CN115767924A - Method for manufacturing circuit board by laser etching - Google Patents
Method for manufacturing circuit board by laser etching Download PDFInfo
- Publication number
- CN115767924A CN115767924A CN202310011906.2A CN202310011906A CN115767924A CN 115767924 A CN115767924 A CN 115767924A CN 202310011906 A CN202310011906 A CN 202310011906A CN 115767924 A CN115767924 A CN 115767924A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- etching
- substrate
- coating material
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000010329 laser etching Methods 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000005530 etching Methods 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000007888 film coating Substances 0.000 claims abstract description 14
- 238000009501 film coating Methods 0.000 claims abstract description 14
- 238000000608 laser ablation Methods 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002253 acid Substances 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 6
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000011161 development Methods 0.000 abstract description 4
- 238000003384 imaging method Methods 0.000 abstract description 4
- 238000012546 transfer Methods 0.000 abstract description 3
- 238000000227 grinding Methods 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to the technical field of circuit board manufacturing, and discloses a method for manufacturing a circuit board by laser etching, which comprises the following steps: s1, drilling and electroplating operations are finished at a set position of a substrate, and then a film coating material is coated on the outer surface of the substrate, so that the copper surface of a non-circuit part is completely exposed; s2, transferring the pattern circuit on the mask sheet to a film coating material of the substrate, and forming an image by laser ablation to form the pattern circuit; s3, completely removing the copper of the non-circuit part by acid etching, and then plating tin on the position without the dry film and in the hole on the circuit board; and S4, removing the film coating material to obtain the circuit board. According to the method for manufacturing the circuit board through laser etching, the image transfer technology is replaced by the laser ablation imaging technology, the technical links of labor waste, large pollution, such as plate grinding, dry film pasting, alignment, exposure, development and dry film removal are omitted, the processing efficiency is greatly improved, the processing cost is reduced, etching can be enabled to be cleaner and more thorough, and the problem of overlarge side etching can be prevented.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a circuit board by laser etching.
Background
With the rapid development of electronic and communication products, the signal transmission amount is increased and the transmission speed is accelerated, so that the design of the printed circuit board is carried out towards the direction of high frequency, high power and miniaturization, and the high signal power, high current and high voltage put forward higher requirements on the surface copper thickness and the hole copper thickness of the printed circuit board.
In the existing printed circuit board manufacturing, an outer layer circuit is manufactured through a positive sheet process after copper deposition and board electrification: coating → exposure → development → copper plating → tin plating → film removal → etching → tin removal, however, some technical links in these steps are labor-consuming, cause pollution greatly, and the processing efficiency is low, so a method for manufacturing a circuit board by laser etching is provided to solve the above-mentioned technical problems.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a method for manufacturing a circuit board by laser etching, which solves the problems of large pollution and low processing efficiency.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a method for manufacturing a circuit board by laser etching comprises the following steps:
s1, drilling and electroplating operations are finished at a set position of a substrate, and then a film coating material is coated on the outer surface of the substrate to completely expose the copper surface of a non-circuit part;
s2, transferring the pattern circuit on the mask film to a film coating material of the substrate, and forming an image by laser ablation to form the pattern circuit;
s3, completely removing the copper of the non-circuit part by acid etching, and then plating tin on the position without the dry film and in the hole on the circuit board;
and S4, removing the film coating material to obtain the circuit board.
Preferably, in the step S1, the coating material is a positive photoresist or a negative photoresist, the coating material is pressed on the substrate by high pressure, and the pressing manner is hot roll pressing.
Preferably, the laser spot with a circular shape and a diameter of 1-500um is used in the laser etching process in the step S2, and the laser etching process is performed until the copper-clad layer is formed.
Preferably, the etching solution used in the etching in step S3 is an acidic etching solution such as a hydrochloric acid system, and the thickness of the copper surface of the non-circuit portion subtracted by the etching is fifty percent of the total thickness of the copper surface.
Preferably, the substrate is rinsed with pure water in step S4, and the AOI inspection is passed.
(III) advantageous effects
Compared with the prior art, the invention provides a method for manufacturing a circuit board by laser etching, which has the following beneficial effects:
according to the method for manufacturing the circuit board through laser etching, the image transfer technology is replaced by the laser ablation imaging technology, the technical links of labor waste, large pollution, such as plate grinding, dry film pasting, alignment, exposure, development and dry film removal are omitted, the processing efficiency is greatly improved, the processing cost is reduced, etching can be enabled to be cleaner and more thorough, and the problem of overlarge side etching can be prevented.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment is as follows:
a method for manufacturing a circuit board by laser etching comprises the following steps:
s1, drilling and electroplating operations are finished at a set position of a substrate, and then a film coating material is coated on the outer surface of the substrate, wherein the film coating material is positive photoresist or negative photoresist, the film coating material is covered on the substrate through high pressure pressing, and the pressing mode is hot roller pressing, so that the copper surface of a non-circuit part is completely exposed;
s2, transferring the pattern circuit on the mask sheet to a film coating material of the substrate, performing laser ablation imaging, and performing laser etching until the pattern circuit is coated with a copper layer by adopting a laser spot which is circular and has the diameter of 1-500 um;
s3, completely removing the copper of the non-circuit part by acid etching, wherein the etching solution is acid etching solution such as a hydrochloric acid system, the thickness of the copper surface of the non-circuit part subtracted by the acid etching is fifty percent of the total thickness of the copper surface, and then plating tin on the position without a dry film on the circuit board and in the hole;
and S4, removing the film coating material, washing the substrate with pure water, and performing AOI (automated optical inspection) to obtain the circuit board.
The invention has the beneficial effects that: through having replaced image transfer technique with laser ablation imaging technology, saved and ground the board, pasted the dry film, to counterpoint, expose, develop and take off the dry film and wait take the manual work, pollute big technical link, promoted machining efficiency greatly, reduced the processing cost, and can make the etching cleaner thoroughly, can prevent to appear the too big problem of undercut.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A method for manufacturing a circuit board by laser etching is characterized by comprising the following steps:
s1, drilling and electroplating operations are finished at a set position of a substrate, and then a film coating material is coated on the outer surface of the substrate, so that the copper surface of a non-circuit part is completely exposed;
s2, transferring the pattern circuit on the mask film to a film coating material of the substrate, and forming an image by laser ablation to form the pattern circuit;
s3, completely removing the copper of the non-circuit part by acid etching, and then plating tin on the position without the dry film and the hole on the circuit board;
and S4, removing the film coating material to obtain the circuit board.
2. The method of claim 1, wherein the coating material in step S1 is a positive photoresist or a negative photoresist, and the coating material is pressed on the substrate by high pressure, and the pressing is performed by hot roll pressing.
3. The method of claim 1, wherein a laser spot with a circular shape and a diameter of 1-500um is used in the laser etching process in step S2, and the laser etching process is performed to the copper-clad layer.
4. The method of claim 1, wherein the etching solution used in the etching in step S3 is an acidic etching solution such as a hydrochloric acid system, and the thickness of the copper surface of the non-circuit portion subtracted by the etching is fifty percent of the total thickness of the copper surface.
5. The method for manufacturing a circuit board by laser etching as claimed in claim 1, wherein the substrate is further rinsed by pure water in step S4, and is inspected by AOI.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310011906.2A CN115767924A (en) | 2023-01-05 | 2023-01-05 | Method for manufacturing circuit board by laser etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310011906.2A CN115767924A (en) | 2023-01-05 | 2023-01-05 | Method for manufacturing circuit board by laser etching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115767924A true CN115767924A (en) | 2023-03-07 |
Family
ID=85348249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310011906.2A Pending CN115767924A (en) | 2023-01-05 | 2023-01-05 | Method for manufacturing circuit board by laser etching |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115767924A (en) |
-
2023
- 2023-01-05 CN CN202310011906.2A patent/CN115767924A/en active Pending
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