CN114980529A - Test method for copper etching uniformity analysis - Google Patents
Test method for copper etching uniformity analysis Download PDFInfo
- Publication number
- CN114980529A CN114980529A CN202210463216.6A CN202210463216A CN114980529A CN 114980529 A CN114980529 A CN 114980529A CN 202210463216 A CN202210463216 A CN 202210463216A CN 114980529 A CN114980529 A CN 114980529A
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- China
- Prior art keywords
- copper
- etching
- board
- film
- test method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 96
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 80
- 239000010949 copper Substances 0.000 title claims abstract description 80
- 238000005530 etching Methods 0.000 title claims abstract description 57
- 238000004458 analytical method Methods 0.000 title claims abstract description 26
- 238000010998 test method Methods 0.000 title claims abstract description 11
- 238000012360 testing method Methods 0.000 claims abstract description 26
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 21
- 239000011889 copper foil Substances 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000003814 drug Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 238000005406 washing Methods 0.000 claims abstract description 5
- 238000004080 punching Methods 0.000 claims abstract description 4
- 238000005259 measurement Methods 0.000 claims description 18
- 238000013461 design Methods 0.000 claims description 8
- 239000000523 sample Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 21
- 238000011161 development Methods 0.000 abstract description 8
- 238000012546 transfer Methods 0.000 description 10
- 238000005553 drilling Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a test method for analyzing uniformity of etched copper, which relates to the technical field of printed circuit board production and comprises the following steps: s1: selecting a preselected size and a preselected thickness of a cutting test board, covering the test board on a board to be tested, and aligning the board edge of the test board with the board edge of the board to be tested; s2: punching positioning holes at four corners of the double-layer copper foil substrate respectively, and corresponding to the alignment holes of the exposure machine; s3: pasting a photoresist film on the copper foil substrate with the positioning hole; s4: transferring the film pattern to a dry film pasted with a photoresist film by using an exposure machine through alignment of an alignment hole; s5: and adjusting the development parameters required by the dry film, and washing the part of the dry film which is not illuminated by using liquid medicine to show a pattern required by copper etching. The method can solve the problems of low working efficiency and inaccurate detection and analysis in the copper etching uniformity process.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a test method for copper etching uniformity analysis.
Background
Along with the requirement of electronic products on the line width interval of a circuit board is smaller and smaller, the tolerance requirement of the line width is tighter and tighter, the copper etching uniformity of an etching section is particularly important, the flow rate of liquid medicine around the board surface is high due to the characteristic water tank effect of an etching process, so that the copper etching effect is unbalanced, the quality of the etching process is influenced, the requirement is that the residual copper uniformity of the etched copper surface is more accurately detected and analyzed, and then the etching parameters in the production process are conveniently adjusted and the spray condition of a nozzle at a corresponding position is rapidly analyzed.
An engineer takes a certain number of test points on the copper-clad plate by means of the measuring tool ruler, the CMI copper thickness measuring instrument is used for collecting copper thickness data of the test points of the copper-clad plate, after the data are collected, data analysis is carried out according to the measured data to obtain the condition of the uniformity of the copper thickness of the experimental plate, and improvement measures are made according to the analysis result. Because the test points are arranged on the copper-clad plate by means of common straight scales and other tools, the measuring work efficiency is low, and the error of the measuring position is large.
Disclosure of Invention
The invention solves the problems of low working efficiency and inaccurate detection and analysis in the process of copper etching uniformity.
In order to solve the above problems, the present invention provides a test method for uniformity analysis of etched copper, comprising the steps of:
s1: selecting a preselected size and a preselected thickness of a cutting test board, covering the test board on a board to be tested, and aligning the board edge of the test board with the board edge of the board to be tested;
s2: punching positioning holes at four corners of the double-layer copper foil substrate respectively, and corresponding to the alignment holes of the exposure machine;
s3: pasting a photoresist film on the copper foil substrate with the positioning hole;
s4: transferring the film pattern to a dry film pasted with a photoresist film by using an exposure machine through alignment of an alignment hole;
s5: adjusting the developing parameters required by the dry film, washing the part of the dry film which is not illuminated by using liquid medicine, and displaying a pattern required by copper etching;
s6: adjusting copper etching parameters, and then etching copper on the windowing position of the copper-clad plate, wherein the copper etching parameters are consistent with those designed in the actual production process;
s7: and (4) carrying out copper thickness measurement on the copper-clad plate graph subjected to copper etching treatment through CMI (China Mobile instrumentation), and carrying out uniformity analysis on the copper thickness after etching after obtaining all measurement data.
In the method, the required accurate position of copper thickness measurement is shown through the processes of sticking a photoresist film, image transfer and developing. By the processes of cutting, copper foil drilling, photoresist film pasting, image transfer, dry film development, copper etching and CMI copper thickness measurement, the working efficiency of the copper etching uniformity analysis process and the accuracy of detection and analysis are improved.
Further, the preselected size in step S1 is 500mm × 620mm, and the preselected thickness is 1.5 mm.
Further, the hole diameter of the positioning hole in step S2 is 2 mm.
Furthermore, the positioning hole is milled out through the milling cutter.
Furthermore, in the design of the film graph, the diameter of a probe of the CMI copper thickness detection instrument is 2cm, and the design graph of the film windowing is larger than 2 cm.
Further, the board to be tested is a copper-clad plate after etching.
The technical scheme adopted by the invention has the following beneficial effects:
the invention can display the accurate position of the required copper thickness measurement by using a test board and pasting a photoresist film, image transfer and developing process. By improving the manufacturing method of the copper etching uniformity test board, through the processes of cutting, copper foil drilling, photoresist film pasting, image transfer, dry film development, copper etching and CMI copper thickness measurement, the working efficiency of the copper etching uniformity analysis process is improved, and the problem that detection and analysis are not accurate enough when engineers use a measuring tool ruler to take a certain number of test points on a copper-clad plate in the prior art is solved.
Drawings
FIG. 1 is a first flowchart of a testing method for uniformity analysis of etched copper according to an embodiment of the present invention;
fig. 2 is a flowchart of a testing method for etching uniformity analysis according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
Examples
The embodiment provides a testing method for etching uniformity analysis, as shown in fig. 1 and fig. 2, the method includes the steps of:
s1: selecting a preselected size and a preselected thickness of a cutting test board, covering the test board on a board to be tested, and aligning the board edge of the test board with the board edge of the board to be tested;
s2: punching positioning holes at four corners of the double-layer copper foil substrate respectively, and corresponding to the alignment holes of the exposure machine;
s3: pasting a photoresist film on the copper foil substrate with the positioning hole;
s4: transferring the film pattern to a dry film pasted with a photoresist film by using an exposure machine through alignment of an alignment hole;
s5: adjusting the developing parameters required by the dry film, washing the part of the dry film which is not illuminated by using liquid medicine, and displaying a pattern required by copper etching;
s6: adjusting copper etching parameters, and then etching copper on the windowing position of the copper-clad plate, wherein the copper etching parameters are consistent with those designed in the actual production process;
s7: and (4) carrying out copper thickness measurement on the copper-clad plate graph subjected to copper etching treatment through CMI (China Mobile instrumentation), and carrying out uniformity analysis on the copper thickness after etching after obtaining all measurement data.
Specifically, the required accurate position of copper thickness measurement is shown through the processes of sticking a photoresist film, image transfer and developing. The working efficiency of the copper etching uniformity analysis process is improved through the processes of cutting, copper foil drilling, photoresist film pasting, image transfer, dry film development, copper etching and CMI copper thickness measurement.
Referring to fig. 2, the test board process specifically includes material cutting, copper foil drilling, photoresist film pasting, image transfer, dry film development, copper etching and CMI copper thickness measurement.
Cutting: the test board is 500mm × 620mm in size, 1.5mm in thickness and 2OZ in copper thickness.
Drilling a copper foil: drilling positioning holes at four corners of the double-layer copper foil substrate, wherein the aperture of each positioning hole is preferably 2mm and is used as a positioning hole of an exposure machine;
pasting a photoresist film: a resist film is attached to the copper foil base copper.
Image transfer: transferring the film pattern to a dry film by utilizing accurate alignment of an exposure CCD; in the film pattern design, the diameter of a probe of a common CMI copper thickness detection instrument is 2cm, the film windowing design pattern needs to be larger than 2cm, and a photoresist film is changed into blue after illumination and is green without illumination.
Dry film development: and adjusting the development parameters required by the dry film to wash away the part of the dry film which is not illuminated by using the liquid medicine, displaying a pattern required by copper corrosion, developing the residual photoresist film in a blue area, and washing the photoresist film in a green area without being illuminated by the liquid medicine to display the windowing of the copper-clad plate.
Etching copper: and (4) etching copper at the windowing position of the copper-clad plate after adjusting the copper etching parameters, wherein the parameters during copper etching are consistent with the copper etching parameters designed in the actual production process.
CMI copper thickness measurement: and (4) carrying out copper thickness measurement on the copper-clad plate graph subjected to copper etching treatment by using CMI (China Mobile instrumentation), and carrying out uniformity analysis on the copper thickness after etching after obtaining all measurement data.
Wherein the preselected size in step S1 is 500mm x 620mm, and the preselected thickness is 1.5 mm.
Wherein, the aperture of the positioning hole in the step S2 is 2 mm.
Wherein, the locating hole is gong out through the gong sword.
In the design of the film graph, the diameter of a probe of the CMI copper thickness detection instrument is 2cm, and the design graph of the film windowing is larger than 2 cm.
Wherein, the board to be tested is a copper-clad plate after etching.
The method can display the accurate position of the required copper thickness measurement through the processes of pasting a photoresist film, image transfer and developing by using a test board. By improving the manufacturing method of the copper etching uniformity test board, through the processes of cutting, copper foil drilling, photoresist film pasting, image transfer, dry film development, copper etching and CMI copper thickness measurement, the working efficiency of the copper etching uniformity analysis process is improved, and the problem that detection and analysis are not accurate enough when engineers use a measuring tool ruler to take a certain number of test points on a copper-clad plate in the prior art is solved.
Although the present disclosure has been described above, the scope of the present disclosure is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, and such changes and modifications will fall within the scope of the present invention.
Claims (6)
1. A test method for etching uniformity analysis of copper is characterized by comprising the following steps:
s1: selecting a preselected size and a preselected thickness of a cutting test board, covering the test board on a board to be tested, and aligning the board edge of the test board with the board edge of the board to be tested;
s2: punching positioning holes at four corners of the double-layer copper foil substrate respectively, and corresponding to the alignment holes of the exposure machine;
s3: pasting a photoresist film on the copper foil substrate with the positioning hole;
s4: transferring the film pattern to a dry film pasted with a photoresist film by using an exposure machine through alignment of an alignment hole;
s5: adjusting the developing parameters required by the dry film, washing the part of the dry film which is not illuminated by using liquid medicine, and displaying a pattern required by copper etching;
s6: adjusting copper etching parameters, and then etching copper on the windowing position of the copper-clad plate, wherein the copper etching parameters are consistent with those designed in the actual production process;
s7: and (4) carrying out copper thickness measurement on the copper-clad plate graph subjected to copper etching treatment through CMI (China Mobile instrumentation), and carrying out uniformity analysis on the copper thickness after etching after obtaining all measurement data.
2. The test method for copper etching uniformity analysis according to claim 1, wherein the preselected dimensions in step S1 are 500mm x 620mm, and the preselected thickness is 1.5 mm.
3. The test method for uniformity analysis of etched copper according to claim 1, wherein the aperture of the positioning hole in step S2 is 2 mm.
4. The test method for uniformity analysis of copper etching according to claim 3, wherein said positioning holes are routed by a routing knife.
5. The test method for uniformity analysis of etched copper according to claim 1, wherein in the design of the film pattern, the diameter of the probe of the CMI copper thickness detection instrument is 2cm, and the film windowing design pattern is greater than 2 cm.
6. The test method for etching uniformity of copper according to claim 1, wherein the board to be tested is a copper clad laminate after etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210463216.6A CN114980529A (en) | 2022-04-28 | 2022-04-28 | Test method for copper etching uniformity analysis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210463216.6A CN114980529A (en) | 2022-04-28 | 2022-04-28 | Test method for copper etching uniformity analysis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114980529A true CN114980529A (en) | 2022-08-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210463216.6A Pending CN114980529A (en) | 2022-04-28 | 2022-04-28 | Test method for copper etching uniformity analysis |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102111961A (en) * | 2010-12-20 | 2011-06-29 | 胜宏科技（惠州）有限公司 | Method for detecting process capability of inner and outer layers of circuit board |
| CN107560533A (en) * | 2017-07-31 | 2018-01-09 | 江门崇达电路技术有限公司 | A kind of measurement apparatus and method for improving electroplating evenness analysis efficiency |
| CN109781048A (en) * | 2019-01-17 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of test board and method for etch uniformity analysis |
| CN110719697A (en) * | 2019-10-28 | 2020-01-21 | 深圳市兴森快捷电路科技股份有限公司 | PCB etching uniformity detection and adjustment method |
| CN111800954A (en) * | 2020-06-16 | 2020-10-20 | 珠海杰赛科技有限公司 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
-
2022
- 2022-04-28 CN CN202210463216.6A patent/CN114980529A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102111961A (en) * | 2010-12-20 | 2011-06-29 | 胜宏科技（惠州）有限公司 | Method for detecting process capability of inner and outer layers of circuit board |
| CN107560533A (en) * | 2017-07-31 | 2018-01-09 | 江门崇达电路技术有限公司 | A kind of measurement apparatus and method for improving electroplating evenness analysis efficiency |
| CN109781048A (en) * | 2019-01-17 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of test board and method for etch uniformity analysis |
| CN110719697A (en) * | 2019-10-28 | 2020-01-21 | 深圳市兴森快捷电路科技股份有限公司 | PCB etching uniformity detection and adjustment method |
| CN111800954A (en) * | 2020-06-16 | 2020-10-20 | 珠海杰赛科技有限公司 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
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