CN205611053U - Ultra -thin circuit board for smart mobile phone - Google Patents
Ultra -thin circuit board for smart mobile phone Download PDFInfo
- Publication number
- CN205611053U CN205611053U CN201620426227.7U CN201620426227U CN205611053U CN 205611053 U CN205611053 U CN 205611053U CN 201620426227 U CN201620426227 U CN 201620426227U CN 205611053 U CN205611053 U CN 205611053U
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- CN
- China
- Prior art keywords
- circuit board
- core
- central layer
- ultra
- top layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an ultra -thin circuit board for smart mobile phone. This kind of ultra -thin circuit board for smart mobile phone, including circuit board main part, circuit board main part includes by the last top layer that down distributes in proper order, core and bottom, between top layer and the core, all be equipped with the PP insulating layer between core and the bottom, the top layer is equipped with the surface mounting component, be equipped with the perforation that runs through whole circuit board main part in the circuit board main part, run through the blind hole of core, PP insulating layer and bottom and run through the buried via hole of core, the core includes core and lower core, goes up the core and is the wavy contact surface of sawtooth with lower core contact surface. The utility model discloses simple structure, reasonable in design, convenient operation, top layer, core and bottom have stable layer interconnection relation within a definite time, go up the core and are the wavy contact surface of sawtooth with lower core contact surface for the structure of circuit board is compacter, and precision is higher, and heat dispersion is good, satisfies the high requirement of existing market to the PCB circuit board completely.
Description
Technical field
This utility model relates to wiring board techniques field, especially a kind of ultra-thin smart handset wiring board.
Background technology
PCB is important electronic unit, is the supporter of electronic devices and components, is electronic devices and components electricity
The carrier that gas connects, owing to it uses electron printing to make, therefore is referred to as printed circuit board (PCB).Due to existing
The most electronic products having all develop towards high density, miniaturization, highly reliable direction, contract the most as far as possible
The volume and weight of little electronic product is highly important.Ultra-thin smart handset is whole world mobile phone development trend,
Therefore the research and development of ultra-thin smart handset wiring board are more and more important.Traditional ultra-thin smart handset wiring board
Structure is complicated so that wiring board loosely organized, and precision is low, and heat dispersion is poor, and stability is poor, complete
Entirely can not meet the existing market high request to PCB.
Utility model content
The technical problems to be solved in the utility model is: overcome the deficiencies in the prior art, it is provided that a kind of
Simple in construction, the ultra-thin smart handset wiring board that stability is high.
This utility model solves its technical problem and be the technical scheme is that a kind of ultra-thin smart handset
With wiring board, including circuit board main body, circuit board main body includes top layer, the central layer being sequentially distributed from top to bottom
And bottom, it being equipped with PP insulating barrier between top layer and central layer, between central layer and bottom, top layer is provided with
Element pasted on surface；Described circuit board main body is provided with and runs through the perforation of whole circuit board main body, runs through core
Plate, PP insulating barrier and the blind hole of bottom and run through the buried via hole of central layer；Described central layer includes central layer
It is the wavy contact surface of sawtooth with lower central layer, upper central layer and lower central layer contact surface.
Further, described element pasted on surface is fixed on topsheet surface by pad.
Further, described element pasted on surface is connected to topsheet surface by component connection wire
Further, described topsheet surface is provided with the radiating groove for element radiating.
The beneficial effects of the utility model are: this utility model simple in construction, reasonable in design, operation
Convenient, top layer, central layer and bottom, there is stable interlayer interconnecting relation, upper central layer and lower central layer and connect
Contacting surface is the wavy contact surface of sawtooth so that the structure of wiring board is compacter, and precision is higher, thermal diffusivity
Can be good, fully meet the existing market high request to PCB.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings this utility model is further illustrated.
Fig. 1 is structural representation of the present utility model；
Wherein: 1. top layer, 2.PP insulating barrier, 3. go up central layer, 4. descend central layer, 5. bottom, 6. element
Connecting line, 7. element pasted on surface, 8. perforation, 9. buried via hole, 10. blind hole, 11. pads.
Detailed description of the invention
Presently in connection with accompanying drawing, this utility model is further described.These accompanying drawings are the schematic diagram of simplification
Basic structure of the present utility model is described the most in a schematic way, and therefore it only shows relevant with this utility model
Constitute.
Ultra-thin smart handset wiring board as shown in Figure 1, including circuit board main body, circuit board main body includes
Top layer 1, central layer and the bottom 5 being sequentially distributed from top to bottom, between top layer 1 and central layer, central layer and the end
Being equipped with PP insulating barrier 2 between layer 5, top layer 1 is provided with element pasted on surface 7；In circuit board main body
It is provided with and runs through the perforation 8 of whole circuit board main body, run through central layer, PP insulating barrier 2 and the blind hole of bottom 5
10 and run through the buried via hole 9 of central layer；Central layer includes central layer 3 and lower central layer 4, upper central layer 3 and under
Central layer 4 contact surface is the wavy contact surface of sawtooth.
Element pasted on surface 7 is fixed on top layer 1 surface by pad 11；Element pasted on surface 7
It is connected to top layer 1 surface by component connection wire 6；Top layer 1 surface is provided with dissipating for element radiating
Heat channel.
This ultra-thin smart handset circuit board structure is simple, reasonable in design, easy to operate, top layer 1,
Central layer and bottom 5, have stable interlayer interconnecting relation, upper central layer 3 and lower central layer 4 contact surface for saw
Tooth undulating contact face so that the structure of wiring board is compacter, and precision is higher, heat dispersion is good, complete
The full up sufficient existing market high request to PCB.
With above-mentioned according to desirable embodiment of the present utility model for enlightenment, by above-mentioned description, relevant
Staff can carry out various change completely in the range of without departing from this utility model technological thought
And amendment.The content that the technical scope of this utility model is not limited in description, it is necessary to root
Its technical scope is determined according to right.
Claims (4)
1. a ultra-thin smart handset wiring board, it is characterised in that: include circuit board main body, circuit board master
Body includes top layer (1), central layer and the bottom (5) being sequentially distributed from top to bottom, top layer (1) and central layer
Between, be equipped with PP insulating barrier (2) between central layer and bottom (5), top layer (1) is provided with surface
Mount components (7)；Described circuit board main body is provided with and runs through the perforation (8) of whole circuit board main body, passes through
The blind hole (10) of punching plate, PP insulating barrier (2) and bottom (5) and run through the buried via hole of central layer
(9)；Described central layer includes central layer (3) and lower central layer (4), upper central layer (3) and lower central layer (4)
Contact surface is the wavy contact surface of sawtooth.
Ultra-thin smart handset wiring board the most according to claim 1, it is characterised in that: described table
Face mount components (7) is fixed on top layer (1) surface by pad (11).
Ultra-thin smart handset wiring board the most according to claim 1, it is characterised in that: described table
Face mount components (7) is connected to top layer (1) surface by component connection wire (6).
Ultra-thin smart handset wiring board the most according to claim 1, it is characterised in that: described top
Layer (1) surface is provided with the radiating groove for element radiating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620426227.7U CN205611053U (en) | 2016-05-12 | 2016-05-12 | Ultra -thin circuit board for smart mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620426227.7U CN205611053U (en) | 2016-05-12 | 2016-05-12 | Ultra -thin circuit board for smart mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205611053U true CN205611053U (en) | 2016-09-28 |
Family
ID=56967233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620426227.7U Expired - Fee Related CN205611053U (en) | 2016-05-12 | 2016-05-12 | Ultra -thin circuit board for smart mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205611053U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115835485A (en) * | 2023-02-15 | 2023-03-21 | 四川英创力电子科技股份有限公司 | Multilayer printed circuit board and processing method thereof |
-
2016
- 2016-05-12 CN CN201620426227.7U patent/CN205611053U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115835485A (en) * | 2023-02-15 | 2023-03-21 | 四川英创力电子科技股份有限公司 | Multilayer printed circuit board and processing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20200512 |