the cleaning capability of the wafer.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (7)
1. A wafer surface cleaning assembly, comprising:
a support bar (1);
one end of the supporting arm (2) is fixedly connected with the upper end of the supporting rod (1), and the other end of the supporting arm (2) is fixedly connected with a cleaning spray head (3);
the cleaning sprayer (3) is positioned above the wafer, and a first spraying component (4), a second spraying component (5) and a third spraying component (6) are arranged on the cleaning sprayer (3);
the first spraying member (4) is communicated with a first conveying pipeline for conveying a first cleaning agent and is used for spraying the first cleaning agent to the wafer, the second spraying member (5) is communicated with a second conveying pipeline for conveying a second cleaning agent and is used for spraying the second cleaning agent to the wafer, and the third spraying member (6) is communicated with a third conveying pipeline for conveying a third cleaning agent and is used for spraying the third cleaning agent to the wafer;
the lower end of the supporting rod (1) is connected with a driving mechanism and is used for driving the supporting rod (1) to do lifting motion so that the cleaning spray head (3) reaches a preset height before use, or driving the supporting rod (1) to do rotating motion so that the cleaning spray head (3) swings back and forth to clean the wafer when used;
the jet orifice of the third jet component (6) is opposite to the surface of the wafer;
the jet orifice of the first jet component (4) is obliquely arranged with the surface of the wafer and is obliquely arranged towards the jet orifice of the third jet component (6);
wherein the injection range of the third injection member (6) is larger than the injection range of the first injection member (4);
the jet orifice of the second jetting component (5) is obliquely arranged with the surface of the wafer and is obliquely arranged towards the jet orifice of the third jetting component (6);
wherein the injection range of the third injection member (6) is larger than the injection range of the second injection member (5);
the first injection member (4), the second injection member (5) and the third injection member (6) enclose a triangle when viewed from top to bottom;
the first spraying component (4) sprays nitrogen, the second spraying component (5) sprays large liquid drops of SC1, the third spraying component (6) sprays nano-scale SC1 in a large range, and a cleaning agent diffusion ring with an effective diffusion radius is formed on the surface of the wafer;
before the SC1 liquid drops enter the surface of the wafer, nitrogen is blown onto the SC1 liquid drops to coat the surface of the SC1 liquid drops to form a nano-scale water film, so that the SC1 liquid drops are prevented from being aggregated, and the cleaning capability of the wafer is improved.
2. A wafer surface cleaning assembly according to claim 1, characterized in that the first, second and third transfer ducts are located inside the support bar (1), support arm (2).
3. A wafer surface cleaning assembly according to claim 2, wherein the cleaning nozzle is provided with a line outgoing member (31) at a connection with the supporting arm (2), the line outgoing member (31) is provided with three through holes, the first delivery pipe, the second delivery pipe and the third delivery pipe are in one-to-one correspondence with the three through holes, the first delivery pipe passes through the corresponding through hole and is communicated with the first spraying member (4), the second delivery pipe passes through the corresponding through hole and is communicated with the second spraying member (5), and the third delivery pipe passes through the corresponding through hole and is communicated with the third spraying member (6).
4. A wafer surface cleaning assembly according to claim 1, wherein the third spraying means (6) comprises:
an injection channel (64), the top view of the injection channel (64) is a circle, and the injection channel (64) is communicated with the third conveying pipeline;
the injection channel comprises a first region (641), a second region (642), a third region (643) and a fourth region (644);
the first region (641) is circular, the second region (642) is an annular region surrounding the first region (641), the third region (643) is an annular region surrounding the second region (642), and the fourth region (644) is an annular region surrounding the third region (643);
wherein a plurality of injection holes (65) for injecting a third cleaning agent are uniformly arranged on the second area (642) and the fourth area (644), and each injection hole (65) is communicated with the injection channel (64).
5. The wafer surface cleaning assembly of claim 4, wherein each of the plurality of spray holes (65) is needle-shaped, a tip of the plurality of spray holes (65) is communicated with the injection channel (64), and a tip of the plurality of spray holes (65) faces the wafer surface.
6. A wafer surface cleaning assembly according to claim 4, wherein the third spray member (6) further comprises a megasonic oscillating plate (63) for generating megasonic waves when the third cleaning agent is sprayed.
7. A wafer surface cleaning assembly according to claim 4, wherein the injection channel (64) is further connected to a recovery conduit (62) for recovering the third cleaning agent.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011630206.4A CN112735984B (en) | 2020-12-30 | 2020-12-30 | Wafer surface cleaning assembly |
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| CN202011630206.4A CN112735984B (en) | 2020-12-30 | 2020-12-30 | Wafer surface cleaning assembly |
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| CN112735984B true CN112735984B (en) | 2023-01-06 |
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