CN205611054U - Precision type high density interconnection printed circuit board - Google Patents
Precision type high density interconnection printed circuit board Download PDFInfo
- Publication number
- CN205611054U CN205611054U CN201620426445.0U CN201620426445U CN205611054U CN 205611054 U CN205611054 U CN 205611054U CN 201620426445 U CN201620426445 U CN 201620426445U CN 205611054 U CN205611054 U CN 205611054U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- top layer
- central layer
- core
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a precision type high density interconnection printed circuit board. This kind of precision type high density interconnection printed circuit board, including circuit board main part, circuit board main part includes by the last top layer that down distributes in proper order, core and bottom, between top layer and the core, all be equipped with the PP insulating layer between core and the bottom, the top layer is equipped with the surface mounting component, be equipped with the perforation that runs through whole circuit board main part in the circuit board main part, run through the blind hole of core, PP insulating layer and bottom and run through the buried via hole of core, pin formula component is installed to the top layer top, and pin formula component both ends are connected with passes the component pin of perforating and setting up. The utility model discloses simple structure, reasonable in design, convenient operation, top layer, core and bottom have stable layer interconnection relation within a definite time, go up the core and are the wavy contact surface of sawtooth with lower core contact surface for the structure of circuit board is compacter, and precision is higher, and heat dispersion is good.
Description
Technical field
This utility model relates to wiring board techniques field, a kind of accurate high-density interconnected printed circuit
Plate.
Background technology
PCB is important electronic unit, is the supporter of electronic devices and components, is electronic devices and components electricity
The carrier that gas connects, owing to it uses electron printing to make, therefore is referred to as printed circuit board (PCB).Due to existing
The most electronic products having all develop towards high density, miniaturization, highly reliable direction, contract the most as far as possible
The volume and weight of little electronic product is highly important.
HDI printed board is mainly used in the electronic product that packaging density is high, particularly " short, little, light, thin "
Consumption electronic product, such as mobile phone, number (taking the photograph) camera, PDA, MP3, MP4 etc., and IC support plate,
Communication, automotive electronics and some other high frequency product high to signal integrity requirement.Mobile phone is HDI at present
The maximum application market of printed board, accounts for more than 50%；Next to that IC support plate, account for about 17%；Communication sum
The consumption electronic products such as code-phase machine respectively account for 11.6%.
Utility model content
The technical problems to be solved in the utility model is: overcome the deficiencies in the prior art, it is provided that a kind of
Simple in construction, the accurate high-density interconnected printed circuit board that stability is high.
This utility model solves its technical problem and be the technical scheme is that a kind of accurate high density
Interconnected printed circuit board, including circuit board main body, top layer that circuit board main body includes being sequentially distributed from top to bottom,
Central layer and bottom, be equipped with PP insulating barrier, top layer between top layer and central layer, between central layer and bottom
It is provided with element pasted on surface；Described circuit board main body is provided with and runs through the perforation of whole circuit board main body, passes through
Punching plate, PP insulating barrier and the blind hole of bottom and run through the buried via hole of central layer；Pacify above described top layer
Equipped with pinned element, pinned element two ends connect the component pin arranged through perforation；Described
Topsheet surface is provided with the radiating groove for element radiating.
Further, described central layer includes central layer and lower central layer, upper central layer and lower central layer contact surface
For the wavy contact surface of sawtooth.
Further, described element pasted on surface is fixed on topsheet surface by pad.
Further, described element pasted on surface is connected to topsheet surface by component connection wire.
Further, described component pin is fixed on pierceable port by pad.
The beneficial effects of the utility model are: this utility model simple in construction, reasonable in design, operation
Convenient, top layer, central layer and bottom, there is stable interlayer interconnecting relation, upper central layer and lower central layer and connect
Contacting surface is the wavy contact surface of sawtooth so that the structure of wiring board is compacter, and precision is higher, thermal diffusivity
Can be good, fully meet the existing market high request to PCB.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings this utility model is further illustrated.
Fig. 1 is structural representation of the present utility model；
Wherein: 1. top layer, 2.PP insulating barrier, 3. go up central layer, 4. descend central layer, 5. bottom, 6. element
Connecting line, 7. element pasted on surface, 8. perforation, 9. buried via hole, 10. blind hole, 11. pads, 12.
Pinned element, 13. component pins.
Detailed description of the invention
Presently in connection with accompanying drawing, this utility model is further described.These accompanying drawings are the schematic diagram of simplification
Basic structure of the present utility model is described the most in a schematic way, and therefore it only shows relevant with this utility model
Constitute.
Accurate high-density interconnected printed circuit board as shown in Figure 1, including circuit board main body, circuit board master
Body includes top layer 1, central layer and the bottom 5 being sequentially distributed from top to bottom, between top layer 1 and central layer, core
Being equipped with PP insulating barrier 2 between plate and bottom 5, top layer 1 is provided with element pasted on surface 7；Circuit board
Main body is provided with and runs through the perforation 8 of whole circuit board main body, runs through central layer, PP insulating barrier 2 and bottom 5
Blind hole 10 and run through the buried via hole 9 of central layer；Top layer 1 is arranged above pinned element 12, draws
Foot formula element 12 two ends connect the component pin 13 having through perforation 8 setting；Top layer 1 surface is provided with
Radiating groove for element radiating.
Central layer includes that central layer 3 and lower central layer 4, upper central layer 3 and lower central layer 4 contact surface are sawtooth waveforms
Shape contact surface；Element pasted on surface 7 is fixed on top layer 1 surface by pad 11；Surface mount unit
Part 7 is connected to top layer 1 surface by component connection wire 6；Component pin 10 is solid by pad 11
It is scheduled on perforation 8 ports.
This accurate high-density interconnected printed circuit board simple in construction, reasonable in design, easy to operate, top
Layer 1, central layer and bottom 5, have stable interlayer interconnecting relation, and upper central layer 3 contacts with lower central layer 4
Face is the wavy contact surface of sawtooth so that the structure of wiring board is compacter, and precision is higher, heat dispersion
Well, the existing market high request to PCB is fully met.
With above-mentioned according to desirable embodiment of the present utility model for enlightenment, by above-mentioned description, relevant
Staff can carry out various change completely in the range of without departing from this utility model technological thought
And amendment.The content that the technical scope of this utility model is not limited in description, it is necessary to root
Its technical scope is determined according to right.
Claims (5)
1. an accurate high-density interconnected printed circuit board, it is characterized in that: include circuit board main body, circuit board main body includes top layer (1), central layer and the bottom (5) being sequentially distributed from top to bottom, being equipped with PP insulating barrier (2) between top layer (1) and central layer, between central layer and bottom (5), top layer (1) is provided with element pasted on surface (7)；Described circuit board main body is provided with the perforation (8) running through whole circuit board main body, runs through the blind hole (10) of central layer, PP insulating barrier (2) and bottom (5) and runs through the buried via hole (9) of central layer；Described top layer (1) is arranged above pinned element (12), and pinned element (12) two ends connect the component pin (13) arranged through perforation (8)；Described top layer (1) surface is provided with the radiating groove for element radiating.
Accurate high-density interconnected printed circuit board the most according to claim 1, it is characterized in that: described central layer includes that central layer (3) and lower central layer (4), upper central layer (3) and lower central layer (4) contact surface are the wavy contact surface of sawtooth.
Accurate high-density interconnected printed circuit board the most according to claim 1, it is characterised in that: described element pasted on surface (7) is fixed on top layer (1) surface by pad (11).
Accurate high-density interconnected printed circuit board the most according to claim 1, it is characterised in that: described element pasted on surface (7) is connected to top layer (1) surface by component connection wire (6).
Accurate high-density interconnected printed circuit board the most according to claim 1, it is characterised in that: described component pin (13) is fixed on perforation (8) port by pad (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620426445.0U CN205611054U (en) | 2016-05-12 | 2016-05-12 | Precision type high density interconnection printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620426445.0U CN205611054U (en) | 2016-05-12 | 2016-05-12 | Precision type high density interconnection printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205611054U true CN205611054U (en) | 2016-09-28 |
Family
ID=56966981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620426445.0U Expired - Fee Related CN205611054U (en) | 2016-05-12 | 2016-05-12 | Precision type high density interconnection printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205611054U (en) |
-
2016
- 2016-05-12 CN CN201620426445.0U patent/CN205611054U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20200512 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |