JPH09246724A - Multilayer printed wiring board manufacturing method - Google Patents
Multilayer printed wiring board manufacturing methodInfo
- Publication number
- JPH09246724A JPH09246724A JP4568196A JP4568196A JPH09246724A JP H09246724 A JPH09246724 A JP H09246724A JP 4568196 A JP4568196 A JP 4568196A JP 4568196 A JP4568196 A JP 4568196A JP H09246724 A JPH09246724 A JP H09246724A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- printed wiring
- layer
- multilayer printed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、多層プリント配線
板の製造方法に関する。[0001] The present invention relates to a method for manufacturing a multilayer printed wiring board.
【０００２】[0002]
【従来の技術】近年、多層プリント配線板の高密度化が
進展し、回路層と回路層の電気的接続を貫通穴で接続す
る方式から、接続に必要な回路層間を非貫通穴で接続す
る方式が検討されている。このような例として、特開平
６−６０３７号公報には、基材としてガラス布を使用し
たプリプレグの非貫通穴になる部分に、予め穴をあけた
後、その外側に銅箔を重ねて多層化積層し一体化した
後、非貫通穴をあけた部分の表面層銅箔を除去した後、
レーザ光を照射して樹脂層に穴をあける、という非貫通
穴の形成法を含む多層プリント配線板の製造方法が記載
されている。2. Description of the Related Art In recent years, the densification of multilayer printed wiring boards has progressed, and circuit layers required for connection are connected by non-through holes, instead of the method of connecting circuit layers and circuit layers by through holes. Methods are being considered. As an example of this, in Japanese Patent Laid-Open No. 6-6037, a hole is preliminarily formed in a non-through hole of a prepreg using a glass cloth as a base material, and then a copper foil is laminated on the outer side thereof to form a multilayer structure. After integrated and laminated, after removing the surface layer copper foil of the part where the non-through holes were opened,
A method of manufacturing a multilayer printed wiring board is described, which includes a method of forming a non-through hole in which a resin layer is irradiated with laser light to form a hole.
【０００３】[0003]
【発明が解決しようとする課題】近年、多層プリント配
線板の高密度化は著しく発展してきており、非貫通穴数
が増加し、非貫通穴の間隙が狭くなってきている。ま
た、隣接する回路層間だけでなく、更にその隣の回路層
との接続も要求されている。特開平６−６０３７号公報
では、未硬化のプリプレグに穴あけするが、穴あけなど
の加工時や取り扱い時に樹脂の粉落ちが発生しやすいた
めに、近接した穴を多数あけることは困難である。ま
た、層間接続が表面層とそれに隣接する内層間に限定さ
れる等の制約がある。本発明は、非貫通穴加工する部分
の絶縁性樹脂部分のレーザ加工性や化学エッチング性を
良好にするために、少なくとも非貫通穴加工部分にガラ
ス布を含ませないこと、また、非貫通穴を高密度に形成
できること、外層とそれに隣接する内層、さらにその内
層に隣接する内層の３層間の任意な接続が可能な多層プ
リント配線板の製造法を提供することを目的とする。In recent years, the densification of multi-layer printed wiring boards has been remarkably developed, the number of non-through holes is increasing, and the gap between the non-through holes is becoming narrower. Further, not only connection between adjacent circuit layers but also connection between adjacent circuit layers is required. In Japanese Unexamined Patent Publication No. 6-6037, holes are formed in an uncured prepreg. However, it is difficult to form a large number of holes close to each other because the resin powder is likely to drop during processing such as hole formation and during handling. Further, there are restrictions such that the interlayer connection is limited to the surface layer and the inner layer adjacent thereto. The present invention, in order to improve the laser processability and chemical etching property of the insulating resin portion of the non-through hole processing, at least the non-through hole processing portion does not include a glass cloth, and the non-through hole processing It is an object of the present invention to provide a method for manufacturing a multilayer printed wiring board, which enables high-density formation, and which allows arbitrary connection between an outer layer, an inner layer adjacent to the outer layer, and an inner layer adjacent to the inner layer.
【０００４】[0004]
【課題を解決するための手段】本発明の多層プリント配
線板の製造方法は、 ａ．両面銅張積層板に貫通穴をあける工程。 ｂ．上記の両面銅張積層板の一方の面に後に内層回路と
なる回路を形成する工程。 ｃ．回路形成した内層板に絶縁性接着シートを重ね、そ
の外側に上記の両面銅張積層板の後に内層回路となる回
路が内側になるように重ね、加圧加熱して積層一体化す
る工程。 ｄ．加圧加熱一体化した上記の多層プリント配線基板に
レーザを照射して、外層銅箔にあけた穴部分の樹脂のみ
を除去する工程。そして、必要に応じて上記の多層プリ
ント配線基板に貫通穴をあける工程。 ｅ．貫通穴とレーザ穴あけした非貫通穴にめっきを行い
層間接続し、外層銅箔をエッチングによって回路形成す
る工程、を有する多層プリント配線板の製造方法であ
る。また外層から第３層目の内層回路において、外層銅
箔の穴あけされたレーザ加工位置に、外層銅箔にあけた
穴の直径よりも少なくとも５０μｍ以上大きいパッドを
設けたり、レーザを照射して、外層から第３層目の内層
回路のパッドにとどく深さの非貫通穴をあけたり、レー
ザを照射して、少なくとも外層から第２層目の内層回路
にとどく非貫通穴をあけたり、レーザで非貫通穴をあけ
る手段の代わりに、化学エッチングを使用したり、外層
回路、外層から第２層目の内層回路、第３層目の内層回
路のそれぞれを非貫通穴で任意に層間接続する方法にお
いて、層間接続する回路は回路と接続したランドまたは
パッドにし、層間接続しない回路は独立したランドまた
はパッドにしたり、絶縁性接着シートに短繊維を含有さ
せると共に、その短繊維の長さが、非貫通穴の直径以下
にすることを特徴とする多層プリント配線板の製造方法
である。SUMMARY OF THE INVENTION A method of manufacturing a multilayer printed wiring board according to the present invention comprises the steps of: a. The process of making a through hole in a double-sided copper clad laminate. b. A step of forming a circuit to be an inner layer circuit on one surface of the double-sided copper-clad laminate. c. A step of stacking an insulating adhesive sheet on a circuit-formed inner layer board, stacking the double-sided copper-clad laminated board on the outside so that the circuit to be the inner layer circuit is on the inner side, pressurizing and heating to laminate and integrate. d. A step of irradiating a laser on the above-mentioned multilayer printed wiring board integrated under pressure and heating to remove only the resin in the holes formed in the outer layer copper foil. Then, a step of forming a through hole in the above-mentioned multilayer printed wiring board if necessary. e. A method for manufacturing a multilayer printed wiring board, comprising the steps of plating the through holes and the laser-drilled non-through holes for interlayer connection, and forming a circuit by etching the outer layer copper foil. Further, in the inner layer circuit of the third layer from the outer layer, at the laser processing position where the outer layer copper foil is drilled, a pad larger than the diameter of the hole drilled in the outer layer copper foil by at least 50 μm or more is provided, or by irradiating laser, A non-through hole with a depth reaching the pad of the inner layer circuit of the third layer from the outer layer is formed, or a non-through hole reaching at least the inner layer circuit of the second layer from the outer layer is formed by irradiating with a laser. A method of using chemical etching instead of the means for forming a non-through hole, or a method of arbitrarily connecting the outer layer circuit, the inner layer circuit of the second layer to the inner layer circuit of the third layer, and the inner layer circuit of the third layer through the non-through hole In the above, the circuit to be connected between layers is a land or pad connected to the circuit, and the circuit not to be connected between layers is an independent land or pad, or the insulating adhesive sheet contains short fibers and Length of a method for manufacturing a multilayer printed wiring board, characterized by the following non-through hole diameter.
【０００５】[0005]
【発明の実施の形態】レーザまたは化学エッチングを用
いて絶縁性接着シートの絶縁層に穴あけする本発明に用
いる両面銅張積層板には、ガラス布、紙、不織布等の強
化材とフェノール樹脂、エポキシ樹脂、ポリイミド樹脂
等の絶縁性樹脂を複合した両面銅張積層板が使用でき
る。また、絶縁層にガラス布、紙、不織布等の強化材を
含まないフィルム状の両面銅張積層板が使用できる。こ
れらの両面銅張積層板の貫通穴は、ドリルやパンチング
マシンを用いて加工できる。ドリル加工は両面銅張積層
板の厚さが薄い場合には、一度に多数枚を重ねて穴あけ
ができるので好ましい方法である。次に、穴あけした両
面銅張積層板の一方の面のみに、通常、プリント配線板
の製造に使用されているエッチング法によって後に内層
回路となる回路を形成する。この両面銅張積層板の一方
の面のみに後に内層回路となる回路を形成する方法は、
従来の製法と異なって貫通穴にめっきを行っていないの
で、回路形成に使用するエッチング液で貫通穴のめっき
がエッチングされる心配がない。そのため、従来の内層
側の回路形成よりもランド径を小さくできることや、貫
通穴に対するランドの位置ずれの余裕度が広い。BEST MODE FOR CARRYING OUT THE INVENTION A double-sided copper-clad laminate used in the present invention for punching holes in an insulating layer of an insulating adhesive sheet using laser or chemical etching includes reinforcing materials such as glass cloth, paper, non-woven cloth, and phenol resin, A double-sided copper-clad laminate that is a composite of insulating resins such as epoxy resin and polyimide resin can be used. In addition, a film-shaped double-sided copper-clad laminate that does not contain a reinforcing material such as glass cloth, paper, or non-woven fabric for the insulating layer can be used. The through holes of these double-sided copper-clad laminates can be processed using a drill or punching machine. The drilling is a preferable method when a double-sided copper-clad laminate has a small thickness, because a large number of sheets can be stacked at one time to make holes. Next, a circuit to be an inner layer circuit is formed on only one surface of the perforated double-sided copper-clad laminate by an etching method that is usually used for manufacturing a printed wiring board. The method of forming a circuit to become an inner layer circuit only on one surface of this double-sided copper clad laminate is
Unlike the conventional manufacturing method, since the through holes are not plated, there is no concern that the plating of the through holes will be etched by the etching solution used to form the circuit. Therefore, the land diameter can be made smaller than that in the conventional circuit formation on the inner layer side, and the margin of positional deviation of the land with respect to the through hole is wide.
【０００６】本発明に用いる回路形成した内層板は特に
制限されるものではなく、通常の多層プリント配線板の
製造に使用されるものと同じものが使用できる。回路形
成した内層板と穴あけし片面にのみ後に内層回路となる
回路を形成した両面銅張積層板の間に挿む絶縁性接着シ
ートには、以下のようなものを使用できる。樹脂として
は、エポキシ系樹脂あるいはポリイミド系樹脂が使用で
き、これらの樹脂を半硬化状態にしたシート状のものが
好適に使用され、また、これらの樹脂中に充填材や強化
材として短繊維を混合したものも使用できる。混合する
繊維の長さは、レーザ加工性やウエットエッチングによ
る穴あけ性の点から、非貫通穴径よりも短いことが必要
である。したがって、使用できる繊維の大きさは、長さ
が約１００μｍ以下で、直径が１０μｍ以下のものであ
ると好ましい。加熱加圧して積層一体化する条件は、絶
縁性接着シートの硬化に必要な温度と時間をかけ、また
絶縁性接着シートの流動に必要な圧力をかける。ボイド
等の発生を抑制するため減圧下において一体化すること
もできる。エポキシ系樹脂を用いたときの代表的な加圧
加熱時間は３ＭＰａ、１７０℃、６０分間である。この
積層時に、絶縁性接着シートの樹脂は、両面銅張積層板
の貫通穴に流入し固化するので、穴の一部または全体が
塞がる。この穴に流入し固化した樹脂を、レーザまたは
ウエットエッチングによって除去することによって非貫
通穴を形成する。レーザとしては、炭酸ガスレーザやエ
キシマレーザが使用できる。穴に流入固化した樹脂に
は、ガラス長繊維等のレーザ加工性の劣る無機物が含ま
れていないので、レーザ加工が容易となる。ガラス布等
を基材として含む両面銅張積層板と穴部分の樹脂は材料
構成が異なるので、穴に流入固化した樹脂のレーザ加工
速度が高く、選択的に穴のみを加工することが可能であ
る。一方ウエットエッチングで穴をあける場合も同様の
ことが言える。ウエットエッチング液としては、硫酸や
ＫＯＨ、ＮａＯＨ等のアルカリ溶液が使用できる。The circuit-formed inner layer board used in the present invention is not particularly limited, and the same inner layer board as used in the production of a normal multilayer printed wiring board can be used. The following can be used as the insulating adhesive sheet to be inserted between the circuit-formed inner layer plate and the double-sided copper-clad laminate plate in which a circuit is formed by drilling only one surface to form an inner layer circuit. As the resin, an epoxy-based resin or a polyimide-based resin can be used, and a sheet-shaped product obtained by semi-curing these resins is preferably used, and short fibers as a filler or a reinforcing material in these resins are used. Mixtures can also be used. The length of the fibers to be mixed is required to be shorter than the diameter of the non-penetrating hole from the viewpoint of laser processability and holeability by wet etching. Therefore, the size of the fibers that can be used is preferably about 100 μm or less in length and 10 μm or less in diameter. The conditions for heating and pressurizing to laminate and integrate are to apply the temperature and time required for curing the insulating adhesive sheet, and apply the pressure required for flowing the insulating adhesive sheet. In order to suppress the generation of voids and the like, they can be integrated under reduced pressure. A typical pressurizing and heating time when an epoxy resin is used is 3 MPa, 170 ° C., and 60 minutes. At the time of this lamination, the resin of the insulating adhesive sheet flows into the through holes of the double-sided copper clad laminate and is solidified, so that some or all of the holes are closed. The non-through hole is formed by removing the resin that has flowed into this hole and solidified by laser or wet etching. A carbon dioxide laser or an excimer laser can be used as the laser. The resin that has flowed into the holes and solidified does not include inorganic substances such as long glass fibers that are inferior in laser processability, so that laser process becomes easy. Since the material composition of the double-sided copper clad laminate containing glass cloth etc. as the base material and the resin of the hole part are different, the laser processing speed of the resin that has flowed into the holes and solidified is high, and it is possible to selectively process only the holes. is there. On the other hand, the same can be said when making holes by wet etching. An alkaline solution such as sulfuric acid, KOH, or NaOH can be used as the wet etching solution.
【０００７】本発明の非貫通穴の断面は、図２に示した
ような構造である。このような非貫通穴において、外層
から数えて第３層目の内層回路の非貫通穴をあける箇所
には、図３に示すようなパッドを設ける。金属のレーザ
加工速度は著しく遅いので、このパッド部分でレーザ加
工を停止させることができる。このパッド径の位置は、
ずれ等の誤差を皆無にできないので、非貫通穴の径より
も少なくとも５０μｍ以上大きくすることが望ましい。
外層回路や外層から第２層目の回路と第３層目の回路を
接続する場合には、図３（ａ）や図４（ａ）のようにパ
ッドまたはランドと回路を接続したパターンを用いる。
回路の接続が必要でない場合には、必要でない層のパッ
ドまたはランドを図３（ｂ）や図４（ｂ）に示すよう
に、独立パターンにする。このようにパッドまたはラン
ドに回路を接続したりあるいは独立にすることによっ
て、第１層目（外層）、第２層目、第３層目の回路の任
意の層間接続が可能となる。また、レーザ加工やウエッ
トエッチングによる穴加工を第２層目の内層回路に到達
した深さで止めることもできる。この場合には、第１層
目と第２層目の電気的接続のために非貫通穴が使用され
る。The cross section of the non-through hole of the present invention has a structure as shown in FIG. In such a non-through hole, a pad as shown in FIG. 3 is provided at a place where a non-through hole is formed in the inner layer circuit of the third layer counting from the outer layer. Since the laser processing speed of metal is extremely slow, the laser processing can be stopped at this pad portion. The position of this pad diameter is
It is desirable to make the diameter at least 50 μm or more larger than the diameter of the non-penetrating hole, because an error such as displacement cannot be eliminated.
When connecting the circuit of the second layer and the circuit of the third layer from the outer layer circuit or the outer layer, a pattern in which the circuit is connected to the pad or land as shown in FIG. 3A or FIG. 4A is used. .
When circuit connection is not necessary, pads or lands of unnecessary layers are formed into independent patterns as shown in FIGS. 3B and 4B. By connecting circuits to the pads or lands or by making them independent in this way, it is possible to connect any layers of the circuits of the first layer (outer layer), the second layer, and the third layer. Further, the hole processing by laser processing or wet etching can be stopped at the depth reaching the inner layer circuit of the second layer. In this case, the non-through holes are used for the electrical connection of the first layer and the second layer.
【０００８】[0008]
（実施例１）図１の（ａ）に示すように、銅箔の厚さ１
８μｍで板厚さが１００μｍのガラス布基材エポキシ樹
脂両面銅張積層板を準備する。次に図１（ｂ）に示すよ
うに、穴径０．１５ｍｍの貫通穴をドリルであけた。次
に図１（ｃ）に示すように、穴あけ加工し貫通穴をあけ
たガラス布基材エポキシ樹脂両面銅張積層板の両面に感
光性ドライフィルムをラミネートして、紫外線を選択的
に照射してレジストパターンを形成し、エッチングによ
って一方の面に後に内層回路となる回路を形成した。次
に図１（ｄ）に示すように、別途エッチング法で作製し
た厚さ０．２ｍｍの回路形成した内層板（ガラス布基材
エポキシ樹脂両面銅張積層板を使用）と、図１（ａ）か
ら（ｃ）の工程で作製した貫通穴をあけた積層板との間
に、厚さ０．０８ｍｍの絶縁性接着シートを挿んだ。絶
縁性接着シートとしては、直径約１μｍ、長さ約２０μ
ｍのホウ酸アルミニウムウィスカーをエポキシ樹脂に２
５体積％混合して、揮発分１％以下にしたプリプレグを
使用した。次に図１（ｅ）に示すように、圧力３ＭＰａ
で温度１７０℃、６０分間加圧加熱して積層一体化し
た。このプレス成形によって貫通穴内に絶縁性接着シー
トのウィスカーおよびエポキシ樹脂が流入固化した。次
に図１（ｆ）に示すように、炭酸ガスレーザを照射して
非貫通穴の樹脂を除去した。炭酸ガスレーザは外層銅箔
に殆どダメージを与えることがなかった。また、第３層
目のパッドの表面でレーザ加工が停止していた。その後
ドリルで貫通穴をあけた。次に、アルカリ性の過マンガ
ン酸ソーダ系のデスミア液に浸漬して、穴内の樹脂残渣
を除去した。次に図１（ｇ）に示すように、常法により
無電解めっきと電気めっきにより約３０μｍの銅めっき
を行って非貫通穴および貫通穴の層間の電気的接続を行
ない、さらにエッチングにより外層の回路形成を行な
い、非貫通穴付き多層プリント配線板を製造した。(Example 1) As shown in FIG. 1A, the thickness of the copper foil 1
A glass cloth base epoxy resin double-sided copper clad laminate having a thickness of 8 μm and a plate thickness of 100 μm is prepared. Next, as shown in FIG. 1B, a through hole having a hole diameter of 0.15 mm was drilled. Next, as shown in FIG. 1 (c), a photosensitive dry film is laminated on both sides of a glass cloth substrate epoxy resin double-sided copper clad laminate having a through hole and a through hole, and ultraviolet rays are selectively irradiated. A resist pattern was formed by etching, and a circuit to be an inner layer circuit was formed on one surface by etching. Next, as shown in FIG. 1D, a circuit-formed inner layer plate (using a glass cloth base material epoxy resin double-sided copper clad laminate) having a thickness of 0.2 mm, which was separately prepared by etching, and FIG. ) To (c), the insulating adhesive sheet having a thickness of 0.08 mm was inserted between the laminated plate having the through holes formed therein. As an insulating adhesive sheet, diameter is about 1μm, length is about 20μ
2m aluminum borate whiskers to epoxy resin 2
A prepreg having a volatile content of 1% or less was used by mixing 5% by volume. Next, as shown in FIG. 1 (e), the pressure is 3 MPa.
The temperature was 170 ° C. and the pressure was heated for 60 minutes to integrate the layers. By this press molding, the whiskers of the insulating adhesive sheet and the epoxy resin flowed into the through holes and solidified. Next, as shown in FIG. 1F, the carbon dioxide gas laser was irradiated to remove the resin in the non-through holes. The carbon dioxide laser hardly damaged the outer copper foil. Further, the laser processing was stopped on the surface of the third layer pad. After that, a through hole was drilled. Next, the resin residue in the hole was removed by immersing in an alkaline sodium permanganate-based desmear solution. Next, as shown in FIG. 1 (g), electroless plating and electroplating are used to carry out copper plating of about 30 μm to electrically connect the layers of the non-through holes and the through holes with each other, and then to etch the outer layer by etching. Circuit formation was performed to manufacture a multilayer printed wiring board with a non-through hole.
【０００９】（実施例２）実施例１の絶縁性接着シート
として用いたプリプレグの代わりに、厚さ７０μｍのエ
ポキシ接着フィルム（日立化成工業株式会社製、商品名
ＡＳ−３０００）を使用した。また、炭酸ガスレーザの
代わりに、ウエットエッチングで非貫通穴の樹脂を除去
した。ウエットエッチングの条件は、６０℃に加熱した
Ｎ−メチル−２−ピロリドン９０重量％、水酸化カリウ
ム３重量％、メタノール７重量％からなるエッチング液
に浸漬して、第３層目のパッドが露出するまでエッチン
グを行った。その他は、実施例１と同様にして非貫通穴
付き多層プリント配線板を製造した。Example 2 Instead of the prepreg used as the insulating adhesive sheet of Example 1, an epoxy adhesive film having a thickness of 70 μm (Hitachi Chemical Co., Ltd., trade name AS-3000) was used. Further, instead of the carbon dioxide gas laser, the resin in the non-through holes was removed by wet etching. Wet etching is performed by immersing in an etching solution consisting of 90% by weight of N-methyl-2-pyrrolidone, 3% by weight of potassium hydroxide and 7% by weight of methanol heated to 60 ° C. to expose the pad of the third layer. Etching was performed until. Other than that was carried out similarly to Example 1, and manufactured the multilayer printed wiring board with a non-through hole.
【００１０】（実施例３）実施例２と同様の工程、同様
の材料を使用して図５（ｅ）に示すように、積層一体化
して多層プリント配線基板を作製した。次に図５（ｆ）
に示すように、第２層目の内層回路が露出するまでウエ
ットエッチングを行った。その他は、実施例２と同様に
して図５（ｇ）に示すように非貫通穴付き多層プリント
配線板を製造した。Example 3 Using the same steps and materials as in Example 2, as shown in FIG. 5 (e), the layers were integrated into a multilayer printed wiring board. Next, FIG. 5 (f)
As shown in FIG. 5, wet etching was performed until the inner layer circuit of the second layer was exposed. Other than that was carried out similarly to Example 2, and manufactured the multilayer printed wiring board with a non-through hole as shown in FIG.5 (g).
【００１１】[0011]
【発明の効果】本発明の多層プリント配線板の製造方法
により、非貫通穴を高密度に形成できること、外層とそ
れに隣接する内層（第２層目の回路）、更にその内層に
隣接する内層（第３層目の回路）の３層間の任意な接続
が可能な多層プリント配線板の製造が可能になった。そ
の結果、多層プリント配線板の小型化が図れた。According to the method for manufacturing a multilayer printed wiring board of the present invention, non-through holes can be formed at a high density, an outer layer and an inner layer adjacent to the outer layer (second layer circuit), and an inner layer adjacent to the inner layer ( It has become possible to manufacture a multilayer printed wiring board capable of arbitrary connection between the three layers (third layer circuit). As a result, the multilayer printed wiring board can be miniaturized.
【図１】 （ａ）〜（ｇ）は、本発明の一実施例を示す
多層プリント配線板の製造方法を説明する工程順に示し
た断面図である。FIG. 1A to FIG. 1G are cross-sectional views showing, in order of steps, a method for manufacturing a multilayer printed wiring board showing an embodiment of the present invention.
【図２】 本発明の方法により得られる多層プリント配
線板の断面図の例である。FIG. 2 is an example of a cross-sectional view of a multilayer printed wiring board obtained by the method of the present invention.
【図３】 （ａ）、（ｂ）は、非貫通穴の穴底となる本
発明の第３層目のパッドの例を示す平面図である。
（ａ）は、回路の接続したパッドの平面図で、（ｂ）
は、回路の接続しない独立したパッドの平面図である。3 (a) and 3 (b) are plan views showing an example of a third-layer pad of the present invention, which is a bottom of a non-through hole.
(A) is a plan view of a pad to which a circuit is connected, (b)
FIG. 6 is a plan view of an independent pad to which a circuit is not connected.
【図４】 （ａ）、（ｂ）は、非貫通穴の第１層目また
は第２層目のランドの例を示す平面図である。（ａ）
は、回路の接続したランドの平面図で、（ｂ）は、回路
の接続しない独立したランドの平面図である。FIGS. 4A and 4B are plan views showing an example of a land of a first layer or a second layer of a non-through hole. (A)
[Fig. 3] is a plan view of a land to which a circuit is connected, and (b) is a plan view of an independent land to which a circuit is not connected.
【図５】 （ａ）〜（ｇ）は、本発明の他の実施例を示
す多層プリント配線板の製造方法を説明する工程順に示
した断面図である。5 (a) to 5 (g) are cross-sectional views showing, in the order of steps, a method for manufacturing a multilayer printed wiring board showing another embodiment of the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 清水 浩 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 (72)発明者 小川 信之 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Shimizu 1500 Ogawa, Shimodate, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Research Laboratory (72) Nobuyuki Ogawa 1500, Ogawa, Shimodate, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Research Center
Claims (7)
層プリント配線板の製造方法において、 ａ．両面銅張積層板に貫通穴をあける工程。 ｂ．上記の両面銅張積層板の一方の面に後に内層回路と
なる回路を形成する工程。 ｃ．回路形成した内層板に絶縁性接着シートを重ね、そ
の外側に上記の両面銅張積層板の後に内層回路となる回
路が内側になるように重ね、加圧加熱して積層一体化す
る工程。 ｄ．加圧加熱一体化した上記の多層プリント配線基板に
レーザを照射して、外層銅箔にあけた穴部分の樹脂のみ
を除去する工程。 ｅ．レーザ穴あけした非貫通穴にめっきを行い層間接続
し、外層銅箔をエッチングによって回路形成する工程、
を有することを特徴とする多層プリント配線板の製造
法。1. A method for manufacturing a multilayer printed wiring board including electrical connection between layers by means of non-through holes, comprising: a. The process of making a through hole in a double-sided copper clad laminate. b. A step of forming a circuit to be an inner layer circuit on one surface of the double-sided copper-clad laminate. c. A step of stacking an insulating adhesive sheet on a circuit-formed inner layer board, stacking the double-sided copper-clad laminated board on the outside so that the circuit to be the inner layer circuit is on the inner side, pressurizing and heating to laminate and integrate. d. A step of irradiating a laser on the above-mentioned multilayer printed wiring board integrated under pressure and heating to remove only the resin in the holes formed in the outer layer copper foil. e. Laser-drilled non-through holes are plated to connect layers, and outer copper foil is etched to form a circuit.
A method of manufacturing a multilayer printed wiring board, comprising:
層銅箔の穴あけされたレーザ加工位置に、外層銅箔にあ
けた穴の直径よりも少なくとも５０μｍ以上大きいパッ
ドを設けることを特徴とする請求項１に記載の多層プリ
ント配線板の製造方法。2. In the inner layer circuit from the outer layer to the third layer, a pad larger than the diameter of the hole drilled in the outer layer copper foil by at least 50 μm is provided at the laser processing position where the outer layer copper foil is drilled. The method for manufacturing a multilayer printed wiring board according to claim 1.
層回路のパッドにとどく深さの非貫通穴をあけることを
特徴とする請求項１または請求項２に記載の多層プリン
ト配線板の製造方法。3. The multilayer printed wiring according to claim 1, wherein a non-through hole having a depth reaching from the outer layer to the pad of the inner layer circuit of the third layer is formed by irradiating a laser. Method of manufacturing a plate.
２層目の内層回路にとどく非貫通穴をあけることを特徴
とする請求項１または請求項２に記載の多層プリント配
線板の製造方法。4. The method for producing a multilayer printed wiring board according to claim 1, wherein a non-through hole is formed by irradiating a laser to reach at least the inner layer circuit of the second layer from the outer layer. .
に、化学エッチングを使用することを特徴とする請求項
１ないし請求項４のいずれかに記載の多層プリント配線
板の製造方法。5. The method for manufacturing a multilayer printed wiring board according to claim 1, wherein chemical etching is used in place of the means for forming a non-through hole with a laser.
第３層目の内層回路のそれぞれを非貫通穴で任意に層間
接続する方法において、層間接続する回路は回路と接続
したランドまたはパッドにし、層間接続しない回路は独
立したランドまたはパッドにすることを特徴とする請求
項１ないし請求項５のいずれかに記載の多層プリント配
線板の製造方法。6. An outer layer circuit, an inner layer circuit from the outer layer to the second layer,
In a method of arbitrarily connecting each of the inner layer circuits of the third layer with non-through holes, the circuit to be connected between layers should be a land or pad connected to the circuit, and the circuit not to be connected between layers should be an independent land or pad. The method for manufacturing a multilayer printed wiring board according to any one of claims 1 to 5.
共に、その短繊維の長さが、非貫通穴の直径以下である
ことを特徴とする請求項１ないし請求項６のいずれかに
記載の多層プリント配線板の製造方法。7. The insulating adhesive sheet contains short fibers, and the length of the short fibers is equal to or less than the diameter of the non-through hole, according to any one of claims 1 to 6. For manufacturing a multilayer printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4568196A JPH09246724A (en) | 1996-03-04 | 1996-03-04 | Multilayer printed wiring board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4568196A JPH09246724A (en) | 1996-03-04 | 1996-03-04 | Multilayer printed wiring board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09246724A true JPH09246724A (en) | 1997-09-19 |
Family
ID=12726146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4568196A Pending JPH09246724A (en) | 1996-03-04 | 1996-03-04 | Multilayer printed wiring board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09246724A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999026458A1 (en) * | 1997-11-19 | 1999-05-27 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for manufacturing the same |
| US6132852A (en) * | 1998-03-13 | 2000-10-17 | Hitachi, Ltd. | Multilayer wiring substrate and method for production thereof |
| JP2002319762A (en) * | 2001-04-20 | 2002-10-31 | Toppan Printing Co Ltd | Multilayer wiring board |
| EP1259102A1 (en) * | 2001-05-14 | 2002-11-20 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
| US6492007B1 (en) | 2000-03-14 | 2002-12-10 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
| KR20030037738A (en) * | 2001-11-05 | 2003-05-16 | 삼성전기주식회사 | Method for creating blind via holes in printed circuit board |
| JP2007115954A (en) * | 2005-10-21 | 2007-05-10 | Matsushita Electric Ind Co Ltd | Multilayer printed wiring board and method of manufacturing same |
| CN1327499C (en) * | 2001-12-18 | 2007-07-18 | Lg电子株式会社 | Method for mfg. semiconductor assembly |
| JP2007220893A (en) * | 2006-02-16 | 2007-08-30 | Nippon Mektron Ltd | Multilayer circuit board and its manufacturing method |
| JP2007227648A (en) * | 2006-02-23 | 2007-09-06 | Sharp Corp | Printed wiring board, and method for manufacturing printed wiring board |
| WO2008004382A1 (en) * | 2006-07-03 | 2008-01-10 | Nippon Mektron, Ltd. | Method for manufacturing multilayer printed wiring board |
| CN109348624A (en) * | 2018-10-11 | 2019-02-15 | 安捷利（番禺）电子实业有限公司 | A kind of alignment method of laser blind hole |
| CN110191573A (en) * | 2019-06-04 | 2019-08-30 | 昆山市鸿运通多层电路板有限公司 | Deep gouge counterbore plate, pcb board and electronic equipment |
| WO2024045411A1 (en) * | 2022-08-30 | 2024-03-07 | 德中（天津）技术发展股份有限公司 | Method for manufacturing multi-layer circuit board by laser-guided electrical patterns and electrical interconnection of different surfaces |
-
1996
- 1996-03-04 JP JP4568196A patent/JPH09246724A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999026458A1 (en) * | 1997-11-19 | 1999-05-27 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for manufacturing the same |
| KR100379119B1 (en) * | 1997-11-19 | 2003-04-07 | 이비덴 가부시키가이샤 | Multilayer printed wiring board and method for manufacturing the same |
| US6132852A (en) * | 1998-03-13 | 2000-10-17 | Hitachi, Ltd. | Multilayer wiring substrate and method for production thereof |
| US6492007B1 (en) | 2000-03-14 | 2002-12-10 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
| JP2002319762A (en) * | 2001-04-20 | 2002-10-31 | Toppan Printing Co Ltd | Multilayer wiring board |
| EP1259102A1 (en) * | 2001-05-14 | 2002-11-20 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
| KR20030037738A (en) * | 2001-11-05 | 2003-05-16 | 삼성전기주식회사 | Method for creating blind via holes in printed circuit board |
| CN1327499C (en) * | 2001-12-18 | 2007-07-18 | Lg电子株式会社 | Method for mfg. semiconductor assembly |
| JP2007115954A (en) * | 2005-10-21 | 2007-05-10 | Matsushita Electric Ind Co Ltd | Multilayer printed wiring board and method of manufacturing same |
| JP2007220893A (en) * | 2006-02-16 | 2007-08-30 | Nippon Mektron Ltd | Multilayer circuit board and its manufacturing method |
| JP2007227648A (en) * | 2006-02-23 | 2007-09-06 | Sharp Corp | Printed wiring board, and method for manufacturing printed wiring board |
| WO2008004382A1 (en) * | 2006-07-03 | 2008-01-10 | Nippon Mektron, Ltd. | Method for manufacturing multilayer printed wiring board |
| CN109348624A (en) * | 2018-10-11 | 2019-02-15 | 安捷利（番禺）电子实业有限公司 | A kind of alignment method of laser blind hole |
| CN110191573A (en) * | 2019-06-04 | 2019-08-30 | 昆山市鸿运通多层电路板有限公司 | Deep gouge counterbore plate, pcb board and electronic equipment |
| WO2024045411A1 (en) * | 2022-08-30 | 2024-03-07 | 德中（天津）技术发展股份有限公司 | Method for manufacturing multi-layer circuit board by laser-guided electrical patterns and electrical interconnection of different surfaces |
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