CN105491818B - High aligning accuracy buries method for manufacturing circuit board - Google Patents
High aligning accuracy buries method for manufacturing circuit board Download PDFInfo
- Publication number
- CN105491818B CN105491818B CN201510823613.XA CN201510823613A CN105491818B CN 105491818 B CN105491818 B CN 105491818B CN 201510823613 A CN201510823613 A CN 201510823613A CN 105491818 B CN105491818 B CN 105491818B
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- Prior art keywords
- hole
- positioning
- circuit board
- aligning accuracy
- manufacturing circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
Method for manufacturing circuit board is buried the invention discloses a kind of high aligning accuracy, includes the following steps: to provide separable carrier；Target pad is processed on the separable carrier；At least one first positioning through hole and multiple windowings are formed on the separable carrier, and first positioning through hole passes through the target pad；It is positioned by first positioning through hole, blind hole is processed at multiple windowings, form circuitous pattern；It returns and bores the second positioning through hole of the first positioning through hole formation, separating the separable carrier is 2 pieces of substrates.It is larger to solve high energy laser beam random offset position very well, the problem of influencing blind hole and pad aligning accuracy, realize in the error precision of blind hole pad ± 12 μm to capability, greatly improve the qualification rate and product reliability of substrate manufacture, in addition, also increasing the route and blind hole design closeness of substrate.
Description
Technical field
The present invention relates to coreless substrate manufacturing technology fields, bury wiring board production more particularly, to a kind of high aligning accuracy
Method.
Background technique
As semiconductor package product develops towards high-performance, slimming and inexpensive direction, coreless substrate has been expedited the emergence of
Coreless technology.In recent years, coreless substrate due to " thinner freedom degree that is lighter, improving electrical characteristic and wires design, it is low at
This " the advantages of, show preferable market prospects.At present industry mainstream without core plate be designed as 3L Coreless/2L ETS and
1.5L ETS/1L thin substrate product；Since road of sunkening cord (ETS) printed line is wide not by etch effects, added using conventional MASP improvement half
15/15um or 18/18um route can be made at process, unlike materials such as the half additional ABF of addition requirements of process of SAP, special micro-
Liquid medicine etc. is lost to improve route binding force, and there is stronger cost advantage in terms of fine-line production；In addition, sunken cord road and PP
Surface maintains an equal level, line pad flatness is splendid, in Flip-Chip Using process, has better reliability.It is buried to give full play to
The advantage of wiring board ETS, route and blind hole design meeting more crypto set, blind hole weld-ring are designed smaller and smaller (≤25um), are
Avoid blind hole from breaking ring, deviation problem influences the reliability of subsequent chip package, this requires blind hole and the high-precision of pad to align control
System is in +/- 12~15um；Except laser drill and route exposure sources it is intrinsic aligning accuracy control it is outer, key also resides in one kind most
The alignment method of good laser drill and route production, as far as possible exclusion other factors, reach and realize stable, high-precision control blind hole
With the +/- 12um of pad to capability.
Summary of the invention
Based on this, the invention reside in overcoming the deficiencies of existing technologies, the wiring board that buries for providing a kind of high aligning accuracy is made
Method, realize control errors ± 12 μm blind hole and pad to capability, increase route and blind hole design closeness, and can
To improve the qualification rate and reliability of substrate manufacture.
Its technical solution is as follows:
A kind of high aligning accuracy buries method for manufacturing circuit board, includes the following steps:
Separable carrier is provided；
Target pad is processed on the separable carrier；
At least one first positioning through hole and multiple windowings are formed on the separable carrier, and first positioning is logical
Hole passes through the target pad；
It is positioned by first positioning through hole, blind hole is processed at multiple windowings, form circuitous pattern；
It returns and bores the second positioning through hole of the first positioning through hole formation, separating the separable carrier is 2 pieces of substrates.
Further, the separable carrier includes center resin layer, and along the center resin layer upper and lower side by
It is interior to the thick copper layer and thin copper layer that set gradually outside.
It further, further include processing to form first line figure on the thin copper layer when processing the target pad
And second line pattern, the specific steps of which are as follows:
Dry film exposes on thin copper layer, forms first line figure and the second line pattern, the target pad are formed in
Close to the edge of the thin copper layer；
Graphic plating is carried out to substrate；
Thin copper layer is etched using etching solution, dry film is removed；
First line figure and the second line pattern laminated bonding internal layer prepreg and outer copper foil.
Further, when forming first positioning through hole, the center of the target pad is positioned by x-ray, and pass through
Drilling shapes.
Further, the diameter range of the target pad is 1~4.5mm.
Further, forming the blind hole, specific step is as follows:
It is positioned by first positioning through hole, dry film exposes, etches the windowing on thin copper layer；
Laser drill forms the blind hole to the first line figure and the second line pattern at the windowing.
Further, the step of forming the circuitous pattern is as follows:
Conductive layer is formed in the blind hole by heavy copper；
Dry film exposes on the electrically conductive, and graphic plating forms the circuitous pattern.
Further, first positioning through hole and the described second logical position hole coaxial arrangement calmly.
Further, the diameter of first positioning through hole is 1~2.5mm.
Further, the diameter of second positioning through hole is 4.5~8.5mm.
The beneficial effects of the present invention are:
Above-mentioned high aligning accuracy buries method for manufacturing circuit board by producing target pad on the carrier of separating, by
The target pad positioning process goes out first positioning through hole, described in the precision positioning production by first positioning through hole
Windowing, processes the blind hole by small energy laser later and forms the circuitous pattern, and the above method passes through " small energy laser
Shu Wufa destroys copper foil at the windowing " design principle, it is larger to solve high energy laser beam random offset position very well, shadow
Ring blind hole and the problem of pad aligning accuracy, realize in blind hole and pad ± 12 μm error precision to capability, greatly
The qualification rate and product reliability of substrate manufacture are improved, in addition, also increasing the route and blind hole design closeness of substrate.
Detailed description of the invention
Fig. 1 is the flow chart for burying method for manufacturing circuit board of high aligning accuracy described in the embodiment of the present invention；
Fig. 2~Figure 10 is that the technique production for burying method for manufacturing circuit board of high aligning accuracy described in the embodiment of the present invention is cutd open
View.
Description of symbols:
100, carrier, 120, thick copper layer, 140, thin copper layer, 142, windowing, 144, blind hole, 200, first line figure are separated
Shape, the 300, second line pattern, 400, target pad, 500, copper foil, 600, prepreg, the 700, first positioning through hole, 720,
Conductive layer, the 740, second positioning through hole.
Specific embodiment
The embodiment of the present invention is described in detail below:
As shown in Figure 1, a kind of high aligning accuracy buries method for manufacturing circuit board, include the following steps:
Separable carrier 100 is provided；
Target pad 400 is processed on the separable carrier 100；
At least one first positioning through hole 700 and multiple windowings 142 are formed on the separable carrier 100, and described
First positioning through hole 700 passes through the target pad 400；
It is positioned by first positioning through hole 700, processes blind hole 144 at multiple windowings 142, form circuit
Figure；
It returns and bores second positioning through hole 740 of the formation of the first positioning through hole 700, separating the separable carrier 100 is 2 pieces
Substrate.
It wherein, in order to realize high-precision positioning process, is added by the way that dry film, exposure, graphic plating etc. are a series of first
Work technique produces target pad 400 on the carrier of separating, and specifically, the target pad 400 is carried in the separation
Circlewise structure on body, in the preferred embodiment of the invention, the separable carrier 100 includes center resin layer, and along institute
State thick copper layer 120 and thin copper layer 140 that the upper and lower side of center resin layer is set gradually from inside to outside.By the target pad
400 positioning processes go out first positioning through hole 700, when forming first positioning through hole 700, position the target by x-ray
The center of pad 400 is marked, and is shaped by drilling, specifically, is processed by machine drilling or laser drill,
Its principle is that x-ray ray beam can penetrate copper metal layer, the shadow for the target pad 400 of cyclic structure out of developing
Picture can position the processing that its center carries out first positioning through hole 700, the positioning method accuracy, high reliablity.But it answers
When pointing out, in actual processing, the forming mode of first positioning through hole 700 is not limited in above two processing method,
In addition, the diameter preferred scope of first positioning through hole 700 is 1~2.5mm, the target pad 400 for the ease of processing
Diameter range be 1~4.5mm, but be not limiting of its scope, be also possible to other numerical value in other embodiments,
Also within the scope of the present invention.
The windowing 142, specifically, the windowing are processed by the precision positioning of first positioning through hole 700
142 be to produce groove on the thin copper layer 140 by the processing method of drilling, and it is described to guarantee that the depth of the groove is equal to
The thickness of thin copper layer 140, the position correspondence by the laser beam of small energy in the windowing 142 processes the blind hole 144 later,
Its working principle is that, after carrying out accurate position positioning by first positioning through hole 700, is swashed by energy is lesser
Light beam, and guarantee that the diameter of laser beam is wider than the diameter of the blind hole 144, the effect that so can achieve is due to laser beam
Energy is smaller, can not melt 140 material of thin copper layer near the windowing 142, and can only process and dispel in described
The material of heart resin layer, thus the blind hole 144 is formed, forming the blind hole 144, specific step is as follows:
It is positioned by first positioning through hole 700, dry film exposes, etches the windowing on thin copper layer 140
142；
Laser drill forms institute to the first line figure 200 and the second line pattern 300 at the windowing 142
State blind hole 144.
The above method passes through the design principle of " small energy laser beams can not destroy copper foil 500 at the windowing 142 ", very well
The problem of it is larger to solve high energy laser beam random offset position, influences blind hole 144 and pad aligning accuracy, realizes blind hole
144 and pad ± 12 μm error precision in capability, greatly improve the qualification rate and product reliability of substrate manufacture,
In addition, also increasing the route and the design closeness of blind hole 144 of substrate.In another preferred embodiment, described in the progress
It, can be the technical solution adopted is that directly with laser by first positioning through hole 700 when the production of the first positioning through hole 700
Interior resin material burn-up, expose the pad of first line figure 200 and the second line pattern 300, is then determined with the pad
Position, which return by laser, bores the second positioning through hole 740, and the program also can achieve the effect of high accuracy positioning processing, also at this
In the protection scope of invention.
It further include processing to form first line figure 200 on the thin copper layer 140 when processing the target pad 400
And second line pattern 300, the specific steps of which are as follows:
Dry film exposes on thin copper layer 140, forms first line figure 200 and the second line pattern 300, the target weldering
Disk 400 is formed close to the edge of the thin copper layer 140；
Graphic plating is carried out to substrate；
Thin copper layer 140 is etched using etching solution, dry film is removed；
First line figure 200 and 300 laminated bonding internal layer prepreg 600 of the second line pattern and outer copper foil 500.
After processing the blind hole 144, it is also necessary to make point diagram figure in the blind hole 144, be produced in order to be formed
The circuit board of product, the step of forming the circuitous pattern, are as follows:
Conductive layer 720 is formed in the blind hole 144 by heavy copper；
Dry film exposes on conductive layer 720, and graphic plating forms the circuitous pattern.
After production forms foregoing circuit figure, for the ease of separating two pieces of bases of the center resin layer upper and lower side
Plate needs to return brill on the basis of the first positioning through hole 700 once, forms the second positioning through hole 740 being relatively large in diameter, with
It realizes being smoothly detached for 2 pieces of substrates, realizes that time processing can form the purpose of two pieces of production boards, substantially increase processing effect
Rate.Preferably, first positioning through hole 700 and the described second logical position hole coaxial arrangement calmly, that is, processing first positioning
When through-hole 700, guarantee that it processes the center line of the center line of second positioning through hole 740 Yu first positioning through hole 700
It is overlapped, to guarantee compared with high manufacturing accuracy.Preferably, the diameter for guaranteeing second positioning through hole 740 is 4.5~8.5mm., with
Correlation separator convenient to use realizes the separation of 2 pieces of substrates up and down, improves work convenience and efficiency.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of high aligning accuracy buries method for manufacturing circuit board, which comprises the steps of:
Separable carrier is provided；
Target pad is processed on the separable carrier；
At least one first positioning through hole and multiple windowings are formed on the separable carrier, and first positioning through hole is worn
Cross the target pad；
It is positioned by first positioning through hole, processes blind hole at multiple windowings using small energy laser, form electricity
Road figure；
It returns and bores the second positioning through hole of the first positioning through hole formation, separating the separable carrier is 2 pieces of substrates.
2. high aligning accuracy according to claim 1 buries method for manufacturing circuit board, which is characterized in that the separable load
Body includes center resin layer, and along the upper and lower side thick copper layer and thin copper that set gradually from inside to outside of the center resin layer
Layer.
3. high aligning accuracy according to claim 2 buries method for manufacturing circuit board, which is characterized in that process the target
When pad, further include on the thin copper layer processing form first line figure and the second line pattern, the specific steps of which are as follows:
Dry film exposes on thin copper layer, forms first line figure and the second line pattern, the target pad are formed close to
The edge of the thin copper layer；
Graphic plating is carried out to substrate；
Thin copper layer is etched using etching solution, dry film is removed；
First line figure and the second line pattern laminated bonding internal layer prepreg and outer copper foil.
4. high aligning accuracy according to claim 1 buries method for manufacturing circuit board, which is characterized in that form described first
When positioning through hole, the center of the target pad is positioned by x-ray, and is shaped by drilling.
5. high aligning accuracy according to claim 4 buries method for manufacturing circuit board, which is characterized in that the target pad
Diameter range be 1~4.5mm.
6. high aligning accuracy according to claim 3 buries method for manufacturing circuit board, which is characterized in that form the blind hole
Specific step is as follows:
It is positioned by first positioning through hole, dry film exposes, etches the windowing on thin copper layer；
Laser drill forms the blind hole to the first line figure and the second line pattern at the windowing.
7. high aligning accuracy according to claim 1 buries method for manufacturing circuit board, which is characterized in that form the circuit
The step of figure, is as follows:
Conductive layer is formed in the blind hole by heavy copper；
Dry film exposes on the electrically conductive, and graphic plating forms the circuitous pattern.
8. high aligning accuracy according to claim 1 buries method for manufacturing circuit board, which is characterized in that first positioning
Through-hole determines through-hole coaxial arrangement with described second.
9. high aligning accuracy according to claim 8 buries method for manufacturing circuit board, which is characterized in that first positioning
The diameter of through-hole is 1~2.5mm.
10. high aligning accuracy according to claim 8 buries method for manufacturing circuit board, which is characterized in that described second is fixed
The diameter of position through-hole is 4.5~8.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510823613.XA CN105491818B (en) | 2015-11-23 | 2015-11-23 | High aligning accuracy buries method for manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510823613.XA CN105491818B (en) | 2015-11-23 | 2015-11-23 | High aligning accuracy buries method for manufacturing circuit board |
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| Publication Number | Publication Date |
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| CN105491818A CN105491818A (en) | 2016-04-13 |
| CN105491818B true CN105491818B (en) | 2018-12-28 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109561596A (en) * | 2018-10-17 | 2019-04-02 | 欣强电子（清远）有限公司 | A kind of choosingization dry film, the fool proof tooling for selecting allelopathic gloss oil |
| CN113225938B (en) * | 2021-03-25 | 2022-12-09 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing thermoelectric separation circuit board |
| CN115023033B (en) * | 2021-09-18 | 2023-06-06 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
| TWI809666B (en) * | 2022-01-18 | 2023-07-21 | 大陸商芯愛科技（南京）有限公司 | Package substrate and manufacturing method thereof |
| CN114900962A (en) * | 2022-04-18 | 2022-08-12 | 广州广芯封装基板有限公司 | Printed circuit board and layer adding method thereof |
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| CN102711382A (en) * | 2012-06-14 | 2012-10-03 | 广州美维电子有限公司 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
| CN103501579A (en) * | 2013-09-29 | 2014-01-08 | 胜华电子（惠阳）有限公司 | Circuit board aligning method |
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101236943B (en) * | 2007-02-01 | 2010-04-21 | 日月光半导体制造股份有限公司 | Heat-radiation no-chip board film base plate with built-in chip and its making method |
| KR101055473B1 (en) * | 2009-12-15 | 2011-08-08 | 삼성전기주식회사 | Carrier member for substrate manufacturing and method for manufacturing substrate using same |
| CN104244597B (en) * | 2014-09-22 | 2017-06-30 | 华进半导体封装先导技术研发中心有限公司 | A kind of preparation method of the coreless substrate of symmetrical structure |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711382A (en) * | 2012-06-14 | 2012-10-03 | 广州美维电子有限公司 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
| CN103501579A (en) * | 2013-09-29 | 2014-01-08 | 胜华电子（惠阳）有限公司 | Circuit board aligning method |
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| CN105491818A (en) | 2016-04-13 |
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