CN206024260U - Vertical printed substrate - Google Patents
Vertical printed substrate Download PDFInfo
- Publication number
- CN206024260U CN206024260U CN201620935745.1U CN201620935745U CN206024260U CN 206024260 U CN206024260 U CN 206024260U CN 201620935745 U CN201620935745 U CN 201620935745U CN 206024260 U CN206024260 U CN 206024260U
- Authority
- CN
- China
- Prior art keywords
- substrate
- chip
- vertical printed
- stem
- conductor assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
This utility model provides a kind of vertical printed substrate, and which includes：If some chip stem substrates and conductor assembly；If the stem substrate is set gradually from top to bottom, the chip is provided between adjacent substrate, the chip is connected with the substrate by bonding method, if the conductor assembly is located at the side of the stem substrate, the chip is electrically connected with the conductor assembly, and parallel with one another between some chips.Take up room relatively small and integrated level of vertical printed substrate of the present utility model is high, has carried out sufficient utilization to the space inside electronic product, is conducive to that electronic product is little towards body and light weight direction is developed.
Description
Technical field
This utility model is related to wiring board techniques field, more particularly to a kind of vertical printed substrate.
Background technology
With the development of science and technology, electronic product is little towards body and light weight direction is developed.Therefore, become in above-mentioned development
Important and influential persons is asked down, and the assembly space of electronic product inner space is relatively limited.Therefore, for the electronics that 26S Proteasome Structure and Function is complex
Product, if carrying out reasonable installation to its internal circuit board, becomes electronic product little to body important with what light weight direction was developed
Aspect.
Therefore, for the problems referred to above, it is necessary to propose further solution.
Utility model content
The purpose of this utility model is to provide a kind of vertical printed substrate, to overcome present in prior art not
Foot.
For realizing that above-mentioned utility model purpose, this utility model provide a kind of vertical printed substrate, which includes：Some cores
If piece stem substrate and conductor assembly；
If the stem substrate is set gradually from top to bottom, the chip between adjacent substrate, is provided with, the chip passes through
Bonding method is connected with the substrate, if the conductor assembly is located at the side of the stem substrate, the chip is led with described
Body component is electrically connected with, and parallel with one another between some chips.
Used as the improvement of vertical printed substrate of the present utility model, the substrate is ceramic substrate.
As the improvement of vertical printed substrate of the present utility model, if the end of the stem substrate is embedded in the conductor
In component.
As the improvement of vertical printed substrate of the present utility model, some grooves, institute on the conductor assembly, is offered
If state stem substrate being installed in corresponding groove in chimeric mode respectively.
Used as the improvement of vertical printed substrate of the present utility model, the conductor assembly includes some conductive units, institute
The quantity for stating conductive unit is equal with the quantity of the substrate, offers the groove on arbitrary conductive unit.
As the improvement of vertical printed substrate of the present utility model, between the chip and substrate, adhesive-layer is provided with,
The chip is connected with the substrate by adhesive-layer, and the adhesive-layer realizes the chip with dispensing mode or coating method
Connection with substrate.
Compared with prior art, the beneficial effects of the utility model are：Vertical printed substrate of the present utility model takes
Space is relatively small and integrated level is high, has carried out sufficient utilization to the space inside electronic product, has been conducive to electronic product court
Develop in Xiang Ti little and light weight direction.
Description of the drawings
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or accompanying drawing to be used is briefly described needed for description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments described in this utility model, for those of ordinary skill in the art, is not paying creative work
On the premise of, can be with according to these other accompanying drawings of accompanying drawings acquisition.
Fig. 1 is the floor map of one specific embodiment of vertical printed substrate of the present utility model.
Specific embodiment
Shown each embodiment is described in detail to this utility model below in conjunction with the accompanying drawings, but it should explanation,
These embodiments are not limitation of the utility model, and those of ordinary skill in the art are according to these embodiment institute works
Equivalent transformation or replacement in energy, method or structure, belongs within protection domain of the present utility model.
As shown in figure 1, vertical printed substrate of the present utility model includes：If 10 stem substrate 20 of some chips and leading
Body component 30.
If the stem substrate 20 is set gradually from top to bottom, the chip 10 between adjacent substrate 20, is provided with.Thus, this
The vertical printed substrate of utility model takes full advantage of the space in electronic product internal vertical direction.Specifically, the substrate
20 is ceramic substrate, is parallel to each other and interval setting between each ceramic substrate.The chip 10 is by bonding method and the base
Plate 20 is connected, it is preferable that be provided with adhesive-layer 40 between the chip 10 and substrate 20, so as to the chip 10 is by viscous
Glue-line 40 is connected with the substrate 20.According to actual needs, the adhesive-layer 40 realizes institute with dispensing mode or coating method
State the connection of chip 10 and substrate 20.Preferably, when the adhesive-layer 40 is arranged in dispensing mode, the adhesive-layer 40 is with array
Mode is arranged.
If the conductor assembly 30 is located at the side of 20 horizontal direction of the stem substrate, the chip 10 and the conductor group
Part 30 is electrically connected with, and parallel with one another between some chips 10.Further, in order to realize the fixed installation of conductor assembly 30,
If the end of the stem substrate 20 is embedded in the conductor assembly 30, so as to conductor assembly 30 is installed on substrate 20.Specifically
Ground, offers some grooves on the conductor assembly 30, if the stem substrate is installed on corresponding groove in chimeric mode respectively
In.
Additionally, the conductor assembly 30 includes some conductive units, wherein, the quantity of the conductive unit and the substrate
20 quantity is equal, offers the groove on arbitrary conductive unit.So as to each substrate 10 is entered with corresponding conductive unit respectively
Row is fixedly connected.
In sum, take up room relatively small and integrated level of vertical printed substrate of the present utility model is high, to electronics
The space of interiors of products has carried out sufficient utilization, is conducive to electronic product to develop towards body is little with light weight direction.
It is obvious to a person skilled in the art that this utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, can realize that this practicality is new in other specific forms
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type is by claims rather than described above is limited, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in this utility model.Any reference in claim should not be considered as restriction
Involved claim.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped
Contain an independent technical scheme, this narrating mode of description is only that those skilled in the art should for clarity
Using description as an entirety, the technical scheme in each embodiment can also form those skilled in the art through appropriately combined
Understandable other embodiment.
Claims (6)
1. a kind of vertical printed substrate, it is characterised in that the vertical printed substrate includes：If some chip stem substrates,
And conductor assembly；
If the stem substrate is set gradually from top to bottom, the chip between adjacent substrate, is provided with, the chip is by pasting
Mode is connected with the substrate, if the conductor assembly is located at the side of the stem substrate, the chip and the conductor group
Part is electrically connected with, and parallel with one another between some chips.
2. vertical printed substrate according to claim 1, it is characterised in that the substrate is ceramic substrate.
3. vertical printed substrate according to claim 1, it is characterised in that if the end of the stem substrate is embedded in institute
State in conductor assembly.
4. vertical printed substrate according to claim 1, it is characterised in that offer on the conductor assembly some recessed
Groove, if the stem substrate is installed in corresponding groove in chimeric mode respectively.
5. vertical printed substrate according to claim 4, it is characterised in that the conductor assembly includes some conductive single
Unit, the quantity of the conductive unit are equal with the quantity of the substrate, offer the groove on arbitrary conductive unit.
6. vertical printed substrate according to claim 1, it is characterised in that be provided between the chip and substrate viscous
Glue-line, the chip are connected with the substrate by adhesive-layer, and the adhesive-layer realizes institute with dispensing mode or coating method
State the connection of chip and substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620935745.1U CN206024260U (en) | 2016-08-25 | 2016-08-25 | Vertical printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620935745.1U CN206024260U (en) | 2016-08-25 | 2016-08-25 | Vertical printed substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206024260U true CN206024260U (en) | 2017-03-15 |
Family
ID=58250999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620935745.1U Active CN206024260U (en) | 2016-08-25 | 2016-08-25 | Vertical printed substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206024260U (en) |
-
2016
- 2016-08-25 CN CN201620935745.1U patent/CN206024260U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200319 Address after: No. 999, Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Yuehu Crystal Core Circuit (Suzhou) Co., Ltd. Address before: 215000 Wuzhong District, Jiangsu Province, Yin Zhong Road, No. 999, No. Patentee before: TIGERBUILDER CIRCUIT (SUZHOU) Co.,Ltd. |
|
| TR01 | Transfer of patent right |