CN110600405A - Cleaning device, method and storage medium - Google Patents
Cleaning device, method and storage medium Download PDFInfo
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- CN110600405A CN110600405A CN201910804727.8A CN201910804727A CN110600405A CN 110600405 A CN110600405 A CN 110600405A CN 201910804727 A CN201910804727 A CN 201910804727A CN 110600405 A CN110600405 A CN 110600405A
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- cleaned
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The embodiment of the invention provides a cleaning device, a cleaning method and a storage medium. Wherein the apparatus comprises: a turntable; the rotary table can rotate; a fixing member provided on the turntable; the device to be cleaned is fixed on the rotary table through the fixing part; wherein a hollow structure is formed between the device to be cleaned fixed on the turntable and the turntable; the rotation of the turntable drives the device to be cleaned to rotate; the first spray head is arranged above the device to be cleaned and used for spraying cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned; the second spray head is used for spraying first liquid so as to remove the cleaning agent to be flowed into the hollow structure in the process of cleaning the surface to be cleaned, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent; the number of the second spray heads is multiple; the plurality of second nozzles are arranged in a circular shape on the upper surface of the turntable.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a cleaning device, a cleaning method and a storage medium.
Background
In the semiconductor manufacturing process, the cleanliness and surface state of the wafer surface are critical to obtain high quality semiconductor devices, and therefore the wafer cleaning step must not be small. In some wafer cleaning processes, it is required to clean one surface (to-be-cleaned surface) of a wafer with a chemical cleaning solution, and it is also required to ensure that the other surface (non-cleaned surface) of the wafer does not contact with the chemical cleaning solution (the non-cleaned surface is not damaged by the chemical cleaning solution). However, in the related art, it is difficult to ensure that the other surface of the wafer does not contact the chemical cleaning solution.
Disclosure of Invention
In order to solve the existing technical problems, embodiments of the present invention provide a cleaning apparatus, a cleaning method, and a storage medium, which can clean a surface to be cleaned of a device to be cleaned and ensure that a non-cleaning surface of the device to be cleaned does not contact with a chemical cleaning solution.
An embodiment of the present invention provides a cleaning apparatus, including:
a turntable; the rotary table can rotate;
a fixing member provided on the turntable; the device to be cleaned is fixed on the rotary table through the fixing part; wherein a hollow structure is formed between the device to be cleaned fixed on the turntable and the turntable; the rotation of the turntable drives the device to be cleaned to rotate;
the first spray head is arranged above the device to be cleaned and used for spraying cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned;
the second spray head is used for spraying first liquid so as to remove the cleaning agent to be flowed into the hollow structure in the process of cleaning the surface to be cleaned, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent; the number of the second spray heads is multiple; the plurality of second nozzles are arranged in a circular shape on the upper surface of the turntable.
In the above scheme, the first liquid is deionized water.
In the above scheme, a first radius of a circle formed by the plurality of second nozzles is smaller than a second radius of the device to be cleaned.
In the above scheme, a difference between the first radius and the second radius is a first preset length.
In the above scheme, the cleaning device further includes a controller, and the controller is configured to control the second nozzle to be opened earlier than the first nozzle, and the second nozzle to be closed later than the first nozzle.
In the above scheme, the device to be cleaned is fixed on the turntable with the surface to be cleaned facing upwards.
The embodiment of the invention also provides a cleaning method, which comprises the following steps:
controlling a rotary table of the cleaning device to rotate so as to drive the device to be cleaned to rotate; the device to be cleaned is fixed on a rotary table of the cleaning device through a fixing part of the cleaning device; a hollow structure is formed between the device to be cleaned and the rotary table, wherein the device to be cleaned is fixed on the rotary table;
controlling a plurality of second spray heads of the cleaning device to spray the first liquid; a plurality of second nozzles are circularly arranged on the upper surface of the rotary table;
controlling a first spray head of the cleaning device to spray a cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned of the device to be cleaned; the first spray head is arranged above the device to be cleaned; and removing the cleaning agent to be flowed into the hollow structure by using the first liquid, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent.
In the above scheme, the first liquid is deionized water.
In the above scheme, the time when the second nozzle is opened is controlled to be earlier than the time when the first nozzle is opened, and the time when the second nozzle is closed is controlled to be later than the time when the first nozzle is closed.
An embodiment of the present invention further provides a storage medium, on which executable instructions are stored, and when the executable instructions are executed by a processor, the method implements any of the steps of the method.
The embodiment of the invention provides a cleaning device, a cleaning method and a storage medium. Wherein the apparatus comprises: a turntable; the rotary table can rotate; a fixing member provided on the turntable; the device to be cleaned is fixed on the rotary table through the fixing part; wherein a hollow structure is formed between the device to be cleaned fixed on the turntable and the turntable; the rotation of the turntable drives the device to be cleaned to rotate; the first spray head is arranged above the device to be cleaned and used for spraying cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned; the second spray head is used for spraying first liquid so as to remove the cleaning agent to be flowed into the hollow structure in the process of cleaning the surface to be cleaned, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent; the number of the second spray heads is multiple; the plurality of second nozzles are arranged in a circular shape on the upper surface of the turntable. According to the embodiment of the invention, the cleaning agent sprayed by the first spray head arranged above the device to be cleaned is used for cleaning the surface to be cleaned, and the cleaning agent which possibly flows back to the non-cleaning surface is removed by the first liquid sprayed by the second spray head circularly arranged on the upper surface of the rotary table, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent, and the damage of the non-cleaning surface of the device to be cleaned by the cleaning agent is avoided.
Drawings
FIG. 1 is a schematic external view of a wafer cleaning apparatus according to the related art;
FIG. 2 is a schematic top view of a turntable of a wafer cleaning apparatus according to the related art;
FIG. 3 is a schematic diagram illustrating a non-cleaning surface of a wafer cleaned by a chemical cleaning agent residue in the related art;
FIG. 4 is a schematic structural diagram of a cleaning apparatus according to an embodiment of the present invention;
FIG. 5 is a schematic external view of a cleaning apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic top view of a turn table of a cleaning apparatus according to an embodiment of the present invention;
fig. 7 is a schematic flow chart illustrating an implementation of the cleaning method according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following describes specific technical solutions of the present invention in further detail with reference to the accompanying drawings in the embodiments of the present invention. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The device to be cleaned in the embodiment of the present invention may include a wafer, but is not limited thereto.
A related art wafer cleaning apparatus is shown in fig. 1. The cleaning device of fig. 1 includes a turntable, a fixing member, a cleaning agent nozzle, a nitrogen nozzle, and a residual liquid collecting tank, wherein: the wafer to be cleaned is fixed on the turntable in a mode that the surface to be cleaned faces upwards through the fixing part; the rotation of the turntable can drive the wafer to be cleaned to rotate by 360 degrees; the cleaning agent nozzle is arranged above the surface to be cleaned of the wafer to be cleaned and can move in a preset area above the wafer to be cleaned, and the chemical cleaning agent sprayed by the cleaning agent nozzle can clean the surface to be cleaned of the wafer to be cleaned; the nitrogen nozzle is arranged at the geometric center of the surface of the turntable (the specific position of the nitrogen nozzle on the surface of the turntable is shown in figure 2), and the nitrogen sprayed by the nitrogen nozzle can form a nitrogen barrier layer between the wafer to be cleaned and the turntable so as to prevent the chemical cleaning agent from flowing back (wherein, the back flow refers to the process that the chemical cleaning agent flows from the surface to be cleaned of the wafer to be cleaned to the surface which is not to be cleaned of the wafer to be cleaned) to the surface which is not to be cleaned of the wafer to be cleaned; the residual liquid collecting tank is used for collecting and cleaning a chemical cleaning agent after the surface to be cleaned of the wafer to be cleaned is cleaned, and meanwhile, the chemical cleaning agent is prevented from splashing to the ground.
After the cleaning device shown in fig. 1 is used to clean the wafer to be cleaned, the chemical cleaning agent sprayed on the surface to be cleaned remains on the non-cleaning surface of the wafer to be cleaned. As shown in fig. 3, the actual test results show that: residual chemical cleaning agent exists in the area where the fixing device is contacted with the wafer to be cleaned and in the area 0.6 mm-2 mm away from the edge of the wafer to be cleaned; in the area where the fixing device is not in contact with the wafer to be cleaned, residual chemical cleaning agents exist in the area 0.3 mm-0.8 mm away from the edge of the wafer to be cleaned, and the residual chemical cleaning agents can etch the film (which can be expressed as film) on the non-cleaning surface, so that the surface of the wafer is rough, and even the surface of the wafer is damaged.
In practical application, the rotating speed of the rotary table, the preset moving area of the cleaning agent nozzle and the speed of the nitrogen sprayed by the nitrogen nozzle can be adjusted according to practical conditions. When the rotating speed of the rotary table is increased, or the speed of spraying nitrogen is increased, or the range of a preset area where the cleaning agent nozzle moves is reduced, the quantity of the chemical cleaning agent flowing back to the non-cleaning surface can be improved to a certain extent.
However, even if the above-described improvements in various parameters are made, the chemical cleaning agent may remain on the non-cleaning surface of the wafer to be cleaned. In addition, the chemical cleaning agent splashes (splashes over a baffle of the residual liquid collecting tank) due to the excessively high rotating speed of the rotary table and the nitrogen spraying speed, so that the environment of a cleaning room is deteriorated, and further the wafer to be cleaned may suffer from more serious defects; reducing the range of the preset area where the cleaning agent nozzle moves causes the uniformity of cleaning of the surface to be cleaned (here, the uniformity of cleaning refers to the influence of the uniformity of the chemical cleaning liquid amount distribution on the cleaning surface), and the cleaning time is prolonged (as can be understood by those skilled in the art, when the range of the preset area where the cleaning agent nozzle moves is reduced, the area where the wafer to be cleaned cannot be directly sprayed to the chemical cleaning agent becomes larger, in these areas, the chemical cleaning agent can only reach under the action of the centrifugal force of the turntable, the uniformity of the chemical cleaning liquid amount distribution is reduced, so that the uniformity of cleaning is deteriorated, and meanwhile, the chemical cleaning liquid needs to be waited to cover the whole surface to be cleaned, so that the cleaning time is also prolonged), so that the production efficiency is reduced.
Meanwhile, nitrogen is used as inert gas, is not easy to generate chemical reaction with other substances, and is very suitable for blocking the reverse flow of the chemical cleaning agent in the cleaning process in the cleaning device. But the nitrogen gas is used as a gas, and the controllability of the nitrogen gas flow rate (equivalent to the nitrogen gas injection rate) is poor. Specifically, the flow rate of nitrogen is generally achieved by adjusting the opening size of a valve provided in the nitrogen nozzle, and since the minimum unit value to which the valve can be adjusted is limited, there may be a case where the flow rate of nitrogen still varies greatly in the case where the opening adjustment of the valve is already the minimum unit value to which the valve can be adjusted. However, in the cleaning apparatus of fig. 1, when the flow rate of the nitrogen gas is large, the chemical cleaning agent may collide with the baffle of the residual liquid collecting tank along with the nitrogen gas flow and then splash back to the cleaning surface and the non-cleaning surface of the wafer to be cleaned, so that the chemical cleaning agent may remain on the non-cleaning surface of the wafer to be cleaned; when the flow rate of the nitrogen is small, the blocking of the chemical cleaning agent can not be well realized, so that the chemical cleaning agent flows back to the non-cleaning surface of the wafer to be cleaned to form retention.
Based on this, in various embodiments of the present invention, nitrogen is replaced by liquid with a relatively well-controlled flow rate, so as to better realize the blocking of the backflow of the chemical cleaning agent and prevent the back-splashing of the chemical cleaning agent; meanwhile, the number and the positions of the nitrogen nozzles in the related technology are optimized; specifically, the number of nozzles that eject liquid is increased and arranged in a circular manner on the upper surface of the turntable, thereby achieving finer control of the nozzles. Thus, the non-cleaning surface of the device to be cleaned can be kept from being contacted with the chemical cleaning agent.
Fig. 4 is a view showing a structural composition of a cleaning apparatus according to an embodiment of the present invention, and the cleaning apparatus 400 according to an embodiment of the present invention includes: a turntable 401, a fixing member 402, a first nozzle 403, and a second nozzle 404; wherein:
the turntable 401 is rotatable;
the fixing member 402 provided on the turntable 401; the device to be cleaned is fixed on the rotary table 401 through the fixing part 402; wherein a hollow structure is formed between the device to be cleaned fixed on the turntable 401 and the turntable 401; the rotation of the rotary table 401 drives the device to be cleaned to rotate;
the first spray head 403 is arranged above the device to be cleaned, and is used for spraying a cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned;
the second spray head 404 is used for spraying a first liquid to remove the cleaning agent to be flowed into the hollow structure in the process of cleaning the surface to be cleaned, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent; the number of the second nozzles 404 is multiple; a plurality of second spray heads 404 are arranged in a circular shape on the upper surface of the turntable 401.
Here, the turntable 401 can rotate 360 ° and can bring the device to be cleaned to rotate 360 ° together.
Here, the device to be cleaned is fixed on the turntable by a fixing member 402. In practical application, in order to prevent the contact of the turntable 401 from damaging the device to be cleaned, a hollow structure is formed between the device to be cleaned fixed on the turntable 401 and the turntable 401.
It should be noted that, in practical applications, the gap between the hollow structures may be set according to needs, and the embodiment of the present invention is not limited thereto.
The first nozzle is used for spraying cleaning agent, and the first nozzle is arranged above the surface to be cleaned of the wafer to be cleaned and can move in a preset area above the device to be cleaned.
Here, the first liquid is a liquid which is electrically non-conductive and has a cleaning effect on the device to be cleaned. Meanwhile, for better control of the flow rate of the first liquid, a plurality of second spray heads 404 are arranged in a circular manner on the upper surface of the turntable 401. In the process of cleaning the device to be cleaned, the first liquid sprayed by the second nozzle 404 can form a good barrier layer, so that the cleaning agent after cleaning flows away along with the first liquid, and the cleaning agent is prevented from flowing back to the non-cleaning surface of the wafer to be cleaned; and since there are a plurality of second nozzles 404, the adjustable minimum unit value of the flow rate of the first liquid can be well controlled, and the cleaning agent does not collide against the blocking means beside the cleaning device to form a back splash.
In practical application, after the to-be-cleaned device is fixed on the rotary table, the to-be-cleaned surface faces upwards (corresponding direction when the rotary table is looked forward), and the non-to-be-cleaned surface faces downwards (corresponding direction when the rotary table is looked forward).
An embodiment of the present invention provides a cleaning apparatus, including: a turntable; the rotary table can rotate; a fixing member provided on the turntable; the device to be cleaned is fixed on the rotary table through the fixing part; wherein a hollow structure is formed between the device to be cleaned fixed on the turntable and the turntable; the rotation of the turntable drives the device to be cleaned to rotate; the first spray head is arranged above the device to be cleaned and used for spraying cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned; the second spray head is used for spraying first liquid so as to remove the cleaning agent to be flowed into the hollow structure in the process of cleaning the surface to be cleaned, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent; the number of the second spray heads is multiple; the plurality of second nozzles are arranged in a circular shape on the upper surface of the turntable. According to the embodiment of the invention, the cleaning agent sprayed by the first spray head arranged above the device to be cleaned is used for cleaning the surface to be cleaned, and the cleaning agent which possibly flows back to the non-cleaning surface is removed by the first liquid sprayed by the second spray head circularly arranged on the upper surface of the rotary table, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent, and the non-cleaning surface of the device to be cleaned is prevented from being damaged by the cleaning agent.
In the embodiment of the present invention, an application scenario is as follows: the cleaning device is a wafer cleaning device, and the device to be cleaned is a round wafer; as shown in fig. 5, the wafer cleaning apparatus includes: a turntable 401, a fixing member 402, a first nozzle 403, and a second nozzle 404; wherein the content of the first and second substances,
the turntable 401 can rotate 360 degrees and can drive the device to be cleaned to rotate 360 degrees together. The wafer to be cleaned is fixed on the turntable 401 by a fixing member 402. In practical application, in order to prevent the wafer to be cleaned from being damaged by contact of the turntable 401, a hollow structure is formed between the wafer fixed on the turntable and the turntable 401. The first nozzle 403 is used for spraying chemical cleaning agent, and the first nozzle 403 is disposed above the surface to be cleaned of the wafer to be cleaned and can move in a preset area above the device to be cleaned. The second spray head 404 is used for spraying a first liquid to remove the cleaning agent to be flowed into the hollow structure in the process of cleaning the surface to be cleaned, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent; the number of the second nozzles 404 is multiple; a plurality of second spray heads 404 are arranged in a circular shape on the upper surface of the turntable 401.
In this application example, the first liquid is deionized water. Deionized water refers to pure water from which impurities present in the form of ions have been removed. The deionized water is not conductive, and simultaneously, the crystal to be cleaned can be cleaned.
In practical application, as shown in fig. 5, a corresponding channel for flowing deionized water is provided on the turntable 401 at a position corresponding to the position of the second nozzle 404, and a valve (not shown in fig. 5) for regulating and controlling the flow rate of deionized water is further provided in the channel.
In practical applications, the first liquid sprayed out needs to form a barrier to the chemical cleaning agent sprayed out from the first nozzle 403, and the first radius of the circle formed by the plurality of second nozzles 404 needs to be smaller than the second radius of the circle formed by the plurality of second nozzles 404, so as to remove the chemical cleaning agent that may flow back to the non-cleaning surface.
Based on this, in an embodiment, a first radius of a circle formed by the plurality of second nozzles 404 is smaller than a second radius of the circle of the device to be cleaned.
In practical application, in order to ensure a better blocking effect, a preset length is required to be controlled between a first radius of a circle formed by the plurality of second nozzles 404 and a second radius of the circle of the wafer to be cleaned, that is, a preset distance is required to be formed between the circle formed by the second nozzles and a projection of the edge of the wafer to be cleaned on the turntable (the circle center of the circle formed by the second nozzles coincides with the projection of the circle center of the wafer to be cleaned on the turntable).
Based on this, in an embodiment, the first radius and the second radius are different by a first preset length.
In practical application, the preset length may be set according to a distance between a position of the second nozzle 404 and a projection of the edge of the wafer to be cleaned on the turntable when the first liquid sprayed out can form the optimal blocking effect. For example, assuming that the radius of the wafer is 150mm, and when it is found from the experimental data that the first liquid sprayed out can form the best blocking effect, the distance between the position of the second nozzle and the projection of the edge of the wafer to be cleaned on the turntable is 2-4 mm, the preset length may be set to be 2-4 mm, and the radius of the second nozzle may be controlled to be 146-148 mm.
In practice, to ensure that all the chemical cleaning liquid is blocked from the non-cleaning surface, the second nozzle should be opened at a time earlier than the first nozzle and closed at a time later than the first nozzle.
Based on this, in an embodiment, the cleaning device further includes a controller, and the controller is configured to control the second nozzle to be opened earlier than the first nozzle and to be closed later than the first nozzle.
In practical application, the wafer cleaning device further comprises a residual liquid collecting tank, and the residual liquid collecting tank is used for collecting cleaning agents after cleaning surfaces of the to-be-cleaned devices to be cleaned.
According to the embodiment of the invention, the cleaning of the surface to be cleaned is realized through the cleaning agent sprayed by the first spray head arranged above the device to be cleaned, and the cleaning agent which possibly flows back to the non-cleaning surface is removed through the first liquid sprayed by the second spray head circularly distributed on the upper surface of the rotary table, so that the non-cleaning surface of the wafer to be cleaned is not contacted with the cleaning agent.
In addition, the deionized water can simultaneously realize the cleaning of the wafer to be cleaned, and prevent the residual chemical cleaning agent from etching the film on the non-cleaning surface or damaging the surface of the wafer; in the embodiment of the invention, the control of the cleaning agent on the non-cleaning surface of the wafer to be cleaned is realized by optimizing the second nozzle, so that the rotating speed of the turntable is not required to be as large as possible, and the range of the preset area where the cleaning agent nozzle (namely the first nozzle) moves is not required to be as small as possible, that is, the scheme of the embodiment of the invention has a larger parameter adjusting space compared with the scheme in the related art, and the larger range of the preset area where the cleaning agent nozzle moves enables the cleaning agent to be distributed uniformly, the cleaning consistency of the surface to be cleaned is better, and the cleaning time is shortened, so that the production efficiency is improved; meanwhile, the scheme of the embodiment of the invention can also reduce the risk that the chemical cleaning agent splashes out of the residual liquid collecting tank, thereby improving the environment of the cleaning chamber and further reducing the risk of wafer damage.
Based on the above apparatus, an embodiment of the present invention further provides a cleaning method, as shown in fig. 7, the cleaning method includes the following steps:
step 701: controlling a rotary table of the cleaning device to rotate so as to drive the device to be cleaned to rotate; the device to be cleaned is fixed on a rotary table of the cleaning device through a fixing part of the cleaning device; a hollow structure is formed between the device to be cleaned and the rotary table, wherein the device to be cleaned is fixed on the rotary table;
step 702: controlling a plurality of second spray heads of the cleaning device to spray the first liquid; a plurality of second nozzles are circularly arranged on the upper surface of the rotary table;
step 703: controlling a first spray head of the cleaning device to spray a cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned of the device to be cleaned; the first spray head is arranged above the device to be cleaned; and removing the cleaning agent to be flowed into the hollow structure by using the first liquid, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent.
In one embodiment, the first liquid is deionized water.
In one embodiment, a first radius of a circle formed by the plurality of second nozzles is smaller than a second radius of the device to be cleaned.
In one embodiment, the first radius and the second radius differ by a first predetermined length.
In one embodiment, the second nozzle is controlled to be opened earlier than the first nozzle, and the second nozzle is controlled to be closed later than the first nozzle.
In one embodiment, the device to be cleaned is fixed to the turntable with the surface to be cleaned facing upward.
It should be noted that, as will be clear to those skilled in the art, for convenience and brevity of description, the specific steps of the method described above may refer to the corresponding processes in the foregoing embodiments of the cleaning apparatus, and are not described herein again.
The embodiment of the invention provides a cleaning method, which comprises the following steps: controlling a rotary table of the cleaning device to rotate so as to drive the device to be cleaned to rotate; the device to be cleaned is fixed on a rotary table of the cleaning device through a fixing part of the cleaning device; a hollow structure is formed between the device to be cleaned and the rotary table, wherein the device to be cleaned is fixed on the rotary table; controlling a plurality of second spray heads of the cleaning device to spray the first liquid; a plurality of second nozzles are circularly arranged on the upper surface of the rotary table; controlling a first spray head of the cleaning device to spray a cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned of the device to be cleaned; the first spray head is arranged above the device to be cleaned; and removing the cleaning agent to be flowed into the hollow structure by using the first liquid, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent. In the embodiment of the invention, nitrogen in the related technology is replaced by liquid with relatively well-controlled flow rate, so that the backflow of the chemical cleaning agent is better blocked and the chemical cleaning agent is prevented from splashing; meanwhile, the number and the positions of the nitrogen nozzles in the related technology are optimized, and the method specifically comprises the following steps: the number of nozzles for ejecting liquid is increased and arranged on the upper surface of the turntable in a circular manner, thereby realizing finer control of the nozzles. Thus, the non-cleaning surface of the device to be cleaned can be kept from being contacted with the chemical cleaning agent.
The embodiment of the invention also provides a storage medium, wherein the storage medium stores executable instructions, and when the executable instructions are executed by at least one processor, the cleaning method provided by the embodiment of the invention is realized.
In some embodiments, the storage medium may be a magnetic random access Memory (FRAM), a Read Only Memory (ROM), a Programmable Read Only Memory (PROM), an Erasable Programmable Read Only Memory (EPROM), an Electrically Erasable Programmable Read Only Memory (EEPROM), a Flash Memory (Flash Memory), a magnetic surface Memory, an optical Disc, or a Compact Disc Read Only Memory (CD-ROM), among other memories; or may be various devices including one or any combination of the above memories.
In some embodiments, executable instructions may be written in any form of programming language (including compiled or interpreted languages), in the form of programs, software modules, scripts or code, and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or other unit suitable for use in a computing environment.
By way of example, executable instructions may correspond, but do not necessarily have to correspond, to files in a file system, and may be stored in a portion of a file that holds other programs or data, such as in one or more scripts in a hypertext markup Language (HTML) document, in a single file dedicated to the program in question, or in multiple coordinated files (e.g., files that store one or more modules, sub-programs, or portions of code).
By way of example, executable instructions may be deployed to be executed on one computing device or on multiple computing devices at one site or distributed across multiple sites and interconnected by a communication network.
It should be noted that: "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In addition, the technical solutions described in the embodiments of the present invention may be arbitrarily combined without conflict.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.
Claims (10)
1. A cleaning device, the device comprising:
a turntable; the rotary table can rotate;
a fixing member provided on the turntable; the device to be cleaned is fixed on the rotary table through the fixing part; wherein a hollow structure is formed between the device to be cleaned fixed on the turntable and the turntable; the rotation of the turntable drives the device to be cleaned to rotate;
the first spray head is arranged above the device to be cleaned and used for spraying cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned;
the second spray head is used for spraying first liquid so as to remove the cleaning agent to be flowed into the hollow structure in the process of cleaning the surface to be cleaned, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent; the number of the second spray heads is multiple; the plurality of second nozzles are arranged in a circular shape on the upper surface of the turntable.
2. The apparatus of claim 1, wherein the first liquid is deionized water.
3. The apparatus of claim 1, wherein a first radius of a circle formed by the plurality of second spray heads is smaller than a second radius of the device to be cleaned.
4. The apparatus of claim 3, wherein the first radius and the second radius differ by a first predetermined length.
5. The apparatus of claim 1, wherein the cleaning apparatus further comprises a controller for controlling the second nozzle to be opened earlier than the first nozzle and to be closed later than the first nozzle.
6. The apparatus according to claim 1, wherein the device to be cleaned is fixed to the turntable with the surface to be cleaned facing upward.
7. A method of cleaning, the method comprising:
controlling a rotary table of the cleaning device to rotate so as to drive the device to be cleaned to rotate; the device to be cleaned is fixed on a rotary table of the cleaning device through a fixing part of the cleaning device; a hollow structure is formed between the device to be cleaned and the rotary table, wherein the device to be cleaned is fixed on the rotary table;
controlling a plurality of second spray heads of the cleaning device to spray the first liquid; a plurality of second nozzles are circularly arranged on the upper surface of the rotary table;
controlling a first spray head of the cleaning device to spray a cleaning agent to the surface to be cleaned of the device to be cleaned so as to clean the surface to be cleaned of the device to be cleaned; the first spray head is arranged above the device to be cleaned; and removing the cleaning agent to be flowed into the hollow structure by using the first liquid, so that the non-cleaning surface of the device to be cleaned is not contacted with the cleaning agent.
8. The method of claim 7, wherein the first liquid is deionized water.
9. The method of claim 7, wherein the second nozzle is controlled to be open at a time earlier than a time at which the first nozzle is open and to be closed at a time later than a time at which the first nozzle is closed.
10. A storage medium having stored thereon executable instructions, which when executed by a processor, carry out the steps of the method of any one of claims 7 to 9.
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| CN201910804727.8A CN110600405A (en) | 2019-08-28 | 2019-08-28 | Cleaning device, method and storage medium |
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| CN201910804727.8A CN110600405A (en) | 2019-08-28 | 2019-08-28 | Cleaning device, method and storage medium |
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| CN112735984A (en) * | 2020-12-30 | 2021-04-30 | 上海至纯洁净系统科技股份有限公司 | Wafer surface cleaning assembly |
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