CN111800954A - Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board - Google Patents
Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board Download PDFInfo
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- CN111800954A CN111800954A CN202010546014.9A CN202010546014A CN111800954A CN 111800954 A CN111800954 A CN 111800954A CN 202010546014 A CN202010546014 A CN 202010546014A CN 111800954 A CN111800954 A CN 111800954A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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Abstract
The invention discloses a reworking method for manufacturing an abnormal product of a copper-clad plate circuit, which comprises the following steps of acid washing, film sticking, engineering data compensation and adjustment, secondary contraposition exposure, development, secondary etching, film stripping and inspection. In the step of acid washing, oxides, oil stains, fingerprints and the like on the surface of the plate are removed, and the copper surface of the plate is roughened, so that the subsequent copper plating of the copper surface is facilitated; in the engineering data compensation adjustment step and the secondary alignment exposure step, the short-circuit area can be etched away by the secondary etching, the problems of line fineness, saw teeth, steps and the like after the secondary etching can be avoided, and the rework quality of the plate is improved. The invention also discloses a printed circuit board which is manufactured by adopting the reworking method for manufacturing the abnormal product of the copper-clad plate circuit, thereby realizing the recycling of the abnormal product and reducing the production cost.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a reworking method for manufacturing an abnormal product of a copper-clad plate circuit and a printed circuit board.
Background
With the rapid development of social economy, the optimization and upgrade of economic structures mean that a new round of scientific and technological revolution and industrial revolution are rising all over the world, and the manufacturing industry is certainly influenced, and a printed circuit board is used as a basic component of electronic equipment, is a transmission carrier of current and signals, plays a very important role in the electronic equipment, and therefore, higher requirements are put on the printed circuit board. Under traditional printed circuit board manufacturing process, defects such as short circuit often appear in the copper-clad plate circuit manufacturing process, and these defects accessible AOI inspection are detected, and mainly because the local position etching that the panel copper layer thickness inequality leads to is incomplete, perhaps appears the virtual light in the exposure process, has seriously influenced printed circuit board's yield, and the defective products increase, have increased the cost of processing printed circuit board.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a reworking method of the abnormal products produced by the copper-clad plate circuit, which can repair the abnormal products produced by the copper-clad plate circuit and improve the yield of the printed circuit board.
The invention also provides a printed circuit board manufactured by adopting the reworking method for manufacturing the abnormal product by the copper-clad plate circuit.
According to the first aspect of the invention, the reworking method for manufacturing the abnormal products of the copper-clad plate circuit comprises the following steps of acid washing: cleaning the board surface of the board to be reworked in a chemical cleaning mode; film pasting: sticking the dry film on the copper surface of the plate; compensation and adjustment of engineering data: carrying out integral compensation on the engineering data used for the first alignment exposure to increase the overall compensation to be not more than 0.51 mil; and (3) secondary alignment exposure: the exposure machine adopts the hole pattern left after the first etching of the plate to align, and the pattern of the engineering data after compensation adjustment is transferred to the dry film; and (3) developing: removing the photosensitive material at the unexposed position of the dry film; and (3) secondary etching: etching the copper layer on the copper-exposed part of the board surface, and protecting the copper layer under the dry film to form a required circuit pattern; film stripping: removing the dry film on the board surface to expose the required circuit; and (4) checking: and inspecting the circuit of the plate to judge whether the circuit of the copper-clad plate is qualified or not.
The reworking method for manufacturing the abnormal products on the copper-clad plate circuit according to the embodiment of the invention at least has the following beneficial effects: in the step of acid washing, oxides, oil stains, fingerprints and the like on the surface of the plate are removed, and the copper surface of the plate is roughened, so that the subsequent copper plating of the copper surface is facilitated; in the engineering data compensation adjustment step, the engineering data is compensated and enlarged integrally, and in the secondary alignment exposure step, the exposure machine is aligned by using a hole pattern left after the first etching of the board, so that the area exposed for the second time completely occupies the area exposed for the first time, and the deviation of the area exposed for the second time relative to the area exposed for the first time is reduced, namely, the coincidence degree or the coincidence degree of the pattern exposed for the second time and the pattern left after the first etching can be increased, further, the short-circuit area can be etched by the second etching, and the problems of line fineness, saw teeth, steps and the like after the second etching can be avoided simultaneously, the rework quality of the board is improved, the yield of the printed circuit board is improved finally, the waste of the board is reduced, and the production cost is reduced; and (4) checking the stripped plate again to determine whether the plate is defective, and continuously machining the qualified product until the printed circuit board is produced, wherein the unqualified product can be reworked or scrapped for three times according to specific conditions.
According to some embodiments of the present invention, the engineering data compensation adjustment step increases the overall compensation by a value between 0.5 and 1 mil.
According to some embodiments of the invention, in the developing step, the photosensitive material at the unexposed portions of the dry film is washed away with a 1% sodium carbonate solution.
According to some embodiments of the present invention, in the second etching step, the etching parameters are adjusted according to the thickness of the copper layer at the location of the defect point to completely etch away the copper at the location of the defect point.
According to some embodiments of the present invention, in the step of stripping, a sodium hydroxide solution with a concentration of 2-5% is used to remove the dry film on the surface of the board, so as to expose the required circuit.
According to some embodiments of the invention, the cleaning agents used in the acid washing step are sodium persulfate and sulfuric acid.
According to some embodiments of the present invention, in the step of attaching the film, the temperature of the film is controlled to be 100-120 ℃, and the pressure is controlled to be 0.4-0.6 MPa.
According to the printed circuit board of the embodiment of the second aspect of the invention, the printed circuit board is manufactured by adopting the reworking method for manufacturing the abnormal product of the copper-clad plate circuit.
The printed circuit board according to the embodiment of the invention has at least the following beneficial effects: the printed circuit board is manufactured by reworking the abnormal products produced by the copper-clad plate circuit, thereby realizing the recycling of the abnormal products and reducing the production cost.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic flow chart of a reworking method for manufacturing an abnormal product of a copper-clad plate circuit according to an embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, the invention discloses a rework method for manufacturing abnormal products of copper-clad plate lines, which comprises the following steps of acid pickling: cleaning the board surface of the board to be reworked in a chemical cleaning mode; film pasting: sticking the dry film on the copper surface of the plate; compensation and adjustment of engineering data: carrying out integral compensation on the engineering data used for the first alignment exposure to increase the overall compensation to be not more than 0.51 mil; and (3) secondary alignment exposure: the exposure machine adopts the hole pattern left after the first etching of the plate to align, and the pattern of the engineering data after compensation adjustment is transferred to the dry film; and (3) developing: removing the photosensitive material at the unexposed position of the dry film; and (3) secondary etching: etching the copper layer on the copper-exposed part of the board surface, and protecting the copper layer under the dry film to form a required circuit pattern; film stripping: removing the dry film on the board surface to expose the required circuit; and (4) checking: and inspecting the circuit of the plate to judge whether the circuit of the copper-clad plate is qualified or not.
In the step of acid washing, impurities such as oxides, oil stains, fingerprints and the like on the surface of the plate are removed, and the copper surface of the plate is roughened, so that the subsequent copper plating of the copper surface is facilitated; because the copper-clad plate is manufactured once, the misalignment is easy to occur during the secondary exposure, the surface of the copper-clad plate is expanded and contracted, the circuit manufactured for the first time can be slightly deformed and offset, so that the difficulty of the realignment during the secondary exposure is increased again, the engineering data is compensated and adjusted, the engineering data is integrally compensated and increased, in the secondary alignment exposure step, the exposure machine is used for aligning by using a hole pattern left after the first etching of the plate, so that the area exposed for the second time completely occupies the area exposed for the first time, the offset of the area exposed for the second time relative to the area exposed for the first time is reduced, namely, the coincidence degree or goodness of coincidence of the pattern exposed for the second time and the pattern left after the first etching is increased, the short-circuit area can be etched by the secondary etching, and the phenomenon that lines appear after the secondary etching can be avoided, The reworking quality of the board is improved due to the problems of sawteeth, steps and the like, the yield of the printed circuit board is improved finally, the waste of the board is reduced, and the production cost is reduced; and (4) checking the stripped plate again to determine whether the plate is defective, and continuously machining the qualified product until the printed circuit board is produced, wherein the unqualified product can be reworked or scrapped for three times according to specific conditions.
In some embodiments of the present invention, in the step of adjusting the engineering data compensation, the overall compensation increase value is between 0.5 mil and 1 mil. The whole compensation is increased on the basis of the original exposure finishing data, so that in the subsequent secondary alignment exposure step, the secondary exposure area can completely cover the area etched for the first time on the plate. The compensation increasing value is too small, the secondary exposure area can not completely cover the area etched for the first time on the plate, the compensation increasing value is too large, and the line width of the circuit can be reduced or the line distance can be increased.
In some embodiments of the present invention, in the developing step, the photosensitive material at the unexposed portion of the dry film is washed away with a 1% sodium carbonate solution. The photosensitive material at the unexposed position was not polymerized, and a 1% sodium carbonate solution was sufficient to dissolve and remove the photosensitive material that had not been polymerized.
In some embodiments of the present invention, in the second etching step, the etching parameters are adjusted according to the thickness of the copper layer at the location of the defect point to completely etch away the copper at the location of the defect point. The copper layer on the position of the defect point is etched, so that the defect point of the line can be removed, and the phenomenon that the copper layer of the plate cannot be etched completely after secondary etching is avoided.
In some embodiments of the present invention, in the step of stripping, a sodium hydroxide solution with a concentration of 2-5% is used to remove the dry film on the board surface, so as to expose the required circuit. The higher concentration is that the sodium hydroxide solution can dissolve and remove the dry film, and the sodium hydroxide solution concentration can not be too high simultaneously to avoid panel face oxidation.
In some embodiments of the present invention, the cleaning agent used in the acid washing step is sodium persulfate and sulfuric acid. The sodium persulfate and the sulfuric acid can thoroughly remove impurities such as oxides, oil stains, fingerprints and the like on the surface of the board, the quality of the circuit is ensured, and the subsequent processing of the printed circuit board can be normally carried out.
In some embodiments of the invention, in the step of film pasting, the temperature of the film pasting is controlled to be 100-120 ℃, and the pressure is controlled to be 0.4-0.6MPa, so that the dry film can be completely and flatly pasted on the surface of the board. The inspection of the copper clad laminate circuit can be an AOI inspection mode. Other steps of the reworking method for manufacturing the abnormal products of the copper-clad plate circuit are the same as those of manufacturing other common copper-clad plate circuits or other common printed circuit boards.
The invention also discloses a printed circuit board which is manufactured by adopting the reworking method for manufacturing the abnormal product of the copper-clad plate circuit.
The printed circuit board is manufactured by reworking the abnormal products produced by the copper-clad plate circuit, thereby realizing the recycling of the abnormal products and reducing the production cost.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (8)
1. The reworking method for the abnormal products produced by the copper-clad plate circuit is characterized by comprising the following steps: acid washing: cleaning the board surface of the board to be reworked in a chemical cleaning mode;
film pasting: sticking the dry film on the copper surface of the plate;
compensation and adjustment of engineering data: carrying out integral compensation on the engineering data used for the first alignment exposure to increase the overall compensation to be not more than 0.51 mil;
and (3) secondary alignment exposure: the exposure machine adopts the hole pattern left after the first etching of the plate to align, and the pattern of the engineering data after compensation adjustment is transferred to the dry film;
and (3) developing: removing the photosensitive material at the unexposed position of the dry film;
and (3) secondary etching: etching the copper layer on the copper-exposed part of the board surface, and protecting the copper layer under the dry film to form a required circuit pattern;
film stripping: removing the dry film on the board surface to expose the required circuit;
and (4) checking: and inspecting the circuit of the plate to judge whether the circuit of the copper-clad plate is qualified or not.
2. The rework method of copper clad laminate line manufacturing abnormal product of claim 1, characterized in that: in the step of compensating and adjusting the engineering data, the overall compensation increasing value is between 0.5 and 1 mil.
3. The rework method of copper clad laminate line manufacturing abnormal product of claim 1, characterized in that: in the developing step, a sodium carbonate solution with the concentration of 1% is adopted to wash away the photosensitive material at the unexposed position part of the dry film.
4. The rework method of copper clad laminate line manufacturing abnormal product of claim 1, characterized in that: in the secondary etching step, the etching parameters are adjusted according to the thickness of the copper layer at the position of the defect point so as to completely etch away the copper at the position of the defect point.
5. The rework method of copper clad laminate line manufacturing abnormal product of claim 1, characterized in that: in the step of stripping, a sodium hydroxide solution with the concentration of 2-5% is adopted to remove the dry film on the board surface, and the required circuit is exposed.
6. The rework method of copper clad laminate line manufacturing abnormal product of claim 1, characterized in that: in the acid washing step, sodium persulfate and sulfuric acid are adopted as cleaning agents.
7. The rework method of copper clad laminate line manufacturing abnormal product of claim 1, characterized in that: in the step of film sticking, the temperature of the film sticking is controlled to be 100-120 ℃, and the pressure is controlled to be 0.4-0.6 MPa.
8. A printed circuit board, characterized by: the printed circuit board is manufactured by adopting the rework method of the abnormal products for manufacturing the copper-clad plate circuit in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010546014.9A CN111800954B (en) | 2020-06-16 | 2020-06-16 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
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| CN202010546014.9A CN111800954B (en) | 2020-06-16 | 2020-06-16 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
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| CN111800954A true CN111800954A (en) | 2020-10-20 |
| CN111800954B CN111800954B (en) | 2021-08-24 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112714555A (en) * | 2020-10-21 | 2021-04-27 | 珠海杰赛科技有限公司 | Method for manufacturing bare copper PCB |
| CN114051327A (en) * | 2021-10-11 | 2022-02-15 | 胜宏科技（惠州）股份有限公司 | Rework etching compensation method for abnormal plate |
| CN114152615A (en) * | 2021-10-12 | 2022-03-08 | 宏华胜精密电子(烟台)有限公司 | Detection method, device and equipment of circuit board detection equipment and storage medium |
| CN114980529A (en) * | 2022-04-28 | 2022-08-30 | 江西一诺新材料有限公司 | Test method for copper etching uniformity analysis |
| CN117750643A (en) * | 2024-02-19 | 2024-03-22 | 四川龙裕天凌电子科技有限公司 | Surface processing method of printed circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112714555A (en) * | 2020-10-21 | 2021-04-27 | 珠海杰赛科技有限公司 | Method for manufacturing bare copper PCB |
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| CN114152615A (en) * | 2021-10-12 | 2022-03-08 | 宏华胜精密电子(烟台)有限公司 | Detection method, device and equipment of circuit board detection equipment and storage medium |
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| CN117750643A (en) * | 2024-02-19 | 2024-03-22 | 四川龙裕天凌电子科技有限公司 | Surface processing method of printed circuit board |
| CN117750643B (en) * | 2024-02-19 | 2024-04-19 | 四川龙裕天凌电子科技有限公司 | Surface processing method of printed circuit board |
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Effective date of registration: 20211209 Address after: 510310 No. 56, Yunqing Road, Huangpu District, Guangzhou, Guangdong Patentee after: Guangzhou Jiesai Electronic Technology Co.,Ltd. Address before: No.1, Fushan Third Road, Fushan Industrial Park, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province, 519000 Patentee before: ZHUHAI GCI SCIENCE & TECHNOLOGY Co.,Ltd. Patentee before: Guangzhou Jiesai Technology Co., Ltd |
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