CN117810136B - Wafer etching device and etching method - Google Patents
Wafer etching device and etching method Download PDFInfo
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- CN117810136B CN117810136B CN202410201555.6A CN202410201555A CN117810136B CN 117810136 B CN117810136 B CN 117810136B CN 202410201555 A CN202410201555 A CN 202410201555A CN 117810136 B CN117810136 B CN 117810136B
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- 238000005530 etching Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 45
- 230000005540 biological transmission Effects 0.000 claims description 88
- 230000007246 mechanism Effects 0.000 claims description 64
- 238000005406 washing Methods 0.000 claims description 27
- 239000007921 spray Substances 0.000 claims description 17
- 238000001039 wet etching Methods 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 78
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 238000005485 electric heating Methods 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000012545 processing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of chip production, and particularly provides a wafer etching device and an etching method. According to the invention, the wafer body on the cross rod can be intermittently transported, so that the wafer body is sequentially etched and washed, the fan blade assembly can generate hot air to dry the wafer body only by driving the second motor, meanwhile, the rotating seat is driven to rotate, the clamping piece is automatically clamped on the wafer body by utilizing the centrifugal force of the centrifugal mass ball, the wafer body rotates and is dried at the same time, the drying area can be increased, the drying dead angle can be greatly reduced by matching with more than two second elastic pieces, the heating uniformity of the wafer body is improved, and the drying efficiency is improved.
Description
Technical Field
The invention relates to the technical field of chip production, in particular to a wafer etching device and an etching method.
Background
The utility model patent of China patent publication No. CN216528780U, publication No. 2022, no. 05 and No. 13, the patent name is a wafer wet etching device, which comprises a frame, a pair of conveying roller sets are installed on the frame, a plurality of spaced conveying belts are installed between the pair of conveying roller sets, a guide device is installed at the upstream end of the conveying belt on the frame, a lifting seat is vertically lifted and lowered below the conveying belt, a rotating seat is rotatably installed on the lifting seat around a vertical central line, the rotating seat is driven by a rotating motor installed on the lifting seat, a tray which is conveniently exposed from a gap area between the conveying belts is installed on the rotating seat, a plurality of supporting columns are arranged on the tray, a placing area which is convenient for placing wafers is formed between the plurality of supporting columns, a spraying device for spraying etching liquid is arranged above the conveying belt on the frame, the device can effectively improve wafer breakage, is convenient to position and clamp firmly, etching liquid is prevented from entering other parts due to wafer breakage, production safety is improved, and production quality is improved.
However, the above patent does not have the washing and drying functions, and the etched wafer needs to be washed and dried manually, so that the production efficiency is greatly reduced.
Disclosure of Invention
The invention aims to provide a wafer etching device and an etching method for solving the technical problems, and the invention is realized by adopting the following technical scheme:
the wafer etching device comprises a supporting chassis, a wafer conveying mechanism, a wet etching mechanism, a washing mechanism and a drying mechanism, wherein the wafer conveying mechanism, the wet etching mechanism, the washing mechanism and the drying mechanism are all arranged on the supporting chassis;
The wafer conveying mechanism comprises a vertical plate, a transverse plate, a ring fixing rod, a positioning ring, a feeding box, a fixed seat, a first motor, a first straight gear, a second straight gear, a first transmission bar, a third straight gear, a second transmission bar, a transmission plate, a conveying piece and two supporting mechanisms, wherein the vertical plate and the fixed seat are fixedly connected to the top wall of a supporting chassis;
The supporting mechanism comprises a cross rod and an inclined rod, the cross rod is fixedly connected to the side wall of the vertical plate, the inclined rod is fixedly connected to the cross rod, the cross rod is horizontally arranged, and the inclined rod is obliquely arranged;
The wet etching mechanism and the washing mechanism are arranged on the transverse plate; the wet etching mechanism comprises a wafer detection sensor and an etching liquid spray head, and the wafer detection sensor and the etching liquid spray head are fixedly connected to the bottom wall of the transverse plate; the water washing mechanism comprises a water washing nozzle which is connected to the bottom wall of the transverse plate;
The drying mechanism comprises a first transmission rod, a second transmission rod, a first wedge-shaped block, a second motor, a rotary table, a first worm wheel, a hinge rod, a second wedge-shaped block, a rotary seat, a stay wire, a first transmission wheel, a first worm and a drying box, wherein the first transmission rod is fixedly connected to the transmission plate, the second transmission rod is fixedly connected to the first transmission rod, the first wedge-shaped block is fixedly connected to the second transmission rod, the second motor and the stay wire are fixedly connected to the top wall of the supporting chassis, and the rotary table and the first worm wheel are fixedly connected to the output shaft of the second motor.
Further, the lower end of the hinging rod is hinged to the top wall of the turntable through a hinging part, the top wall of the turntable is fixedly connected with a limiting rod and a fixing plate, the limiting rod is propped against the hinging rod, a pressing piece is connected to the fixing plate through a first elastic piece, a transverse plate is propped against the hinging rod, two grooves are formed in the top wall of the turntable, the side walls of the grooves are communicated with the side walls of the turntable through connecting channels, the bottom wall of the grooves is slidably connected with clamping pieces, the upper ends of the clamping pieces extend to the upper side of the turntable, the clamping pieces are connected with the side walls of the grooves through second elastic pieces, a stay wire is fixedly connected to the side walls of the clamping pieces, one end of the stay wire penetrates through the connecting channels and extends to the outside of the turntable, a centrifugal mass ball is fixedly connected to one end of the clamping pieces, and more than two second elastic pieces are fixedly connected to the top wall of the turntable.
The first transmission wheel is rotationally connected to the side wall of the stay wire, the first worm is fixedly connected to the first transmission wheel, the first worm is meshed with the first worm wheel, the drying box is fixedly connected to the top wall of the stay wire, the drying box is provided with a first transmission cavity and a second transmission cavity, the first transmission cavity and the second transmission cavity are both communicated with the bottom wall of the drying box, the side wall of the first transmission cavity is rotationally connected with the second transmission wheel, the second transmission wheel is connected with the first transmission wheel through a transmission belt, the second transmission wheel is fixedly connected with the second worm, one end of the second worm extends into the second transmission cavity, the top wall of the second transmission cavity is rotationally connected with the second worm wheel, the second worm wheel is meshed with the second worm wheel, the bottom wall of the second worm wheel is fixedly connected with a fan blade component, and an electric heating net is erected on the side wall of the second transmission cavity and is located below the fan blade component.
Further, the top wall of the supporting chassis is detachably connected with a collecting box.
Further, an elastic buffer layer is arranged on the inner wall of the collecting box.
Further, the top wall of the inclined rod is fixedly connected with an anti-deviation plate.
Further, the top wall of the second transmission cavity is communicated with the top wall of the drying box through an airflow hole.
A wafer etching method comprising the steps of:
The wafer body is placed on the wafer conveying mechanism, and the wafer conveying mechanism can sequentially convey the wafer body to the wet etching mechanism for etching, to the water washing mechanism for water washing and to the drying mechanism for drying.
The invention has the following beneficial effects:
According to the invention, the wafer bodies in the feeding box can be pushed out one by one through more than two rotating conveying pieces, and the wafer bodies on the cross rod can be intermittently conveyed, so that the wafer bodies are sequentially etched and washed, and the fan blade assembly can generate hot air to dry the wafer bodies only through the driving of the second motor, meanwhile, the rotating seat is driven to rotate, the clamping piece is automatically clamped on the wafer bodies by utilizing the centrifugal force of the centrifugal mass ball, the wafer bodies are rotated and dried simultaneously, the drying area can be increased, the drying dead angle can be greatly reduced by matching with more than two second elastic pieces, the heating uniformity of the wafer bodies is improved, the drying efficiency is improved, the wafer bodies on the rotating seat can be automatically enabled to fall into the collecting box to be collected through the driving of the first motor after the drying is finished, the device has high automation degree, the functions are diversified, and the wafer etching efficiency and the production quality are greatly improved.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
FIG. 1 is a schematic diagram of a wafer etching apparatus according to the present invention;
FIG. 2 is an enlarged view of the invention at A in FIG. 1;
FIG. 3 is an enlarged view of the swivel mount of FIG. 1 in accordance with the invention;
FIG. 4 is an enlarged view of the transmission case of FIG. 1 in accordance with the present invention;
FIG. 5 is a top view of the cross plate, cross bar and diagonal members of FIG. 1 in accordance with the present invention;
FIG. 6 is a top view of the first wedge block and the second wedge block of FIG. 1 in accordance with the present invention;
Fig. 7 is a right side view of the turntable of fig. 1 in accordance with the present invention.
Reference numerals: 1. a support chassis; 2. a riser; 3. a cross plate; 4. a wafer detection sensor; 5. etching liquid spray head; 6. washing the spray head; 7. a cross bar; 8. a diagonal rod; 9. an anti-deviation plate; 10. a ring fixing rod; 11. a positioning ring; 12. feeding a material box; 13. a movable bottom plate; 14. a limiting block; 15. a wafer body; 16. a fixing seat; 17. a first motor; 18. a first straight gear; 19. a second spur gear; 20. a first transmission bar; 21. a third spur gear; 22. a second transmission bar; 23. a drive plate; 24. a transport member; 25. a first transmission rod; 26. a second transmission rod; 27. a first wedge block; 28. a second motor; 29. a turntable; 30. a first worm wheel; 31. a hinge part; 32. a hinge rod; 33. a limit rod; 34. a fixing piece; 35. a first elastic member; 36. tabletting; 37. a second wedge block; 38. rotating base; 39. a groove; 40. a connection channel; 41. a clamping piece; 42. a second elastic member; 43. a pull wire; 44. centrifuging the mass ball; 45. a first driving wheel; 46. a first worm; 47. a transmission belt; 48. a second driving wheel; 49. a second worm wheel; 50. a fan blade assembly; 51. an electric heating net; 52. a second worm; 53. an air flow hole; 54. a drying box; 55. a first transmission chamber; 56. a second transmission chamber; 57. and (5) collecting a box.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," "fourth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, connected via an intermediary, or connected by communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1 to 7, a wafer etching device comprises a supporting chassis 1, a wafer transporting mechanism, a wet etching mechanism, a washing mechanism and a drying mechanism, wherein the wafer transporting mechanism, the wet etching mechanism, the washing mechanism and the drying mechanism are all arranged on the supporting chassis 1;
the wafer transportation mechanism comprises a vertical plate 2, a transverse plate 3, a ring fixing rod 10, a positioning ring 11, an upper feed box 12, a fixed seat 16, a first motor 17, a first straight gear 18, a second straight gear 19, a first transmission bar 20, a third straight gear 21, a second transmission bar 22, a transmission plate 23, a transportation piece 24 and two supporting mechanisms, wherein the vertical plate 2 and the fixed seat 16 are fixedly connected to the top wall of the supporting chassis 1, the transverse plate 3 and the ring fixing rod 10 are fixedly connected to the side wall of the vertical plate 2, the positioning ring 11 is fixedly connected to the ring fixing rod 10, the bottom wall of the upper feed box 12 is slidably connected with a movable bottom plate 13, more than two wafer bodies 15 are stacked in the upper feed box 12, the side wall of the upper feed box 12 is fixedly connected with a limiting block 14, the upper feed box 12 passes through the positioning ring 11, the bottom wall of the limiting block 14 and the top wall of the positioning ring 11, the first motor 17 is fixedly connected to the front wall of the fixed seat 16, the first straight gear 18 is fixedly connected to the output shaft of the first motor 17, the second straight gear 19 and the third straight gear 21 are rotatably connected to the front wall of the fixed seat 16, the second straight gear 19 and the third straight gear 21 are rotatably connected to the front wall of the transmission bar 20 and the transmission piece 23 respectively;
the supporting mechanism comprises a cross rod 7 and an inclined rod 8, wherein the cross rod 7 is fixedly connected to the side wall of the vertical plate 2, the inclined rod 8 is fixedly connected to the cross rod 7, the cross rod 7 is horizontally arranged, and the inclined rod 8 is obliquely arranged;
The wet etching mechanism and the washing mechanism are arranged on the transverse plate 3; the wet etching mechanism comprises a wafer detection sensor 4 and an etching liquid spray head 5, wherein the wafer detection sensor 4 and the etching liquid spray head 5 are fixedly connected to the bottom wall of the transverse plate 3; the water washing mechanism comprises a water washing spray head 6, and the water washing spray head 6 is connected to the bottom wall of the transverse plate 3;
The drying mechanism comprises a first transmission rod 25, a second transmission rod 26, a first wedge-shaped block 27, a second motor 28, a rotary table 29, a first worm wheel 30, a hinging rod 32, a second wedge-shaped block 37, a rotary seat 38, a pull wire 43, a first transmission wheel 45, a first worm 46 and a drying box 54, wherein the first transmission rod 25 is fixedly connected to the transmission plate 23, the second transmission rod 26 is fixedly connected to the first transmission rod 25, the first wedge-shaped block 27 is fixedly connected to the second transmission rod 26, the second motor 28 and the pull wire 43 are fixedly connected to the top wall of the supporting chassis 1, and the rotary table 29 and the first worm wheel 30 are fixedly connected to the output shaft of the second motor 28.
According to an alternative embodiment of the invention, the lower end of the hinging rod 32 is hinged to the top wall of the turntable 29 through the hinging part 31, the top wall of the turntable 29 is fixedly connected with the limiting rod 33 and the fixing piece 34, the limiting rod 33 is propped against the hinging rod 32, the fixing piece 34 is connected with the pressing piece 36 through the first elastic piece 35, the transverse plate 3 is propped against the hinging rod 32, the top wall of the swivel seat 38 is provided with two grooves 39, the side walls of the grooves 39 are communicated with the side walls of the swivel seat 38 through the connecting channel 40, the bottom wall of the grooves 39 is slidably connected with the clamping piece 41, the upper end of the clamping piece 41 extends above the swivel seat 38, the clamping piece 41 is connected with the side walls of the grooves 39 through the second elastic piece 42, the side walls of the clamping piece 41 are fixedly connected with the pull wire 43, one end of the pull wire 43 extends to the outside of the swivel seat 38 through the connecting channel 40, one end of the clamping piece 41 is fixedly connected with the centrifugal mass ball 44, and the top wall of the swivel seat 38 is fixedly connected with more than two second elastic pieces 42;
The first driving wheel 45 is rotationally connected to the side wall of the stay wire 43, the first worm 46 is fixedly connected to the first driving wheel 45, the first worm 46 is meshed with the first worm wheel 30, the drying box 54 is fixedly connected to the top wall of the stay wire 43, a first driving cavity 55 and a second driving cavity 56 are formed in the drying box 54, the first driving cavity 55 and the second driving cavity 56 are communicated with the bottom wall of the drying box 54, the side wall of the first driving cavity 55 is rotationally connected with the second driving wheel 48, the second driving wheel 48 is connected with the first driving wheel 45 through a driving belt 47, a second worm 52 is fixedly connected to the second driving wheel 48, one end of the second worm 52 extends into the second driving cavity 56, a second worm wheel 49 is rotationally connected to the top wall of the second driving cavity 56, the second worm wheel 49 is meshed with the second worm 52, a fan blade assembly 50 is fixedly connected to the bottom wall of the second worm wheel 49, an electric heating net 51 is erected on the side wall of the second driving cavity 56, and the electric heating net 51 is located below the fan blade assembly 50.
The electric heating net 51 may be used to perform a heating function by using the prior art, for example, the electric heating net 51 is an iron net, and the iron net is connected to a heating device, and the heating device may heat the iron net to raise the temperature of the iron net.
In an alternative embodiment according to the invention, the top wall of the support chassis 1 is detachably connected with a collecting box 57.
In an alternative embodiment according to the invention, the inner wall of the collecting tank 57 is provided with an elastic buffer layer.
In an alternative embodiment of the invention, the top wall of the diagonal rod 8 is fixedly connected with an anti-deflection plate 9.
In an alternative embodiment according to the present invention, the top wall of the second transfer chamber 56 communicates with the top wall of the drying box 54 through the air flow hole 53.
A wafer etching method comprising the steps of:
the wafer body 15 is placed on the wafer transporting mechanism, and the wafer transporting mechanism sequentially transports the wafer body 15 to the wet etching mechanism for etching, to the water washing mechanism for water washing and to the drying mechanism for drying.
The implementation process comprises the following steps:
A processing module can be arranged in the supporting chassis 1, and the processing module is used for data analysis and control of all components to work.
At first, the movable bottom plate 13 seals the inner cavity of the upper feed box 12, the wafer body 15 to be processed is stacked in the upper feed box 12, the movable bottom plate 13 supports the wafer body 15, the upper feed box 12 passes through the positioning ring 11, the limiting block 14 and the positioning ring 11 are propped against each other, the movable bottom plate 13 is pulled leftwards so that the wafer body 15 in the upper feed box 12 falls for a small distance, the lowest wafer body 15 is propped against the top walls of the two cross bars 7, the first motor 17 is started, the first motor 17 drives the first straight gear 18 to rotate, the first straight gear 18 drives the second straight gear 19 and the third straight gear 21 to rotate, thereby driving the first transmission bar 20, the second transmission bar 22, the transmission plate 23 and all the conveying pieces 24 to rotate clockwise, the transmission plate 23 always keeps a horizontal state, the conveying pieces 24 push the lowest wafer body 15 in the upper feed box 12 to move rightwards for a certain distance, every turn of the transmission plate 23 pushes the lowermost wafer body 15 in the feeding box 12 to the right, and pushes the wafer bodies 15 on the top walls of all the cross rods 7 to the right, when the wafer detection sensor 4 detects that the wafer bodies 15 are below, the etching liquid spray head 5 sprays etching liquid to the wafer bodies 15 below the wafer detection sensor 4 to etch, after etching is finished, the wafer bodies 15 are conveyed to the lower part of the washing spray head 6 by the conveying member 24, the washing spray head 6 continuously sprays clean water to wash the wafer bodies 15, chips and etching liquid are washed, when the wafer bodies 15 are conveyed to the inclined rods 8, the wafer bodies 15 slide onto the second elastic members 42 on the top walls of the rotary bases 38 along the inclined rods 8, the wafer bodies 15 are positioned between the two clamping pieces 41, the second motor 28 and the electric heating net 51 are started, the output shaft of the second motor 28 rotates, thereby driving the turntable 29, the hinging rod 32, the swivel mount 38, the first worm wheel 30, the first worm 46, the first driving wheel 45, the driving belt 47, the second driving wheel 48, the second worm 52, the second worm wheel 49 and the fan blade assembly 50 to rotate rapidly, the fan blade assembly 50 rotates rapidly to generate wind, the wind becomes hot wind after passing through the high-temperature electric heating net 51 and blows to the wafer body 15 of the swivel mount 38, the second elastic piece 42 frames the wafer body 15 to enable the bottom wall of the wafer body 15 to have a gap, so that the hot wind can dry all surfaces of the wafer body 15, the drying dead angle is reduced, when the swivel mount 38 rotates, the two centrifugal mass balls 44 fly outwards under the centrifugal force, so that the clamping pieces 41 are pulled by the pull wire 43 to overcome the elasticity of the second elastic piece 42 to move horizontally, the two clamping pieces 41 are close to each other, the wafer body 15 is clamped, after the drying is finished, the output shaft of the second motor 28 stops rotating gradually, the output shaft of the second motor 28 controls the swivel mount 38 to reset, the two centrifugal mass balls 44 naturally droop, the clamping piece 41 resets under the action of the elastic force of the second elastic piece 42, the clamping piece 41 releases the clamping of the wafer body 15, when the transporting piece 24 pushes the other wafer body 15 onto the diagonal rod 8, the first wedge block 27 moves right at the same time, the first wedge block 27 pushes the second wedge block 37 to move forward, so that the hinge rod 32 overcomes the elastic force of the first elastic piece 35 to rotate backwards, the swivel mount 38 tilts, the wafer body 15 on the swivel mount 38 slides into the collecting box 57 to be collected, the elastic buffer layer can protect the wafer body 15, when the first wedge block 27 leaves the second wedge block 37, the hinge rod 32 is pushed by the pressing piece 36 to reset to a vertical state under the elastic force of the first elastic piece 35, the swivel mount 38 resets to a horizontal state, at this time, the wafer body 15 on the bevel lever 8 will slide onto the swivel base 38, and the same principle of the above-mentioned drying operation is performed.
The first motor 17 and the second motor 28 may each be a waterproof motor.
According to the invention, the wafer bodies 15 in the feeding box 12 can be pushed out one by one through more than two rotating conveying pieces 24, and the wafer bodies 15 on the cross rod 7 can be intermittently conveyed, so that the wafer bodies 15 are sequentially etched and washed, the fan blade assembly 50 can generate hot air to dry the wafer bodies 15 only through the driving of one second motor 28, meanwhile, the rotating seat 38 is driven to rotate, the clamping piece 41 is automatically clamped on the wafer bodies 15 by utilizing the centrifugal force of the centrifugal mass balls 44, the wafer bodies 15 can be rotated and dried while the drying area can be increased, the drying dead angle can be greatly reduced by matching with more than two second elastic pieces 42, the heating uniformity of the wafer bodies 15 is improved, the drying efficiency is improved, the wafer bodies 15 on the rotating seat 38 can be automatically dropped into the collecting box 57 to be collected through the driving of the first wedge-shaped block 27 through the first motor 17 after the drying is finished, the automation degree of the device is high, the functions are diversified, and the etching efficiency and the production quality of the wafer are greatly improved.
The components, modules, mechanisms and devices of the invention, which do not describe the structure in detail, are all common standard components or components known to those skilled in the art, and the structure and principle thereof are all known to those skilled in the art through technical manuals or through routine experimental methods.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (7)
1. The wafer etching device is characterized by comprising a supporting chassis (1), a wafer conveying mechanism, a wet etching mechanism, a washing mechanism and a drying mechanism, wherein the wafer conveying mechanism, the wet etching mechanism, the washing mechanism and the drying mechanism are all arranged on the supporting chassis (1);
The wafer conveying mechanism comprises a vertical plate (2), a transverse plate (3), a ring fixing rod (10), a positioning ring (11), a feeding box (12), a fixed seat (16), a first motor (17), a first straight gear (18), a second straight gear (19), a first transmission bar (20), a third straight gear (21), a second transmission bar (22), a transmission plate (23), a conveying piece (24) and two supporting mechanisms, wherein the vertical plate (2) and the fixed seat (16) are fixedly connected to the top wall of a supporting chassis (1), the transverse plate (3) and the ring fixing rod (10) are fixedly connected to the side wall of the vertical plate (2), the positioning ring (11) is fixedly connected to the ring fixing rod (10), the bottom wall of the feeding box (12) is slidably connected with a movable bottom plate (13), more than two wafer bodies (15) are stacked in the feeding box (12), a limiting block (14) is fixedly connected to the side wall of the feeding box (12), the limiting block (14) is abutted to the top wall of the positioning ring (11), the first motor (17) is fixedly connected to the front wall (16) of the first straight gear (18) and the first straight gear (19) is fixedly connected to the front output shaft (17), the second straight gear (19) and the third straight gear (21) are respectively meshed with the first straight gear (18), the first transmission bar (20) is rotationally connected to the front wall of the second straight gear (19), the second transmission bar (22) is rotationally connected to the front wall of the third straight gear (21), the first transmission bar (20) and the second transmission bar (22) are fixedly connected with the transmission plate (23), and more than two conveying pieces (24) are fixedly connected to the top wall of the transmission plate (23);
the supporting mechanism comprises a cross rod (7) and an inclined rod (8), wherein the cross rod (7) is fixedly connected to the side wall of the vertical plate (2), the inclined rod (8) is fixedly connected to the cross rod (7), the cross rod (7) is horizontally arranged, and the inclined rod (8) is obliquely arranged;
The wet etching mechanism and the washing mechanism are arranged on the transverse plate (3); the wet etching mechanism comprises a wafer detection sensor (4) and an etching liquid spray head (5), wherein the wafer detection sensor (4) and the etching liquid spray head (5) are fixedly connected to the bottom wall of the transverse plate (3); the water washing mechanism comprises a water washing spray head (6), and the water washing spray head (6) is connected to the bottom wall of the transverse plate (3);
The drying mechanism comprises a first transmission rod (25), a second transmission rod (26), a first wedge-shaped block (27), a second motor (28), a rotary table (29), a first worm wheel (30), a hinge rod (32), a second wedge-shaped block (37), a rotary seat (38), a stay wire (43), a first transmission wheel (45), a first worm (46) and a drying box (54), wherein the first transmission rod (25) is fixedly connected to the transmission plate (23), the second transmission rod (26) is fixedly connected to the first transmission rod (25), the first wedge-shaped block (27) is fixedly connected to the second transmission rod (26), the second motor (28) and the stay wire (43) are fixedly connected to the top wall of the supporting chassis (1), and the rotary table (29) and the first worm wheel (30) are fixedly connected to the output shaft of the second motor (28).
2. The wafer etching device according to claim 1, wherein the lower end of the hinging rod (32) is hinged to the top wall of the turntable (29) through the hinging part (31), the top wall of the turntable (29) is fixedly connected with a limiting rod (33) and a fixing piece (34), the limiting rod (33) is propped against the hinging rod (32), the fixing piece (34) is connected with a pressing piece (36) through a first elastic piece (35), the transverse plate (3) is propped against the hinging rod (32), the top wall of the swivel base (38) is provided with two grooves (39), the side walls of the grooves (39) are communicated with the side walls of the swivel base (38) through a connecting channel (40), the bottom wall of the grooves (39) is slidably connected with a clamping piece (41), the upper end of the clamping piece (41) is extended to the upper side wall of the swivel base (38), the side wall of the clamping piece (41) is fixedly connected with a pull wire (43), one end of the pull wire (43) penetrates through the connecting channel (40) to the outside of the swivel base (38), and one end of the clamping piece (41) is fixedly connected with a centrifugal mass ball (44), and the upper two upper walls of the clamping piece (42) are fixedly connected with the upper ends of the swivel base (42).
The first transmission wheel (45) is rotationally connected to the side wall of the stay wire (43), the first worm (46) is fixedly connected to the first transmission wheel (45), the first worm (46) is meshed with the first worm wheel (30), the drying box (54) is fixedly connected to the top wall of the stay wire (43), the drying box (54) is provided with a first transmission cavity (55) and a second transmission cavity (56), the first transmission cavity (55) and the second transmission cavity (56) are communicated with the bottom wall of the drying box (54), the side wall of the first transmission cavity (55) is rotationally connected with a second transmission wheel (48), the second transmission wheel (48) is connected with the first transmission wheel (45) through a transmission belt (47), a second worm (52) is fixedly connected to the second transmission wheel (48), one end of the second worm (52) extends into the second transmission cavity (56), the top wall of the second transmission cavity (56) is rotationally connected with a second transmission cavity (49), the second worm wheel (49) is meshed with the second worm wheel (52), the bottom wall of the second transmission cavity (56) is fixedly connected with a fan blade assembly (50), and the second worm wheel transmission cavity (56) is erected with an electrothermal wire (51), and the electrothermal wire (51) is located below the electrothermal wire assembly.
3. A wafer etching apparatus according to claim 2, wherein the top wall of the support chassis (1) is detachably connected with a collecting box (57).
4. A wafer etching apparatus according to claim 3, wherein the inner wall of the collection chamber (57) is provided with an elastic buffer layer.
5. A wafer etching apparatus according to claim 4, wherein the top wall of the inclined rod (8) is fixedly connected with an anti-deflection plate (9).
6. A wafer etching apparatus according to claim 5, wherein the top wall of the second transmission chamber (56) is communicated with the top wall of the drying box (54) through the air flow hole (53).
7. A wafer etching method, characterized in that it is based on the wafer etching apparatus of any one of claims 1-6, comprising the steps of:
The wafer body (15) is placed on the wafer conveying mechanism, and the wafer conveying mechanism can sequentially convey the wafer body (15) to the wet etching mechanism for etching, to the water washing mechanism for water washing and to the drying mechanism for drying.
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| CN202410201555.6A CN117810136B (en) | 2024-02-23 | 2024-02-23 | Wafer etching device and etching method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN205406498U (en) * | 2016-03-25 | 2016-07-27 | 苏州晶洲装备科技有限公司 | Wafer etching apparatus |
| CN112133659A (en) * | 2020-09-30 | 2020-12-25 | 青田林心半导体科技有限公司 | Semiconductor wafer surface cleaning and safe storage protection box |
| CN213670789U (en) * | 2020-09-29 | 2021-07-13 | 无锡亚电智能装备有限公司 | Auxiliary rolling mechanism for internal wafer of split-frame type wafer cleaning equipment |
| CN114562874A (en) * | 2022-03-02 | 2022-05-31 | 浙江光特科技有限公司 | Drying treatment device used after wafer cleaning |
| CN218821441U (en) * | 2022-10-08 | 2023-04-07 | 苏州英尔捷半导体有限公司 | Wafer drying device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205406498U (en) * | 2016-03-25 | 2016-07-27 | 苏州晶洲装备科技有限公司 | Wafer etching apparatus |
| CN213670789U (en) * | 2020-09-29 | 2021-07-13 | 无锡亚电智能装备有限公司 | Auxiliary rolling mechanism for internal wafer of split-frame type wafer cleaning equipment |
| CN112133659A (en) * | 2020-09-30 | 2020-12-25 | 青田林心半导体科技有限公司 | Semiconductor wafer surface cleaning and safe storage protection box |
| CN114562874A (en) * | 2022-03-02 | 2022-05-31 | 浙江光特科技有限公司 | Drying treatment device used after wafer cleaning |
| CN218821441U (en) * | 2022-10-08 | 2023-04-07 | 苏州英尔捷半导体有限公司 | Wafer drying device |
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