CN109348626A - A kind of technology of wiring board dynamic compensation - Google Patents
A kind of technology of wiring board dynamic compensation Download PDFInfo
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- CN109348626A CN109348626A CN201811239910.XA CN201811239910A CN109348626A CN 109348626 A CN109348626 A CN 109348626A CN 201811239910 A CN201811239910 A CN 201811239910A CN 109348626 A CN109348626 A CN 109348626A
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- Prior art keywords
- wiring board
- route
- dry film
- compensate
- dynamic
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention relates to a kind of technologies of wiring board dynamic compensation, comprising: is cleared up wiring board and is dried；One layer of dry film is pasted on the copper face of assist side；Processing is exposed to the dry film being attached on the wiring board；Development treatment is carried out to the wiring board for completing exposure, makes not dissolve by the dry film of exposure curing, exposes copper face, be retained on copper face by the dry film of exposure curing；The wiring board for completing development is etched, by the copper face eating away of exposing, forms line pattern；According to route distribution situation, dynamic compensation is carried out to the route, keeps the width of the route uniform；Dry film on the wiring board for completing corresponding etching to compensate is taken off, layers of copper route is obtained；The wiring board for taking off film to completion is washed and is dried.By dynamic etch compensation software, different corresponding etching to compensate amounts is designed for the different zones of wiring board, realizes that dynamic compensates, improves the homogeneity of route, improve the precision and quality of wiring board.
Description
Technical field
The present invention relates to wiring board production technical field, in particular to the route dynamic compensation method of a kind of wiring board.
Background technique
Wiring board is important electronic component, is the supporter of electronic component, is the load of electronic component electrical connection
Body, electronic product develop to " light, thin, short, small " direction, and wiring board is also to high density, highly difficult development, with electronic technology
High speed development, for high-precision, high density, frequency PCB, it is desirable that PCB finished product bottom copper is thick, pattern precision is high, and line width is small, therefore wants
Equipment is asked to have stable, uniform line width output.When etching, since the route of wiring board is distributed density situation, liquid medicine exchange velocity
Variant, the independent line position in spacious area of meeting, the without hindrance obstruction of liquid medicine, exchange is fast, and etch quantity is more, and in intensive line, because intensive
Gap is small between line, and liquid medicine exchange is slow, and etch quantity is few.Therefore cause etching uneven, wiring board is formed not in different zones
Same line width, customary etch compensation method are difficult to meet the intensive line of PCB of high speed development, isolated line Line-width precision requirement, occur
Different zones, different types of route, the finished product figure size difference of different type figure are larger, and precision capability is relatively low, no
It is able to satisfy terminal requirements.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of technologies of wiring board dynamic compensation.
The technical scheme to solve the above technical problems is that
A kind of technology of wiring board dynamic compensation, comprising:
Supplied materials processing step: wiring board is cleared up and is dried；
Step of membrane sticking: one layer of dry film is pasted on the copper face of the wiring board；
Step of exposure: processing is exposed to the dry film being attached on the wiring board；
Development step: carrying out development treatment to the wiring board for completing exposure, makes the dry film for not passing through exposure curing
Dissolution is exposed copper face, is retained on copper face by the dry film of exposure curing；
Etching step: being etched the wiring board for completing development, by the copper face eating away of exposing, forms line map
Shape；
Corresponding etching to compensate step: according to route distribution situation, dynamic compensation is carried out to the route, makes the width of the route
It is uniform；
It takes off film step: the dry film on the wiring board for completing corresponding etching to compensate being taken off, layers of copper route is obtained；
Discharging processing step: the wiring board for taking off film to completion is washed and is dried.
Further, the supplied materials processing step cleans the copper face by polish-brush, makes the copper of the wiring board
Face roughening.
Further, the corresponding etching to compensate step includes:
By dynamic etch compensation software, by the line pattern object of the wiring board divide into Pad, SMD, route and its
The object being classified object adjacent thereto is also divided into Pad, SMD, route and other types by its type；
By the dynamic etch compensation function of dynamic etch compensation software, the every class object root adjacent thereto to the object
According to different spacing and required offset set-up function module, dynamic etch compensation is carried out to the wiring board.
Further, in the corresponding etching to compensate step, the dynamic etch compensation software is Genesis2000.
Further, in the corresponding etching to compensate step, to every route of line intensive in the route according to corresponding erosion
It carves compensation rate and carries out unilateral corresponding etching to compensate, every route of isolated line in the route is carried out according to corresponding corresponding etching to compensate amount
Bilateral corresponding etching to compensate.
Further, the dry film is resin film.
Further, the development step is by lye by there is no the dissolutions of the dry film of curing reaction to wash out.
Further, described to take off film step the dry film on the wiring board is faded away by strong base solution.
Compared with prior art, the beneficial effects of the present invention are:
The present invention is by dynamic etch compensation software, according to the line condition of wiring board, by the line pattern object of wiring board
Part divides into Pad, SMD, route and other types, and the object being classified object adjacent thereto is also divided into Pad, SMD, line
Road and other types, by the dynamic etch compensation function of dynamic etch compensation software, the every class adjacent thereto to the object
Object carries out dynamic etch compensation according to different spacing and required offset set-up function module, to the wiring board.
Realize that dynamic compensates, can be big to avoid line width difference caused by etching unevenly, to improve the homogeneity of route, mention
The high precision and quality of wiring board, quality of finished product good, meanwhile, it is arranged by reasonable dynamic compensation, can be disposably completed
Compensation avoids repeatedly modifying compensation, thus improve work efficiency, it is time saving and energy saving.
Detailed description of the invention
The invention will be further described with embodiment with reference to the accompanying drawing.
Fig. 1 is the flow diagram of the wiring board dynamic compensation technology of one embodiment of the invention.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.Below with reference to the attached drawing of the embodiment of the present invention, technical solution of the present invention is described further, the present invention is not only
It is limited to following specific embodiments.
The present invention provides a kind of technology of wiring board dynamic compensation, as shown in Figure 1, comprising the following steps:
Step 101: wiring board being cleared up and is dried, this step is also referred to as supplied materials processing step.
Specifically, in this step, the wiring board is washed, it is dirty to wash the PCB surface, and cleaning is dry
It is dried after net, keeps the cleaning of wiring board, so as to the processing of subsequent handling, avoid causing processing procedure to occur because plate face is dirty
Bad and finished product is unsightly.
In a preferred embodiment, in the supplied materials processing step, by polish-brush to the copper face of the wiring board into
Row cleaning, the copper face of the wiring board is cleaned using polish-brush, can remove the stain of wiring board copper face, is cleaned cleaner
More thoroughly, it is also possible to be roughened the copper face of wiring board, so that the copper face of wiring board be made to better contact with dry film, reach
Better pad pasting effect.
Step 102: one layer of dry film is pasted on the copper face of the wiring board, this step is also referred to as step of membrane sticking.
Specifically, in this step, on the clean wiring board copper face for completing cleaning, one layer is sticked by laminator
Dry film covers the copper face of the wiring board.
In a preferred embodiment, in the step of membrane sticking, the dry film used is resin film, and resin film price is low
It is honest and clean, it is easy to get, production cost can be saved using resin film, meanwhile, resin machinability is good, facilitates process operation.
Step 103: processing being exposed to the dry film being attached on the wiring board, this step is also referred to as step of exposure.
Specifically, it in this step, according to specific route design conditions, is plotted on egative film by optical plotter, drafting
There is the egative film of line map to cover on the dry film of the wiring board, be then exposed processing, takes egative film away after completing exposure, institute
It states and forms corresponding line pattern on dry film, the dry film of line pattern part reacts solidification, and passes through subsequent processing steps
Form line pattern.
Step 104: development treatment being carried out to the wiring board for completing exposure, is made not molten by the dry film of exposure curing
Solution is exposed copper face, is retained on copper face by the dry film of exposure curing, this step is also referred to as development step.
Specifically, in this step, development treatment is carried out to the wiring board for completing exposure, by the completion exposure
The wiring board washes away the dry film for not being cured reaction by lye, exposes copper face, and the dry film for being cured reaction then retains
, thus the dry film for not being cured reaction it is developed fall, complete development step.
Step 105: the wiring board for completing development is etched, by the copper face eating away of exposing, forms line pattern,
This step is also referred to as etching step.
Specifically, in this step, the wiring board for completing development is etched using etching medical fluid, without dry film
The part copper face of protection is etched medical fluid and etches away, and the copper face for having dry film to protect remains, and forms line pattern.
Step 106: according to route distribution situation, dynamic compensation is carried out to the route, keeps the width of the route uniform,
This step is also referred to as corresponding etching to compensate step.
It specifically,, will be described using the dynamic etch compensation function of dynamic etch software Genesis2000 in this step
The line pattern object of wiring board divides into Pad, SMD, route and other types, by the object being classified object adjacent thereto
Also Pad, SMD, route and other types are divided into；It is compensated by the dynamic etch of dynamic etch compensation software Genesis2000
Function, the every class object adjacent thereto to the object according to different spacing and required offset set-up function module,
Dynamic etch compensation is carried out to the wiring board, to improve the inhomogeneities of etching, improves finished product route precision.Using
Genesis2000 software, Genesis2000 software is easy to operate easy to get started, high degree of automation, can to avoid manual operation,
Manpower and time are saved, realizes that dynamic compensates, can be big to avoid line width difference caused by etching unevenly, to be promoted
The homogeneity of route, improves the precision and quality of wiring board, quality of finished product good, meanwhile, it is set by reasonable dynamic compensation
It sets, can disposably complete to compensate, avoid repeatedly modifying compensation, thus improve work efficiency, it is time saving and energy saving.
In a preferred embodiment, in the corresponding etching to compensate step, to every route of line intensive in the route
Unilateral corresponding etching to compensate is carried out according to corresponding corresponding etching to compensate amount, to every route of isolated line in the route according to corresponding erosion
It carves compensation rate and carries out bilateral corresponding etching to compensate.Since each route spacing of intensive line is small, the bad operation of bilateral corresponding etching to compensate is carried out, is held
Easily there is error, influences the line width uniformity of finished product, it can be in order to operate using unilateral corresponding etching to compensate, the line width uniformity of finished product
More preferably.
Step 107: the dry film on the wiring board for completing corresponding etching to compensate being taken off, layers of copper route, this step are obtained
It is known as taking off film step.
Specifically, in this step, the dry film dissolution of copper face will be protected to take off on the wiring board using strong base solution, make by
The layers of copper of protection is exposed, and layers of copper route is obtained.
Step 108: the wiring board for taking off film to completion is washed and is dried, this step also referred to as discharges and handles step
Suddenly.
Specifically, the wiring board for completing to take off film step is subjected to washing cleaning, is then dried in this step,
Clean dried is kept, the wiring board is transported to next process and carries out subsequent processing.
The present invention is further described with embodiment below.
Embodiment 1
Wiring board to be processed is provided, is cleaned by plate face of the polish-brush to wiring board, is then dried.
By pasting one layer of dry film on the copper face of film laminator assist side.
The egative film drawn and have line map is covered in the circuit board, and processing is exposed to dry film using exposure machine.
Using lye, soaking flushing is carried out to the wiring board for completing exposure, makes not develop by the dry film of exposure curing
Fall, exposes copper face, be retained on copper face by the dry film of exposure curing.
The wiring board for completing development is placed in etching medical fluid and is etched, line pattern is formed.
Using Genesis2000 software, according to route distribution situation, to the route according to corresponding corresponding etching to compensate amount into
The bilateral corresponding etching to compensate of row.
The dry film on the wiring board for completing corresponding etching to compensate is taken off using strong base solution, obtains layers of copper route.
The wiring board for taking off film to completion is washed and is dried, and is then sent to next process and is carried out subsequent processing.
Method carries out dynamic etch compensation to wiring board through this embodiment, and on inspection, the route line width of wiring board is uniform,
Line width difference < 0.02mil between each route, ensure that the consistency of finished product line width, improves quality of finished.
Embodiment 2
Wiring board to be processed is provided, is cleaned by plate face of the polish-brush to wiring board, is then dried.
By pasting one layer of dry film on the copper face of film laminator assist side.
The egative film drawn and have line map is covered in the circuit board, and processing is exposed to dry film using exposure machine.
Using lye, soaking flushing is carried out to the wiring board for completing exposure, makes not develop by the dry film of exposure curing
Fall, exposes copper face, be retained on copper face by the dry film of exposure curing.
The wiring board for completing development is placed in etching medical fluid and is etched, line pattern is formed.
Using Genesis2000 software, according to route distribution situation, to every route of intensive line according to corresponding etching
Compensation rate range carries out unilateral corresponding etching to compensate, carries out bilateral etching according to corresponding corresponding etching to compensate amount range to All other routes figure
Compensation.
The dry film on the wiring board for completing corresponding etching to compensate is taken off using strong base solution, obtains layers of copper route.
The wiring board for taking off film to completion is washed and is dried, and is then sent to next process and is carried out subsequent processing.
Method carries out dynamic etch compensation to wiring board through this embodiment, and on inspection, the route line width of wiring board is uniform,
Line width difference < 0.01mil between each route, ensure that the consistency of finished product line width, improves quality of finished.
By contrast, between embodiment 1 and embodiment 2, embodiment 2 uses unilateral corresponding etching to compensate to intensive line, makes resulting
There is some difference for the line width difference of wiring board, and the line width difference of embodiment 2 is smaller, the route of gained wiring board more evenly, at
Product quality is higher.Embodiment 2 is a preferred version provided by the invention.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (8)
1. a kind of technology of wiring board dynamic compensation characterized by comprising
Supplied materials processing step: wiring board is cleared up and is dried；
Step of membrane sticking: one layer of dry film is pasted on the copper face of the wiring board；
Step of exposure: processing is exposed to the dry film being attached on the wiring board；
Development step: carrying out development treatment to the wiring board for completing exposure, makes not dissolve by the dry film of exposure curing,
Expose copper face, is retained on copper face by the dry film of exposure curing；
Etching step: being etched the wiring board for completing development, by the copper face eating away of exposing, forms line pattern；
Corresponding etching to compensate step: according to route distribution situation, dynamic compensation is carried out to the route, keeps the width of the route equal
One；
It takes off film step: the dry film on the wiring board for completing corresponding etching to compensate being taken off, layers of copper route is obtained；
Discharging processing step: the wiring board for taking off film to completion is washed and is dried.
2. the technology of wiring board dynamic compensation according to claim 1, which is characterized in that the supplied materials processing step passes through
Polish-brush cleans the copper face, is roughened the copper face of the wiring board.
3. the technology of wiring board dynamic compensation according to claim 1, which is characterized in that the corresponding etching to compensate step packet
It includes:
By dynamic etch compensation software, the line pattern object of the wiring board is divided into Pad, SMD, route and other classes
The object being classified object adjacent thereto is also divided into Pad, SMD, route and other types by type；
By the dynamic etch compensation function of dynamic etch compensation software, the every class object adjacent thereto to the object be not according to
Same spacing and required offset set-up function module carries out dynamic etch compensation to the wiring board.
4. the technology of wiring board dynamic compensation according to claim 3, which is characterized in that in the corresponding etching to compensate step,
The dynamic etch compensation software is Genesis2000.
5. the technology of wiring board dynamic compensation according to claim 3, which is characterized in that in the corresponding etching to compensate step,
Unilateral corresponding etching to compensate is carried out according to corresponding corresponding etching to compensate amount to every route of line intensive in the route, in the route
Every route of isolated line carries out bilateral corresponding etching to compensate according to corresponding corresponding etching to compensate amount.
6. the technology of wiring board dynamic compensation according to claim 1, which is characterized in that the dry film is resin film.
7. the technology of wiring board dynamic compensation according to claim 1, which is characterized in that the development step passes through lye
By there is no the dissolutions of the dry film of curing reaction to wash out.
8. the technology of wiring board dynamic compensation according to claim 1, which is characterized in that the film step that takes off passes through highly basic
Solution fades away the dry film on the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811239910.XA CN109348626A (en) | 2018-10-23 | 2018-10-23 | A kind of technology of wiring board dynamic compensation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811239910.XA CN109348626A (en) | 2018-10-23 | 2018-10-23 | A kind of technology of wiring board dynamic compensation |
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| Publication Number | Publication Date |
|---|---|
| CN109348626A true CN109348626A (en) | 2019-02-15 |
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ID=65311617
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811239910.XA Pending CN109348626A (en) | 2018-10-23 | 2018-10-23 | A kind of technology of wiring board dynamic compensation |
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| CN (1) | CN109348626A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111800954A (en) * | 2020-06-16 | 2020-10-20 | 珠海杰赛科技有限公司 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
| CN114051327A (en) * | 2021-10-11 | 2022-02-15 | 胜宏科技（惠州）股份有限公司 | Rework etching compensation method for abnormal plate |
| CN114760758A (en) * | 2022-03-17 | 2022-07-15 | 苏州悦谱半导体有限公司 | CAM-based dynamic PCB line compensation optimization method |
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| CN104507264A (en) * | 2014-12-31 | 2015-04-08 | 苏州福莱盈电子有限公司 | Technology for manufacturing 30-micron fine line |
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| CN108024454A (en) * | 2017-12-14 | 2018-05-11 | 悦虎电路(苏州)有限公司 | A kind of line build-out method based on 1.5mil wiring boards |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111800954A (en) * | 2020-06-16 | 2020-10-20 | 珠海杰赛科技有限公司 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
| CN111800954B (en) * | 2020-06-16 | 2021-08-24 | 珠海杰赛科技有限公司 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
| CN114051327A (en) * | 2021-10-11 | 2022-02-15 | 胜宏科技（惠州）股份有限公司 | Rework etching compensation method for abnormal plate |
| CN114760758A (en) * | 2022-03-17 | 2022-07-15 | 苏州悦谱半导体有限公司 | CAM-based dynamic PCB line compensation optimization method |
| CN114760758B (en) * | 2022-03-17 | 2024-05-24 | 苏州悦谱半导体有限公司 | Dynamic PCB circuit compensation optimization method based on CAM |
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