CN204885508U - Connection structure of primary and secondary printing inter -plate in identical product - Google Patents
Connection structure of primary and secondary printing inter -plate in identical product Download PDFInfo
- Publication number
- CN204885508U CN204885508U CN201520538465.2U CN201520538465U CN204885508U CN 204885508 U CN204885508 U CN 204885508U CN 201520538465 U CN201520538465 U CN 201520538465U CN 204885508 U CN204885508 U CN 204885508U
- Authority
- CN
- China
- Prior art keywords
- primary
- printed board
- contact pin
- board
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses a connection structure of primary and secondary printing inter -plate in identical product, including contact pin, son printing board and female printing board, the outside of contact pin is equipped with insulating filler block, is provided with the contact pin hole on its insulating filler block, is provided with the arch of location usefulness on insulating filler block upper and lower, be equipped with daughter board mounting hole and daughter board locating hole corresponding to contact pin hole and arch on the son printing board, be equipped with mother board mounting hole and mother board locating hole corresponding to contact pin hole and arch on female printing board, the downthehole constitution of contact pin that all contact pins are packed into on the insulating filler block is whole, and primary and secondary printing inter -plate is gone into to the reload. Adopt the utility model discloses a connection structure when the primary and secondary of product printing inter -plate is connected, can print the concrete length that highly sets up the contact pin of inter -plate according to the primary and secondary to at the insulating filler block of the outer whole suit of all contact pins, form a whole back equipment at primary and secondary printing inter -plate.
Description
Technical field
The utility model relates to a kind of syndeton, relates to the syndeton between primary and secondary printed board in a kind of identical product specifically.
Background technology
Along with the volume of the development of science and technology, electronic equipment is more and more less, its inner space is also more and more less.And due to the needs of structural design and circuit design in design of electronic products process, printed board usually can carry out being fastened and connected between each printed board by welding connector, reach the requirement making doubling plate or Multilayer Structure product.In existing printed board, when needing to connect between the primary and secondary printed board of product, the connected mode adopted has wire connection, printed board connector connects and naked pin connects.But above-mentioned connected mode has the following disadvantages: when adopting wire to connect, its wire length is wayward, and outward appearance is poor, can not increase the intensity combined between primary and secondary printed board; Employing printed board connector connects, the restriction highly by connector size between its primary and secondary printed board; When adopting naked pin to connect, there is the hidden danger of short circuit in it.
Utility model content
For above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide the syndeton in a kind of identical product between primary and secondary printed board, this syndeton not only has simply attractive in appearance, that fabrication and installation convenient, bonding strength is good advantage, and connects feature that is reliable, accurate positioning.
To achieve these goals, the technical solution adopted in the utility model is: the syndeton in a kind of identical product between primary and secondary printed board, comprise contact pin, sub-printed board and female printed board, the outside of described contact pin is provided with insulation lining block, its insulation lining block is provided with pin holes, insulation lining block up and down on be provided with location projection, the height of its projection is less than the thickness of sub-printed board and female printed board; Described sub-printed board is provided with daughter board installing hole and daughter board location hole corresponding to pin holes and projection, its daughter board installing hole is provided with pad; Described female printed board is provided with motherboard installing hole and motherboard location hole corresponding to pin holes and projection, its motherboard installing hole is provided with pad; It is overall that all contact pins load composition in the pin holes on insulation lining block, reinstall between primary and secondary printed board, the two ends of its contact pin are all extended outside daughter board installing hole and motherboard installing hole, and are fixed by pad solder, and its projection is positioned at daughter board location hole and motherboard location hole.
Preferably, described contact pin is scheduled in the pin holes on insulation lining block by glue-filling solid.
Further, described projection and insulation lining block conjuncted, the quantity of its projection is two or more.
Adopt the utility model of the technical program, its beneficial effect is: adopt syndeton of the present utility model, when connecting between the primary and secondary printed board of product, can according to the concrete length highly arranging contact pin between primary and secondary printed board, and at the outer integral assembling insulation lining block of all contact pins, be assembled between primary and secondary printed board after forming an entirety.Syndeton of the present utility model not only has simply attractive in appearance, that fabrication and installation convenient, bonding strength is good advantage, and connects feature that is reliable, accurate positioning.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Number in the figure: 1, insulation lining block; 2, contact pin; 3, sub-printed board; 4, female printed board; 11, pin holes; 12, protruding; 31, daughter board installing hole; 32, daughter board location hole; 41, motherboard installing hole; 42, motherboard location hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
See Fig. 1, syndeton in identical product of the present utility model between primary and secondary printed board, comprise contact pin 2, sub-printed board 3 and female printed board 4, the outside of described contact pin 2 is provided with insulation lining block 1, its insulation lining block 1 is provided with pin holes 11, insulation lining block 1 up and down on be provided with location projection 12, the height of its projection 12 is less than the thickness of sub-printed board 3 and female printed board 4; Described sub-printed board 3 corresponds to pin holes 11 and protruding 12 and be provided with daughter board installing hole 31 and daughter board location hole 32, its daughter board installing hole 31 is provided with pad; Described female printed board 4 corresponds to pin holes 11 and protruding 12 and be provided with motherboard installing hole 41 and motherboard location hole 42, its motherboard installing hole 41 is provided with pad; It is overall that all contact pins 2 load composition in the pin holes 11 on insulation lining block 1, reinstall between primary and secondary printed board, the two ends of its contact pin 2 are all extended outside daughter board installing hole 31 and motherboard installing hole 41, and are fixed by pad solder, and its projection 12 is positioned at daughter board location hole 32 and motherboard location hole 42.Described contact pin 2 is scheduled in the pin holes 11 on insulation lining block 1 by glue-filling solid.Described protruding 12 with insulation lining block 1 conjuncted, its projection 12 be four.
In using, when needing to be fixed connection between the primary and secondary printed board to product, according to the concrete length highly arranging contact pin 2 between primary and secondary printed board, and at the outer integral assembling insulation lining block 1 of all contact pins 2, be assembled between primary and secondary printed board after forming an entirety, the two ends of its contact pin 2 are all extended outside daughter board installing hole 31 and motherboard installing hole 41, and are fixed by pad solder.Certainly, in concrete assembling, contact pin 2 also schedules in pin holes 11 by glue-filling solid, the long point that contact pin 2 also can be arranged, and until shearing after pad solder is fixing, does not specifically just repeat at this again.
Above are only a kind of embodiment of the present utility model, not in order to limit the utility model, all any amendments done within spirit of the present utility model and principle are equivalent to be replaced and improves, and all should be included within protection range of the present utility model.
Claims (3)
1. the syndeton in an identical product between primary and secondary printed board, comprise contact pin, sub-printed board and female printed board, it is characterized in that: the outside of described contact pin is provided with insulation lining block, its insulation lining block is provided with pin holes, the lower edges of insulation lining block 1 is provided with the projection of location, and the height of its projection is less than the thickness of sub-printed board and female printed board; Described sub-printed board is provided with daughter board installing hole and daughter board location hole corresponding to pin holes and projection, its daughter board installing hole is provided with pad; Described female printed board is provided with motherboard installing hole and motherboard location hole corresponding to pin holes and projection, its motherboard installing hole is provided with pad; It is overall that all contact pins load composition in the pin holes on insulation lining block, reinstall between primary and secondary printed board, the two ends of its contact pin are all extended outside daughter board installing hole and motherboard installing hole, and are fixed by pad solder, and its projection is positioned at daughter board location hole and motherboard location hole.
2. the syndeton in identical product according to claim 1 between primary and secondary printed board, is characterized in that: described contact pin is scheduled in the pin holes on insulation lining block 1 by glue-filling solid.
3. the syndeton in identical product according to claim 1 between primary and secondary printed board, is characterized in that: described projection and insulation lining block conjuncted, the quantity of its projection is two or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520538465.2U CN204885508U (en) | 2015-07-23 | 2015-07-23 | Connection structure of primary and secondary printing inter -plate in identical product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520538465.2U CN204885508U (en) | 2015-07-23 | 2015-07-23 | Connection structure of primary and secondary printing inter -plate in identical product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204885508U true CN204885508U (en) | 2015-12-16 |
Family
ID=54829845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520538465.2U Expired - Fee Related CN204885508U (en) | 2015-07-23 | 2015-07-23 | Connection structure of primary and secondary printing inter -plate in identical product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204885508U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105846185A (en) * | 2016-03-24 | 2016-08-10 | 贵州航天电子科技有限公司 | Printed circuit board direct welding type electric connector |
| CN106018890A (en) * | 2016-08-10 | 2016-10-12 | 昆山兢美电子科技有限公司 | Rear connecting plate of flying probe test head |
| CN106981739A (en) * | 2017-05-12 | 2017-07-25 | 江苏华风电子有限公司 | Electric connection structure between pcb board built in microphone |
| CN113000966A (en) * | 2021-04-29 | 2021-06-22 | 西安微电子技术研究所 | Welding method of connector between gold-plated pin plates |
-
2015
- 2015-07-23 CN CN201520538465.2U patent/CN204885508U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105846185A (en) * | 2016-03-24 | 2016-08-10 | 贵州航天电子科技有限公司 | Printed circuit board direct welding type electric connector |
| CN106018890A (en) * | 2016-08-10 | 2016-10-12 | 昆山兢美电子科技有限公司 | Rear connecting plate of flying probe test head |
| CN106981739A (en) * | 2017-05-12 | 2017-07-25 | 江苏华风电子有限公司 | Electric connection structure between pcb board built in microphone |
| CN113000966A (en) * | 2021-04-29 | 2021-06-22 | 西安微电子技术研究所 | Welding method of connector between gold-plated pin plates |
| CN113000966B (en) * | 2021-04-29 | 2023-09-22 | 西安微电子技术研究所 | Welding method of connector between gold-plated pin plates |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20160723 |