CN108333881A - A kind of splicing adjustment method applied to write-through exposure machine - Google Patents
A kind of splicing adjustment method applied to write-through exposure machine Download PDFInfo
- Publication number
- CN108333881A CN108333881A CN201810060266.3A CN201810060266A CN108333881A CN 108333881 A CN108333881 A CN 108333881A CN 201810060266 A CN201810060266 A CN 201810060266A CN 108333881 A CN108333881 A CN 108333881A
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- Prior art keywords
- exposure
- write
- adjacent
- mark points
- exposure machine
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of splicing adjustment method applied to write-through exposure machine, including：Design a kind of suitable exposure figure；Using relational theory design value in position between field as position relation value between initial field；A printed circuit board is placed on exposure table top；Exposure figure is exposed on printed circuit board；Measure the coordinate and record of each MARK points；Calculate offset component of the qualified two adjacent MARK points along X, Y both direction；The offset component of both direction is judged whether in preset indication range, if so, being repeated the above steps position relation value between current field as position relation value between final field if it is not, then compensating offset component into position relation value between current field.The present invention carries out automatic measurement by means of the high precision measuring system of write-through exposure machine itself and computes and compensates for verifying by designing a kind of suitable exposure figure, and debug time is greatly saved, effectively increases production efficiency.
Description
Technical field
It is specifically a kind of applied to write-through exposure machine the present invention relates to write-through exposure machine machine debugging technical field
Splice adjustment method.
Background technology
Write-through exposure machine is the required facility in printed circuit board (pcb board) production process, is a kind of utilization figure hair
The mask plate of raw device substitution conventional lithography machine, and by DMD reflect the laser of specific wavelength in dry film or by photoresist it is anti-
The equipment that exposure figure should be transferred directly on printed circuit board.
Write-through exposure machine saves the time for making the film and expense compared with conventional exposure machine, can improve printing electricity
The production capacity and yield of road plate producer.But write-through exposure machine is in process of production, and splicing debugging needs to consume manpower and needs
It is equipped with high-precision microscope, is measured time-consuming.
Invention content
The purpose of the present invention is to provide a kind of splicing adjustment methods applied to write-through exposure machine, to solve write-through
The exposure machine splicing debugging link problem that time-consuming, debugging flow is cumbersome.
The technical scheme is that：
A kind of splicing adjustment method applied to write-through exposure machine, this approach includes the following steps：
(1) a kind of exposure figure consistent with the maximum exposure size of write-through exposure machine to be debugged, the exposure are designed
The content of figure is that there are one unique marks for each MARK points tool in equidistant MARK dot matrixs and the matrix；
(2) position relational theory design value between the field of each pair of adjacent exposure subelement of write-through exposure machine to be debugged is made
The position relation value between its initial field；
(3) printed circuit board is placed on exposure table top；
(4) exposure figure is exposed on the printed circuit board using write-through exposure machine to be debugged；
(5) using the measuring system of write-through exposure machine to be debugged to MARK dot matrixs exposed on printed circuit board
It measures, records the centre coordinate of each MARK points；
(6) for each pair of adjacent exposure subelement, this is optionally belonging respectively to two exposures in adjacent exposure subelement
Subelement exposes and the identical two adjacent MARK points of row coordinate, calculates described two adjacent MARK points along X, the offset of Y-direction
Component Δ x, Δ y；
(7) Δ x, Δ y are judged whether in preset indication range, if it is not, (8) are thened follow the steps, if so, executing
Step (9)；
(8) it Δ x, Δ y being compensated the current field to this between adjacent exposure subelement in the relation value of position, then repeats
Step (3) is to step (7)；
(9) position relationship the position relation value field final as its current field using this between adjacent exposure subelement
Value.
The splicing adjustment method applied to write-through exposure machine, in step (1), the MARK points are diameter 1mm
Dot.
The splicing adjustment method applied to write-through exposure machine, in step (6), calculated using following formula described in
Two adjacent MARK points are along X, offset component Δ x, the Δ y of Y-direction：
Δ x=X(i+1,j)-X(i,j)-d
Δ y=Y(i+1,j)-Y(i,j)
Wherein, X(i+1,j)、X(i,j)The centre coordinate of described two adjacent MARK points in X direction, Y are indicated respectively(i+1,j)、
Y(i,j)Indicate that centre coordinate of described two adjacent MARK points along Y-direction, d indicate the theory of described two adjacent MARK points respectively
Centre-to-centre spacing.
Beneficial effects of the present invention are：
As shown from the above technical solution, the present invention is by designing a kind of suitable exposure figure, and by means of write-through
The high precision measuring system of exposure machine itself carries out automatic measurement and computes and compensates for verifying, and write-through exposure machine is greatly saved
Debug time effectively increases the production efficiency of write-through exposure machine.
Description of the drawings
Fig. 1 is flow chart of the method for the present invention；
Fig. 2 is the exposure figure exemplary plot that the present invention designs；
Fig. 3 is the graphical examples that the present invention is exposed on printed circuit board；
Fig. 4 is the schematic diagram that X, Y-direction offset component are calculated in the present invention.
Specific implementation mode
It further illustrates the present invention in the following with reference to the drawings and specific embodiments.
As shown in Figure 1, a kind of splicing adjustment method applied to write-through exposure machine, includes the following steps：
S1, a kind of exposure figure consistent with the maximum exposure size of write-through exposure machine to be debugged of design, such as Fig. 2 institutes
Show, the content of exposure figure is equidistant circle MARK dot matrixs, shares m rows n row.Each the diameter of MARK points is
1mm, and each MARK points are there are one unique mark, such as (i, j), i=1,2 ..., m represent current line, j=1, and 2 ...,
Forefront is worked as in n representatives.The theoretical center of two adjacent MARK points in same row/column is away from for d.
As shown in figure 3, the MARK points that coordinate is (i, j) and (i+1, j) (j=1,2 ..., n) are two adjacent exposures respectively
The figure that subelement exposes out, referred to herein as between field at stitching position.Since actual exposure subelement is there are installation error,
So the theoretical center that configures with operating center distance away from having deviation when exposure.The MARK points of right side broken line representation are theory in Fig. 3
The MARK points of position, solid line are physical location.
S2, by write-through exposure machine to be debugged exposure subelement field between position relational theory design value (X0,Y0) conduct
Position relation value between initial field, the present embodiment are illustrated with two exposure subelements, then X0Indicate that second exposure is single
Member exposes the theoretical center of subelement in X direction away from Y relative to first0Indicate second exposure subelement relative to first
It is a exposure subelement along Y-direction theoretical center away from.
S3, one piece of printed circuit board for being covered with certain emulsion is placed on exposure table top.
S4, the suitable exposure dose of exposure figure designed in step S1 is exposed using write-through exposure machine to be debugged
On light to printed circuit board.Ensure that vacuum suction is good between printed circuit board and exposure table top when exposure, edges of boards surrounding is without warpage.
S5, using the measuring system of write-through exposure machine to be debugged to MARK dot matrixs exposed on printed circuit board
It measures, records the centre coordinate (C of each MARK pointsi,Cj).Ensure the survey of write-through exposure machine to be debugged before this
Amount system is adapted to be finished, and index is met.Measurement and record in the step are to be performed fully automatic.
S6, as shown in figure 4, the MARK points according to step S5 record centre coordinate, using following formula, calculating belongs to respectively
In two adjacent exposure subelement exposures and the identical two adjacent MARK points of row coordinate (an optional row) are along X, Y both direction
Offset component：
Δ x=X(i+1,j)-X(i,j)-d
Δ y=Y(i+1,j)-Y(i,j)
Wherein, Δ x indicate be belonging respectively to two adjacent exposure subelements exposure two adjacent MARK points (i+1, j) and
The offset component of (i, j) in X direction, Δ y indicate two adjacent MARK points for being belonging respectively to the exposure of two adjacent exposure subelements
(i+1, j) and (i, j) is along the offset component of Y-direction, X(i+1,j)Indicate the actual measurement centre coordinate of MARK points (i+1, j) in X direction,
Y(i+1,j)Indicate MARK points (i+1, j) along the actual measurement centre coordinate of Y-direction, X(i,j）Indicate the actual measurement of MARK points (i, j) in X direction
Centre coordinate, Y(i,j)Indicate actual measurement centre coordinate of the MARK points (i, j) along Y-direction.Due to a shared n row, herein the value of j from
1,2 ..., optional one in n.
S7, Δ x, Δ y are judged whether in preset indication range, if it is not, S8 is thened follow the steps, if so, executing
Step S9.
S8, Δ x, Δ y are compensated into position relation value between current field, repeats step S3~S7.Wherein, by Δ x, Δ
Y is compensated into position relation value between current field to be obtained using cumulative method, such as in first time iterative process, current field
Between position relation value between initial field position relation value on the spot between position relational theory design value (X0,Y0), it uses at this time following
Formula obtains position relation value (X between new field1,Y1), it is used further to next iteration, and so on：
X1=X0+Δx
Y1=Y0+Δy
S9, using position relation value between current field as position relation value between final field, splicing debugging is completed.
Since the present embodiment is illustrated with two exposure subelements, that is, only a pair of of adjacent exposure is single
Member, in practical applications, the number for exposing subelement are unlimited, that is, there are several to adjacent exposure subelement, then for every
To adjacent exposure subelement, operated respectively according to above-mentioned steps.
In conclusion the present invention utilizes the measuring system of write-through exposure machine itself precision to be debugged, a kind of exposure is designed
Figure is handled for debugging, and by debugging flow with software automation, is achieved the effect that accurate, quick, inexpensive.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to the model of the present invention
It encloses and is defined, under the premise of not departing from design spirit of the present invention, technical side of the those of ordinary skill in the art to the present invention
The various modifications and improvement that case is made should all be fallen into the protection domain of claims of the present invention determination.
Claims (3)
1. a kind of splicing adjustment method applied to write-through exposure machine, which is characterized in that this approach includes the following steps：
(1) a kind of exposure figure consistent with the maximum exposure size of write-through exposure machine to be debugged, the exposure figure are designed
Content be that there are one unique marks for each MARK points tool in equidistant MARK dot matrixs and the matrix；
(2) using position relational theory design value between the field of each pair of adjacent exposure subelement of write-through exposure machine to be debugged as it
Position relation value between initial field；
(3) printed circuit board is placed on exposure table top；
(4) exposure figure is exposed on the printed circuit board using write-through exposure machine to be debugged；
(5) MARK dot matrixs exposed on printed circuit board are carried out using the measuring system of write-through exposure machine to be debugged
It measures, records the centre coordinate of each MARK points；
(6) for each pair of adjacent exposure subelement, it is single to two exposure in adjacent exposure subelement to be optionally belonging respectively to this
Member exposure and the identical two adjacent MARK points of row coordinate calculate described two adjacent MARK points along X, the offset component of Y-direction
Δx、Δy；
(7) Δ x, Δ y are judged whether in preset indication range, if it is not, (8) are thened follow the steps, if so, thening follow the steps
(9)；
(8) Δ x, Δ y being compensated the current field to this between adjacent exposure subelement in the relation value of position, then repeatedly step
(3) to step (7)；
(9) position relation value the position relation value field final as its current field using this between adjacent exposure subelement.
2. the splicing adjustment method according to claim 1 applied to write-through exposure machine, which is characterized in that step (1)
In, the MARK points are the dot of diameter 1mm.
3. the splicing adjustment method according to claim 1 applied to write-through exposure machine, which is characterized in that step (6)
In, described two adjacent MARK points are calculated along X, offset component Δ x, the Δ y of Y-direction using following formula：
Δ x=X(i+1,j)-X(i,j)-d
Δ y=Y(i+1,j)-Y(i,j)
Wherein, X(i+1,j)、X(i,j)The centre coordinate of described two adjacent MARK points in X direction, Y are indicated respectively(i+1,j)、Y(i,j)Point
Do not indicate that centre coordinate of described two adjacent MARK points along Y-direction, d indicate the theoretical center of described two adjacent MARK points
Away from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810060266.3A CN108333881A (en) | 2018-01-22 | 2018-01-22 | A kind of splicing adjustment method applied to write-through exposure machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810060266.3A CN108333881A (en) | 2018-01-22 | 2018-01-22 | A kind of splicing adjustment method applied to write-through exposure machine |
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| CN108333881A true CN108333881A (en) | 2018-07-27 |
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|---|---|---|---|
| CN201810060266.3A Withdrawn CN108333881A (en) | 2018-01-22 | 2018-01-22 | A kind of splicing adjustment method applied to write-through exposure machine |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109283804A (en) * | 2018-11-14 | 2019-01-29 | 江苏友迪激光科技有限公司 | A method of improving direct write exposure machine exposure accuracy and harmomegathus measurement accuracy |
| CN109597224A (en) * | 2018-11-27 | 2019-04-09 | 深圳市华星光电技术有限公司 | Mosaic splices product splice region method of adjustment and device |
| CN111983901A (en) * | 2020-08-28 | 2020-11-24 | 合肥众群光电科技有限公司 | Splicing debugging device and method based on platform position signal |
| CN114488704A (en) * | 2021-12-15 | 2022-05-13 | 惠州市金百泽电路科技有限公司 | Method for detecting and correcting graph splicing error of photoetching machine based on DMD |
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| US20090262319A1 (en) * | 2008-03-10 | 2009-10-22 | Hiroyasu Matsuura | Maskless exposure method |
| CN102902164A (en) * | 2012-09-19 | 2013-01-30 | 天津芯硕精密机械有限公司 | Two-dimensional mosaic processing method for direct writing lithography machine in step printing |
| KR20140066609A (en) * | 2012-11-23 | 2014-06-02 | 엘지디스플레이 주식회사 | Methods for aligning a maskless exposure apparatus |
| CN104281013A (en) * | 2014-09-29 | 2015-01-14 | 天津津芯微电子科技有限公司 | Inclined scanning stitching method of write-through lithography system |
| CN106647180A (en) * | 2016-11-28 | 2017-05-10 | 湖北凯昌光电科技有限公司 | Error correction and compensation method and device based on calibration board in direct-writing exposure machine |
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2018
- 2018-01-22 CN CN201810060266.3A patent/CN108333881A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090262319A1 (en) * | 2008-03-10 | 2009-10-22 | Hiroyasu Matsuura | Maskless exposure method |
| CN102902164A (en) * | 2012-09-19 | 2013-01-30 | 天津芯硕精密机械有限公司 | Two-dimensional mosaic processing method for direct writing lithography machine in step printing |
| KR20140066609A (en) * | 2012-11-23 | 2014-06-02 | 엘지디스플레이 주식회사 | Methods for aligning a maskless exposure apparatus |
| CN104281013A (en) * | 2014-09-29 | 2015-01-14 | 天津津芯微电子科技有限公司 | Inclined scanning stitching method of write-through lithography system |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109283804A (en) * | 2018-11-14 | 2019-01-29 | 江苏友迪激光科技有限公司 | A method of improving direct write exposure machine exposure accuracy and harmomegathus measurement accuracy |
| CN109597224A (en) * | 2018-11-27 | 2019-04-09 | 深圳市华星光电技术有限公司 | Mosaic splices product splice region method of adjustment and device |
| CN109597224B (en) * | 2018-11-27 | 2021-04-23 | Tcl华星光电技术有限公司 | Mosaic splicing product splicing area adjusting method and device |
| CN111983901A (en) * | 2020-08-28 | 2020-11-24 | 合肥众群光电科技有限公司 | Splicing debugging device and method based on platform position signal |
| CN114488704A (en) * | 2021-12-15 | 2022-05-13 | 惠州市金百泽电路科技有限公司 | Method for detecting and correcting graph splicing error of photoetching machine based on DMD |
| CN114488704B (en) * | 2021-12-15 | 2024-04-02 | 惠州市金百泽电路科技有限公司 | Method for detecting and correcting pattern splicing error of photoetching machine based on DMD |
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Application publication date: 20180727 |