CN202411661U - Laser adhesive removing device and equipment - Google Patents
Laser adhesive removing device and equipment Download PDFInfo
- Publication number
- CN202411661U CN202411661U CN 201120489814 CN201120489814U CN202411661U CN 202411661 U CN202411661 U CN 202411661U CN 201120489814 CN201120489814 CN 201120489814 CN 201120489814 U CN201120489814 U CN 201120489814U CN 202411661 U CN202411661 U CN 202411661U
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- laser
- adhesive
- colloid
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- glue
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Abstract
The utility model discloses a laser adhesive removing device, which comprises an adhesive position selecting unit, an adhesive thickness grading unit, an adhesive removing area dividing unit and a laser energy or laser scanning frequency injecting unit. The adhesive position selecting unit is used for selecting a position with adhesive required to be removed on a PCB (printed circuit board), the adhesive thickness grading unit is connected with the adhesive position selecting unit and used for grading the position with the adhesive according to the thickness of the adhesive, the adhesive removing area dividing unit is connected with the adhesive thickness grading unit and used for dividing different adhesive removing areas, and the laser energy or laser scanning frequency injecting unit is connected with the adhesive removing area dividing unit and used for transmitting laser with different energies or scanning frequencies to the PCB to remove the adhesive according to the adhesive removing areas. The utility model further discloses a laser adhesive removing method and a system. The laser adhesive removing device and the system remove the adhesive by the purely physical method, are environment-friendly and are free of chemical pollution, time is saved, and production efficiency is greatly improved.
Description
Technical field
The utility model relates to the laser equipment field, is specifically related to a kind of laser and removes adhesive dispenser and equipment.
Background technology
Printed circuit board is claimed printed circuit board (PCB), printed substrate again, is called for short printed board; English PCB (printed circuit board) or the PWB (printed wiring board) of being called for short is base material with the insulation board, is cut into certain size; At least has a conductive pattern on it; And cloth porose (like component hole, fastener hole, plated through-hole etc.), be used for replacing installing the chassis of electronic devices and components in the past, and realize interconnecting between the electronic devices and components.Via can make the above circuit conducting each other of two levels; Bigger via has non-conduction hole (nPTH) to be commonly used to as the surface mount location then as part plug-in unit usefulness in addition, and fixed screw is used during assembling; Have many welding holes on the pcb board, be used for through the fixing electronic devices and components of colloid.
When processing final products, integrated circuit, electric crystal, diode, passive device (as: resistance, electric capacity, connector etc.) and other various electronic components can be installed on it.Borrowing lead to be communicated with, can form the electric signal binding and function should be arranged.
In the process of manufacturing PCB plate, when the electronic devices and components that on testing pcb board, insert are bad, need take away; Again change non-defective unit; Will remove the colloid that clings defective products on the pcb board before changing non-defective unit, traditional method adopts manual work to grind off or wipe off, and is so promptly time-consuming; Effort and remove insufficiently, and it is not high to cut yield.
The utility model content
In order to solve above technical problem, the utility model provides a kind of laser to remove adhesive dispenser and equipment.
The utility model discloses a kind of laser and remove adhesive dispenser, comprising:
The colloid part selecting unit is used to select need remove on the pcb board position of colloid;
Colloid thickness stage unit links to each other with described colloid part selecting unit, is used for the classification of colloid thickness is carried out at the position of described colloid;
Remove glue zone division unit, link to each other, be used for according to described different-thickness classification with described colloid thickness stage unit, divides different except that glue regional;
Laser energy or laser scanning number of times are injected the unit, link to each other with the described glue zone division unit of removing, and are used for according to the described glue zone of removing, and emission different laser energy or different laser scanning number of times are removed colloid on described pcb board.
In the described laser of the utility model removes adhesive dispenser, the described different glue zones of removing, specifically: a plurality of different squares and/or rectangle fritter.
Remove in the adhesive dispenser at the described laser of the utility model, thicker in the described thickness classification, needed laser energy or laser scanning number of times are high more, and thickness is more little in the described thickness classification, and needed laser energy or laser scanning number of times are more little.
The utility model discloses a kind of laser glue-removing equipment; The movable platform that bears pcb board that comprises laser generator, the galvanometer head that links to each other with described laser generator, is oppositely arranged with said galvanometer head, the control module that links to each other with described laser generator, galvanometer head and movable platform, described control module comprises that above-mentioned laser removes adhesive dispenser.
In the described laser of the utility model removes adhesive dispenser, but move on the described movable platform X axle, Y axle, three directions of Z axle.
Remove in the adhesive dispenser at the described laser of the utility model, described galvanometer head is movable galvanometer head.
In the described laser of the utility model removes adhesive dispenser, but move on the described galvanometer head X axle, Y axle, three directions of Z axle.
A kind of laser of implementing the utility model removes adhesive dispenser and equipment, has following beneficial technical effects:
1. the method for pure physics realizes removing glue, no chemical contamination, and environmental protection, and durable in use;
2. production efficiency greatly promotes; Be fit to large-batch industrial and remove glue;
3. not retrained by pcb board surface glue body thickness, greatly reduce and produce fraction defective;
4. save time, automated production.
Description of drawings
Fig. 1 is that a kind of laser of the utility model embodiment removes the adhesive dispenser workflow diagram;
Fig. 2 is that a kind of laser of the utility model embodiment removes adhesive dispenser structure block diagram;
Fig. 3 is a kind of laser glue-removing equipment structure of the utility model embodiment block diagram.
The specific embodiment
By the technology contents, the structural feature that specify the utility model, realized purpose and effect, know clearly below in conjunction with embodiment and conjunction with figs. and give explanation.
Laser processing technology be the characteristic of utilizing laser beam and matter interaction to material (comprising metal and nonmetal) cut, welding, surface treatment, punching, little processing and as light source; A special kind of skill of recognition object etc.; The maximum field of conventional use is a laser processing technology, and laser-processing system comprises laser instrument, light-conducting system, machining tool, control system and detection system.
See also Fig. 1, a kind of laser removes gluing method, comprising:
S1. select to remove on the pcb board position of colloid;
Remove bad element, during like IC, colloid also remains on the pcb board, can take the photograph and import the position that display selects to remove colloid mutually into through this colloid of scanning.
S2. the classification of colloid thickness is carried out at the position of described colloid;
It is low that colloid has height to have, and is irregular status, and the utility model carries out the thickness classification, as: can be divided into:
0.01mm～0.02mm is first level of thickness;
0.02mm～0.03mm is second level of thickness;
0.03～0.04mm is the 3rd level of thickness, and the like.Certainly, the class interval of classification can freely be set, and does not limit to top classification, and every various conversion of doing based on the design of the utility model are all at the row of the protection of the utility model.
Thicker in the thickness classification, needed laser energy or laser scanning number of times are high more, and thickness is more little in the described thickness classification, and needed laser energy or laser scanning number of times are more little.
S3. according to described different-thickness classification, divide the different glue zones of removing;
The different glue zones of removing, specifically: a plurality of different squares and/or rectangle fritter.
Because different thickness needs laser energy or laser scanning number of times different, like thinner region, only need run-down to remove; And, need laser scanning repeatedly just can all remove for the colloid in thicker zone.
S4. according to the described glue zone of removing, emission different laser energy or different laser scanning number of times are removed colloid on described pcb board.
We are divided into 0.4mm * 0.4mm (big I is set) like: overall region, and for the colloid of first level of thickness of 0.01mm～0.02mm, this colloid is thinner: laser scanning once can all be removed residual colloid,
And for the colloid of the 3rd level of thickness of 0.03～0.04mm, this colloid is thicker, and we can set more scanning times or laser power is removed glue.As than the colloid of first level of thickness of the 0.01mm～0.02mm scanning of Duoing 3 times.
See also Fig. 2, a kind of laser and remove adhesive dispenser 1, be used for above-mentioned method, comprising: colloid part selecting unit 10, colloid thickness stage unit 20, remove glue zone division unit 30, laser energy or laser scanning number of times and inject unit 40.
Colloid part selecting unit 10 is used to select need remove on the pcb board position of colloid;
Colloid thickness stage unit 20 links to each other with colloid part selecting unit 10, is used for the classification of colloid thickness is carried out at the position of described colloid;
Remove glue zone division unit 30, link to each other, be used for according to described different-thickness classification with colloid thickness stage unit 20, divides different except that glue regional;
Laser energy or laser scanning number of times are injected unit 40, and remove glue zone division unit 30 and link to each other, are used for according to the described glue zone of removing, and on described pcb board, launch the different laser energy or different laser scanning number of times is removed colloid.
Further, the described different glue zones of removing, specifically: a plurality of different squares and/or rectangle fritter.Thicker in the described thickness classification, needed laser energy or laser scanning number of times are high more, and thickness is more little in the described thickness classification, and needed laser energy or laser scanning number of times are more little.
See also Fig. 3, a kind of laser glue-removing equipment; The movable platform that bears pcb board 120 that comprises laser generator 100, the galvanometer head 110 that links to each other with laser generator 100, is oppositely arranged with galvanometer head 110, the control module 130 that links to each other with laser generator 100, galvanometer head 110 and movable platform 120, control module 130 comprises that above-mentioned laser removes adhesive dispenser 1.
Wherein, but move on the movable platform 120 X axles, Y axle, three directions of Z axle; Galvanometer head 110 is movable galvanometer head, but moves on the galvanometer head 110 X axles, Y axle, three directions of Z axle.
This equipment course of work is: the pcb board of needs being removed colloid is placed on movable platform 120; Remove adhesive dispenser 1 through the laser in the control module 130 and select to remove the glue zone; Start laser generator 100, regional through galvanometer head 110 emission laser in removing glue, according to circumstances; Can be moved up and down in movable platform 120 front and back, to make things convenient for the colloid of different parts on the pcb board.Certainly, also can let galvanometer head 110 seesaw except that glue up and down.
A kind of laser of implementing the utility model removes gluing method, device and equipment, has following beneficial technical effects:
1. the method for pure physics realizes removing glue, no chemical contamination, and environmental protection, and durable in use;
2. production efficiency greatly promotes; Be fit to large-batch industrial and remove glue;
3. not retrained by pcb board surface glue body thickness, greatly reduce and produce fraction defective;
4. save time, automated production.
Combine accompanying drawing that the embodiment of the utility model is described above; But the utility model is not limited to the above-mentioned specific embodiment, and the above-mentioned specific embodiment only is schematically, rather than restrictive; Those of ordinary skill in the art is under the enlightenment of the utility model; Not breaking away under the scope situation that the utility model aim and claim protect, also can make a lot of forms, these all belong within the protection of the utility model.
Claims (7)
1. a laser removes adhesive dispenser, it is characterized in that, comprising:
The colloid part selecting unit is used to select need remove on the pcb board position of colloid;
Colloid thickness stage unit links to each other with described colloid part selecting unit, is used for the classification of colloid thickness is carried out at the position of described colloid;
Remove glue zone division unit, link to each other, be used for according to described different-thickness classification with described colloid thickness stage unit, divides different except that glue regional;
Laser energy or laser scanning number of times are injected the unit, link to each other with the described glue zone division unit of removing, and are used for according to the described glue zone of removing, and emission different laser energy or different laser scanning number of times are removed colloid on described pcb board.
2. laser according to claim 1 removes adhesive dispenser, it is characterized in that, the described different glue zones of removing, specifically: a plurality of different squares and/or rectangle fritter.
3. laser according to claim 1 removes adhesive dispenser; It is characterized in that, thicker in the described thickness classification, needed laser energy or laser scanning number of times are high more; Thickness is more little in the described thickness classification, and needed laser energy or laser scanning number of times are more little.
4. laser glue-removing equipment; The movable platform that bears pcb board that comprises laser generator, the galvanometer head that links to each other with described laser generator, is oppositely arranged with said galvanometer head, the control module that links to each other with described laser generator, galvanometer head and movable platform; It is characterized in that described control module comprises that the described laser of claim 1 removes adhesive dispenser.
5. laser glue-removing equipment according to claim 4 is characterized in that, but moves on the described movable platform X axle, Y axle, three directions of Z axle.
6. laser glue-removing equipment according to claim 4 is characterized in that, described galvanometer head is movable galvanometer head.
7. laser glue-removing equipment according to claim 4 is characterized in that, described galvanometer head can be along moving on X axle, Y axle, three directions of Z axle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120489814 CN202411661U (en) | 2011-11-30 | 2011-11-30 | Laser adhesive removing device and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120489814 CN202411661U (en) | 2011-11-30 | 2011-11-30 | Laser adhesive removing device and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202411661U true CN202411661U (en) | 2012-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120489814 Expired - Fee Related CN202411661U (en) | 2011-11-30 | 2011-11-30 | Laser adhesive removing device and equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202411661U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102489882A (en) * | 2011-11-30 | 2012-06-13 | 深圳市木森科技有限公司 | Method, device and equipment for colloid removal with laser |
| CN108461657A (en) * | 2014-12-31 | 2018-08-28 | 上海微电子装备（集团）股份有限公司 | The frit packaging method of laser assisted |
| CN110102900A (en) * | 2019-04-03 | 2019-08-09 | 大族激光科技产业集团股份有限公司 | Ultraviolet laser removes gluing method and system |
| CN111515543A (en) * | 2019-01-16 | 2020-08-11 | 福士瑞精密工业(郑州)有限公司 | Laser degumming method and device |
| CN116275536A (en) * | 2023-03-16 | 2023-06-23 | 中船重工安谱（湖北）仪器有限公司 | Chip silk screen removing device and method |
-
2011
- 2011-11-30 CN CN 201120489814 patent/CN202411661U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102489882A (en) * | 2011-11-30 | 2012-06-13 | 深圳市木森科技有限公司 | Method, device and equipment for colloid removal with laser |
| CN108461657A (en) * | 2014-12-31 | 2018-08-28 | 上海微电子装备（集团）股份有限公司 | The frit packaging method of laser assisted |
| CN111515543A (en) * | 2019-01-16 | 2020-08-11 | 福士瑞精密工业(郑州)有限公司 | Laser degumming method and device |
| CN110102900A (en) * | 2019-04-03 | 2019-08-09 | 大族激光科技产业集团股份有限公司 | Ultraviolet laser removes gluing method and system |
| CN110102900B (en) * | 2019-04-03 | 2020-11-06 | 大族激光科技产业集团股份有限公司 | Ultraviolet laser degumming method and system |
| CN116275536A (en) * | 2023-03-16 | 2023-06-23 | 中船重工安谱（湖北）仪器有限公司 | Chip silk screen removing device and method |
| CN116275536B (en) * | 2023-03-16 | 2024-03-12 | 中船重工安谱（湖北）仪器有限公司 | Chip silk screen removing device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20151130 |