CN105916305A - Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad - Google Patents
Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad Download PDFInfo
- Publication number
- CN105916305A CN105916305A CN201610335458.1A CN201610335458A CN105916305A CN 105916305 A CN105916305 A CN 105916305A CN 201610335458 A CN201610335458 A CN 201610335458A CN 105916305 A CN105916305 A CN 105916305A
- Authority
- CN
- China
- Prior art keywords
- pcb
- printing ink
- jack
- windowed
- jacks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The invention relates to a method for preventing printing ink in jacks of a single-side-windowed jack panel of a PCB from attaching to a welding pad. The method is used for manufacturing the PCB, and comprises the steps that the PCB is subjected to an exposure working procedure after solder mask printing, and then subjected to a development working procedure and an added empty exposure working procedure after the development working procedure. According to the method, the empty exposure working procedure is added, so that surface of the printing ink in the jacks at single-side-windowed positions are subjected to preliminary curing, a printing ink solvent in the jacks can volatilize towards two sides of the jacks evenly rather than volatilize towards jack surfaces at the single-side-windowed positions, since the solvent in the jacks volatilize towards two sides of the jack ports evenly, printing ink residues formed through volatilization towards one surface of the jack ports excessively cannot appear on the jack ports of the welding pad, the problem that the printing ink or printing ink solvent residues appear on the jack ports of the welding pad can be solved, thereby enhancing production efficiency.
Description
Technical field
The present invention relates in the consent plate hole that a kind of PCB of preventing one side is windowed the method for pad on ink, belong to pcb board and manufacture field.
Background technology
Development along with mounting technology, it is desirable to pcb board one side is windowed and required plug oil in patch, hole, it is ensured that during patch, tin sweat(ing) will not be dropped to be formed on components and parts stannum poor short circuit by being penetrated into other one side in hole.
In existing production technology, for this type of pcb board, after green oil print exposure, development, enter oven carry out baking sheet and be dried, when being dried, the one side volatilization that the printing ink solvent in pcb board hole will all be windowed from one side, volatilization process has some ink or printing ink solvent remains on the pad in aperture, when causing patch, cannot normal patch, it is necessary to manual struck off, thus reduce production efficiency.
It is therefore desirable to the method for pad on ink in designing the consent plate hole that a kind of PCB of preventing one side is windowed, to overcome the problems referred to above.
Summary of the invention
It is an object of the invention to overcome the defect of prior art, it is provided that the method for pad on ink in the consent plate hole that a kind of PCB of preventing one side is windowed, it is possible to resolve ink or printing ink solvent remain in this problem on the pad in aperture, thus improve production efficiency.
The present invention is achieved in that
The present invention provides in the consent plate hole that a kind of PCB of preventing one side is windowed the method for pad on ink, is used for manufacturing pcb board, it is characterised in that, including: pcb board is after green oil prints, first carry out exposure process, then carry out developing procedure, after developing procedure, increase empty exposure process.
Further, in developing procedure concentration be the aqueous sodium carbonate of 1%-2% as developer solution, the temperature of developer solution is 30 DEG C-40 DEG C.
Further, exposure process and empty exposure process all use high voltage mercury lamp or Iodine gallium light as light source.
The method have the advantages that
Pcb board, after green oil prints, first carries out exposure process, then carries out developing procedure, increases empty exposure process after developing procedure.The present invention increases sky exposure process, in making the hole of opening one side window position, ink pellet surface carries out primary solidification, then when heat cure, in hole, printing ink solvent can volatilize to both sides, hole uniformly, rather than all volatilize to the face, hole of opening one side window position, owing to the solvent in hole volatilizees to two sides, aperture uniformly, would not occur because the most too much volatilizing the ink residue formed on the pad in aperture to aperture one side, ink can be solved or printing ink solvent remains in this problem on the pad in aperture, thus improve production efficiency.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art are obtained on the premise of not making creative work, broadly fall into the scope of protection of the invention.
In the consent plate hole that the embodiment of the present invention a kind of PCB of preventing one side of offer is windowed, the method for pad on ink, is used for manufacturing pcb board, it is characterised in that, including: pcb board is after green oil prints, first carry out exposure process, then carry out developing procedure, after developing procedure, increase empty exposure process.
Further, in developing procedure concentration be the aqueous sodium carbonate of 1%-2% as developer solution, the temperature of developer solution is 30 DEG C-40 DEG C.
Further, exposure process and empty exposure process all use high voltage mercury lamp or Iodine gallium light as light source.
In exposure process, before starting exposure, mylar and the instrument bezel of exposure frame to be checked is the cleanest, if electrostatic preventive cloth wiped clean the most totally should be used in time, then, open the on and off switch of exposure machine, then open vacuum button selection exposure program, before not starting formally to expose, can allow exposure machine " empty expose " five times, the effect of " empty expose " is to enable the machine to enter saturated duty, most importantly makes ultraviolet exposure lamp energy enter normal range.If the energy of " empty exposure " Exposing Lamp may not be introduced into optimal duty.Pcb board will be made in exposure to go wrong.Exposure machine enters optimum Working, and before with photographic film para-position, negative quality to be checked is the most qualified.Check on negative, whether medicine face has the part of pin hole and exposure, the most consistent with the figure of pcb board, because this will check that photograph negative can be avoided because some unnecessary reasons make pcb board do over again or scrap.
In developing procedure, development operation is carried out in developing machine, controls the photographic parameters such as the temperature of developer solution, transfer rate, spray pressure well, it is possible to obtain more preferable development effect.In this preferred embodiment, in developing procedure concentration be the aqueous sodium carbonate of 1%-2% as developer solution, the temperature of developer solution is 30 DEG C-40 DEG C.Development is the welding resistance that the part developing solution of shading is removed on pad.Before formal development, developing machine to be heated up, make solution reach predetermined temperature, thus reach optimal development effect.Developing machine divides three parts: first paragraph is spray section, mainly by high-pressure injection natrium carbonicum calcinatum, makes the solder resist not being exposed be dissolved down；Second segment is washing section, is first to utilize high-pressure pump to wash, and first by clean for residual solution washing, subsequently into circulating water wash, thoroughly cleans；3rd section is to be respectively arranged with an air knife before and after the section of drying up, the section of drying up mainly with hot blast, plank to be dried up, then has that the temperature of the section of drying up is higher also can dry plank.
Developing procedure increases empty exposure process after completing, in making the hole of opening one side window position, ink pellet surface carries out primary solidification, then when heat cure, in hole, printing ink solvent can volatilize to both sides, hole uniformly, rather than all volatilize to the face, hole of opening one side window position, owing to the solvent in hole volatilizees to two sides, aperture uniformly, would not occur because the most too much volatilizing the ink residue formed on the pad in aperture to aperture one side, ink can be solved or printing ink solvent remains in this problem on the pad in aperture, thus improve production efficiency.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (3)
1. prevent in the consent plate hole that PCB one side windows a method for pad on ink, be used for manufacturing pcb board, it is characterised in that including: pcb board, after green oil prints, first carries out exposure process, then carries out developing procedure, after developing procedure, increase empty exposure process.
The method of pad on ink in the consent plate hole that a kind of PCB of preventing one side is windowed, it is characterised in that: in developing procedure concentration be the aqueous sodium carbonate of 1%-2% as developer solution, the temperature of developer solution is 30 DEG C-40 DEG C.
The method of pad on ink in the consent plate hole that a kind of PCB of preventing one side is windowed, it is characterised in that: exposure process and empty exposure process all use high voltage mercury lamp or Iodine gallium light as light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610335458.1A CN105916305A (en) | 2016-05-19 | 2016-05-19 | Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610335458.1A CN105916305A (en) | 2016-05-19 | 2016-05-19 | Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105916305A true CN105916305A (en) | 2016-08-31 |
Family
ID=56749463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610335458.1A Pending CN105916305A (en) | 2016-05-19 | 2016-05-19 | Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105916305A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658990A (en) * | 2016-11-13 | 2017-05-10 | 惠州市大亚湾科翔科技电路板有限公司 | Method preventing printing ink from remaining on pad in hole of one-side windowed plughole panel of PCB |
| CN106937487A (en) * | 2017-04-21 | 2017-07-07 | 广东依顿电子科技股份有限公司 | Two kinds of methods of ink of silk-screen on wiring board |
| CN109429432A (en) * | 2017-08-29 | 2019-03-05 | 湖北龙腾电子科技有限公司 | A kind of PCB consent board machining process |
| CN113597111A (en) * | 2021-07-29 | 2021-11-02 | 上达电子（黄石）股份有限公司 | Manufacturing process of FPC product without printing ink residue on back surface of through hole |
| CN113966101A (en) * | 2021-12-21 | 2022-01-21 | 广东科翔电子科技股份有限公司 | Small pad windowing manufacturing method of high-precision Mini-LED PCB |
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| CN103458619A (en) * | 2013-08-19 | 2013-12-18 | 四川海英电子科技有限公司 | Method for producing double-sided PCB |
| CN105163503A (en) * | 2015-08-31 | 2015-12-16 | 昆山龙朋精密电子有限公司 | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing |
| CN105319837A (en) * | 2014-06-25 | 2016-02-10 | 东友精细化工有限公司 | Method of preparing photoresist pattern |
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2016
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Patent Citations (9)
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| CN85100133A (en) * | 1985-04-01 | 1986-08-06 | 清华大学 | The manufacturing process of micro-foil resistance strain gauge |
| CN1391430A (en) * | 2001-06-07 | 2003-01-15 | 明碁电通股份有限公司 | Flexible circuit board and its preparing process |
| CN1468049A (en) * | 2002-07-08 | 2004-01-14 | 联测科技股份有限公司 | Method for plating conductive layer on circuit layout of printed circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658990A (en) * | 2016-11-13 | 2017-05-10 | 惠州市大亚湾科翔科技电路板有限公司 | Method preventing printing ink from remaining on pad in hole of one-side windowed plughole panel of PCB |
| CN106937487A (en) * | 2017-04-21 | 2017-07-07 | 广东依顿电子科技股份有限公司 | Two kinds of methods of ink of silk-screen on wiring board |
| CN106937487B (en) * | 2017-04-21 | 2020-04-21 | 广东依顿电子科技股份有限公司 | Method for silk-screen printing of two kinds of printing ink on circuit board |
| CN109429432A (en) * | 2017-08-29 | 2019-03-05 | 湖北龙腾电子科技有限公司 | A kind of PCB consent board machining process |
| CN109429432B (en) * | 2017-08-29 | 2021-09-10 | 湖北龙腾电子科技有限公司 | PCB (printed circuit board) plugging plate processing technology |
| CN113597111A (en) * | 2021-07-29 | 2021-11-02 | 上达电子（黄石）股份有限公司 | Manufacturing process of FPC product without printing ink residue on back surface of through hole |
| CN113966101A (en) * | 2021-12-21 | 2022-01-21 | 广东科翔电子科技股份有限公司 | Small pad windowing manufacturing method of high-precision Mini-LED PCB |
| CN113966101B (en) * | 2021-12-21 | 2022-03-18 | 广东科翔电子科技股份有限公司 | Small pad windowing manufacturing method of high-precision Mini-LED PCB |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20160831 |