CN207425854U - A kind of Big Dipper LNA integration modules - Google Patents

Abstract

The utility model is related to antenna technical fields, more particularly to a kind of Big Dipper LNA integration modules, by by LNA circuits passive device integration to ltcc substrate to form LNA circuits, so as to reduce LNA circuits taking up space on pcb board, and Big Dipper LNA integration modules also have reliability height, low energy consumption, failure rate is low and sexual valence it is high than the advantages that, therefore with very strong practicability.

Description

A kind of Big Dipper LNA integration modules

Technical field

The utility model is related to antenna technical field more particularly to a kind of Big Dipper LNA integration modules.

Background technology

At present, as depicted in figs. 1 and 2, LNA (low-noise amplifier) circuits just as general circuit-mode in PCB LNA, SAW (surface acoustic wave, surface acoustic wave) wave filter, sheet capacitor, inductance, resistance decile are utilized on plate Vertical component is built-up, and this mode occupies the very big space of pcb board, so as to add artificial Material Cost, and due to Solder joint is more in circuit, occurs that the possibility of rosin joint is larger, this can cause entire circuit working performance unstable, homogeneity of product It can not ensure, these are all that those skilled in the art do not expect to see.

Utility model content

In view of the above problems, the utility model discloses a kind of Big Dipper LNA integration modules, wherein, including LNA electricity Road passive device, LTCC (Low Temperature Co-fired Ceramic LTCC, low-temperature co-fired ceramics) substrates and upper Lid；

The LNA circuits passive device integration on the ltcc substrate with the shape together with the wiring on the ltcc substrate Into LNA circuits, the upper cover is arranged on the ltcc substrate to be encapsulated the LNA circuits passive device.

Above-mentioned Big Dipper LNA integration modules, wherein, the LNA circuits passive device include LNA chips, SAW filter, Sheet capacitor, inductance and resistance.

Above-mentioned Big Dipper LNA integration modules, wherein, the Big Dipper LNA integration modules are a rectangular parallelepiped structure, and the length The length and width of cube structure is no more than 5mm, highly no more than 2mm.

Above-mentioned Big Dipper LNA integration modules, wherein, the Big Dipper LNA integration modules are applied on a navigation antenna.

Above-mentioned Big Dipper LNA integration modules, wherein, the ltcc substrate is internally provided with multilayer wiring, and the laminates It is interconnected between line；

The LNA circuits passive device and the multilayer wiring form level-one amplifying circuit or second amplifying circuit together.

Compared with prior art, above-mentioned utility model has the following advantages that or advantageous effect：

First, circuit is simplified；LTCC IPD compress techniques cause LNA IC, SAW filter, sheet capacitor, inductance and It inside buries the components such as LC capacitances, inductance to be integrated on ltcc substrate, simplifies the design, debugging and installation of whole circuit board；Together When also to solve the problems, such as that LNA circuits that original discrete electronic device is formed take up space on pcb board big.

2nd, high reliability；Big Dipper LNA integration modules have the advantages that reliability is high, so as to improve whole circuit board work The reliability of work, and improve the working performance and uniformity of circuit；In addition, after using Big Dipper LNA integration modules, in circuit Solder joint is greatly reduced, and the possibility for rosin joint occur reduces, and makes entire circuit work more reliable.

3rd, energy consumption is small；Big Dipper LNA integration modules also have many advantages, such as that power consumption is small, small, economical and practical, same function Circuit, using Big Dipper LNA integration modules than using discrete electronic device circuit power consumption it is small.

4th, failure rate is low；For discrete component circuit, the rate of breakdown of Big Dipper LNA integration modules than relatively low, Therefore the rate of breakdown of entire circuit is reduced.

5th, for LNA discrete component circuits, the LAN circuit performances formed using Big Dipper LNA integration modules are referred to Higher is marked, compared with the LNA circuits that discrete electronic device is formed, Big Dipper LNA integration module gain highers, null offset is more It is small, and cost is also lower.

Description of the drawings

Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, the utility model and its spy Sign, shape and advantage will become more apparent.Identical mark indicates identical part in whole attached drawings.It can be by Attached drawing is drawn according to ratio, it is preferred that emphasis is the purport of the utility model is shown.

Fig. 1 is the structure diagram of level-one amplifying circuit in the utility model background technology；

Fig. 2 is the structure diagram of second amplifying circuit in the utility model background technology；

Fig. 3 is the structure diagram of Big Dipper LNA integration modules in the utility model embodiment one；

Fig. 4 is the schematic diagram of ltcc substrate another side in Fig. 1；

Fig. 5 is the structure diagram of Big Dipper LNA integration modules in the utility model embodiment two；

Fig. 6 is the schematic diagram of ltcc substrate another side in Fig. 4；

Fig. 7 is the preparation method flow chart of Big Dipper LNA integration modules in the utility model embodiment three.

Specific embodiment

With the development of electronic technology, semiconductor is after micron system enters nanometer processing procedure, the collection of active electric subcomponent Cheng Du is also substantially improved therewith, and the passive element demand of opposite active member of arranging in pairs or groups is even more to increase substantially.The city of electronic product Field development trend is light and short, so the promotion of manufacture of semiconductor ability, makes the active element number of packages in same volume increase, remove Mating passive element quantity is significantly increased, it is also desirable to have more space to place these passive elements, therefore necessarily increases Add the volume size of overall package device, this is far from each other with the development trend in market.From a cost perspective, totle drilling cost and nothing Source element quantity is proportional, therefore on the premise of a large amount of passive element uses, how to go to reduce the cost of passive element And the performance of space or even raising passive element, it is one of currently the most important problem.

IPD technologies can integrate a variety of electric functions, such as sensor, RF transceiver, micro-electromechanical system (MEMS), power Amplifier.Power Management Unit and digital processing unit etc. provide compact integrated passive devices IPD products, have miniaturization and Improve the advantage of system performance.Therefore, the dimension and weight of entire product is either reduced still in existing small product size Increase function, integrated passive components technology can play very big effect.

In the past few years, IPD technologies have become an important realization method of system in package (SiP), IPD skills Art will pave the way for the integrated multifunction of " surmounting Mooreis law "；Meanwhile the processing of PCB can introduce IPD technologies, pass through The integrated advantage of IPD technologies can make ever-expanding gap between encapsulation technology and PCB technologies up.IPD integrated passive components Technology is had evolved to from initial commercial technology at present to substitute discrete passive components, ESD/EMI, RF, high-brightness LED, The industries such as digital hybrid circuit drive lower steady-state growth.With advances in technology, PCB printed circuit boards are towards higher precision and more Highdensity direction is developed, and progressively highly integrated with IC package field, and passive element, which integrates, meets current electronic system Development trend, IPD technologies have become an important realization method of system in package (SiP).Future, IPD technologies will be wide The general electronics industry applied to every field such as aerospace, military project, medical treatment, industry control and communications.

IPD integrated passive components technology is high, small, light-weight with wiring density；Integrated level is high, can be with embedding electricity The passive devices such as resistance, inductance, capacitance and active chip；High frequency characteristics is good, the advantages that available for microwave and millimeter wave field.It will be thin Film IPD integrated passive components technology applied to PCB process, reach saving package area, improve signal transmission performance, reduce into Originally the purpose of, improving reliability, by the integrated advantage of IPD technologies, makes up ever-expanding between encapsulation technology and PCB technologies Gap can effectively reduce complete electronic set and the volume and weight of system, have a vast market prospect.

Development based on the above problem and IPD technologies, the utility model proposes a kind of Big Dipper LNA integration modules.

The utility model is further described with specific embodiment below in conjunction with the accompanying drawings, but not as this practicality New restriction.Embodiment one：

As shown in Figure 3 and Figure 4, the present embodiment is related to a kind of Big Dipper LNA integration modules, specifically, Big Dipper LNA integrates mould Block includes LNA circuits passive device 2, ltcc substrate 3 and upper cover 1；LNA circuits passive device 2 be integrated on ltcc substrate 3 with Wiring on ltcc substrate 3 forms LNA circuits together, and upper cover 1 is arranged on ltcc substrate 3 with by the passive device of LNA circuits It is encapsulated.

Specifically, above-mentioned LNA circuits passive device includes LNA chips, SAW filter, sheet capacitor, inductance and resistance etc. Device specifically includes which device is determined according to process requirements.

Preferably, above-mentioned Big Dipper LNA integration modules are a rectangular parallelepiped structure, and the length and width of rectangular parallelepiped structure is not More than 5mm, highly no more than 2mm.

Preferably, above-mentioned Big Dipper LNA integration modules are applied on a navigation antenna.

Preferably, above-mentioned ltcc substrate 3 is internally provided with multilayer wiring, and is interconnected between the multilayer wiring；It is above-mentioned LNA circuits passive device 2 and the multilayer wiring form level-one amplifying circuit or second amplifying circuit, wherein ltcc substrate 3 together Black portions be electrode terminal.

Embodiment two：

As shown in Figure 5 and Figure 6, the present embodiment is roughly the same with embodiment one, differs only in, according to production in the present embodiment The performance of product is had chosen different from the LNA circuits passive device 12 in embodiment one, that is, has chosen different model and quantity LNA cores The components such as piece, SAW filter, sheet capacitor, inductance, resistance, it is different so as to achieve the effect that；Due in LNA integration modules The model and quantity of portion's component are different from embodiment one, therefore the apparent size of Big Dipper LNA integration modules also becomes therewith Change, the wiring layer design in ltcc substrate 13 would also vary from；Big Dipper LNA integration modules and embodiment i.e. in the present embodiment One Big Dipper LNA integration modules are with a series of different product.

Embodiment three：

As shown in fig. 7, the present embodiment is related to a kind of preparation method of Big Dipper LNA integration modules, specifically, this method includes Following steps：

Step S1 prepares one and is internally provided with the ltcc substrate of multilayer wiring and the upper cover of ltcc substrate, and the laminates Between line be interconnected, according to wires design prepare one be internally provided with multilayer wiring ltcc substrate and with the ltcc substrate The technique of upper cover is well known to those skilled in the art, and is not just repeated herein.

Step S2 provides LNA circuit passive devices, and utilizes IPD technologies by LNA circuits passive device integration to LTCC bases To form LAN circuits on plate.

Preferably, above-mentioned LNA circuits passive device includes LNA chips, SAW filter, sheet capacitor, inductance and resistance Deng.

Preferably, above-mentioned LAN circuits are level-one amplifying circuit or second amplifying circuit.

Step S3, covers upper cover, and the passive device of LNA circuits is encapsulated on ltcc substrate.

Preferably, above-mentioned Big Dipper LNA integration modules are a rectangular parallelepiped structure, and the length and width of rectangular parallelepiped structure is not More than 5mm, highly no more than 2mm.

Preferably, above-mentioned LNA integration modules are applied on a navigation antenna.

It is not difficult to find that the present embodiment is the corresponding embodiment of the method for embodiment of above-mentioned Big Dipper LNA integration modules, this reality Applying example can work in coordination implementation with the embodiment of above-mentioned Big Dipper LNA integration modules.In the embodiment of above-mentioned Big Dipper LNA integration modules The relevant technical details mentioned are still effective in the present embodiment, and in order to reduce repetition, which is not described herein again.Correspondingly, this reality The relevant technical details mentioned in example are applied to be also applicable in the embodiment of above-mentioned Big Dipper LNA integration modules.

To sum up, the utility model discloses a kind of Big Dipper LNA integration modules, by the way that LNA circuit passive device integrations are arrived To form LNA circuits on ltcc substrate, so as to reduce LNA circuits taking up space on pcb board, and Big Dipper LNA is integrated Module also has that reliability is high, and low energy consumption, failure rate is low and sexual valence it is high than the advantages that, therefore with very strong practicability.

It should be appreciated by those skilled in the art that those skilled in the art combine the prior art and above-described embodiment can be with Realize change case, this will not be repeated here.Such change case has no effect on the substantive content of the utility model, not superfluous herein It states.

The preferred embodiment of the utility model is described above.It is to be appreciated that the utility model not office It is limited to above-mentioned particular implementation, wherein the equipment and structure be not described in detail to the greatest extent are construed as with the common side in this field Formula is practiced；Any those skilled in the art in the case where not departing from technical solutions of the utility model ambit, may be used Technical solutions of the utility model are made with many possible changes and modifications using the methods and technical content of the disclosure above or is repaiied The equivalent embodiment of equivalent variations is changed to, this has no effect on the substantive content of the utility model.Therefore, it is every without departing from this practicality The content of new technique scheme, according to the technical essence of the utility model to it is made for any of the above embodiments it is any it is simple modification, etc. With variation and modification, still fall within technical solutions of the utility model protection in the range of.

Claims (5)

1. a kind of Big Dipper LNA integration modules, which is characterized in that including LNA circuits passive device, ltcc substrate and upper cover；

The LNA circuits passive device integration on the ltcc substrate to be formed together with the wiring on the ltcc substrate LNA circuits, the upper cover are arranged on the ltcc substrate to be encapsulated the LNA circuits passive device.

2. Big Dipper LNA integration modules as described in claim 1, which is characterized in that the LNA circuits passive device includes LNA Chip, SAW filter, sheet capacitor, inductance and resistance.

3. Big Dipper LNA integration modules as described in claim 1, which is characterized in that the Big Dipper LNA integration modules are rectangular for one Body structure, and the length and width of the rectangular parallelepiped structure is no more than 5mm, highly no more than 2mm.

4. Big Dipper LNA integration modules as described in claim 1, which is characterized in that the Big Dipper LNA integration modules are applied to one On navigation antenna.

5. Big Dipper LNA integration modules as described in claim 1, which is characterized in that the ltcc substrate is internally provided with multilayer Wiring, and be interconnected between the multilayer wiring；

The LNA circuits passive device and the multilayer wiring form level-one amplifying circuit or second amplifying circuit together.