CN110191573A - Deep gouge counterbore plate, pcb board and electronic equipment - Google Patents
Deep gouge counterbore plate, pcb board and electronic equipment Download PDFInfo
- Publication number
- CN110191573A CN110191573A CN201910482285.XA CN201910482285A CN110191573A CN 110191573 A CN110191573 A CN 110191573A CN 201910482285 A CN201910482285 A CN 201910482285A CN 110191573 A CN110191573 A CN 110191573A
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- CN
- China
- Prior art keywords
- substrate
- counterbore
- deep gouge
- pcb board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 238000003801 milling Methods 0.000 claims abstract description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004092 self-diagnosis Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
Abstract
The present invention provides a kind of deep gouge counterbore plate, pcb board and electronic equipments, wherein deep gouge counterbore plate includes: first substrate, and the milling of at least one predetermined position is empty on first substrate, forms at least one through slot or through-hole；The second substrate, first substrate are pressed together with the second substrate, constitute the third substrate with deep gouge or counterbore, wherein for the shapes and sizes of deep gouge or counterbore with through slot or through-hole, depth is the thickness of first substrate.The present invention can guarantee the deep gouge of finished substrate and the precision of counterbore depth, improve the reliability of the electronic equipment comprising thus planting pcb board made of finished substrate.
Description
Technical field
The present invention relates to circuit board technology fields, and in particular to a kind of deep gouge counterbore plate, a kind of pcb board and a kind of electronics are set
It is standby.
Background technique
Current smart machine is conventional electrical devices and computer technology, data processing technique, control theory, sensor
The product that technology, network communication technology, power electronic technique etc. combine mainly has the function of self detection, self diagnosis etc..
Current smart machine is a kind of supermatic electromechanical integration equipment, since its structure is complicated, in system
In effect it is particularly significant, therefore have very high requirement to the reliability of smart machine.The reliability of component, Technology design,
Technological level and technical management etc. have codetermined the reliability of smart machine.However there are the heavy of pcb board for current component
Slot and the poor problem of counterbore depth tolerances precision, cause the reliability of smart machine not high.
Summary of the invention
The present invention is directed to solve one of the technical problem in above-mentioned technology at least to a certain extent, for this purpose, the present invention one
A purpose is to propose a kind of deep gouge counterbore plate, and can guarantee the deep gouge of finished substrate and the precision of counterbore depth, raising includes
Thus the reliability of the electronic equipment of pcb board made of finished substrate is planted.
Second object of the present invention is to propose a kind of pcb board.
Third object of the present invention is to propose a kind of electronic equipment.
To achieve the above object, first aspect present invention embodiment proposes a kind of deep gouge counterbore plate, comprising: the first base
Plate, the milling of at least one predetermined position is empty on the first substrate, forms at least one through slot or through-hole；The second substrate, it is described
First substrate is pressed together with the second substrate, constitutes the third substrate with deep gouge or counterbore, wherein the deep gouge or
For the shapes and sizes of counterbore with the through slot or through-hole, depth is the thickness of the first substrate.
The deep gouge counterbore plate proposed according to the present invention, it is empty by milling first substrate predeterminated position, through slot or through-hole are formed,
Then the third substrate with deep gouge or counterbore is constituted with the second substrate pressing, the depth of deep gouge or counterbore depends on the as a result,
The thickness of one substrate can guarantee the deep gouge of finished substrate and the precision of counterbore depth, improve comprising thus planting finished substrate system
At pcb board electronic equipment reliability.In addition, the sharp instrument box proposed according to that above embodiment of the present invention can also have as
Under additional technical characteristic:
Further, the first substrate is pressed together with the second substrate using prepreg
To achieve the above object, second aspect of the present invention embodiment proposes a kind of pcb board, is mentioned by first aspect embodiment
Deep gouge counterbore plate out is made.
The precision of the pcb board proposed according to the present invention, deep gouge and counterbore depth is higher.
To achieve the above object, third aspect present invention embodiment proposes a kind of electronic equipment, including second aspect reality
Apply the pcb board of example proposition.
The electronic equipment proposed according to the present invention, the deep gouge of pcb board and the precision of counterbore depth are higher, thus reliability
It is higher.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the deep gouge counterbore plate of one embodiment of the invention；
Fig. 2 is the schematic diagram of the first substrate of one embodiment of the invention；
Fig. 3 is the schematic diagram of the second substrate of one embodiment of the invention；
Fig. 4 is the schematic diagram of the third substrate of one embodiment of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 is the structural schematic diagram of deep gouge counterbore plate of the invention.
As shown in Figure 1, deep gouge counterbore plate of the invention includes first substrate 10 and the second substrate 20.Wherein, first substrate
The milling of at least one predetermined position is empty on 10, forms at least one through slot or through-hole；First substrate 10 and the second substrate 20 press
Together, constitute the third substrate with deep gouge or counterbore, wherein the shapes and sizes of deep gouge or counterbore with through slot or through-hole,
Depth is the thickness of first substrate 10.
In one particular embodiment of the present invention, as shown in Fig. 2, six predetermined positions are empty by milling on first substrate 1,
Form two through slots and four through-holes, two of them through slot is respectively through slot 11 and through slot 12, four through-holes be respectively through-hole 13,
Through-hole 14, through-hole 15 and through-hole 16.
In one particular embodiment of the present invention, as shown in figure 3, the second substrate 20 does not open up any hole slot, shape
It is identical as first substrate 10 with size, with first substrate 10 press back edge profile can be completely coincident, formed finished substrate, i.e., on
The third substrate stated.
In one embodiment of the invention, first substrate 10 and the second substrate 20 can be pressed together on one by prepreg
It rises.Specifically compression method is, first by prepreg be placed between first substrate 10 and the second substrate 20, and guarantee the first base
Plate 10 and the corresponding edge profile of the second substrate 20 are completely coincident, and are then placed it in high temperature and pressure and are pressed, most end form
At third substrate planar dimension it is identical as the planar dimension of first substrate 10 and the second substrate 20, with a thickness of first substrate
10, the sum of the second substrate 20 and the thickness of semi-solid preparation layer.The prepreg wherein used is because its mobility is small, so in high temperature height
It can avoid it when being pressed to flow in deep gouge or counterbore, guarantee that finished device is mountable in deep gouge or counterbore.
As shown in figure 4, deep gouge, counterbore on the third substrate obtained by above-mentioned compression method and corresponding first substrate
10 through slot, the shapes and sizes of through-hole are identical, wherein the deep gouge on third substrate includes deep gouge 30 and deep gouge 31, and corresponding
First substrate 10 through slot 11 it is identical with the shapes and sizes of through slot 12, depth be first substrate 10 thickness.Third substrate
On counterbore include counterbore 32, counterbore 33, counterbore 34 and counterbore 35, wherein counterbore 32 and counterbore 33 and corresponding first substrate
10 through-hole 13 is identical with the shapes and sizes of through-hole 14, and depth is the thickness of first substrate 10；Counterbore 34 and counterbore 35 and phase
The through-hole 15 for the first substrate 10 answered is identical with the shapes and sizes of through-hole 16, and depth is the thickness of first substrate 10.
For example, the size of the through slot 11 on first substrate 10 can be 335mm*40mm, and the size of through slot 12 can be
The size of 284*8mm, through-hole 13 and through-hole 14 can be diameter 6.4mm, and the size of through-hole 15 and through-hole 16 can be diameter 7.2mm,
Wherein the depth accuracy of above-mentioned through slot and through-hole can be 1.5mm+/- 0.1mm.Shape is pressed by first substrate 10 and the second substrate 20
At third substrate deep gouge 30 size can be 335mm*40mm, the size of deep gouge 31 can be 284*8mm, counterbore 32 and counterbore
33 size can be diameter 6.4mm, and the size of counterbore 34 and counterbore 35 can be diameter 7.2mm, wherein the precision of above-mentioned deep gouge can
For 1.5mm+/- 0.1mm.
It, can be directly made of pressing if there is the demand that through slot or through-hole are arranged on finished substrate in actual production
Through slot or through-hole are opened up on third substrate.Alternatively, can also on first substrate and the second substrate corresponding position open up respectively it is logical
Slot or through-hole need to guarantee that first substrate is identical with the shape size of through slot in the second substrate or through-hole, then by first substrate and
The second substrate is pressed by above-mentioned compression method, so that the finished substrate be made to have through slot or through-hole.
The deep gouge counterbore plate proposed according to the present invention, it is empty by milling first substrate predeterminated position, through slot or through-hole are formed,
Then the third substrate with deep gouge or counterbore is constituted with the second substrate pressing, the depth of deep gouge or counterbore depends on the as a result,
The thickness of one substrate can guarantee the deep gouge of finished substrate and the precision of counterbore depth, improve comprising thus planting finished substrate system
At pcb board electronic equipment reliability.
Corresponding above-described embodiment, the invention also provides a kind of pcb boards.
Pcb board of the invention, the deep gouge counterbore plate proposed including the above embodiment of the present invention.
The precision of the pcb board proposed according to the present invention, deep gouge and counterbore depth is higher.
Corresponding above-described embodiment, the invention also provides a kind of electronic equipment.
Electronic equipment of the invention, the pcb board proposed including the above embodiment of the present invention.
The electronic equipment proposed according to the present invention, the deep gouge of pcb board and the precision of counterbore depth are higher, thus reliability
It is higher.
In the description of the present invention, term " first ", " second " are used for description purposes only, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic.The feature of " first ", " second " is defined as a result,
It can explicitly or implicitly include one or more of the features.The meaning of " plurality " is two or more, unless
Separately there is clearly specific restriction.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. a kind of deep gouge counterbore plate characterized by comprising
First substrate, the milling of at least one predetermined position is empty on the first substrate, forms at least one through slot or through-hole；
The second substrate, the first substrate are pressed together with the second substrate, constitute the third base with deep gouge or counterbore
Plate, wherein for the shapes and sizes of the deep gouge or counterbore with the through slot or through-hole, depth is the thickness of the first substrate.
2. deep gouge counterbore plate according to claim 1, which is characterized in that the first substrate and the second substrate use
Prepreg presses together.
3. a kind of pcb board, which is characterized in that be made of deep gouge counterbore plate according to claim 1 or 2.
4. a kind of electronic equipment, which is characterized in that including pcb board according to claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910482285.XA CN110191573A (en) | 2019-06-04 | 2019-06-04 | Deep gouge counterbore plate, pcb board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910482285.XA CN110191573A (en) | 2019-06-04 | 2019-06-04 | Deep gouge counterbore plate, pcb board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110191573A true CN110191573A (en) | 2019-08-30 |
Family
ID=67720261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910482285.XA Pending CN110191573A (en) | 2019-06-04 | 2019-06-04 | Deep gouge counterbore plate, pcb board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110191573A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09246724A (en) * | 1996-03-04 | 1997-09-19 | Hitachi Chem Co Ltd | Multilayer printed wiring board manufacturing method |
| CN101790285A (en) * | 2009-05-13 | 2010-07-28 | 华为技术有限公司 | Communication device and method for manufacturing circuit board of communication device |
| CN103687308A (en) * | 2012-09-14 | 2014-03-26 | 北大方正集团有限公司 | Blind-hole Press-joint multilayer printed circuit board and manufacturing method thereof |
| CN104378931A (en) * | 2014-11-21 | 2015-02-25 | 江门崇达电路技术有限公司 | Method for manufacturing metallized counterbore in PCB |
| CN109413893A (en) * | 2018-10-30 | 2019-03-01 | 珠海杰赛科技有限公司 | A kind of the lamination resistance gluing method and printed circuit board of blind slot printed circuit board |
-
2019
- 2019-06-04 CN CN201910482285.XA patent/CN110191573A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09246724A (en) * | 1996-03-04 | 1997-09-19 | Hitachi Chem Co Ltd | Multilayer printed wiring board manufacturing method |
| CN101790285A (en) * | 2009-05-13 | 2010-07-28 | 华为技术有限公司 | Communication device and method for manufacturing circuit board of communication device |
| CN103687308A (en) * | 2012-09-14 | 2014-03-26 | 北大方正集团有限公司 | Blind-hole Press-joint multilayer printed circuit board and manufacturing method thereof |
| CN104378931A (en) * | 2014-11-21 | 2015-02-25 | 江门崇达电路技术有限公司 | Method for manufacturing metallized counterbore in PCB |
| CN109413893A (en) * | 2018-10-30 | 2019-03-01 | 珠海杰赛科技有限公司 | A kind of the lamination resistance gluing method and printed circuit board of blind slot printed circuit board |
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