CN203120288U - Printed circuit board easy in heat dissipation - Google Patents
Printed circuit board easy in heat dissipation Download PDFInfo
- Publication number
- CN203120288U CN203120288U CN 201320132732 CN201320132732U CN203120288U CN 203120288 U CN203120288 U CN 203120288U CN 201320132732 CN201320132732 CN 201320132732 CN 201320132732 U CN201320132732 U CN 201320132732U CN 203120288 U CN203120288 U CN 203120288U
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- China
- Prior art keywords
- heat dissipation
- easy
- circuit board
- printed circuit
- components
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a printed circuit board easy in heat dissipation. The printed circuit board comprises a PCB (printed circuit board) substrate, electronic components and welding pads are distributed on the PCB substrate and connected through a conducting circuit, multiple heat dissipation holes are arranged around each electronic component, rectangular wire fixing holes are arranged on the PCB substrate and positioned on the outer side of the welding pads, and the heat dissipation holes are uniformly distributed around the electronic components. By arranging the heat dissipation holes around the electronic components, effective heat dissipation can be realized, and the printed circuit board is simple in structure and easy to implement. In addition, by arranging the wire fixing holes, loosening or shedding of wires caused by being pulled is further prevented.
Description
Technical field
The utility model relates to a kind of printed substrate, relates in particular to a kind of printed substrate that is easy to dispel the heat.
Background technology
Printed circuit board (PCB), English PCB (printed circuit board) or the PWB (printed wiring board) of being called for short, be base material with the insulation board, be cut into certain size, at least has a conductive pattern on it, and cloth porose (as component hole, fastener hole, plated-through hole etc.), be used for replacing installing the chassis of electronic devices and components in the past, and realize interconnecting between the electronic devices and components.
Classify according to the PCB printed substrate circuit number of plies: the PCB printed substrate is divided into single sided board, double sided board and multi-layer sheet.Common multi-layer sheet is generally 4 laminates or 6 laminates, and complicated multi-layer sheet can reach tens layers.Along with high-tech development, printed wiring board is realized greater functionality in the confined space constantly to light, thin, short, little development as far as possible, and it is big that wiring density becomes, thereby cause the heating of components and parts excessive, and the time has been grown and caused components and parts and adhesive-layer to break away from easily.Therefore, be necessary to provide a kind of printed substrate that is easy to dispel the heat.
The utility model content
Technical problem to be solved in the utility model provides a kind of printed substrate that is easy to dispel the heat, can efficiently radiates heat, and simple in structure, easy to implement.
The utility model is to solve the problems of the technologies described above the technical scheme that adopts to provide a kind of printed substrate that is easy to dispel the heat, comprise the PCB substrate, be distributed with electronic devices and components and pad on the described PCB substrate, described electronic devices and components link to each other by the conducting wire with pad, wherein, described electronic devices and components around be provided with louvre.
The above-mentioned printed substrate that is easy to dispel the heat wherein, also offers rectangular lead fixed hole on the described PCB substrate, described lead fixed hole is positioned at the outside of pad.
The above-mentioned printed substrate that is easy to dispel the heat, wherein, the number of described louvre is a plurality of, described a plurality of louvres be evenly distributed on electronic devices and components around.
The utility model contrast prior art has following beneficial effect: the printed substrate that is easy to dispel the heat that the utility model provides, and by louvre is set around electronic devices and components, thus can efficiently radiates heat, and simple in structure, easy to implement.In addition, the utility model is by arranging the lead fixed hole, further prevents be heated post-tensioning pine or pull of lead.
Description of drawings
The printed substrate structure schematic diagram that Fig. 1 is easy to dispel the heat for the utility model.
Among the figure:
4 leads, 5 lead fixed holes, 6 louvres
Embodiment
The utility model will be further described below in conjunction with drawings and Examples.
The printed substrate structure schematic diagram that Fig. 1 is easy to dispel the heat for the utility model.
See also Fig. 1, the printed substrate that is easy to dispel the heat that the utility model provides comprises PCB substrate 1, is distributed with electronic devices and components 2 and pad 3 on the described PCB substrate 1, and described electronic devices and components 2 and pad 3 link to each other by the conducting wire, wherein, described electronic devices and components 2 around be provided with louvre 6.
The printed substrate that is easy to dispel the heat that the utility model provides, by around electronic devices and components 2, louvre 6 being set, thus can efficiently radiates heat, and simple in structure, easy to implement.In order to strengthen radiating effect, the number of described louvre 6 is a plurality of, described a plurality of louvres 6 be evenly distributed on electronic devices and components 2 around.
In addition, can also offer rectangular lead fixed hole 5 on the PCB substrate 1 of the present utility model, described lead fixed hole 5 is positioned at the outside of pad 3, the length in lead fixed hole 5 is slightly larger than conductor width, lead passes admittance line fixing hole 5 and links to each other with pad 3, further prevents be heated post-tensioning pine or pull of lead.
Though the utility model discloses as above with preferred embodiment; so it is not in order to limit the utility model; any those skilled in the art; in not breaking away from spirit and scope of the present utility model; when doing a little modification and perfect, therefore protection range of the present utility model is worked as with being as the criterion that claims were defined.
Claims (3)
1. printed substrate that is easy to dispel the heat, comprise PCB substrate (1), be distributed with electronic devices and components (2) and pad (3) on the described PCB substrate (1), described electronic devices and components (2) link to each other by the conducting wire with pad (3), it is characterized in that, be provided with louvre (6) around the described electronic devices and components (2).
2. the printed substrate that is easy to dispel the heat as claimed in claim 1 is characterized in that, also offers rectangular lead fixed hole (5) on the described PCB substrate (1), and described lead fixed hole (5) is positioned at the outside of pad (3).
3. the printed substrate that is easy to dispel the heat as claimed in claim 1 or 2 is characterized in that, the number of described louvre (6) is a plurality of, described a plurality of louvres (6) be evenly distributed on electronic devices and components (2) around.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320132732 CN203120288U (en) | 2013-03-22 | 2013-03-22 | Printed circuit board easy in heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320132732 CN203120288U (en) | 2013-03-22 | 2013-03-22 | Printed circuit board easy in heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203120288U true CN203120288U (en) | 2013-08-07 |
Family
ID=48900594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320132732 Expired - Fee Related CN203120288U (en) | 2013-03-22 | 2013-03-22 | Printed circuit board easy in heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203120288U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911795A (en) * | 2021-02-26 | 2021-06-04 | 深圳市皓文电子有限公司 | Method for connecting cables in high-power-density power module |
-
2013
- 2013-03-22 CN CN 201320132732 patent/CN203120288U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911795A (en) * | 2021-02-26 | 2021-06-04 | 深圳市皓文电子有限公司 | Method for connecting cables in high-power-density power module |
| CN112911795B (en) * | 2021-02-26 | 2022-08-19 | 深圳市皓文电子有限公司 | Method for connecting cables in high-power-density power module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130807 Termination date: 20160322 |