CN203574928U - Improved circuit board having very good heat-radiation effect - Google Patents

Improved circuit board having very good heat-radiation effect Download PDF

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Publication number
CN203574928U
CN203574928U CN201320654261.6U CN201320654261U CN203574928U CN 203574928 U CN203574928 U CN 203574928U CN 201320654261 U CN201320654261 U CN 201320654261U CN 203574928 U CN203574928 U CN 203574928U
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CN
China
Prior art keywords
heating panel
circuit board
heat
board body
radiation plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320654261.6U
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Chinese (zh)
Inventor
欧阳建英
梁启光
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New Microelectronics (dongguan) Co Ltd
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New Microelectronics (dongguan) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201320654261.6U priority Critical patent/CN203574928U/en
Application granted granted Critical
Publication of CN203574928U publication Critical patent/CN203574928U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an improved circuit board having a very good heat-radiation effect. The improved circuit board comprises a circuit board body and one or more electronic components installed on the circuit board body, a first heat-radiation plate and a second heat-radiation plate wrap the upper end face and the lower end face of the circuit board body respectively, the first heat-radiation plate and the second heat-radiation plate have a protective function and a heat-radiation function, the electronic components penetrate the first heat-radiation plate or the second heat-radiation plate and are exposed out of the first heat-radiation plate or the second heat-radiation plate, and peripheries of the electronic components are contacted with the first heat-radiation plate or the second heat-radiation plate so that heat can be fully radiated. The first heat-radiation plate and the second heat-radiation plate wrap the circuit board body, and the circuit board body is clamped and fixed through the first heat-radiation plate and the second heat-radiation plate, so a good protective function is achieved, and a heat-radiation area can be increased to obtain a good heat-radiation effect. Furthermore, the small thickness of the first heat-radiation plate and the small thickness of the second heat-radiation plate cannot influence normal use of the improved circuit board, and development requirements of micromation, lightening and thinning of electronic products can be satisfied, so the improved circuit board has a large market competitiveness.

Description

The modified form circuit plate that radiating effect is fabulous
Technical field
The utility model relates to circuit board product technical field, more particularly, relates to the fabulous modified form circuit plate of a kind of radiating effect.
Background technology
Printed circuit board (Printing Circuit Board, PCB) is the supplier of electronic devices and components electrical connection.Its development history of existing more than 100 year, it adopts the major advantage of circuit board is the mistake that greatly reduces wiring and assembling, has improved the gentle productive labor rate of Automated water.
On traditional printed circuit board (PCB) (PCB), except planning has predetermined electronic circuit, also comprise many grafting electronic unit thereon, these electronic units disengage certain working temperature at work, improper if dispelled the heat, by affecting the operating efficiency of electronic unit, even destroy the running of system.In order to solve heat dissipation problem, general method is to add fin on these electronic units, utilize the heat conducting material behavior of fin high efficiency (for example aluminium), after exhaled temperature is absorbed, disperse to be again delivered to the each position of fin that area is larger, make thermal source be unlikely concentrated and reach the effect that appropriateness is lowered the temperature.But, such radiating effect is unsatisfactory, in addition, the fin adding is all generally to convexedly stretch on electronic unit, to performing heat radiation of electric component, but, fin is generally longer, so that its space occupying is larger, affects the normal use of circuit board, can not meet the development of electronic product microminiaturization, lightening direction, manufacturer is caused to great puzzlement.
In view of this, the inventor proposes following technical scheme.
Utility model content
The purpose of this utility model is to overcome above-mentioned defect of the prior art, provides a kind of radiating effect fabulous modified form circuit plate.
For achieving the above object, the technical scheme that the utility model provides is as follows: the fabulous modified form circuit plate of this radiating effect comprises: circuit board body and one or more electronic unit being installed on circuit board body, the upper and lower both ends of the surface of described circuit board body are coated with respectively the first heating panel and second heating panel with protective effect and thermolysis, wherein, described electronic unit is all revealed in outside the first heating panel or the second heating panel through the first heating panel or the second heating panel, and the periphery of electronic unit contacts with the first heating panel or the second heating panel, so that can fully dispel the heat.
Furthermore, in technique scheme, the position that electronic unit is installed on the first described heating panel corresponding circuits plate body is provided with through hole, and electronic unit is revealed in outside the first heating panel through this through hole, wherein, electronic unit is peripheral closely conflicts with the hole wall of through hole.
Furthermore, in technique scheme, the size of the through hole in described the first heating panel matches with the size of the electronic unit through this through hole.
Furthermore, in technique scheme, the first described heating panel and the second heating panel are by the stable upper and lower both ends of the surface of described circuit board body that are installed on of fixed form of pasting.
Furthermore, in technique scheme, the outer rim of described the first heating panel, circuit board body, the second heating panel is respectively arranged with corresponding screwed hole, and joins by screw and screwed hole spiral, makes between the first heating panel, circuit board body, the second heating panel and forms and stablize assembling.
Furthermore, in technique scheme, in the first described heating panel or the second heating panel, be provided with at least two line holes of passing for wire.
Furthermore, in technique scheme, the plate face size of described the first heating panel is more than or equal to the plate face size of circuit board body; The plate face size of described the first heating panel is in the same size with the plate face of the second heating panel.
Furthermore, in technique scheme, described circuit board body comprises: substrate, be arranged at the conductive layer on substrate and be covered in the anti-ink layer on conductive layer, wherein, be printed with circuit on conductive layer.
Furthermore, in technique scheme, the thickness of described substrate is 1mm~4mm, the thickness 150 μ m~200 μ m of described conductive layer.
Furthermore, in technique scheme, the thickness of described the first heating panel is 1mm~2mm; The thickness of described the second heating panel is 1mm~2mm.
The beneficial effects of the utility model are: the utility model in circuit board body by the first heating panel and the second heating panel double team, to form stable assembling, wherein, the electronic unit arranging on circuit board body is through the first heating panel or the second heating panel, and the periphery of electronic unit contacts with the first heating panel or the second heating panel.The assembling mode of the first heating panel and the second heating panel not only can play a good protection to circuit board main body and electronic unit, and has larger area of dissipation, so that can effectively dispel the heat to the electronic unit in circuit board main body.In addition, the first heating panel and the second heating panel thickness are less, and the space that it is occupied is less, can't affect normal use of the present utility model, and can meet the development of electronic product microminiaturization, lightening direction, has the larger market competitiveness.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation;
Fig. 2 is the local enlarged diagram of A part in Fig. 1;
Include in the drawings: 1---circuit board body, 11---substrate, 12---conductive layer, 2---electronic unit, 3---the first heating panel, 4 second heating panels.
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Embodiment
Be below the preferred example of the fabulous modified form circuit plate of radiating effect described in the utility model, therefore do not limit protection range of the present utility model.
Please refer to Fig. 1,2, there is shown the structure of the fabulous modified form circuit plate of a kind of radiating effect.
The modified form circuit plate that radiating effect is fabulous; it comprises: circuit board body 1 and one or more electronic unit 2 being installed on circuit board body 1; described circuit board body Shang Xia 1 both ends of the surface be coated with respectively the first heating panel 3 and second heating panel 4 with protective effect and thermolysis; wherein; described electronic unit 2 is all revealed in outside the first heating panel 3 or the second heating panel 4 through the first heating panel 3 or the second heating panel 4; and the periphery of electronic unit 2 contacts with the first heating panel 3 or the second heating panel 4, so that can fully dispel the heat.
Described circuit board body 1 comprises: substrate 11, be arranged at the conductive layer 12 on substrate 11 and be covered in the anti-ink layer on conductive layer 12, wherein, on conductive layer 12, be printed with circuit, and the thickness of described substrate 11 is 1mm~4mm, the thickness 150 μ m~200 μ m of described conductive layer 12.
The position that electronic unit 2 is installed on the first described heating panel 3 corresponding circuits plate bodies 1 is provided with through hole 31; 2 of electronic units are revealed in outside the first heating panel 3 through this through hole 31; wherein; electronic unit 2 is peripheral closely conflicts with the hole wall of through hole 31; so not only can play a good protection to electronic unit; and increasing heat radiation area, so that can effectively dispel the heat to the electronic unit in circuit board main body.
The size of the through hole 31 in described the first heating panel 3 matches with the size of the electronic unit 2 through this through hole, so that can play certain supporting role to electronic unit 2, plays a good protection.
The first described heating panel 3 and the second heating panel 4 are by the stable described circuit board body both ends of the surface Shang Xia 1 that are installed on of the fixed form of pasting, wherein, the outer rim of described the first heating panel 3, circuit board body 1, the second heating panel 4 is respectively arranged with corresponding screwed hole, and join by screw and screwed hole spiral, make between the first heating panel 3, circuit board body 1, the second heating panel 4 and form and stablize assembling.Can play a good protection to circuit board body 1 like this.
In the first described heating panel 3 or the second heating panel 4, be provided with at least two line holes of passing for wire.
The plate face size of described the first heating panel 3 is more than or equal to the plate face size of circuit board body 1; The plate face size of described the first heating panel 3 is in the same size with the plate face of the second heating panel 4.The thickness of described the first heating panel 3 is 1mm~2mm; The thickness of described the second heating panel 4 is 1mm~2mm.
The utility model in circuit board body by the first heating panel and the second heating panel double team, to form stable assembling, wherein, the electronic unit arranging on circuit board body is through the first heating panel or the second heating panel, and the periphery of electronic unit contacts with the first heating panel or the second heating panel.The assembling mode of the first heating panel and the second heating panel not only can play a good protection to circuit board main body and electronic unit, and has larger area of dissipation, so that can effectively to the electronic unit in circuit board main body, effectively dispel the heat.In addition, the first heating panel and the second heating panel thickness are less, and the space that it is occupied is less, can't affect normal use of the present utility model, and can meet the development of electronic product microminiaturization, lightening direction, has the larger market competitiveness.
Above-described embodiment is preferably execution mode of the utility model; but execution mode of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection range of the present utility model.

Claims (10)

1. the fabulous modified form circuit plate of radiating effect, it comprises: circuit board body (1) and one or more electronic unit (2) being installed on circuit board body (1), it is characterized in that: the upper and lower both ends of the surface of described circuit board body (1) are coated with respectively the first heating panel (3) and second heating panel (4) with protective effect and thermolysis, wherein, described electronic unit (2) is all revealed in outside the first heating panel (3) or the second heating panel (4) through the first heating panel (3) or the second heating panel (4), and the periphery of electronic unit (2) contacts with the first heating panel (3) or the second heating panel (4), so that can fully dispel the heat.
2. the fabulous modified form circuit plate of radiating effect according to claim 1, it is characterized in that: the position that electronic unit (2) is installed on described the first heating panel (3) corresponding circuits plate body (1) is provided with through hole (31), electronic unit (2) is revealed in outside the first heating panel (3) through this through hole (31), wherein, electronic unit (2) is peripheral closely conflicts with the hole wall of through hole (31).
3. the fabulous modified form circuit plate of radiating effect according to claim 2, is characterized in that: the size of the through hole (31) in described the first heating panel (3) matches with the size of the electronic unit (2) through this through hole.
4. the modified form circuit plate fabulous according to the radiating effect described in claim 1-3 any one, is characterized in that: described the first heating panel (3) and the second heating panel (4) are by the stable upper and lower both ends of the surface of described circuit board body (1) that are installed on of fixed form of pasting.
5. the modified form circuit plate fabulous according to the radiating effect described in claim 1-3 any one, it is characterized in that: the outer rim of described the first heating panel (3), circuit board body (1), the second heating panel (4) is respectively arranged with corresponding screwed hole, and join by screw and screwed hole spiral, make between the first heating panel (3), circuit board body (1), the second heating panel (4) and form and stablize assembling.
6. the modified form circuit plate fabulous according to the radiating effect described in claim 1-3 any one, is characterized in that: in described the first heating panel (3) or the second heating panel (4), be provided with at least two line holes (30) of passing for wire.
7. the modified form circuit plate fabulous according to the radiating effect described in claim 1-3 any one, is characterized in that: the plate face size of described the first heating panel (3) is more than or equal to the plate face size of circuit board body (1); The plate face size of described the first heating panel (3) is in the same size with the plate face of the second heating panel (4).
8. the modified form circuit plate fabulous according to the radiating effect described in claim 1-3 any one, it is characterized in that: described circuit board body (1) comprising: substrate (11), be arranged at the conductive layer (12) on substrate (11) and be covered in the anti-ink layer on conductive layer (12), wherein, on conductive layer (12), be printed with circuit.
9. the fabulous modified form circuit plate of radiating effect according to claim 8, is characterized in that: the thickness of described substrate (11) is 1mm~4mm, the thickness 150 μ m~200 μ m of described conductive layer (12).
10. the modified form circuit plate fabulous according to the radiating effect described in claim 1-3 any one, is characterized in that: the thickness of described the first heating panel (3) is 1mm~2mm; The thickness of described the second heating panel (4) is 1mm~2mm.
CN201320654261.6U 2013-10-23 2013-10-23 Improved circuit board having very good heat-radiation effect Expired - Fee Related CN203574928U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320654261.6U CN203574928U (en) 2013-10-23 2013-10-23 Improved circuit board having very good heat-radiation effect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320654261.6U CN203574928U (en) 2013-10-23 2013-10-23 Improved circuit board having very good heat-radiation effect

Publications (1)

Publication Number Publication Date
CN203574928U true CN203574928U (en) 2014-04-30

Family

ID=50542634

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320654261.6U Expired - Fee Related CN203574928U (en) 2013-10-23 2013-10-23 Improved circuit board having very good heat-radiation effect

Country Status (1)

Country Link
CN (1) CN203574928U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140430

Termination date: 20151023

EXPY Termination of patent right or utility model