CN104816098A - Technological method for machining second-order blind holes through UV laser - Google Patents
Technological method for machining second-order blind holes through UV laser Download PDFInfo
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- CN104816098A CN104816098A CN201510131783.1A CN201510131783A CN104816098A CN 104816098 A CN104816098 A CN 104816098A CN 201510131783 A CN201510131783 A CN 201510131783A CN 104816098 A CN104816098 A CN 104816098A
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- laser
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- blind holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention discloses a technological method for machining second-order blind holes through UV laser. The method comprises the following steps that A, the smoothness of a drilling platform is adjusted, and a printed circuit board required to be machined is placed on a machining table and is kept flat; B, the UV laser power is arranged to 1.5 W to 12 W, the machining speed is arranged to 80 mm/s to 150 mm/s, and the laser frequency is arranged to 50 KHZ to 90 KHZ; and C, a two-layer method or a three-layer method is adopted for blind hole manufacturing. The technological method for machining the second-order blind holes through the UV laser is simple in process and high in efficiency. Inner layer MARK points are adopted by the UV laser blind holes for alignment, and the second-order blind holes are machined at one time; deviation cannot happen to the position between the overlaid blind holes; and alignment of an outer-layer circuit is better in operation, and the product yield is improved. The shape of the blind holes can be adjusted directly through the UV laser, and is adjusted to the optimum; and electroplating and hole filling difficulties can be greatly reduced, and the product quality is improved.
Description
Technical field
The present invention relates to printed circuit board laser blind hole and make field, refer to a kind of process of UV Laser Processing second-order blind holes especially.
Background technology
" UV+CO2 " of the prior art technique make second-order blind holes be exactly with UV laser drill removing blind hole position ground floor copper, L1-L2 interlayer resin and second layer copper, then with CO2 laser drill removing L2-L3 interlayer resin, thus a complete second order laser blind hole is obtained.This process uses 8 Making programme, and cost-effective rate is low.There will be the risk of lateral erosion during etching L2 layer, lateral erosion can affect blind hole plating, causes the crack problem of blind hole.There is twice contraposition processing blind hole in UV laser and CO2 laser, second-order blind holes exists off normal.After CO2 laser blind hole, at the bottom of hole and hole wall need de-smear, de-smear affects blind hole electroplating quality.Increase manufacturer's equipment investment, Product processing cost is high, is not suitable for producing in enormous quantities.
Summary of the invention
An object of the present invention is the process proposing a kind of UV Laser Processing second-order blind holes, solve second-order blind holes processing technology of the prior art complicated, product yield is low, and blind hole is folded between hole the problems such as deviation.
Technical scheme of the present invention is achieved in that a kind of process of UV Laser Processing second-order blind holes, comprises the following steps:
A) adjusting the planarization of drilling platform, by needing the printed wiring board of processing to be positioned in machine table, keeping smooth;
B) arranging UV laser power is 1.5-12W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ.
C) two-layer method or three-layer process is adopted to carry out blind hole making.
Preferably, when adopting two-layer method to carry out blind hole making, the UV laser power of ground floor laser is 5-12W, and arranging process velocity is 90-150mm/s, and arranging laser frequency is 60-90KHZ; The UV laser power of second layer laser is 1.5-5W, and arranging process velocity is 80-100mm/s, and arranging laser frequency is 50-70KHZ.
Preferably, when adopting two-layer method to carry out blind hole making, the UV laser power of ground floor laser is 1.5-3W, and arranging process velocity is 50-100mm/s, and arranging laser frequency is 50-70KHZ; The UV laser power of second layer laser is 6-12W, and arranging process velocity is 100-150mm/s, and arranging laser frequency is 70-90KHZ.
Preferably, when adopting two-layer method to carry out blind hole making, the UV laser power of ground floor laser is 1.5-3W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ; The UV laser power of second layer laser is 6-12W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ.
Preferably, when adopting three-layer process to carry out blind hole making, the UV laser power of ground floor laser is 5-12W, and arranging process velocity is 90-150mm/s, and arranging laser frequency is 60-90KHZ; The UV laser power of second layer laser is 1.5-5W, and arranging process velocity is 80-100mm/s, and arranging laser frequency is 50-70KHZ; The UV laser power of third layer laser is 1.5-5W, and arranging process velocity is 80-100mm/s, and arranging laser frequency is 50-70KHZ.
Preferably, when adopting three-layer process to carry out blind hole making, the UV laser power of ground floor laser is 1.5-3W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ; The UV laser power of second layer laser is 6-12W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ; The UV laser power of third layer laser is 1.5-3W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ.
Preferably, the thickness of the ground floor copper of described printed wiring board is 16-22 micron; The thickness of second layer copper is 16-22 micron; Resin thickness between described ground floor copper and described second layer copper is 65-95 micron.
Preferably, adopt two layers of method or three-layer process to make in the process of blind hole and adopt the contraposition of MARK point counter-point.Beneficial effect of the present invention is: the process flow process of UV Laser Processing second-order blind holes of the present invention is simple, and efficiency is high.UV laser blind hole adopts the contraposition of internal layer MARK point, second-order blind holes time processing, and blind hole is folded between hole and do not had deviation, and outer-layer circuit contraposition better operates, and product yield promotes.Blind hole hole shape can directly be adjusted by UV laser, and hole shape adjusts to the difficulty that the best can reduce plating and filling perforation greatly, improves product quality.Its principle of UV laser blind hole utilizes the ultraviolet photochemical erosion reaction destruction material molecule chain that splits to become blind hole, originally melting glue slag can not be adhered at hole base compared with carbon dioxide laser blind hole, this is at the bottom of rear operation hole and hole wall clean less demanding, the easy management and control of quality.
Detailed description of the invention
For understanding the present invention better; below by following examples, elaboration concrete is further done to the present invention; but unintelligible is limitation of the invention; for some nonessential improvement and adjustment that those skilled in the art does according to foregoing invention content, be also considered as dropping in protection scope of the present invention.
Embodiment 1
Inventor is according to content provided by the invention, and UV laser carries out second-order blind holes processing to printed circuit board (PCB) 1, and the thickness of described printed circuit board (PCB) 1 ground floor copper is 16 microns; The thickness of second layer copper is 16 microns; Resin thickness between described ground floor copper and described second layer copper is 65 microns; Concrete procedure of processing is as follows:
The planarization of adjustment drilling platform, by needing the printed wiring board of processing to be positioned in machine table, keeps smooth;
Arranging UV laser power is 5-12W, and arranging process velocity is 90-150mm/s, and arranging laser frequency is 60-90KHZ; Carry out ground floor Laser Processing;
Arranging UV laser power is 1.5-5W, and arranging process velocity is 80-100mm/s, and arranging laser frequency is 50-70KHZ; The contraposition of MARK point counter-point, carries out second layer Laser Processing, processes second-order blind holes 1.
Embodiment 2
Inventor is according to content provided by the invention, and UV laser carries out second-order blind holes processing to printed circuit board (PCB) 2, and the thickness of the ground floor copper of described printed wiring board is 22 microns; The thickness of second layer copper is 22 microns; Resin thickness between described ground floor copper and described second layer copper is 95 microns; Concrete procedure of processing is as follows:
The planarization of adjustment drilling platform, by needing the printed wiring board of processing to be positioned in machine table, keeps smooth;
Arranging UV laser power is 1.5-3W, and arranging process velocity is 50-100mm/s, and arranging laser frequency is 50-70KHZ; Carry out ground floor Laser Processing;
Arranging UV laser power is 6-12W, and arranging process velocity is 100-150mm/s, and arranging laser frequency is 70-90KHZ; The contraposition of MARK point counter-point, carries out second layer Laser Processing, processes second-order blind holes 2.
Embodiment 3
Inventor is according to content provided by the invention, and UV laser carries out second-order blind holes processing to printed circuit board (PCB) 3, and the thickness of the ground floor copper of described printed wiring board is 20 microns; The thickness of second layer copper is 20 microns; Resin thickness between described ground floor copper and described second layer copper is 80 microns.
Arranging UV laser power is 5-12W, and arranging process velocity is 90-150mm/s, and arranging laser frequency is 60-90KHZ; Carry out ground floor Laser Processing;
Arranging UV laser power is 1.5-5W, and arranging process velocity is 80-100mm/s, and arranging laser frequency is 50-70KHZ; Adopt the contraposition of MARK point counter-point; Second layer Laser Processing;
Arranging UV laser power is 1.5-5W, and arranging process velocity is 80-100mm/s, and arranging laser frequency is 50-70KHZ; Adopt the contraposition of MARK point counter-point, third layer Laser Processing, processes second-order blind holes 3.
The process flow process of UV Laser Processing second-order blind holes of the present invention is simple, and efficiency is high.UV laser blind hole adopts the contraposition of internal layer MARK point, second-order blind holes time processing, and all do not have deviation between the folded hole of second-order blind holes 1, second-order blind holes 2, second-order blind holes 3, outer-layer circuit contraposition better operates, and product yield promotes.Blind hole hole shape can directly be adjusted by UV laser, and hole shape adjusts to the difficulty that the best can reduce plating and filling perforation greatly, improves product quality.Its principle of UV laser blind hole utilizes the ultraviolet photochemical erosion reaction destruction material molecule chain that splits to become blind hole, originally melting glue slag can not be adhered at hole base compared with carbon dioxide laser blind hole, this is at the bottom of rear operation hole and hole wall clean less demanding, the easy management and control of quality.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a process for UV Laser Processing second-order blind holes, is characterized in that comprising the following steps:
A) adjusting the planarization of drilling platform, by needing the printed wiring board of processing to be positioned in machine table, keeping smooth;
B) arranging UV laser power is 1.5-12W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ.
C) two-layer method or three-layer process is adopted to carry out blind hole making.
2. the process of UV Laser Processing second-order blind holes as claimed in claim 1, it is characterized in that: when adopting two-layer method to carry out blind hole making, the UV laser power of ground floor laser is 5-12W, and arranging process velocity is 90-150mm/s, and arranging laser frequency is 60-90KHZ; The UV laser power of second layer laser is 1.5-5W, and arranging process velocity is 80-100mm/s, and arranging laser frequency is 50-70KHZ.
3. the process of UV Laser Processing second-order blind holes as claimed in claim 1, it is characterized in that: when adopting two-layer method to carry out blind hole making, the UV laser power of ground floor laser is 1.5-3W, and arranging process velocity is 50-100mm/s, and arranging laser frequency is 50-70KHZ; The UV laser power of second layer laser is 6-12W, and arranging process velocity is 100-150mm/s, and arranging laser frequency is 70-90KHZ.
4. the process of UV Laser Processing second-order blind holes as claimed in claim 1, it is characterized in that: when adopting two-layer method to carry out blind hole making, the UV laser power of ground floor laser is 1.5-3W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ; The UV laser power of second layer laser is 6-12W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ.
5. the process of UV Laser Processing second-order blind holes as claimed in claim 1, it is characterized in that: when adopting three-layer process to carry out blind hole making, the UV laser power of ground floor laser is 5-12W, and arranging process velocity is 90-150mm/s, and arranging laser frequency is 60-90KHZ; The UV laser power of second layer laser is 1.5-5W, and arranging process velocity is 80-100mm/s, and arranging laser frequency is 50-70KHZ; The UV laser power of third layer laser is 1.5-5W, and arranging process velocity is 80-100mm/s, and arranging laser frequency is 50-70KHZ.
6. the process of UV Laser Processing second-order blind holes as claimed in claim 1, it is characterized in that: when adopting three-layer process to carry out blind hole making, the UV laser power of ground floor laser is 1.5-3W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ; The UV laser power of second layer laser is 6-12W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ; The UV laser power of third layer laser is 1.5-3W, and arranging process velocity is 80-150mm/s, and arranging laser frequency is 50-90KHZ.
7. the process of the UV Laser Processing second-order blind holes as described in as arbitrary in claim 1-6, is characterized in that: the thickness of the ground floor copper of described printed wiring board is 16-22 micron; The thickness of second layer copper is 16-22 micron; Resin thickness between described ground floor copper and described second layer copper is 65-95 micron.
8. the process of the UV Laser Processing second-order blind holes as described in as arbitrary in claim 1-6, is characterized in that: adopt two layers of method or three-layer process to make in the process of blind hole and adopt the contraposition of MARK point counter-point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510131783.1A CN104816098A (en) | 2015-03-24 | 2015-03-24 | Technological method for machining second-order blind holes through UV laser |
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| CN201510131783.1A CN104816098A (en) | 2015-03-24 | 2015-03-24 | Technological method for machining second-order blind holes through UV laser |
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| CN201510131783.1A Pending CN104816098A (en) | 2015-03-24 | 2015-03-24 | Technological method for machining second-order blind holes through UV laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799541A (en) * | 2021-01-19 | 2022-07-29 | 深圳市大族数控科技股份有限公司 | Multi-axis micro blind hole machining method and system based on ultrafast laser |
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| CN101080146A (en) * | 2006-05-24 | 2007-11-28 | 富葵精密组件(深圳)有限公司 | A method for making L2 blind hole of high-density interconnection circuit board |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
| CN101820731A (en) * | 2009-12-31 | 2010-09-01 | 昆山市正业电子有限公司 | Method for processing blind hole with ultraviolet laser |
| CN101959373A (en) * | 2009-07-17 | 2011-01-26 | 北大方正集团有限公司 | Method for improving blind hole alignment of printed circuit board |
| KR20110051442A (en) * | 2009-11-10 | 2011-05-18 | 가부시기가이샤 디스코 | Laser machining method, laser machining apparatus and chip manufacturing method |
| CN101372071B (en) * | 2008-09-12 | 2011-06-08 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN102711382A (en) * | 2012-06-14 | 2012-10-03 | 广州美维电子有限公司 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
| CN103974562A (en) * | 2013-01-31 | 2014-08-06 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
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2015
- 2015-03-24 CN CN201510131783.1A patent/CN104816098A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101080146A (en) * | 2006-05-24 | 2007-11-28 | 富葵精密组件(深圳)有限公司 | A method for making L2 blind hole of high-density interconnection circuit board |
| CN101372071B (en) * | 2008-09-12 | 2011-06-08 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
| CN101959373A (en) * | 2009-07-17 | 2011-01-26 | 北大方正集团有限公司 | Method for improving blind hole alignment of printed circuit board |
| KR20110051442A (en) * | 2009-11-10 | 2011-05-18 | 가부시기가이샤 디스코 | Laser machining method, laser machining apparatus and chip manufacturing method |
| CN101820731A (en) * | 2009-12-31 | 2010-09-01 | 昆山市正业电子有限公司 | Method for processing blind hole with ultraviolet laser |
| CN102711382A (en) * | 2012-06-14 | 2012-10-03 | 广州美维电子有限公司 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
| CN103974562A (en) * | 2013-01-31 | 2014-08-06 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799541A (en) * | 2021-01-19 | 2022-07-29 | 深圳市大族数控科技股份有限公司 | Multi-axis micro blind hole machining method and system based on ultrafast laser |
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Application publication date: 20150805 |
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