CN205883804U - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN205883804U CN205883804U CN201521132621.1U CN201521132621U CN205883804U CN 205883804 U CN205883804 U CN 205883804U CN 201521132621 U CN201521132621 U CN 201521132621U CN 205883804 U CN205883804 U CN 205883804U
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- heat
- conduction support
- support
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The utility model discloses an electronic device, including the chip, still include heat conduction support and radiating shell, install the chip laminates on the heat conduction support and with the heat conduction plane of heat conduction support, and the heat conduction support links to each other with the radiating shell. Among this electronic device, heat conduction support and radiating shell link to each other, form the cooling surface of large tracts of land, by a wide margin increase heat radiating area. The heat conduction support can be given with heat transfer to chip and the laminating of heat conduction support, and the heat conduction support links to each other with the radiating shell, has to give the radiating shell with heat transfer. Heat conduction support and radiating shell disperse the heat step by step, and every grade of heat progressively steadilys decrease, has played fine radiating effect. Radiating effect in this electronic device use is better, can not reduce electronic device's performance because the heat dissipation is bad, has improved electronic device's life.
Description
Technical field
This utility model relates to technical field of electronic products, particularly relates to a kind of electronic equipment.
Background technology
Electronic technology is the emerging technology starting late nineteenth century, earlier 1900s to grow up,
Twentieth century development is the rapidest, most widely used general, becomes a weight of modern science technology development
Indicate.
Integrated circuit on one piece of silicon, makes electronics electronic component integrations such as many transistors
Equipment develops to smallerization.Integrated circuit develops rapidly on a large scale from small scale integration
Integrated circuit and super large-scale integration so that electronic equipment towards high-effect low consumption,
In high precision, high stable, intelligentized direction are developed.
Along with electronic functionalities is continuously increased, power consumption is also in lasting increase, the thing followed
It it is exactly the heat dissipation problem of electronic equipment.Volume outward appearance and performance must be asked comparison high by electronic equipment,
Fan convection current can not be used to force to dispel the heat.Electronic equipment is higher to the requirement of dustproof and waterproof,
Surface can not the design such as hole, free convection by hole can not be considered when heat dissipation design
Mode.Restriction due to each side so that electronic equipment is difficult to dispel the heat, in use,
It is difficult to dispel the heat, easily makes the performance of equipment reduce.
Therefore, how to improve the heat dissipation problem of electronic equipment, be that those skilled in the art are anxious at present
Need to solve the technical problem that.
Utility model content
The purpose of this utility model is to provide a kind of electronic equipment, the radiating effect of this electronic equipment
Preferably, by increasing capacitance it is possible to increase the service life of electronic equipment.
For realizing above-mentioned utility model purpose, this utility model provides a kind of electronic equipment, including
Chip, also includes that heat conduction support and radiating shell, described chip are arranged on described heat conduction support
And fit with the heat-conducting planar of described heat conduction support, described heat conduction support and described radiating shell phase
Even.
Optionally, described heat conduction support includes lateral frame and longitudinal support, described lateral frame and described
Longitudinal support is respectively provided with described heat-conducting planar, described lateral frame and described longitudinal support and is connected with each other and all
It is connected with described radiating shell.
Optionally, multiple described chips are separately positioned on the institute of described lateral frame and described longitudinal support
State on heat-conducting planar.
Optionally, the side outside described radiating shell is provided with heat insulation shell.
Optionally, heat conduction is smeared between the described heat-conducting planar of described chip and described heat conduction support
Medium.
Optionally, the position that described heat conduction support is installed described chip is provided with screwed hole, passes through
Described chip and described heat conduction support are locked by screw.
Optionally, described heat conduction support is the support being made up of heat-conducting.
Optionally, described radiating shell is the housing being made up of heat radiation material.
The electronic equipment that this utility model provides, including chip, also includes heat conduction support and heat radiation
Housing, chip is arranged on heat conduction support and fits with the heat-conducting planar of heat conduction support, and heat conduction is propped up
Frame is connected with radiating shell.
In this electronic equipment, heat conduction support is connected with radiating shell, forms large-area radiating surface,
Significantly add area of dissipation.Chip and heat conduction cradle fits, it is possible to transfer heat to
Heat conduction support, heat conduction support is connected with radiating shell, has and can transfer heat to radiating shell.
Heat is disperseed by heat conduction support and radiating shell step by step, and every grade of heat progressively successively decreases, and serves very
Good radiating effect.The radiating effect of this electronic equipment is preferable, will not drop because heat radiation is bad
The serviceability of low electronic equipment, improves the service life of electronic equipment.
Accompanying drawing explanation
Fig. 1 is that the structure of a kind of detailed description of the invention of electronic equipment provided by the utility model is shown
It is intended to；
Wherein, the corresponding relation between the reference in Fig. 1 and component names is as follows:
1 heat conduction support；2 first chips；3 second chips；4 radiating shells；5 heat insulation shells.
Detailed description of the invention
Core of the present utility model is to provide a kind of electronic equipment, the radiating effect of this electronic equipment
Preferably, by increasing capacitance it is possible to increase the service life of electronic equipment.
In order to make those skilled in the art be more fully understood that this utility model scheme, below in conjunction with
The utility model is described in further detail for the drawings and specific embodiments.
Refer to Fig. 1, Fig. 1 is that electronic equipment one provided by the utility model is embodied as
The structural representation of mode.
In a kind of specific embodiment, this utility model provides a kind of electronic equipment, bag
Including chip, also include heat conduction support 1 and radiating shell 4, chip is arranged on heat conduction support 1
And fit with the heat-conducting planar of heat conduction support 1, heat conduction support 1 is connected with radiating shell 4.
In this electronic equipment, chip is arranged on heat conduction support 1, heat conduction support 1 and radiation shell
Body 4 is connected, and defines large-area radiating surface for chip, is meeting the design of electronic equipment
Require and while structural requirement, significantly add area of dissipation.
Chip is fitted with heat conduction support 1, chip adstante febre, it is possible to transfers heat to heat conduction and props up
Frame 1, heat conduction support 1 is connected with radiating shell 4, has and can transfer heat to radiating shell 4.
The heat that chip produces is disperseed by heat conduction support 1 and radiating shell 4 step by step, and every grade of heat is progressively
Successively decrease, serve good radiating effect.
This electronic equipment radiating effect in use is preferable, will not be because heat radiation is bad
Reduce the serviceability of electronic equipment, improve the service life of electronic equipment.
One preferred embodiment in, heat conduction support 1 includes lateral frame and longitudinal support, horizontal
Frame and longitudinal support are respectively provided with heat-conducting planar, lateral frame and longitudinal support and are connected with each other and equal and radiation shell
Body is connected.
Generally having multiple chip in electronic equipment, the position functions of each chip all differ, at electricity
Inside subset, in order to preferably coordinate the heat radiation of chip, heat conduction support 1 can be according to each core
The position of sheet arranges multiple lateral frame and longitudinal support, lateral frame and longitudinal support and is respectively provided with heat-conducting planar,
Can be that chip provides more area of dissipation, make the multiple chips in electronic equipment can be very
Good heat radiation, improves the radiating effect of electronic equipment further.
Further in specific embodiment, multiple chips are separately positioned on lateral frame and longitudinal support
Heat-conducting planar on.
As it is shown in figure 1, the first chip 2 is arranged on lateral frame, the second chip 3 is arranged on vertical
On support, the chip of diverse location can well be dispelled the heat, it is achieved multiple pyrotoxins are same
Time heat radiation, to reach optimal radiating effect.
In a kind of specific embodiment, the side outside radiating shell 4 is provided with heat insulation shell 5.
Heat conduction support 1 and radiating shell 4 can be the chip cooling of heating step by step, in this process
In, the temperature of radiating shell 4 can gradually rise, in order to avoid the temperature of radiating shell 4 is too high,
Present the state that hands can not be held, be provided with heat insulation shell 5 in the side in the outside of radiating shell 4,
Heat insulation shell 5 can be made up of the material of low heat conduction, so so that be provided with heat insulation shell 5
The temperature of side can hand-held maybe can contact.
It should be noted that heat insulation shell 5 is difficult to arrange too much, in order to avoid affecting radiating shell 4
Radiating effect, arrange outside radiating shell 4 at one or at two.
In above-mentioned each specific embodiment, it is coated with between the heat-conducting planar of chip and heat conduction support 1
Smear heat-conducting medium.
When the heat-conducting planar of chip and heat conduction support 1 is fully fitted, the heat conduction effect of heat conduction support 1
Fruit is best, and then radiating effect is preferably also, in order to enable chip to paste reliably with heat-conducting planar
Close, heat-conducting medium can be smeared between.
Concrete heat-conducting medium can be heat-conducting glue, or other heat-conductings.
In further preferred embodiment, on heat conduction support 1, the position of chip is provided with spiral shell
Pit, is locked chip and heat conduction support 1 by screw.
In order to ensure that chip can be installed reliably with heat conduction support 1, can be situated between smearing heat conduction
While matter, by screw, the two is locked.
Concrete, heat conduction support 1 is the support being made up of heat-conducting；Radiating shell 4 is served as reasons
The housing that heat radiation material is made.
Above electronic equipment provided by the utility model is described in detail.Herein should
By specific case, principle of the present utility model and embodiment are set forth, above enforcement
The explanation of example is only intended to help to understand method of the present utility model and core concept thereof.Should refer to
Go out, for those skilled in the art, without departing from this utility model principle
On the premise of, it is also possible to this utility model is carried out some improvement and modification, and these improve and repair
Decorations also fall in this utility model scope of the claims.
Claims (8)
1. an electronic equipment, including chip, it is characterised in that also include heat conduction support (1)
With radiating shell (4), described chip be arranged on described heat conduction support (1) upper and with described heat conduction
The heat-conducting planar laminating of support (1), described heat conduction support (1) and described radiating shell (4)
It is connected.
2. electronic equipment as claimed in claim 1, it is characterised in that described heat conduction support
(1) include that lateral frame and longitudinal support, described lateral frame and described longitudinal support are respectively provided with described heat conduction
Plane, described lateral frame is connected with each other with described longitudinal support and is all connected with described radiating shell.
3. electronic equipment as claimed in claim 2, it is characterised in that multiple described chips
It is separately positioned on the described heat-conducting planar of described lateral frame and described longitudinal support.
4. electronic equipment as claimed in claim 3, it is characterised in that described radiating shell
(4) side in outside is provided with heat insulation shell (5).
5. the electronic equipment as described in any one of Claims 1-4, it is characterised in that institute
State and smear heat-conducting medium between the described heat-conducting planar of chip and described heat conduction support (1).
6. electronic equipment as claimed in claim 5, it is characterised in that described heat conduction support
(1) the upper position installing described chip is provided with screwed hole, by screw by described chip and described
Heat conduction support (1) is locked.
7. electronic equipment as claimed in claim 6, it is characterised in that described heat conduction support
(1) for the support being made up of heat-conducting.
8. electronic equipment as claimed in claim 7, it is characterised in that described radiating shell
(4) for the housing being made up of heat radiation material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521132621.1U CN205883804U (en) | 2015-12-30 | 2015-12-30 | Electronic device |
| PCT/CN2016/078909 WO2017113536A1 (en) | 2015-12-30 | 2016-04-08 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521132621.1U CN205883804U (en) | 2015-12-30 | 2015-12-30 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205883804U true CN205883804U (en) | 2017-01-11 |
Family
ID=57686251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521132621.1U Active CN205883804U (en) | 2015-12-30 | 2015-12-30 | Electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205883804U (en) |
| WO (1) | WO2017113536A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101600325B (en) * | 2009-07-02 | 2011-12-21 | 北京东土科技股份有限公司 | Combination heat sink of closed shell electronic equipment |
| US9078357B2 (en) * | 2009-08-17 | 2015-07-07 | Seagate Technology Llc | Internal cover thermal conduction |
| CN104349637B (en) * | 2013-07-23 | 2018-06-26 | 奇鋐科技股份有限公司 | Radiator structure and the portable electric device with the radiator structure |
| CN103906397B (en) * | 2013-07-25 | 2016-12-28 | 深圳一电科技有限公司 | Electronic equipment |
-
2015
- 2015-12-30 CN CN201521132621.1U patent/CN205883804U/en active Active
-
2016
- 2016-04-08 WO PCT/CN2016/078909 patent/WO2017113536A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017113536A1 (en) | 2017-07-06 |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |