WO2022000810A1 - Lamination method for flexible circuit board - Google Patents
Lamination method for flexible circuit board Download PDFInfo
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- WO2022000810A1 WO2022000810A1 PCT/CN2020/116280 CN2020116280W WO2022000810A1 WO 2022000810 A1 WO2022000810 A1 WO 2022000810A1 CN 2020116280 W CN2020116280 W CN 2020116280W WO 2022000810 A1 WO2022000810 A1 WO 2022000810A1
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- flexible circuit
- circuit board
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- outer layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
Provided by the present invention is a lamination method for a flexible circuit board. The flexible circuit board comprises an inner flexible circuit board and N layers of outer flexible circuit boards sequentially stacked on the inner flexible circuit board, where N is a positive integer. The lamination method comprises the following steps: setting an identification point; constructing a workbench; the flexible circuit board adds an electric charge; the inner flexible circuit board is aligned with the workbench; and the outer flexible circuit boards are aligned with the inner flexible circuit board. Compared to the prior art, the lamination method for the flexible circuit board according to the present invention uses an image control system for positioning, and the inner flexible circuit board and the outer flexible circuit boards are fixed by means of electrostatic adsorption, so that the alignment precision is greatly improved.
Description
本发明涉及柔性线路板技术领域，尤其涉及一种柔性线路板的叠板方法。The invention relates to the technical field of flexible circuit boards, in particular to a method for stacking flexible circuit boards.
随着通讯行业的快速发展，很多电子产品的尺寸越来越小，其内部的柔性线路板的层数越来越高。多层柔性线路板的制造过程当中，各层之间的对位精度是一项重要的参数，其直接决定了过孔annular
ring值，对线路排版的高密度化起着重要影响。此外，对位精度还直接影响多层柔性线路板的良率。With the rapid development of the communication industry, the size of many electronic products is getting smaller and smaller, and the number of layers of flexible circuit boards inside them is getting higher and higher. In the manufacturing process of multi-layer flexible circuit boards, the alignment accuracy between layers is an important parameter, which directly determines the via annular
The ring value has an important influence on the high density of line layout. In addition, the alignment accuracy also directly affects the yield of the multilayer flexible circuit board.
传统的多层柔性线路板的多层压合前采用治具套PIN叠板，通过PIN钉与内外层之间的治具孔进行定位，定位完成后再退PIN进行预压。Before the multi-layer lamination of traditional multi-layer flexible circuit boards, a jig sleeve PIN stack is used, and the PIN nails and the jig holes between the inner and outer layers are used for positioning. After the positioning is completed, the PIN is returned for pre-pressing.
然而，上述制造多层柔性线路板的过层中，套PIN时会导致偏位；退PIN时的动作可能造成上下层偏位；大批量生产时，内、外层的涨缩会存在动波导致成内、外层与治具的涨缩存在一定的差异，进而限制了线路的高密度化。However, in the above-mentioned over-layer manufacturing of multi-layer flexible circuit boards, deviation will be caused when the PIN is set; the movement of the PIN may cause the upper and lower layers to be offset; in mass production, there will be fluctuations in the expansion and contraction of the inner and outer layers As a result, there is a certain difference in the expansion and contraction of the inner and outer layers and the fixture, which limits the high density of the circuit.
因此，实有必须提供一种新的柔性线路板的叠板方法解决上述问题。Therefore, it is necessary to provide a new method for stacking flexible circuit boards to solve the above problems.
本发明的目的在于提供一种对位精度高的柔性线路板的叠板方法。The purpose of the present invention is to provide a method for stacking flexible circuit boards with high alignment accuracy.
为了达到上述目的，本发明提供了一种柔性线路板的叠板方法，所述柔性线路板包括内层柔性线路板和依次叠设于所述内层柔性线路板上的N层外层柔性线路板，N为正整数，该叠板方法包括以下步骤：
In order to achieve the above object, the present invention provides a method for stacking flexible circuit boards, the flexible circuit board includes an inner-layer flexible circuit board and N-layer outer-layer flexible circuits sequentially stacked on the inner-layer flexible circuit board board, N is a positive integer, and the stacking method includes the following steps:
设置标识点：在所述内层柔性线路板和所述外层柔性线路板上分别按预设规则设置用于对位的内层标识点和外层标识点；Setting identification points: respectively setting inner layer identification points and outer layer identification points for alignment according to preset rules on the inner layer flexible circuit board and the outer layer flexible circuit board;
搭建工作台：搭建一个用于承载所述柔性线路板的工作台，利用静电发生器为所述工作台附加特定极性的电荷；Build a workbench: build a workbench for carrying the flexible circuit board, and use an electrostatic generator to add a charge of a specific polarity to the workbench;
所述柔性线路板附加电荷：通过所述静电发生器分别为所述内层柔性线路板和所述外层柔性线路板附加电荷，使得所述内层柔性线路板附加的电荷极性与所述工作台附加的电荷极性相反；The additional charge of the flexible circuit board: the inner layer flexible circuit board and the outer layer flexible circuit board are respectively charged by the electrostatic generator, so that the added charge polarity of the inner layer flexible circuit board is the same as that of the The charge attached to the workbench has opposite polarity;
所述内层柔性线路板与所述工作台对位：采用摄像控制系统识别所述内层柔性线路板上的所述内层标识点，通过机械手将所述内层柔性线路板搬运至所述工作台，并使所述内层标识点与所述工作台的特定位置进行对位，且所述内层柔性线路板通过静电吸附固定于所述工作台；The inner layer flexible circuit board is aligned with the worktable: the camera control system is used to identify the inner layer identification point on the inner layer flexible circuit board, and the inner layer flexible circuit board is transported to the a workbench, the inner layer identification point is aligned with a specific position of the workbench, and the inner layer flexible circuit board is fixed on the workbench by electrostatic adsorption;
所述外层柔性线路板与所述内层柔性线路板对位；以所述内层柔性线路板上的所述内层标识点为目标，通过所述摄像控制系统识别所述外层柔性线路板上的所述外层标识点，通过机械手将所述外层柔性线路板移至叠设于所述内层柔性线路板上，并使所述外层标识点与所述内层标识点进行对位，且所述外层柔性线路板与所述内层柔性线路板通过静电吸附固定以形成所述柔性线路板的叠板。The outer layer flexible circuit board is aligned with the inner layer flexible circuit board; taking the inner layer identification point on the inner layer flexible circuit board as a target, identifying the outer layer flexible circuit through the camera control system The outer layer identification point on the board, the outer layer flexible circuit board is moved to be stacked on the inner layer flexible circuit board by a manipulator, and the outer layer identification point and the inner layer identification point are carried out. alignment, and the outer layer flexible circuit board and the inner layer flexible circuit board are fixed by electrostatic adsorption to form a stack of the flexible circuit boards.
优选的，当所述外层柔性线路板包括至少两层时，在所述柔性线路板附加电荷的步骤中还包括：使叠设于所述内层柔性线路板的相邻两层所述外层柔性线路板的电荷极性相反；Preferably, when the outer flexible circuit board includes at least two layers, the step of adding charges to the flexible circuit board further includes: making the outer two adjacent layers of the outer flexible circuit board stacked on the inner flexible circuit board. The charge polarity of the layered flexible circuit board is opposite;
在所述内层柔性线路板与所述工作台对位步骤中还包括：通过所述摄像控制系统识别下一层所述外层柔性线路板上的所述外层标识点，通过机械手将该下一层所述外层柔性线路板移至叠设于上一层所述外层柔性线路板上，并使该下一层所述外层柔性线路板的所述外层标识点与上一层所述外层柔性线路板的所述外层标识点进行对位，且使该相邻两层所述外层柔性线路板通过静电吸附固定以形成叠板。The step of aligning the inner-layer flexible circuit board with the worktable further includes: identifying the outer-layer identification points on the outer-layer flexible circuit board in the next layer through the camera control system; The outer layer flexible circuit board of the next layer is moved to be stacked on the outer layer flexible circuit board of the upper layer, and the outer layer identification points of the outer layer flexible circuit board of the next layer are aligned with those of the upper layer. The outer layer identification points of the outer layer flexible circuit boards are aligned, and the two adjacent layers of the outer layer flexible circuit boards are fixed by electrostatic adsorption to form a stack.
优选的，所述柔性线路板的边长尺寸范围为150mm~200mm。Preferably, the side length of the flexible circuit board ranges from 150 mm to 200 mm.
优选的，所述内层柔性线路板包括固定于所述工作台的第一铜层和贴设固定于所述第一铜层远离所述工作台一侧的第一基材层；所述外层柔性线路板包括贴设固定于所述第一基材层的第二基材层和贴设固定于第二基材层远离所述第一基材层一侧的第二铜层。Preferably, the inner-layer flexible circuit board includes a first copper layer fixed on the workbench and a first base material layer attached and fixed on a side of the first copper layer away from the workbench; the outer layer The layered flexible circuit board includes a second base material layer attached and fixed to the first base material layer and a second copper layer attached and fixed to the side of the second base material layer away from the first base material layer.
优选的，所述内层标识点为贯穿所述内层柔性线路板的通孔，所述外层标识点为贯穿所述外层柔性线路板的通孔，所述内层标识点和所述外层标识点的孔径均为0.5mm~0.1mm。Preferably, the inner layer identification point is a through hole passing through the inner layer flexible circuit board, the outer layer identification point is a through hole passing through the outer layer flexible circuit board, the inner layer identification point and the The diameter of the outer marking points is 0.5mm~0.1mm.
优选的，所述内层标识点为蚀刻所述第一铜层形成的盲孔，所述外层标识点为蚀刻所述第二铜层形成的盲孔，所述内层标识点和所述外层标识点的孔径均为0.5mm~0.1mm。Preferably, the inner layer identification point is a blind hole formed by etching the first copper layer, the outer layer identification point is a blind hole formed by etching the second copper layer, the inner layer identification point and the The diameter of the outer marking points is 0.5mm~0.1mm.
优选的，所述外层柔性线路板和所述内层柔性线路板均为矩形，所述内层标识点包括第一内层标识点和第二内层标识点，所述第一内层标识点和所述第二内层标识点的水平距离为130mm~180mm；所述外层标识点包括第一外层标识点和第二外层标识点，所述第一外层标识点和所述第二外层标识点的水平距离为130mm~180mm。Preferably, the outer layer flexible circuit board and the inner layer flexible circuit board are both rectangular, and the inner layer identification point includes a first inner layer identification point and a second inner layer identification point, and the first inner layer identification point The horizontal distance between the point and the second inner layer identification point is 130mm～180mm; the outer layer identification point includes the first outer layer identification point and the second outer layer identification point, the first outer layer identification point and the The horizontal distance of the second outer layer identification point is 130mm~180mm.
优选的，所述第一内层标识点和所述第二内层标识点均包括两个，两个所述第一内层标识点和两个所述第二内层标识点均关于所述内层柔性线路板的中心点呈对称设置，且两个所述第一内层标识点和两个所述第二内层标识点的中心点均位于所述内层柔性线路板的对角线上。Preferably, the first inner layer identification point and the second inner layer identification point each include two, and the two first inner layer identification points and the two second inner layer identification points are both related to the The center points of the inner layer flexible circuit board are arranged symmetrically, and the center points of the two first inner layer identification points and the two second inner layer identification points are located on the diagonal of the inner layer flexible circuit board. superior.
优选的，所述第一外层标识点和所述第二外层标识点均包括两个，两个所述第一外层标识点和两个所述第二外层标识点均关于所述外层柔性线路板的中心点呈对称设置，且两个所述第一外层标识点和两个所述第二外层标识点的中心点均位于所述外层柔性线路板的对角线上。Preferably, the first outer layer identification point and the second outer layer identification point each include two, and the two first outer layer identification points and the two second outer layer identification points are both related to the The center points of the outer layer flexible circuit board are arranged symmetrically, and the center points of the two first outer layer identification points and the two second outer layer identification points are located on the diagonal of the outer layer flexible circuit board. superior.
与相关技术相比，本发明的柔性线路板的叠板方法，采用图像控制系统分别识别所述内层柔性线路板的内层标识点、所述外层柔性线路板的外层标识点以及所述工作台的特定位置，通过机械手将所述内层柔性线路板搬运至所述工作台，并使所述内层标识点与所述工作台的特定位置进行对位；再以所述内层柔性线路板上的所述内层标识点为目标，通过机械手将所述外层柔性线路板移至叠设于所述内层柔性线路板上，并使所述外层标识点与所述内层标识点进行对位。该方法利用图像控制系统进行定位，其定位精度高，不存在定位偏差。另一方面，由于静电作用将所述内层柔性线路板和所述外层柔性线路板很好的吸附在一起，避免了相关技术使用变形孔与PIN钉结合造成的偏位，也避免了退PIN时可能造成的偏位，对位精度大幅提高，从而实现高精度的柔性线路板。Compared with the related art, the method for stacking a flexible circuit board of the present invention adopts an image control system to identify the inner layer identification point of the inner layer flexible circuit board, the outer layer identification point of the outer layer flexible circuit board, and all The specific position of the workbench, the inner layer flexible circuit board is transported to the workbench by a manipulator, and the inner layer identification point is aligned with the specific position of the workbench; The inner layer identification point on the flexible circuit board is the target, and the outer layer flexible circuit board is moved to be stacked on the inner layer flexible circuit board by a manipulator, and the outer layer identification point is connected with the inner layer identification point. Layer identification points are aligned. The method utilizes an image control system for positioning, and its positioning accuracy is high and there is no positioning deviation. On the other hand, due to the electrostatic effect, the inner-layer flexible circuit board and the outer-layer flexible circuit board are well adsorbed together, which avoids the deviation caused by the combination of the deformed hole and the PIN nail in the related art, and also avoids the backlash. The offset that may be caused by PIN is greatly improved, and the alignment accuracy is greatly improved, thereby realizing high-precision flexible circuit boards.
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, under the premise of no creative work, other drawings can also be obtained from these drawings, wherein:
图1为本发明柔性线路板的叠板方法的流程框图;Fig. 1 is the flow chart of the stacking method of flexible circuit board of the present invention;
图2为本发明各层柔性线路板及工作台的结构示意图；2 is a schematic structural diagram of each layer of flexible circuit boards and a workbench according to the present invention;
图3为本发明各层柔性线路板的标识点的结构示意图；3 is a schematic structural diagram of the identification points of the flexible circuit boards of each layer of the present invention;
图4为本发明柔性线路板的叠板方法中各步骤对应的结构示意图。FIG. 4 is a schematic structural diagram corresponding to each step in the method for stacking flexible circuit boards according to the present invention.
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
请同时参阅图1、图2以及图4，本发明提供了一种柔性线路板100的叠板方法，所述柔性线路板100包括内层柔性线路板1和依次叠设于所述内层柔性线路板1上的N层外层柔性线路板2，N为正整数，该叠板方法包括以下步骤Please refer to FIG. 1 , FIG. 2 and FIG. 4 at the same time, the present invention provides a method for stacking a flexible circuit board 100 . The flexible circuit board 100 includes an inner layer flexible circuit board 1 and a flexible circuit board 1 stacked on the inner layer in sequence N-layer outer flexible circuit board 2 on circuit board 1, N is a positive integer, and the method for stacking the boards includes the following steps
步骤S1，设置标识点3：在所述内层柔性线路板1和所述外层柔性线路板2上分别按预设规则设置用于对位的内层标识点31和外层标识点32；Step S1, setting the identification point 3: on the inner layer flexible circuit board 1 and the outer layer flexible circuit board 2, respectively set the inner layer identification point 31 and the outer layer identification point 32 for alignment according to preset rules;
步骤S2，搭建工作台4：搭建一个用于承载所述柔性线路板100的工作台4，利用静电发生器5为所述工作台4附加特定极性的电荷Step S2, build a workbench 4: build a workbench 4 for carrying the flexible circuit board 100, and use the electrostatic generator 5 to add a charge of a specific polarity to the workbench 4
步骤S3，所述柔性线路板100附加电荷：通过所述静电发生器5分别为所述内层柔性线路板1和所述外层柔性线路板2附加电荷，使得所述内层柔性线路板1附加的电荷极性与所述工作台4附加的电荷极性相反。Step S3, the flexible circuit board 100 is additionally charged: the inner layer flexible circuit board 1 and the outer layer flexible circuit board 2 are respectively charged by the electrostatic generator 5, so that the inner layer flexible circuit board 1 The polarity of the added charge is opposite to the polarity of the added charge of the table 4 .
步骤S4，所述内层柔性线路板1与所述工作台4对位：采用摄像控制系统识别所述内层柔性线路板1上的所述内层标识点31，通过机械手将所述内层柔性线路板1搬运至所述工作台4，并使所述内层标识点31与所述工作台4的特定位置进行对位，且所述内层柔性线路板1通过静电吸附固定于所述工作台4。Step S4, the inner layer flexible circuit board 1 is aligned with the worktable 4: the camera control system is used to identify the inner layer identification point 31 on the inner layer flexible circuit board 1, and the inner layer is moved by a manipulator. The flexible circuit board 1 is transported to the workbench 4 , and the inner layer marking points 31 are aligned with the specific position of the workbench 4 , and the inner layer flexible circuit board 1 is fixed on the workbench by electrostatic adsorption. Workbench 4.
步骤S5，所述外层柔性线路板2与所述内层柔性线路板1对位；以所述内层柔性线路板1上的所述内层标识点31为目标，通过所述摄像控制系统识别所述外层柔性线路板2上的所述外层标识点32，通过机械手将所述外层柔性线路板2移至叠设于所述内层柔性线路板1上，并使所述外层标识点32与所述内层标识点31进行对位，且所述外层柔性线路板2与所述内层柔性线路板1通过静电吸附固定以形成所述柔性线路板100的叠板。Step S5, the outer layer flexible circuit board 2 is aligned with the inner layer flexible circuit board 1; taking the inner layer identification point 31 on the inner layer flexible circuit board 1 as the target, through the camera control system Identify the outer layer identification points 32 on the outer layer flexible circuit board 2, move the outer layer flexible circuit board 2 to be stacked on the inner layer flexible circuit board 1 by a manipulator, and make the outer layer flexible circuit board 2 The layer identification points 32 and the inner layer identification points 31 are aligned, and the outer layer flexible circuit board 2 and the inner layer flexible circuit board 1 are fixed by electrostatic adsorption to form a stack of the flexible circuit boards 100 .
上述柔性线路板100的叠板方法，采用图像控制系统分别识别所述内层柔性线路板1的内层标识点31、所述外层柔性线路板2的外层标识点32以及所述工作台4的特定位置，通过机械手将所述内层柔性线路板1搬运至所述工作台4，并使所述内层标识点31与所述工作台4的特定位置进行对位；再以所述内层柔性线路板1上的所述内层标识点31为目标，通过机械手将所述外层柔性线路板2移至叠设于所述内层柔性线路板1上，并使所述外层标识点32与所述内层标识点31进行对位。该方法利用图像控制系统进行定位，其定位精度高，不存在定位偏差。另一方面，由于静电作用将所述内层柔性线路板1和所述外层柔性线路板2很好的吸附在一起，避免了相关技术使用变形孔与PIN钉结合造成的偏位，也避免了退PIN时可能造成的偏位，对位精度大幅提高，从而实现高精度的柔性线路板100。当然，上述步骤顺序并非唯一，比如上述步骤S1和步骤S2可以互换顺序（即工作台4先附加电荷，柔性电路板再设置标识点），其都是可行的。In the above-mentioned method of stacking the flexible circuit board 100, the image control system is used to identify the inner layer identification point 31 of the inner layer flexible circuit board 1, the outer layer identification point 32 of the outer layer flexible circuit board 2, and the workbench respectively. 4, the inner layer flexible circuit board 1 is transported to the workbench 4 by a manipulator, and the inner layer identification point 31 is aligned with the specific position of the workbench 4; The inner layer identification point 31 on the inner layer flexible circuit board 1 is the target, and the outer layer flexible circuit board 2 is moved to be stacked on the inner layer flexible circuit board 1 by a manipulator, and the outer layer flexible circuit board 1 is moved. The identification point 32 is aligned with the inner layer identification point 31 . The method utilizes an image control system for positioning, and its positioning accuracy is high and there is no positioning deviation. On the other hand, due to the electrostatic effect, the inner layer flexible circuit board 1 and the outer layer flexible circuit board 2 are well adsorbed together, which avoids the deviation caused by the combination of the deformation hole and the PIN nail in the related art, and also avoids the The deviation that may be caused when the PIN is withdrawn is eliminated, and the alignment accuracy is greatly improved, thereby realizing a high-precision flexible circuit board 100 . Of course, the sequence of the above steps is not unique. For example, the sequence of the above steps S1 and S2 can be interchanged (that is, the workbench 4 is charged first, and then the flexible circuit board is set with identification points), which are all feasible.
需要说明的是，当所述外层柔性线路板2包括至少两层时，在所述柔性线路板100附加电荷的步骤中还包括：使叠设于所述内层柔性线路板1的相邻两层所述外层柔性线路板2的电荷极性相反；在所述内层柔性线路板1与所述工作台4对位步骤中还包括：通过所述摄像控制系统识别下一层所述外层柔性线路板2上的所述外层标识点32，通过机械手将该下一层所述外层柔性线路板移至叠设于上一层所述外层柔性线路板上，并使该下一层所述外层柔性线路板的所述外层标识点与上一层所述外层柔性线路板的所述外层标识点进行对位，且使该相邻两层所述外层柔性线路板2通过静电吸附固定以形成叠板。It should be noted that, when the outer flexible circuit board 2 includes at least two layers, the step of adding charges to the flexible circuit board 100 further includes: making adjacent layers stacked on the inner flexible circuit board 1 The charge polarities of the two layers of the outer flexible circuit board 2 are opposite; the alignment step of the inner flexible circuit board 1 and the worktable 4 also includes: identifying the next layer through the camera control system. The outer layer identification point 32 on the outer layer flexible circuit board 2 is moved by a manipulator to the outer layer flexible circuit board of the next layer to be stacked on the upper layer of the outer layer flexible circuit board, and the The outer layer identification point of the outer layer flexible circuit board of the next layer is aligned with the outer layer identification point of the outer layer flexible circuit board of the upper layer, and the two adjacent layers of the outer layer are aligned. The flexible circuit board 2 is fixed by electrostatic adsorption to form a stack.
本实施方式中，所述柔性线路板的边长尺寸范围为150mm~200mm，该尺寸范围的设置，使得柔性线路板100可以应用在小型设备中。In this embodiment, the side length of the flexible circuit board ranges from 150 mm to 200 mm. The setting of this size range enables the flexible circuit board 100 to be applied to small devices.
具体的，所述内层柔性线路板1包括固定于所述工作台4的第一铜层11和贴设固定于所述第一铜层11远离所述工作台4一侧的第一基材层12；所述外层柔性线路板2包括贴设固定于所述第一基材层12的第二基材层21和贴设固定于第二基材层21远离所述第一基材层12一侧的第二铜层22。Specifically, the inner-layer flexible circuit board 1 includes a first copper layer 11 fixed on the workbench 4 and a first base material attached and fixed on the side of the first copper layer 11 away from the workbench 4 . layer 12; the outer flexible circuit board 2 includes a second base material layer 21 attached and fixed to the first base material layer 12 and a second base material layer 21 attached and fixed to the second base material layer 21 away from the first base material layer The second copper layer 22 on the 12 side.
更优的，为了使所述图像控制系统更快速准确的识别标识点，在本实施方式中，所述内层标识点31为贯穿所述内层柔性线路板1的通孔，所述外层标识点32为贯穿所述外层柔性线路板2的通孔。当然，不限于此，所述内层标识点31还可以为蚀刻所述第一铜层11形成的盲孔，所述外层标识点32还可以为蚀刻所述第二铜层22形成的盲孔，且所述内层标识点31和所述外层标识点32的孔径均为0.5mm~0.1mm。More preferably, in order to enable the image control system to identify the marking point more quickly and accurately, in this embodiment, the inner layer marking point 31 is a through hole penetrating the inner layer flexible circuit board 1, and the outer layer marking point 31 is a through hole. The identification point 32 is a through hole passing through the outer flexible circuit board 2 . Of course, not limited to this, the inner layer identification points 31 may also be blind holes formed by etching the first copper layer 11 , and the outer layer identification points 32 may also be blind holes formed by etching the second copper layer 22 . holes, and the diameters of the inner layer identification points 31 and the outer layer identification points 32 are both 0.5 mm to 0.1 mm.
请参阅图3所示，所述外层柔性线路板2和所述内层柔性线路板1均为矩形，所述内层标识点31包括第一内层标识点311和第二内层标识点312，所述第一内层标识点311和所述第二内层标识点312的水平距离为130mm~180mm；所述外层标识点32包括第一外层标识点321和第二外层标识点322，所述第一外层标识点321和所述第二外层标识点321的水平距离为130mm~180mm。Please refer to FIG. 3 , the outer layer flexible circuit board 2 and the inner layer flexible circuit board 1 are both rectangular, and the inner layer identification point 31 includes a first inner layer identification point 311 and a second inner layer identification point 312, the horizontal distance between the first inner layer identification point 311 and the second inner layer identification point 312 is 130mm～180mm; the outer layer identification point 32 includes the first outer layer identification point 321 and the second outer layer identification point 312 Point 322, the horizontal distance between the first outer layer identification point 321 and the second outer layer identification point 321 is 130mm~180mm.
进一步的，所述第一内层标识点311和所述第二内层标识312点均包括两个，两个所述第一内层标识点311和两个所述第二内层标识点312均关于所述内层柔性线路板1的中心点呈对称设置，且两个所述第一内层标识点311和两个所述第二内层标识点312的中心点均位于所述内层柔性线路板1的对角线上。所述第一外层标识点321和所述第二外层标识点322均包括两个，两个所述第一外层标识点321和两个所述第二外层标识点322均关于所述外层柔性线路板2的中心点呈对称设置，且两个所述第一外层标识点321和两个所述第二外层标识点322的中心点均位于所述外层柔性线路板2的对角线上。Further, the first inner layer identification point 311 and the second inner layer identification point 312 each include two, two of the first inner layer identification point 311 and two of the second inner layer identification point 312 Both are symmetrically arranged with respect to the center point of the inner layer flexible circuit board 1, and the center points of the two first inner layer identification points 311 and the two second inner layer identification points 312 are both located in the inner layer on the diagonal of the flexible circuit board 1 . Both the first outer layer identification point 321 and the second outer layer identification point 322 include two, and the two first outer layer identification points 321 and the two second outer layer identification points 322 are both related to the The center points of the outer layer flexible circuit board 2 are symmetrically arranged, and the center points of the two first outer layer identification points 321 and the two second outer layer identification points 322 are located on the outer layer flexible circuit board. 2 on the diagonal.
与相关技术相比，本发明的柔性线路板的叠板方法，采用图像控制系统分别识别所述内层柔性线路板的内层标识点、所述外层柔性线路板的外层标识点以及所述工作台的特定位置，通过机械手将所述内层柔性线路板搬运至所述工作台，并使所述内层标识点与所述工作台的特定位置进行对位；再以所述内层柔性线路板上的所述内层标识点为目标，通过机械手将所述外层柔性线路板移至叠设于所述内层柔性线路板上，并使所述外层标识点与所述内层标识点进行对位。该方法利用图像控制系统进行定位，其定位精度高，不存在定位偏差。另一方面，由于静电作用将所述内层柔性线路板和所述外层柔性线路板很好的吸附在一起，避免了相关技术使用变形孔与PIN钉结合造成的偏位，也避免了退PIN时可能造成的偏位，对位精度大幅提高，从而实现高精度的柔性线路板。Compared with the related art, the method for stacking a flexible circuit board of the present invention adopts an image control system to identify the inner layer identification point of the inner layer flexible circuit board, the outer layer identification point of the outer layer flexible circuit board, and all The specific position of the workbench, the inner layer flexible circuit board is transported to the workbench by a manipulator, and the inner layer identification point is aligned with the specific position of the workbench; The inner layer identification point on the flexible circuit board is the target, and the outer layer flexible circuit board is moved to be stacked on the inner layer flexible circuit board by a manipulator, and the outer layer identification point is connected with the inner layer identification point. Layer identification points are aligned. The method utilizes an image control system for positioning, and its positioning accuracy is high and there is no positioning deviation. On the other hand, due to the electrostatic effect, the inner-layer flexible circuit board and the outer-layer flexible circuit board are well adsorbed together, which avoids the deviation caused by the combination of the deformed hole and the PIN nail in the related art, and also avoids the backlash. The offset that may be caused by PIN is greatly improved, and the alignment accuracy is greatly improved, thereby realizing high-precision flexible circuit boards.
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。The above descriptions are only the embodiments of the present invention, and are not intended to limit the scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other related technologies Fields are similarly included in the scope of patent protection of the present invention.
Claims (9)
- 一种柔性线路板的叠板方法，所述柔性线路板包括内层柔性线路板和依次叠设于所述内层柔性线路板上的N层外层柔性线路板，N为正整数，其特征在于，该叠板方法包括以下步骤：A method for stacking flexible circuit boards, the flexible circuit board comprises an inner layer flexible circuit board and N layers of outer layer flexible circuit boards stacked on the inner layer flexible circuit board in sequence, N is a positive integer, and is characterized by: That is, the stacking method includes the following steps:设置标识点：在所述内层柔性线路板和所述外层柔性线路板上分别按预设规则设置用于对位的内层标识点和外层标识点；Setting identification points: respectively setting inner layer identification points and outer layer identification points for alignment according to preset rules on the inner layer flexible circuit board and the outer layer flexible circuit board;搭建工作台：搭建一个用于承载所述柔性线路板的工作台，利用静电发生器为所述工作台附加特定极性的电荷；Build a workbench: build a workbench for carrying the flexible circuit board, and use an electrostatic generator to add a charge of a specific polarity to the workbench;所述柔性线路板附加电荷：通过所述静电发生器分别为所述内层柔性线路板和所述外层柔性线路板附加电荷，使得所述内层柔性线路板附加的电荷极性与所述工作台附加的电荷极性相反；The additional charge of the flexible circuit board: the inner layer flexible circuit board and the outer layer flexible circuit board are respectively charged by the electrostatic generator, so that the added charge polarity of the inner layer flexible circuit board is the same as that of the The charge attached to the workbench has opposite polarity;所述内层柔性线路板与所述工作台对位：采用摄像控制系统识别所述内层柔性线路板上的所述内层标识点，通过机械手将所述内层柔性线路板搬运至所述工作台，并使所述内层标识点与所述工作台的特定位置进行对位，且所述内层柔性线路板通过静电吸附固定于所述工作台；The inner layer flexible circuit board is aligned with the worktable: the camera control system is used to identify the inner layer identification point on the inner layer flexible circuit board, and the inner layer flexible circuit board is transported to the a workbench, the inner layer identification point is aligned with a specific position of the workbench, and the inner layer flexible circuit board is fixed on the workbench by electrostatic adsorption;所述外层柔性线路板与所述内层柔性线路板对位；以所述内层柔性线路板上的所述内层标识点为目标，通过所述摄像控制系统识别所述外层柔性线路板上的所述外层标识点，通过机械手将所述外层柔性线路板移至叠设于所述内层柔性线路板上，并使所述外层标识点与所述内层标识点进行对位，且所述外层柔性线路板与所述内层柔性线路板通过静电吸附固定以形成所述柔性线路板的叠板。The outer layer flexible circuit board is aligned with the inner layer flexible circuit board; taking the inner layer identification point on the inner layer flexible circuit board as a target, identifying the outer layer flexible circuit through the camera control system The outer layer identification point on the board, the outer layer flexible circuit board is moved to be stacked on the inner layer flexible circuit board by a manipulator, and the outer layer identification point and the inner layer identification point are carried out. alignment, and the outer layer flexible circuit board and the inner layer flexible circuit board are fixed by electrostatic adsorption to form a stack of the flexible circuit boards.
- 根据权利要求1所述的柔性线路板的叠板方法，其特征在于，当所述外层柔性线路板包括至少两层时，在所述柔性线路板附加电荷的步骤中还包括：使叠设于所述内层柔性线路板的相邻两层所述外层柔性线路板的电荷极性相反；The method for stacking a flexible circuit board according to claim 1, wherein when the outer layer flexible circuit board includes at least two layers, the step of adding electric charge to the flexible circuit board further comprises: stacking the flexible circuit board The charge polarities of the two adjacent layers of the outer flexible circuit board on the inner flexible circuit board are opposite;在所述内层柔性线路板与所述工作台对位步骤中还包括：通过所述摄像控制系统识别下一层所述外层柔性线路板上的所述外层标识点，通过机械手将该下一层所述外层柔性线路板移至叠设于上一层所述外层柔性线路板上，并使该下一层所述外层柔性线路板的所述外层标识点与上一层所述外层柔性线路板的所述外层标识点进行对位，且使该相邻两层所述外层柔性线路板通过静电吸附固定以形成叠板。The step of aligning the inner-layer flexible circuit board with the worktable further includes: identifying the outer-layer identification points on the outer-layer flexible circuit board in the next layer through the camera control system; The outer layer flexible circuit board of the next layer is moved to be stacked on the outer layer flexible circuit board of the upper layer, and the outer layer identification points of the outer layer flexible circuit board of the next layer are aligned with those of the upper layer. The outer layer identification points of the outer layer flexible circuit boards are aligned, and the two adjacent layers of the outer layer flexible circuit boards are fixed by electrostatic adsorption to form a stack.
- 根据权利要求1所述的柔性线路板的叠板方法，其特征在于，所述柔性线路板的边长尺寸范围为150mm~200mm。The method for stacking a flexible circuit board according to claim 1, wherein the side length of the flexible circuit board ranges from 150 mm to 200 mm.
- 根据权利要求3所述的柔性线路板的叠板方法，其特征在于，所述内层柔性线路板包括固定于所述工作台的第一铜层和贴设固定于所述第一铜层远离所述工作台一侧的第一基材层；所述外层柔性线路板包括贴设固定于所述第一基材层的第二基材层和贴设固定于第二基材层远离所述第一基材层一侧的第二铜层。The method for stacking flexible circuit boards according to claim 3, wherein the inner-layer flexible circuit board comprises a first copper layer fixed on the worktable, and a first copper layer that is attached and fixed to the first copper layer away from the The first base material layer on one side of the workbench; the outer flexible circuit board includes a second base material layer attached and fixed to the first base material layer and a second base material layer attached and fixed to the second base material layer away from the the second copper layer on the side of the first base material layer.
- 根据权利要求4所述的柔性线路板的叠板方法，其特征在于，所述内层标识点为贯穿所述内层柔性线路板的通孔，所述外层标识点为贯穿所述外层柔性线路板的通孔，所述内层标识点和所述外层标识点的孔径均为0.5mm~0.1mm。The method for stacking flexible circuit boards according to claim 4, wherein the inner layer identification point is a through hole passing through the inner layer flexible circuit board, and the outer layer identification point is a through hole passing through the outer layer For the through holes of the flexible circuit board, the diameters of the inner layer identification points and the outer layer identification points are both 0.5 mm to 0.1 mm.
- 根据权利要求4所述的柔性线路板的叠板方法，其特征在于，所述内层标识点为蚀刻所述第一铜层形成的盲孔，所述外层标识点为蚀刻所述第二铜层形成的盲孔，所述内层标识点和所述外层标识点的孔径均为0.5mm~0.1mm。The method for stacking flexible circuit boards according to claim 4, wherein the inner layer identification point is a blind hole formed by etching the first copper layer, and the outer layer identification point is a blind hole formed by etching the second copper layer. For the blind hole formed by the copper layer, the diameters of the inner layer identification point and the outer layer identification point are both 0.5 mm to 0.1 mm.
- 根据权利要求3所述的柔性线路板的叠板方法，其特征在于，所述外层柔性线路板和所述内层柔性线路板均为矩形，所述内层标识点包括第一内层标识点和第二内层标识点，所述第一内层标识点和所述第二内层标识点的水平距离为130mm~180mm；所述外层标识点包括第一外层标识点和第二外层标识点，所述第一外层标识点和所述第二外层标识点的水平距离为130mm~180mm。The method for stacking flexible circuit boards according to claim 3, wherein the outer-layer flexible circuit board and the inner-layer flexible circuit board are both rectangular, and the inner-layer identification point comprises a first inner-layer identification point and the second inner layer identification point, the horizontal distance between the first inner layer identification point and the second inner layer identification point is 130mm～180mm; the outer layer identification point includes the first outer layer identification point and the second inner layer identification point The outer layer identification point, the horizontal distance between the first outer layer identification point and the second outer layer identification point is 130mm~180mm.
- 根据权利要求7所述的柔性线路板的叠板方法，其特征在于，所述第一内层标识点和所述第二内层标识点均包括两个，两个所述第一内层标识点和两个所述第二内层标识点均关于所述内层柔性线路板的中心点呈对称设置，且两个所述第一内层标识点和两个所述第二内层标识点的中心点均位于所述内层柔性线路板的对角线上。The method for stacking flexible circuit boards according to claim 7, wherein the first inner layer identification point and the second inner layer identification point each include two, and two of the first inner layer identification points are included. The point and the two second inner layer identification points are symmetrically arranged with respect to the center point of the inner layer flexible circuit board, and the two first inner layer identification points and the two second inner layer identification points are arranged symmetrically. The center points are all located on the diagonal line of the inner flexible circuit board.
- 根据权利要求7所述的柔性线路板的叠板方法，其特征在于，所述第一外层标识点和所述第二外层标识点均包括两个，两个所述第一外层标识点和两个所述第二外层标识点均关于所述外层柔性线路板的中心点呈对称设置，且两个所述第一外层标识点和两个所述第二外层标识点的中心点均位于所述外层柔性线路板的对角线上。The method for stacking flexible circuit boards according to claim 7, wherein the first outer layer identification point and the second outer layer identification point each include two, and two of the first outer layer identification points The point and the two second outer layer identification points are symmetrically arranged with respect to the center point of the outer flexible circuit board, and the two first outer layer identification points and the two second outer layer identification points are arranged symmetrically. The center points are all located on the diagonal line of the outer flexible circuit board.
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