CN108770286A - A kind of method of pasting chip heat dissipation on improvement circuit board - Google Patents
A kind of method of pasting chip heat dissipation on improvement circuit board Download PDFInfo
- Publication number
- CN108770286A CN108770286A CN201810507832.0A CN201810507832A CN108770286A CN 108770286 A CN108770286 A CN 108770286A CN 201810507832 A CN201810507832 A CN 201810507832A CN 108770286 A CN108770286 A CN 108770286A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- box body
- copper
- chip
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of methods of pasting chip heat dissipation on improvement circuit board, include the following steps：Chip is welded on to the top layer of circuit board, and circuit board top layer is furnished with copper wire, and the entire surface of bottom is covered with copper, this face is ground plane, the ground of circuit board upper and lower surface is connected together by through-hole；By circuit board bottom coat silver content at least 50% or more conducting resinl, circuit board and copper box body are fixed together, at this time the medium between circuit board and copper box body be silver.
Description
Technical field
The invention belongs to the field of electromagnetic compatibility, be one kind is improved by medium between change circuit board bottom and box body
The method of circuit board top layer chip cooling.
Background technology
Joule heating effect will not make the temperature rise of copper conductor, by the fact that can obtain to draw a conclusion：These conducting wires
Higher temperature is because the thermal conductivity of copper is higher.Copper conductor conducts the partial heat generated in transistor chip to outside device.
The thermal coefficient of circuit board is poor, therefore high temperature not as being heated to copper conductor.At this moment the temperature of device
Degree cannot conduct well, but device temperature is excessively high, and heat conduction does not go out that device may be damaged.At this moment
Circuit board and box body can be adhered to together using conducting resinl, such heat can be transmitted in metal case, the temperature of chip
It will reduce.
Invention content
The purpose of this patent is to provide a kind of method that can be reduced and be operated in chips on circuit boards temperature, effectively to work
It radiates as chip.Technical solution is as follows：
The method of pasting chip heat dissipation, includes the following steps on a kind of improvement circuit board：
1) chip is welded on to the top layer of circuit board, circuit board top layer is furnished with copper wire, and the entire surface of bottom is covered with copper, this
Face is ground plane, is connected together the ground of circuit board upper and lower surface by through-hole；
2) by circuit board bottom coat silver content at least 50% or more conducting resinl, circuit board and copper box body are fixed on
Together, the medium at this time between circuit board and copper box body is silver.
Description of the drawings
Fig. 1 model stereograms
Fig. 2 model vertical views
Fig. 3 circuit models：Medium between circuit board bottom and box body is air
Fig. 4 circuit models：Medium between circuit board bottom and box body is silver
Specific implementation mode
The present invention will be described with reference to the accompanying drawings and examples.
Model stereogram as shown in Figure 1, vertical view as shown in Fig. 2, this two figures describe only FR4 planks bottom and box body
Between medium be conducting resinl, need to only change conducting resinl into air when medium is air.FR4 planks are divided into top layer and bottom,
Top layer is welded with chip, also various circuit traces, ground hole (i.e. via)；Bottom is stratum all over, and the ground of top layer and bottom leads to
Via connects.
Under normal circumstances, chip is welded to circuit board (this scheme be FR4 planks), with screw by circuit board and metal box
Body is fixed, and is at this moment had the gap between the bottom and box body of circuit board (FR4 planks), and intermediate medium is air, mould
For type profile figure as shown in figure 3, the conductibility of air is poor, temperature is difficult to be transmitted to box body, and the temperature of chip can be higher.
When being glued together with conduction between the bottom and metal case of circuit board (FR4 planks), at this moment circuit board and gold
It is exactly silver to belong to the medium between box body, and silver-colored conductivity is higher, this is that heat on chip can be very good to conduct on box body, core
The temperature of on piece can reduce, and model is as shown in Figure 4.
Because conducting resinl main component is silver, so only considering the parameter of silver, other substances can be ignored, by two media
Some parameters are into row-column list, as shown in table 1.
Above-mentioned two situations are emulated respectively by comsol simulation softwares, for circuit board bottom and gold when emulation
When medium is conducting resinl between category box body, the characteristic of metallic silver is only considered.Chip surface temperature is simulated, when not using conducting resinl
The maximum temperature of chip is 46.37 DEG C, the use of chip maximum temperature after conducting resinl is 45.73 DEG C, it is evident that when using conducting resinl
The temperature of chip reduces.
Conducting resinl is a kind of adhesive cured or have certain electric conductivity after dry, it usually with matrix resin and leads
Electric filler, that is, conducting particles is main constituents, conducting particles is combined together by the bonding effect of matrix resin, shape
At conductive path, being conductively connected for material is glued in realization.Conducting particles used herein is silver powder, and the addition of silver powder at least exists
50% or more.
Parameter comparison between 1 air of table and silver
Claims (1)
1. a kind of method improving pasting chip heat dissipation on circuit board, includes the following steps：
1) chip is welded on to the top layer of circuit board, circuit board top layer is furnished with copper wire, and the entire surface of bottom is covered with copper, this face is
Ground plane is connected together the ground of circuit board upper and lower surface by through-hole；
2) by circuit board bottom coat silver content at least 50% or more conducting resinl, circuit board and copper box body are fixed on one
It rises, the medium between circuit board and copper box body is silver at this time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810507832.0A CN108770286A (en) | 2018-05-24 | 2018-05-24 | A kind of method of pasting chip heat dissipation on improvement circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810507832.0A CN108770286A (en) | 2018-05-24 | 2018-05-24 | A kind of method of pasting chip heat dissipation on improvement circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108770286A true CN108770286A (en) | 2018-11-06 |
Family
ID=64006555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810507832.0A Pending CN108770286A (en) | 2018-05-24 | 2018-05-24 | A kind of method of pasting chip heat dissipation on improvement circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108770286A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1731917A (en) * | 2005-09-06 | 2006-02-08 | 威盛电子股份有限公司 | Print circuit board with improved heat rejection structure and electronic device |
| CN101707195A (en) * | 2009-11-13 | 2010-05-12 | 中电智能卡有限责任公司 | Lead frame for use in production of contact smart card modules and preparation method thereof |
| CN202050587U (en) * | 2011-03-18 | 2011-11-23 | 春焱电子科技（苏州）有限公司 | Thick copper PCB board |
| CN202076252U (en) * | 2011-03-04 | 2011-12-14 | 深圳市傲川科技有限公司 | Heat conducting silicon sheet for DVR master chip |
| CN206024350U (en) * | 2016-09-26 | 2017-03-15 | 深圳市大疆创新科技有限公司 | Electron speed regulator and the head with the electron speed regulator, unmanned vehicle |
| CN207354808U (en) * | 2017-07-31 | 2018-05-11 | 武汉芯宝科技有限公司 | ESD full-shield function paper tinsels and ESD full-shield function paper tinsel circuit boards |
-
2018
- 2018-05-24 CN CN201810507832.0A patent/CN108770286A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1731917A (en) * | 2005-09-06 | 2006-02-08 | 威盛电子股份有限公司 | Print circuit board with improved heat rejection structure and electronic device |
| CN101707195A (en) * | 2009-11-13 | 2010-05-12 | 中电智能卡有限责任公司 | Lead frame for use in production of contact smart card modules and preparation method thereof |
| CN202076252U (en) * | 2011-03-04 | 2011-12-14 | 深圳市傲川科技有限公司 | Heat conducting silicon sheet for DVR master chip |
| CN202050587U (en) * | 2011-03-18 | 2011-11-23 | 春焱电子科技（苏州）有限公司 | Thick copper PCB board |
| CN206024350U (en) * | 2016-09-26 | 2017-03-15 | 深圳市大疆创新科技有限公司 | Electron speed regulator and the head with the electron speed regulator, unmanned vehicle |
| CN207354808U (en) * | 2017-07-31 | 2018-05-11 | 武汉芯宝科技有限公司 | ESD full-shield function paper tinsels and ESD full-shield function paper tinsel circuit boards |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181106 |
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| RJ01 | Rejection of invention patent application after publication |