JPH09214137A - Manufacture of multilayered board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a simple manufacturing method of a multilayered board wherein the handling as a conductor foil is easy and flatness of the surface of a conductor foil of the outermost layer can be sufficiently ensured. SOLUTION: Conductor foils 30 having releasing films wherein conductor foils 31 for forming a pattern and releasing films 32 are previously separably stuck are arranged on both surfaces of an inner layer member 10 via prepreg 20, setting the conductor foils 31 inside. The inner layer member 10, the prepreg 20 and the conductor foil 30 having releasing films are collectively laminated by heating and pressing, with a pair of mirror plates 40, from outside the conductor foils 30 having releasing films.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a substrate having conductor circuits on both sides, an inner layer material such as a metal core, and a conductor foil such as a copper foil for forming a conductor pattern on the outermost layer. The present invention relates to a method for manufacturing the laminated plate.

[0002]

2. Description of the Related Art A method for producing a laminated board having a substrate having conductor circuits on both sides and an inner layer material such as a metal core inside and a conductor foil such as a copper foil for forming a conductor pattern in the outermost layer. As the method, a method is generally adopted in which conductor foils are arranged on both surfaces of an inner layer material via prepregs, and heat and pressure are applied by a mirror plate to laminate and integrate them. In such a method, when particles such as powdery foreign matter or resin dust generated from the prepreg enter between the conductor foil and the mirror surface plate during the integration of the layers, the dust locally causes the conductor foil to be localized. A pressing pressure is applied to cause dents on the surface of the conductor foil.

Therefore, for example, as shown in FIG. 2, a release film made of resin or the like is arranged between the conductor foil and the mirror surface plate, and a local portion caused by dust that has entered between the conductor foil and the mirror surface plate. It has been proposed to absorb a typical press pressure by the deformation of the release film to prevent the formation of dents on the surface of the conductor foil.

Further, as disclosed in Japanese Patent Laid-Open No. 2-222597, an aluminum foil is preliminarily adhered to the surface of a conductor foil such as a copper foil, and the aluminum foil is made to function as a mirror plate. It has also been proposed to prevent dust from entering between the conductor foil and the mirror surface plate (aluminum foil) and prevent the formation of dents on the conductor foil surface. Here, the aluminum foil is peeled from the surface of the conductor foil after forming the laminated plate and before forming the conductor pattern from the conductor foil by etching or the like.

[0005]

However, even in the conventional method of disposing the release film between the conductor foil and the mirror plate, the conductor foil is as thin as 12 to 35 .mu.m and easily broken. Therefore, the inconvenience of handling such as cleaning of the surface and positioning and fixing cannot be solved.

On the other hand, in the method of previously attaching the aluminum foil functioning as a mirror plate to the conductor foil, since the entire thickness is increased by the amount of the aluminum foil, the conductor foil can be easily handled. The aluminum foil must have a sufficient thickness to ensure the rigidity to function as a mirror plate, but in consideration of the ease of peeling from the conductor foil, the thickness has an upper limit and must be 100 μm or less. I won't. An aluminum foil having such a thickness cannot sufficiently function as a mirror plate, and in particular, when the inner layer material is a substrate having conductor patterns on both sides, unevenness of the conductor pattern of the inner layer substrate May appear on the copper foil.

The present invention has been made in view of the above circumstances, and an object thereof is to easily handle the conductor foil and to ensure that the outermost conductor foil has a sufficiently smooth surface. It is to provide a method for manufacturing a laminated plate which can be secured in a simple manner.

[0008]

The means adopted by the present invention for solving the above problems will be described with reference to the reference numerals used in the drawings. "The prepreg 20 is provided on both sides of the inner layer material 10.
The conductor foil 31 for pattern formation and the release film 32, which are preliminarily attached to each other so as to be separable from each other, with the conductor foil 31 side facing inward.
A pair of mirror surface plates 4 from the outside of the conductor foil 30 with the release film.
The inner layer material 10 and the prepreg 20 are heated and pressurized by 0
And a release film-attached conductor foil 30 are integrally laminated.

According to the above-mentioned manufacturing method, the release film 32 is attached to the conductor foil 31 in advance, and the release film 32 is laminated with the release film 32 on the outside. Even if dust enters the face plate 40, the local pressing pressure generated by the dust can be absorbed by the deformation of the release film 32, and the surface of the conductor foil 31 is not dented by dust.

Further, since the conductor foil 31 is handled as the release film-attached conductor foil 30 which is preliminarily attached to the release film 32 so as to be separable from the release film 32, the conductor foil 31 is thicker than the release film 32 and is less likely to be torn. Handling such as positioning and fixing at the time of integration and surface cleaning becomes easy. As a result, the thickness of the conductor foil 31 itself can be reduced, and the thickness of the laminated plate can be reduced.

Since the release film 32 may be peeled from the surface of the conductor foil 31 at appropriate times after forming the laminated plate and before forming the through holes, the laminated film is laminated at the time of storage of the laminated plate or transportation to various steps. It also functions as a protective film on the board surface.

By the way, in the above-mentioned manufacturing method, the mirror surface plate 40 is used, and the surface smoothness of the conductor foil 31 is ensured by the mirror surface plate 40. Therefore, even if the substrate having conductor patterns on both sides is the inner layer material 10, the conductor pattern of the inner layer substrate does not rise to the surface of the conductor foil 31, and the surface of the outermost conductor foil 31 is not exposed. Sufficient smoothness is secured.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of a method for manufacturing a laminated board according to the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an example of an embodiment of a method for manufacturing a laminated board according to the present invention. The laminated plate is generally formed by laminating the constituent materials of the individual laminated plates on each of a plurality of pairs of mirror surface plates 40, and simultaneously forming a plurality of laminated plates by heating and pressurizing. The portion forming one laminated plate between the pair of mirror surface plates 40 is extracted, and the portion forming the other laminated plate is omitted.

Between a pair of mirror surface plates 40 formed of a 1 mm-thick SUS (stainless steel) plate, on both surfaces of a 0.2 mm-thick inner layer material 10 such as a substrate having a conductor pattern on both surfaces or a metal core, 0.1 mm thick prepreg 2
A conductor foil 31 with a release film, which is obtained by pasting a conductor foil 31 for pattern formation and a release film 32 in advance so that they can be separated from each other, is arranged with the conductor foil 31 side inside. The inner plate 10, the prepreg 20, and the release film-attached conductor foil 30 are laminated and integrated by heating and pressing with the face plate 40.

Since the conductor foil 31 is handled as the release film-attached conductor foil 30 and is easy to handle, a very thin conductor foil 31 can be adopted.
Therefore, in this example, a copper foil having a thickness of 12 μm is used as the conductor foil 31. Further, the release film 32 has, as its characteristics, no residue (adhesion to the mirror plate 40) after lamination and integration, a small heat shrinkage ratio (about 1 to 2% at 190 ° C.), is hard to tear, and is punched. It is required to have good properties and less dust to be caught. Therefore, in this example, a resin film formed of PET (polyethylene terephthalate) resin, PPS (polyphenylene sulfide) resin, or the like is used. If the release film 32 is too thin, it will not be able to sufficiently absorb the pressing pressure of the dust that has entered it, and if it is torn, it will be difficult to peel it off. Since the conductor foil 31 cannot be fitted to the smooth surface, the unevenness on the surface of the inner layer material 10 may cause the conductor foil 3 when the layers are integrated.
The problem occurs that it is raised on the first surface.
Therefore, in this example, the thickness of the release film 32 is set to 2
It is set to 5 to 75 μm. The thickness of the release film 32 is preferably set to about 38 to 50 μm in consideration of easier peeling and ensuring the smoothness of the surface of the conductor foil 31.

As for the release film 32, the material may be appropriately determined in consideration of the characteristics other than the above, and for example, a resin film formed of an acrylic resin may be adopted. . Regarding the thickness, naturally, tearing does not occur and peeling is easy, and it is possible to reliably absorb the pressing pressure of dust that has entered between the release film-attached conductor foil 30 and the mirror surface plate 40. It may be appropriately determined in consideration of surely fitting the conductor foil 31 to the smooth surface of the mirror plate 40.

By the way, in this example, the conductor foil 31 formed of copper foil and the release film 32 formed of PET resin, PPS resin, or the like are used as an adhesive agent for ST (manufactured by Panac Co.) or HP ( A conductive foil 30 with a release film is formed by being adhered so as to be separable from each other by an acrylic adhesive such as an adhesive manufactured by Panac Co., Ltd. In this way, the copper foil and the resin film such as PET resin or PPS resin are separated by S.
5 to 1 at room temperature when attached with T adhesive or HP adhesive
Peel of about 0g / 25mm (force required for peeling)
It can be easily peeled off. In addition, as the adhesive, one having a small peel is preferable, and considering this point,
HP adhesive is preferred (HP adhesive has a peel of 5
g / 25mm, with ST adhesive, peel is 1
0 g / 25 mm). Further, in consideration of prevention of inadvertent peeling due to heating and pressurization at the time of stacking and unifying, it is preferable that the heat resistance is excellent, and in this respect also, the HP adhesive having higher heat resistance than the ST adhesive is preferable.

An example of the adhesive for sticking the conductor foil 31 and the release film 32 has been described above, but the adhesive is not limited to the above, and the conductor foil 31 and the release film 32 are not limited to the above.
It may be appropriately determined depending on the material, heating and pressurizing conditions, and the like, and for example, an adhesive whose adhesive strength is weakened at a predetermined temperature can be adopted.

[0020]

As described in detail above, the method for manufacturing a laminated board according to the present invention is such that even if dust enters between the conductive foil with release film and the mirror surface plate, the separation on the mirror surface plate side is prevented. The die film can prevent dents from being formed on the surface of the conductor foil, and the mirror surface plate can ensure the smoothness of the surface of the conductor foil. A conductor foil that is difficult to handle is attached to a release film so that it can be handled as a conductor foil with a release film.

Therefore, according to the present invention, a simple method for producing a laminated plate is described, which is easy to handle as a conductor foil and can sufficiently secure the surface smoothness of the outermost conductor foil. Can be provided by.

[Brief description of drawings]

FIG. 1 is a front view showing an example of a method for manufacturing a laminated board according to the present invention.

FIG. 2 is a front view showing an example of a conventional laminated plate manufacturing method.

[Explanation of symbols]

 10 Inner Layer Material 20 Prepreg 30 Conductor Foil with Release Film 31 Conductor Foil 32 Release Film 40 Mirror Surface Plate

Claims (1)

[Claims] 1. A release film-attached conductor foil, which is obtained by pasting a pattern-forming conductor foil and a release film in advance so that they can be separated from each other on both surfaces of an inner layer material via prepregs. A laminated board characterized by being placed inside and heat-pressed from the outside of the conductor foil with release film by a pair of mirror surface plates to integrally laminate the inner layer material, prepreg and conductor foil with release film. Production method.