CN102006727A - Method for machining built-in slot of PCB - Google Patents
Method for machining built-in slot of PCB Download PDFInfo
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- CN102006727A CN102006727A CN 201010525400 CN201010525400A CN102006727A CN 102006727 A CN102006727 A CN 102006727A CN 201010525400 CN201010525400 CN 201010525400 CN 201010525400 A CN201010525400 A CN 201010525400A CN 102006727 A CN102006727 A CN 102006727A
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Abstract
The embodiment of the invention discloses a method for machining a built-in slot of a printed circuit board (PCB). The method comprises the following steps of: machining a first board and an adjacent second board to obtain a through hole; b, placing a gasket in the through hole and laminating to obtain the PCB; c, performing depth-controlled milling on other boards, corresponding to the through hole, on the PCB; and d, taking the gasket out. In the method provided by the invention, before laminating, the second board adjacent to the first board is machined first and then the gasket is added into the through hole machined on the second board for laminating; after finishing laminating, the depth-controlled milling is performed on other laminated boards until the gasket is exposed out; and the built-in slot of the PCB is finished machining after taking the gasket out. In the method provided by the invention, the built-in slot is machined in a machining way step by step, so that the damage to the board surface of the first board is prevented when machining by using a mechanical milling machine.
Description
Technical field
The present invention relates to PCB production technical field, more particularly, relate to the processing method of the built-in groove of a kind of pcb board.
Background technology
In recent years, present electronic product is more and more towards integrated, and volume miniaturization, portability direction develop, and this just requires PCB wiring board and components and parts disposed thereon must take more and more littler volume, in order to reach above-mentioned requirements, present designs direction has:
1, components and parts develop towards the direction of miniaturization, reduce the volume of whole PCB wiring board by the design little components and parts that take up room;
2, with the lip-deep components and parts of PCB burying appearance, to bury device form such as resistance, the mode by flush type is built in and realizes reducing of whole pcb board volume in the pcb board.
3, press together by rigid plate and flex plate, form existing rigid element, flex section is arranged again, reach the purpose that reduces the space by the good bending of flexible part.
4, be built in pcb board inside by useless position in the mill off pcb board, and with electronic devices and components, reach the purpose of saving the space.
In the above-mentioned developing direction, are a kind of modes of present widespread usage by controlling the mode of milling deeply with the mode of nonuseable part mill off on the pcb board and built-in components and parts, but, owing to be subjected to the restriction of profile milling machine machining accuracy, control in the pcb board in the process of milling deeply, on pcb board, need the degree of depth of the groove processed dark more, precision just is difficult to guarantee, please refer to accompanying drawing 1-2, pcb board is by first plate 11, second plate 13, the 3rd plate 15 and the 4th plate 17 are by prepreg 12, behind prepreg 14 and prepreg 16 laminations, directly on this pcb board, carry out the processing of built-in groove 18, structure as shown in Figure 2 after finishing, in the process that control is milled deeply, the machining accuracy of existing mechanical milling machine can only reach ± 0.1mm, damages the plate face of first plate 11 when being worked into the pcb board bottom easily.
Summary of the invention
In view of this, the invention provides the processing method of the built-in groove of a kind of pcb board, avoided in the control process of milling deeply because the precision of milling machine is not high, and damaged the problem of the plate face of first plate.
For achieving the above object, the invention provides following technical scheme:
The processing method of the built-in groove of a kind of pcb board may further comprise the steps:
A, second plate adjacent with first plate processed, obtained through hole;
B, in described through hole, put into pad, and carry out lamination, obtain pcb board;
C, mill controlling deeply with corresponding other plates of described through hole on the described pcb board;
D, taking-up pad.
Preferably, in the processing method of the built-in groove of above-mentioned pcb board, step a specific implementation is:
Mark is carried out in a1, the zone that needs to process on second plate adjacent with first plate;
A2, employing milling machine are processed the zone of above-mentioned mark, obtain through hole.
From above-mentioned technical scheme as can be seen, in the processing method of the built-in groove of pcb board that provides in the embodiment of the invention, change an existing secondary control and milled the processing method that processes built-in groove deeply, in the method provided by the invention, before lamination, second plate that earlier will be adjacent with first plate is processed, add pad then in the through hole of on second plate, processing and carry out lamination, after lamination is finished other plates of lamination are controlled deeply and mill, until exposing pad, the built-in groove of pcb board is just finished processing after taking out pad, adopt the mode of substep processing that built-in groove is processed in the method provided by the invention, prevented that mechanical milling machine from adding the damage of man-hour to the plate face of first plate.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of pcb board lamination in the prior art;
Fig. 2 is the structural representation after built-in groove machines on the pcb board in the prior art;
The flow process chart of the built-in groove of pcb board that Fig. 3 provides for the embodiment of the invention;
Structural representation after second plate processing in the pcb board that Fig. 4 provides for the embodiment of the invention;
Structural representation behind the pcb board lamination that Fig. 5 provides for the embodiment of the invention;
Structural representation after the pcb board control that Fig. 6 provides for the embodiment of the invention is milled deeply.
Embodiment
In order more clearly the scheme that the embodiment of the invention provided to be understood, make an explanation the technical term in the present specification as follows below:
Control is milled deeply: groove milling need not be milled and be worn, but mills designated depth, and need satisfy certain precision.
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
The embodiment of the invention discloses the processing method of the built-in groove of a kind of pcb board, avoided in the control process of milling deeply because the precision of milling machine is not high, and damaged the problem of the plate face of first plate.
Please refer to accompanying drawing 3-6, the flow chart of the processing method of the built-in groove of pcb board that Fig. 3 provides for the embodiment of the invention; Structural representation in the pcb board that Fig. 4 provides for the embodiment of the invention after the processing of second plate; Structural representation behind the pcb board lamination that Fig. 5 provides for the embodiment of the invention; Structural representation after the pcb board control that Fig. 6 provides for the embodiment of the invention is milled deeply.
The processing method of the built-in groove of pcb board that the embodiment of the invention provides may further comprise the steps:
A, second plate 23 adjacent with first plate 21 processed, obtained through hole 281;
Can adopt general machining apparatus processing to get final product among the above-mentioned steps a.
B, in described through hole 281, put into pad 29, and carry out lamination, obtain pcb board;
After among the step b second plate 23 being put into pad, that second plate 23, the 3rd plate 25 and the 4th plate 27 is laminated together by prepreg 22, semi-solid preparation 24 and prepreg 27.
C, mill controlling deeply with corresponding other plates of described through hole on the described pcb board;
Pcb board behind the lamination being controlled deeply mill, specifically is that the 3rd plate 25, the 4th plate 27 are controlled deeply and milled, up to exposing pad 29.
D, taking-up pad 29, built-in groove 282 machines.
In the processing method of the built-in groove of pcb board that provides in the embodiment of the invention, change an existing secondary control and milled the processing method that processes built-in groove deeply, in the method provided by the invention, before lamination, earlier second plate 22 adjacent with first plate 21 processed, on second plate 22, add pad 29 then in the through hole 281 of processing and carry out lamination, other plates (the 3rd plate 25 and the 4th plate 27) to lamination after lamination is finished are controlled deeply and are milled, until exposing pad 29, take out the built-in groove of pad 29 back pcb boards and just finish processing, adopt the mode of substep processing that built-in groove is processed in the method provided by the invention, prevented that mechanical milling machine from adding the damage of man-hour to the plate face of first plate.
Preferably, in the processing method of the built-in groove of above-mentioned pcb board, step a specific implementation is:
Mark is carried out in a1, the zone that needs to process on second plate 23 adjacent with first plate 21;
A2, employing milling machine are processed the zone of mark on above-mentioned second plate 23, obtain through hole 281.
Mark is carried out in the zone that needs in the foregoing description to process on second plate 23, but the working (machining) efficiency of processing equipment milling machine, and mark can be avoided mistake processing.
The pcb board that provides in the embodiment of the invention is made up of first plate 21, second plate 23, the 3rd plate 25 and the 4th plate 27, be that pcb board is formed by four laminate spare laminations, certainly the plate in the lamination process can also have the different plate lamination of quantity to form, but the course of processing of built-in groove is identical.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (2)
1. the processing method of the built-in groove of pcb board is characterized in that, may further comprise the steps:
A, second plate adjacent with first plate processed, obtained through hole;
B, in described through hole, put into pad, and carry out lamination, obtain pcb board;
C, mill controlling deeply with corresponding other plates of described through hole on the described pcb board;
D, taking-up pad.
2. the processing method of the built-in groove of pcb board according to claim 1 is characterized in that, step a specific implementation is:
Mark is carried out in a1, the zone that needs to process on second plate adjacent with first plate;
A2, employing milling machine are processed the zone of above-mentioned mark, obtain through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105254006A CN102006727B (en) | 2010-10-27 | 2010-10-27 | Method for machining built-in slot of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105254006A CN102006727B (en) | 2010-10-27 | 2010-10-27 | Method for machining built-in slot of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102006727A true CN102006727A (en) | 2011-04-06 |
| CN102006727B CN102006727B (en) | 2012-06-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010105254006A Active CN102006727B (en) | 2010-10-27 | 2010-10-27 | Method for machining built-in slot of PCB |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291940A (en) * | 2011-08-01 | 2011-12-21 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN105282980A (en) * | 2015-10-20 | 2016-01-27 | 深圳市景旺电子股份有限公司 | Fabrication method for metallic stepped hole of printed circuit board (PCB) |
| CN105530769A (en) * | 2014-09-30 | 2016-04-27 | 深南电路有限公司 | Processing method of printed circuit board and printed circuit board |
| CN109392238A (en) * | 2017-08-02 | 2019-02-26 | 奥特斯奥地利科技与系统技术有限公司 | Uneven magnetic foil in built in items load-bearing part |
| CN112654152A (en) * | 2020-11-09 | 2021-04-13 | 奥士康科技股份有限公司 | Method for bending ninety degrees of semi-flexible PCB |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784164A (en) * | 2010-02-08 | 2010-07-21 | 沪士电子股份有限公司 | Making method of groove type printed circuit board |
-
2010
- 2010-10-27 CN CN2010105254006A patent/CN102006727B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784164A (en) * | 2010-02-08 | 2010-07-21 | 沪士电子股份有限公司 | Making method of groove type printed circuit board |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291940A (en) * | 2011-08-01 | 2011-12-21 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN102291940B (en) * | 2011-08-01 | 2013-05-01 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN105530769A (en) * | 2014-09-30 | 2016-04-27 | 深南电路有限公司 | Processing method of printed circuit board and printed circuit board |
| CN105530769B (en) * | 2014-09-30 | 2019-02-05 | 深南电路有限公司 | A kind of processing method and printed circuit board of printed circuit board |
| CN105282980A (en) * | 2015-10-20 | 2016-01-27 | 深圳市景旺电子股份有限公司 | Fabrication method for metallic stepped hole of printed circuit board (PCB) |
| CN109392238A (en) * | 2017-08-02 | 2019-02-26 | 奥特斯奥地利科技与系统技术有限公司 | Uneven magnetic foil in built in items load-bearing part |
| US10993313B2 (en) | 2017-08-02 | 2021-04-27 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Non-uniform magnetic foil embedded in component carrier |
| CN109392238B (en) * | 2017-08-02 | 2021-11-26 | 奥特斯奥地利科技与系统技术有限公司 | Inhomogeneous magnetic foil embedded in a component carrier |
| CN112654152A (en) * | 2020-11-09 | 2021-04-13 | 奥士康科技股份有限公司 | Method for bending ninety degrees of semi-flexible PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102006727B (en) | 2012-06-06 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |