CN202050587U

CN202050587U - Thick copper PCB board

Info

Publication number: CN202050587U
Application number: CN2011200719647U
Authority: CN
Inventors: 张永鸿
Original assignee: Chun Yan Electronic Technology (suzhou) Co Ltd
Current assignee: SUZHOU COMBO CIRCUIT TECHNOLOGY CO., LTD.
Priority date: 2011-03-18
Filing date: 2011-03-18
Publication date: 2011-11-23
Anticipated expiration: 2021-03-18

Abstract

The utility model discloses a PCB board having 12oz copper thickness for a circuit, comprising a first electroplating etching layer, a first printing filling layer, a second electroplating etching layer, a second printing filling layer, a surface electroplating layer and a soldering resistant outer layer, wherein the first printing filling layer is arranged on the first electroplating etching layer, the first electroplating etching layer is provided with the second electroplating etching layer, the second electroplating etching layer is provided with the second printing filling layer, the second printing filling layer is provided with the surface electroplating layer, and the surface electroplating layer is provided with the soldering resistant outer layer on the outside. The thick copper PCB board realizes a circuit having 12oz copper thickness, has high voltage and high heat resistance, and satisfies the synchronizing effect of insulation and conduction.

Description

A kind of thick copper pcb board

Technical field

The utility model relates to a kind of pcb board, particularly a kind of thick copper pcb board.

Background technology

On the insulation board of certain size, be processed into the figure that some have the thick conduction of 12oz copper, and cloth porose (as element jointing holes, fastener hole, plated-through hole etc.), be the chassis with it, can realize interconnecting between the components and parts, this wiring plate claims printed circuit board (PCB) (pcb board).

The pcb board that the etching method of at present extensive use is made, on copper coated foil plate, carry out etching exactly selectively, obtain the figure of required circuit, basic manufacturing process flow is: metal-clad plate--＞cut out plate--＞boring--＞press dry film (or roller coating wet film)--＞exposure imaging--＞etching--＞striping--＞solder-mask printing printing ink--＞moulding--＞surface treatment--＞finished product.

At present, it is thick all below 6oz to print the circuit copper of pcb board conventional design double sided board, satisfies the power match requirement at high-power high-tension electrical equipment is acomia.

The utility model content

Technical problem to be solved in the utility model provides a kind of bad high pressure high-heat performance that has, and satisfies the thick copper pcb board of the synchronous effect of insulation and conducting simultaneously.

In order to solve above-mentioned technical problem, the technical solution of the utility model is: a kind of thick copper pcb board, it comprises that first electroplates etch layer, the first printing filling layer, the second plating etch layer, the second printing filling layer, surface electrical coating and welding resistance skin, the described first printing filling layer is arranged on first and electroplates on the etch layer, first electroplates etch layer is provided with the second plating etch layer, second electroplates etch layer is provided with the second printing filling layer, the second printing filling layer is provided with surface electrical coating, and surface electrical coating also is provided with the welding resistance skin outward.

The utility model has been realized having the thick circuit of 12oz copper and has been had bad high pressure high-heat performance simultaneously, satisfies the synchronous effect of insulation and conducting.The utility model has the advantages that:

1, pcb board self has high pressure resistant high-heat performance;

2, the industry blank of the thick pcb board of the above circuit copper of 6oz can be filled up, the market demand can be satisfied simultaneously with high pressure resistant high-heat performance electrical equipment;

3, save electric manufacturing cost, can fully phase out the demand of the external connection line in the electric assembling.

Description of drawings

Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.

Fig. 1 is that structural representation is made in the thick copper 1 secondary line etching of 4oz of the present utility model;

Fig. 2 is that structural representation is made in the filling of No. 1 retaining point of line insulation resin of the present utility model reticulated printing;

Fig. 3 is that the 1st heavy copper of insulating resin and circuit surface of printing of the present utility model is electroplated the making structural representation;

Fig. 4 makes structural representation for the copper layer that the 1st inferior heavy copper is electroplated of the present utility model carries out the 2nd secondary line etching;

Fig. 5 is that structural representation is made in the filling of No. 2 retaining points of line insulation resin of the present utility model reticulated printing;

Fig. 6 is that structural representation is made in the machine drilling of the utility model conducting link position;

Fig. 7 is the making structural representation of the heavy copper hole wall metallization of the utility model and 2 panel platings;

Fig. 8 is the making structural representation that the etching of the utility model outer-layer circuit is made;

Fig. 9 is the making structural representation of the outer welding resistance printing of the utility model.

Embodiment

A kind of thick copper pcb board, it comprises that first electroplates etch layer, the first printing filling layer, the second plating etch layer, the second printing filling layer, surface electrical coating and welding resistance skin, the described first printing filling layer is arranged on first and electroplates on the etch layer, first electroplates etch layer is provided with the second plating etch layer, second electroplates etch layer is provided with the second printing filling layer, the second printing filling layer is provided with surface electrical coating, and surface electrical coating also is provided with the welding resistance skin outward.The utility model manufacturing process is as follows:

(1), completing institute in the thick copper 1 secondary line etching of 4oz must a line pattern, form first and electroplate etch layer, as shown in Figure 1.

(2), the spacing between the 4oz thick copper circuit keeps off the filling of a some net resinon ink print, constitutes the first printing filling layer, as shown in Figure 2.

(3), electroplate, surface electrical copper facing is increased to more than the 8oz, as shown in Figure 3 at 1 heavy copper of insulating resin printing ink and circuit copper face.

(4), for the second time 1 heavy copper copper electroplating layer is carried out the secondary line etching and makes, form second and electroplate etch layer, as shown in Figure 4.

(5), carry out insulating resin 2 times filling, form the second printing filling layer, as shown in Figure 5 at the second etch circuit.

(6), carry out machine drilling, its position is as shown in Figure 6.

(7), carry out 2 heavy copper hole wall metallization and 3 panel platings at the hole wall of machine drilling and the surface of insulating resin printing ink and circuit, be increased to surface electrical copper facing more than the 12oz and finish the two-layer copper sheet of hole wall metallization realization synchronously and connect conducting, form surface electrical coating, as shown in Figure 7.

(8), carry out the outer-layer circuit making at the outer copper sheet that reaches the thick requirement of copper after finishing, as shown in Figure 8.

(9), the printing of outer-layer circuit insulation welding resistance, thereby realize that the thick circuit of 12oz copper connects the effect of conducting insulation, forms the welding resistance skin, as shown in Figure 9.

The foregoing description limits the utility model never in any form, and every employing is equal to replaces or technical scheme that the mode of equivalent transformation obtains all drops in the protection range of the present utility model.

Claims

1. thick copper pcb board, it is characterized in that comprising that first electroplates etch layer, the first printing filling layer, the second plating etch layer, the second printing filling layer, surface electrical coating and welding resistance skin, the described first printing filling layer is arranged on first and electroplates on the etch layer, first electroplates etch layer is provided with the second plating etch layer, second electroplates etch layer is provided with the second printing filling layer, the second printing filling layer is provided with surface electrical coating, and surface electrical coating also is provided with the welding resistance skin outward.