CN203407075U - Multilayer flexible printed circuit board - Google Patents

Multilayer flexible printed circuit board Download PDF

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Publication number
CN203407075U
CN203407075U CN201320539365.2U CN201320539365U CN203407075U CN 203407075 U CN203407075 U CN 203407075U CN 201320539365 U CN201320539365 U CN 201320539365U CN 203407075 U CN203407075 U CN 203407075U
Authority
CN
China
Prior art keywords
printed circuit
flexible printed
circuit board
boards
stiffener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320539365.2U
Other languages
Chinese (zh)
Inventor
李庚桓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen fosunny Tai Precision circuit Co. Ltd.
Original Assignee
Haiyang Bi Ai Odd Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haiyang Bi Ai Odd Electron Co Ltd filed Critical Haiyang Bi Ai Odd Electron Co Ltd
Priority to CN201320539365.2U priority Critical patent/CN203407075U/en
Application granted granted Critical
Publication of CN203407075U publication Critical patent/CN203407075U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a multilayer flexible printed circuit board and belongs to the technical field of circuit board technology. The multi-layer flexible printed circuit board includes single-side flexible printed circuit boards in multiple layers and reinforcing boards. The reinforcing boards arranged in an equally space manner are arranged between the adjacent single-side flexible printed circuit boards. The reinforcing boards are fixed between the single-side flexible printed circuit boards through insulating adhesive. The multilayer flexible printed circuit board is reasonable in structural design and simple and practical in use. The reinforcing boards are provided with through holes, so that mutual connection of the single-side flexible printed circuit boards is realized; using efficiency of the single-side flexible printed circuit boards is improved; a condition of poor circuit contact of the connection holes caused by circuit board bending is prevented effectively; and application range of the flexible printed circuit board is enlarged. At the same time, by riveting hollow copper pins in the through holes, an effect of electroplating is achieved and ventilation and heat dissipation performance is improved. Technical process is simplified, manufacturing material is reduced and cost is lowered.

Description

A kind of multi-layer flexible printed circuit board
Technical field
The utility model relates to printed circuit field, relates in particular to a kind of multi-layer flexible printed circuit board.
Background technology
The multi-layer flexible printed circuit board of existing design, usually because multi-layer bonded being integral, in flexion area circuit frangibility, losing circuit function and the application of two-sided or multi-layer flexible printed circuit board is restricted.Conductive layer between multilayer circuit board will be communicated with simultaneously, prior art adopts the through hole that first runs through connection circuit on circuit board conventionally, through hole is again by electroplating, the upper and lower circuit of circuit board is electrically connected to, and electroplate on manufacturing, comparatively trouble is inconvenient, its manufacturing cost also increases, circuit board in use, if repeatedly bending easily causes connection hole circuit loose contact.
Utility model content
The technical problem that the utility model solves is to overcome the deficiencies in the prior art, utilization arranges through hole and in through hole, stiffener is set on multi-layer flexible printed circuit board, improve the number of bends of multi-layer flexible printed circuit board, expand range of application and the field of flexible printed circuit board, realize circuit board interconnecting between layers.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is:
A kind of multi-layer flexible printed circuit board, comprise Multilayer single flexible printed circuit board and stiffener, between described adjacent single-sided flexible printed circuit board (PCB), be provided with the stiffener of a plurality of equidistant arrangements, this stiffener is fixed between single-sided flexible layer printed circuit board and layer by insulating cement;
On described stiffener, through hole is set;
In described through hole, rivet columniform hollow copper pin;
Described stiffener is epoxy resin board.
Beneficial effect:
The utility model reasonable in design, simple and practical, on the stiffener of circuit board, through hole is set, realized Multilayer single flexible printed circuit board interconnecting between layers, improved the service efficiency of multi-layer flexible printed circuit board, and the mechanical strength on stiffener is stronger, has effectively prevented the situation of the connection hole circuit loose contact that circuit board causes when bending, improve the number of bends of multi-layer flexible printed circuit board, expand range of application and the field of flexible printed circuit board.Meanwhile, in through hole, rivet hollow copper pin and not only substituted the effect of electroplating, and improved the result of ventilating heat dissipation of circuit board, simplified technological process, save and make material, reduced cost.
Accompanying drawing explanation
Fig. 1 is cross-sectional view of the present utility model;
4-through hole 5-hollow copper pin in 1-circuit board 2-stiffener 3-space in figure
Embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is further described in detail.
A kind of multi-layer flexible printed circuit board, comprise Multilayer single flexible printed circuit board 1 and stiffener 2, the stiffener 2 that is provided with a plurality of equidistant arrangements between described adjacent single-sided flexible printed circuit board (PCB) 1, this stiffener 2 is fixed on single-sided flexible printed circuit board (PCB) 1 between layers by insulating cement;
On described stiffener 2, through hole 4 is set;
In described through hole 4, rivet columniform hollow copper pin 5;
Described stiffener 2 is epoxy resin board.
Certainly; above-mentioned explanation is not to restriction of the present utility model; the utility model is also not limited in above-mentioned giving an example, and the variation that those skilled in the art make in essential scope of the present utility model, remodeling, interpolation or replacement, also should belong to protection range of the present utility model.

Claims (3)

1. a multi-layer flexible printed circuit board, comprise Multilayer single flexible printed circuit board and stiffener, between described adjacent single-sided flexible printed circuit board (PCB), be provided with the stiffener of a plurality of equidistant arrangements, this stiffener is fixed between single-sided flexible layer printed circuit board and layer by insulating cement, it is characterized in that, on described stiffener, through hole is set.
2. a kind of multi-layer flexible printed circuit board according to claim 1, is characterized in that, rivets columniform hollow copper pin in described through hole.
3. a kind of multi-layer flexible printed circuit board according to claim 1, is characterized in that, described stiffener is epoxy resin board.
CN201320539365.2U 2013-08-30 2013-08-30 Multilayer flexible printed circuit board Expired - Fee Related CN203407075U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320539365.2U CN203407075U (en) 2013-08-30 2013-08-30 Multilayer flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320539365.2U CN203407075U (en) 2013-08-30 2013-08-30 Multilayer flexible printed circuit board

Publications (1)

Publication Number Publication Date
CN203407075U true CN203407075U (en) 2014-01-22

Family

ID=49942993

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320539365.2U Expired - Fee Related CN203407075U (en) 2013-08-30 2013-08-30 Multilayer flexible printed circuit board

Country Status (1)

Country Link
CN (1) CN203407075U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211572A (en) * 2016-07-28 2016-12-07 广东欧珀移动通信有限公司 Circuit board and mobile terminal
CN112867234A (en) * 2021-01-12 2021-05-28 宁化宽信科技服务有限公司 Flexible printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211572A (en) * 2016-07-28 2016-12-07 广东欧珀移动通信有限公司 Circuit board and mobile terminal
CN112867234A (en) * 2021-01-12 2021-05-28 宁化宽信科技服务有限公司 Flexible printed circuit board

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SHENZHEN FUCHANGTAI PRECISION CIRCUIT CO., LTD.

Free format text: FORMER OWNER: HAIYANG BIAIQI ELECTRONICS CO., LTD.

Effective date: 20141219

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 265100 YANTAI, SHANDONG PROVINCE TO: 518104 SHENZHEN, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20141219

Address after: 518104, Shenzhen, Guangdong, Baoan District province manhole street, Wan An Road (West) Heng Changrong Industrial Park, C building on the first floor, A District

Patentee after: Shenzhen fosunny Tai Precision circuit Co. Ltd.

Address before: 265100 No. 12, Nanjing street, Haiyang Economic Development Zone, Yantai, Shandong

Patentee before: Haiyang Bi Ai odd electron Co., Ltd

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140122

Termination date: 20160830

CF01 Termination of patent right due to non-payment of annual fee