CN108646523A - Elargol circuit developing process - Google Patents
Elargol circuit developing process Download PDFInfo
- Publication number
- CN108646523A CN108646523A CN201810455231.XA CN201810455231A CN108646523A CN 108646523 A CN108646523 A CN 108646523A CN 201810455231 A CN201810455231 A CN 201810455231A CN 108646523 A CN108646523 A CN 108646523A
- Authority
- CN
- China
- Prior art keywords
- conductive film
- developing
- water
- silver colloid
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000005406 washing Methods 0.000 claims abstract description 40
- 239000007921 spray Substances 0.000 claims abstract description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 76
- 229910052709 silver Inorganic materials 0.000 claims description 76
- 239000004332 silver Substances 0.000 claims description 76
- 239000000084 colloidal system Substances 0.000 claims description 68
- 238000005507 spraying Methods 0.000 claims description 55
- 238000007605 air drying Methods 0.000 claims description 13
- 238000000861 blow drying Methods 0.000 claims description 11
- 238000007664 blowing Methods 0.000 claims description 8
- 238000007602 hot air drying Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 abstract description 10
- 239000002245 particle Substances 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 7
- 238000007599 discharging Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 206010027146 Melanoderma Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- -1 organic matters Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses elargol circuit developing process, include the following steps：It is fed forward conductive film using transmission device, conductive film is made to discharge after development spray position, the first cold wind cut position, washing spray position and air-dried position；When conductive film is by development spray position, the line width that elargol ink and the elargol circuit of exposure are printed with using elargol developer solution spray is 15um conductive films below, and the elargol developer solution under drenching returns in developing trough；When conductive film cuts position by the first cold wind, conductive film is tangentially brushed using cold wind, the solution adhered on conductive film is come back in developing trough；When conductive film is by washing spray position, room temperature water spray conductive film is utilized.Conductive film is tangentially brushed using cold wind, the elargol ink of some elargol developer solutions and dissolving for adhering on conductive film can be come back in developing trough, be avoided the impurity such as the resin adhered on conductive film, Ag particles from being cured on conductive film, effectively prevent conductive film dirty.
Description
Technical Field
The invention belongs to the field of touch screens, and particularly relates to a silver colloid line developing process.
Background
The touch screen comprises a conductive film, wherein a touch circuit is arranged on the conductive film, and the touch circuit realizes frame wiring through a silver colloid circuit and even bridges through the silver colloid circuit. In order to ensure the precision of the silver paste circuit, the silver paste circuit is usually processed by printing, exposing and developing.
The existing developing process of the silver colloid circuit comprises the following steps: post exposure guidesThe electric film is sequentially processed by silver colloid developing solution (the concentration is 2.0 +/-0.2 g/l, the spray pressure is 1.0 +/-0.2 kg/cm)2) Spraying, hot air cutting, water washing spraying (spraying pressure is 1.0 +/-0.2 kg/cm)2) And after air drying, discharging; the silver colloid developing solution has high concentration and strong cleaning capability, even if partial Ag particles, resin and other impurities are solidified on the surface of the conductive film during hot air cutting, the silver colloid developing solution can be peeled from the conductive film during subsequent high-pressure washing, but the exposed silver colloid can not be washed away only if the line width of the exposed silver colloid reaches more than 20 mu m, the developed lines are smooth and complete, and no visible dirt phenomenon exists in the appearance;
in order to prevent the silver colloid circuit from being washed away by developing and spraying, the silver colloid circuit with the line width below 15um needs to use lower developing concentration and spraying pressure (the higher the concentration is, the faster the silver colloid reaction rate is, the silver colloid is easy to drop off, the larger the spraying pressure is, the stronger the cleaning capability is, and the fine line circuit is easy to wash away). However, since the developing concentration and the spraying pressure are reduced, after the silver colloid is developed and sprayed, resin and Ag ions in the solution can be solidified through hot air cutting, so that the washing capacity of the subsequent washing step is insufficient, Ag impurities cannot be washed away, and the pollution phenomenon is formed.
Disclosure of Invention
The invention aims to provide a developing process of a silver colloid circuit, which aims to solve the technical problem that the development of a superfine silver colloid circuit by using the existing developing process of the silver colloid circuit causes the pollution of a conductive film after the development.
In order to solve the technical problems, the developing process of the silver colloid circuit adopts the technical scheme that:
the developing process of the silver colloid circuit comprises the following steps: the conductive film is conveyed forwards by a conveying device, and the conductive film is discharged after passing through a developing spraying position, a first cold air cutting position, a water washing spraying position and an air drying position;
when the conductive film passes through the developing spraying position, spraying the conductive film printed with the silver colloid ink and with the line width of an exposed silver colloid circuit below 15um by using a silver colloid developing solution, and returning the sprayed silver colloid developing solution to the developing tank;
when the conductive film passes through the first cold air cutting position, the conductive film is blown tangentially by cold air, and the solution attached to the conductive film is driven back to the developing tank;
and when the conducting film passes through the washing spraying position, the conducting film is sprayed by cold water, and the sprayed water returns to the water tank below the washing spraying position.
Further, the conducting film passes through a prewashing position and a second cold air cutting position which are positioned between the first cold air cutting position and the water washing spraying position when being conveyed forwards;
when the conducting film passes through the pre-washing position, spraying the conducting film by using cold water, and returning the sprayed water to the water tank below the pre-washing position;
and when the conducting film passes through the second cold air cutting position, blowing the conducting film by using cold air to drive the water attached to the conducting film back to the water washing spraying position.
Specifically, when the conductive film passes through the developing spraying position, the concentration is 1.2 +/-0.2 g/L, and the spraying pressure is 0.5 +/-0.2 kg/cm2The conductive film is sprayed by the silver colloid developing solution.
Specifically, the developing spray position is divided into three sections, and the conductive film sequentially passes through a first section, a second section and a third section.
Specifically, when the conducting film passes through a water washing spraying position, the spraying pressure is 0.5 +/-0.2 kg/cm2The conductive film is sprayed with the cold water.
Specifically, the water washing and spraying positions are divided into three sections, and the conducting film sequentially passes through the first section, the second section and the third section.
Specifically, when the conductive film passes through the pre-washing position, the spraying pressure is 0.5 +/-0.2kg/cm2The conductive film is sprayed with the cold water.
Specifically, the air drying position comprises a cold air drying position and a hot air drying position; the conducting film passing through the washing and spraying position passes through a cold air blow-drying position and then passes through a hot air blow-drying position;
when the conducting film passes through the cold air blow-drying position, blowing the conducting film by using cold air to blow off water attached to the conducting film;
and when the conductive film passes through the hot air blow-drying position, blowing the conductive film by utilizing hot air to evaporate the fine water drops on the conductive film.
The developing process of the silver colloid circuit provided by the invention has the beneficial effects that: the conducting film is firstly sprayed by the silver colloid developing solution, unexposed silver colloid ink on the conducting film can be dissolved by the silver colloid developing solution, the silver colloid developing solution flows into the developing tank together with the dissolved silver colloid ink, the conducting film is blown at the first cold air cutting position by utilizing cold air in a tangential direction, some silver colloid developing solution attached to the conducting film and the dissolved silver colloid ink can be driven back to the developing tank, meanwhile, the phenomenon that the conducting film is heated to cause the impurities such as resin and Ag particles attached to the conducting film to be solidified on the conducting film is avoided, the conducting film is further cleaned by water washing and spraying, air drying and discharging are carried out, the phenomenon that black spots are formed because the Ag particles are solidified on the conducting film by the resin is avoided, and the conducting film is effectively prevented from being dirty.
Drawings
Fig. 1 is a flowchart of a developing process of a silver paste line according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, a developing process of a silver paste line according to the present invention will now be described. The developing process of the silver colloid circuit comprises the following steps: the conducting film is conveyed forwards by a conveying device, and the conducting film is discharged after passing through a developing spraying position, a first cold air cutting position, a water washing spraying position and an air drying position; wherein,
when the conductive film passes through the developing spraying position, spraying the conductive film printed with the silver colloid ink and exposed with the silver colloid circuit with the line width below 15um by using a silver colloid developing solution, and returning the sprayed silver colloid developing solution to the developing tank;
when the conductive film passes through the first cold air cutting position, the conductive film is blown tangentially by cold air, and the solution attached to the conductive film is driven back to the developing tank;
when the conducting film passes through the washing spraying position, cold water is used for spraying the conducting film, and the sprayed water returns to the water tank below the washing spraying position. The cold wind in this application can be natural wind, and cold water can be normal atmospheric temperature water.
Compared with the prior art, the developing process of the silver colloid circuit provided by the invention has the advantages that the conductive film is firstly sprayed by the silver colloid developing solution, the unexposed silver colloid ink on the conductive film can be dissolved by the silver colloid developing solution, the silver colloid developing solution and the dissolved silver colloid ink flow into the developing tank together, the conductive film is blown tangentially by cold air at the first cold air cutting position, some silver colloid developing solution and the dissolved silver colloid ink attached to the conductive film can be driven back to the developing tank, meanwhile, the impurities such as resin and Ag particles attached to the conductive film due to heating of the conductive film are prevented from being solidified on the conductive film, the conductive film is further cleaned by water spraying, and then air drying and discharging are carried out, so that black spots formed due to solidification of the Ag particles on the conductive film by the resin are avoided, and the conductive film is effectively prevented from being dirty.
Further, the conducting film passes through a prewashing position and a second cold air cutting position between the first cold air cutting position and the water washing spraying position when being conveyed forwards;
when the conductive film passes through the prewashing position, spraying the conductive film by using cold water, and returning the sprayed water to the water tank below the prewashing position;
and when the conducting film passes through the second cold air cutting position, blowing the conducting film by using cold air to drive water attached to the conducting film back to the water washing spraying position.
When the conductive film is sprayed by the silver colloid developing solution, the unexposed silver colloid ink on the conductive film can be washed away by the silver colloid developing solution, but some impurities such as Ag particles and organic matters remain on the conductive film, the conductive film is sprayed by cold water to clean off some impurities attached on the conductive film, the conductive film is blown tangentially by cold air at a second cold air cutting position to return the water, Ag particles and organic matters attached on the conductive film to a water tank below a pre-washing position, meanwhile, impurities such as organic matters, Ag particles and the like attached to the conductive film due to heating of the conductive film are prevented from being solidified on the conductive film, and after the conductive film is further cleaned by water washing and spraying, air-dry, the ejection of compact avoids forming the black spot because Ag particle is solidified on the conducting film by the organic matter, effectively prevents the conducting film smudging, avoids because of the bad phenomenon of the outward appearance that the washing is not enough leads to.
Specifically, when the conductive film passes through the developing spraying position, the concentration is 1.2 +/-0.2 g/L, and the spraying pressure is 0.5 +/-0.2 kg/cm2The silver colloid developing solution sprays the conductive film. Not only ensures the ability of enough cleaning unexposed silver colloid, but also avoids the exposed silver colloid from dropping caused by overhigh concentration and overlarge spray pressure of the silver colloid developing solution.
Specifically, the developing spray position is divided into three sections, and the conductive film sequentially passes through a first section, a second section and a third section thereof. And the conducting film is sprayed with the silver colloid developing solution for three times, so that the cleaning effect can be improved, and a clear silver colloid circuit is obtained.
Specifically, when the conductive film passes through the water washing spraying position, the spraying pressure is 0.5 +/-0.2 kg/cm2The conductive film is sprayed with cold water. Not only improves the cleaning capability of impurities on the conductive film, but also avoids the excessive spray pressureCausing the exposed silver paste to fall off.
Specifically, the water-washing spray position is divided into three sections, and the conductive film sequentially passes through the first section, the second section and the third section. The conducting film is sprayed with cold water for three times, so that the cleaning effect can be improved, and a clear silver colloid circuit is obtained.
Specifically, when the conductive film passes through the pre-washing position, the spraying pressure is 0.5 +/-0.2 kg/cm2The conductive film is sprayed with cold water. The cleaning capability of impurities on the conductive film is improved, and the phenomenon that the exposure silver paste falls off due to overlarge spray pressure is avoided.
Specifically, the air drying position comprises a cold air drying position and a hot air drying position; the conducting film passing through the washing and spraying position passes through a cold air blow-drying position and then passes through a hot air blow-drying position;
when the conducting film passes through the cold air blow-drying position, blowing the conducting film by using cold air to blow off water attached to the conducting film;
when the conductive film passes through the hot air drying position, the conductive film is blown by hot air, and the fine water drops on the conductive film are evaporated to dryness. The air drying efficiency is improved.
Specifically, the silver colloid ink is 130A ink, and fine lines with higher ink resolution can be obtained.
Specifically, the method also comprises a material receiving step after the material discharging step: and collecting the conductive film conveyed by the conveying device.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. The developing process of the silver colloid circuit is characterized by comprising the following steps: the conductive film is conveyed forwards by a conveying device, and the conductive film is discharged after passing through a developing spraying position, a first cold air cutting position, a water washing spraying position and an air drying position;
when the conductive film passes through the developing spraying position, spraying the conductive film printed with the silver colloid ink and with the line width of an exposed silver colloid circuit below 15um by using a silver colloid developing solution, and returning the sprayed silver colloid developing solution to the developing tank;
when the conductive film passes through the first cold air cutting position, the conductive film is blown tangentially by cold air, and the solution attached to the conductive film is driven back to the developing tank;
and when the conducting film passes through the washing spraying position, the conducting film is sprayed by cold water, and the sprayed water returns to the water tank below the washing spraying position.
2. The developing process of the silver colloid circuit according to claim 1, wherein the conductive film also passes through a prewash position and a second cold air cut position between the first cold air cut position and the water-wash spray position when being conveyed forward;
when the conducting film passes through the pre-washing position, spraying the conducting film by using cold water, and returning the sprayed water to the water tank below the pre-washing position;
and when the conducting film passes through the second cold air cutting position, blowing the conducting film by using cold air to drive the water attached to the conducting film back to the water washing spraying position.
3. The developing process of silver colloid circuit according to claim 1, wherein the conductive film passes through the developing spray position by using the developing solution with concentration of 1.2 ± 0.2g/L and spray pressure of 0.5 ± 0.2kg/cm2The conductive film is sprayed by the silver colloid developing solution.
4. The developing process of the silver colloid circuit according to claim 3, wherein the developing spray position is divided into three sections, and the conductive film passes through the first section, the second section and the third section thereof in sequence.
5. The developing process of silver colloid circuit according to claim 1, wherein the spraying pressure is 0.5 ± 0.2kg/cm when the conductive film passes through the water-washing spraying position2The conductive film is sprayed with the cold water.
6. The developing process of the silver colloid circuit according to claim 5, wherein the water washing spraying position is divided into three sections, and the conductive film passes through the first section, the second section and the third section thereof in sequence.
7. The developing process for silver paste line according to claim 2, wherein the conductive film passes through the pre-washing position with a spraying pressure of 0.5 ± 0.2kg/cm2The conductive film is sprayed with the cold water.
8. The silver paste line developing process according to claim 1, wherein the air drying position comprises a cold air drying position and a hot air drying position; the conducting film passing through the washing and spraying position passes through a cold air blow-drying position and then passes through a hot air blow-drying position;
when the conducting film passes through the cold air blow-drying position, blowing the conducting film by using cold air to blow off water attached to the conducting film;
and when the conductive film passes through the hot air blow-drying position, blowing the conductive film by utilizing hot air to evaporate the fine water drops on the conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810455231.XA CN108646523A (en) | 2018-05-14 | 2018-05-14 | Elargol circuit developing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810455231.XA CN108646523A (en) | 2018-05-14 | 2018-05-14 | Elargol circuit developing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108646523A true CN108646523A (en) | 2018-10-12 |
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ID=63755126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810455231.XA Pending CN108646523A (en) | 2018-05-14 | 2018-05-14 | Elargol circuit developing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108646523A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458619A (en) * | 2013-08-19 | 2013-12-18 | 四川海英电子科技有限公司 | Method for producing double-sided PCB |
| CN107168020A (en) * | 2017-07-11 | 2017-09-15 | 信丰迅捷兴电路科技有限公司 | A kind of wiring board welding resistance development production system automatically |
-
2018
- 2018-05-14 CN CN201810455231.XA patent/CN108646523A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458619A (en) * | 2013-08-19 | 2013-12-18 | 四川海英电子科技有限公司 | Method for producing double-sided PCB |
| CN107168020A (en) * | 2017-07-11 | 2017-09-15 | 信丰迅捷兴电路科技有限公司 | A kind of wiring board welding resistance development production system automatically |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181012 |