CN114885504A - Micro blind hole laser alignment method and system - Google Patents
Micro blind hole laser alignment method and system Download PDFInfo
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- CN114885504A CN114885504A CN202210518223.1A CN202210518223A CN114885504A CN 114885504 A CN114885504 A CN 114885504A CN 202210518223 A CN202210518223 A CN 202210518223A CN 114885504 A CN114885504 A CN 114885504A
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- laser
- blind hole
- blind
- medium layer
- alignment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser alignment method and a laser alignment system for a micro blind hole, wherein the method comprises the following steps: removing surface copper and a first resin medium layer with a first set thickness on an inner layer alignment target of the printed board through a laser machine, wherein a second resin medium layer with a second set thickness is covered on the alignment target; grabbing the position of the alignment target by an exposure machine according to the second resin medium layer and manufacturing a blind hole opening image; and according to the blind hole opening image, ablating the second resin medium layer through a laser machine to obtain a blind hole consistent with the blind hole opening image. According to the invention, when the blind hole opening image is manufactured, the alignment is carried out according to the position of the alignment target, so that the blind hole opening image is manufactured, and the accurate positioning of the blind hole is realized; meanwhile, after the development of the blind holes, the holes are formed on the second resin medium layer only through small-energy ablation, the hole diameter of the blind holes is not enlarged, and the quality of the blind holes is ensured.
Description
Technical Field
The invention relates to the technical field of printed boards, in particular to a micro blind hole laser alignment method and system.
Background
With the development trend of electronic products towards small volume and high performance, the blind holes of the PCB are designed to be smaller and smaller, when the blind holes are very small, the quality of the formed holes is high, the position accuracy of the formed holes is high, the holes are very difficult, and the same problems exist in the SIP and heterogeneous integration.
Through a conventional LDD laser direct pore-forming method, the manufactured blind hole has high position precision but poor quality; the method is mainly characterized in that although the surface copper and the dielectric layer on the alignment target are firstly ablated by the LDD process during laser, the alignment Pad on the lower layer graph is identified, and the alignment consistency of the laser and the lower layer graph is realized, namely the laser and the lower layer graph are the same alignment system; however, the laser machine uses a large spot with high energy to ablate 3-6um of surface copper, and then uses low energy to ablate the resin dielectric layer below the surface copper to form a blind hole, the high-heat thermal ablation effect during surface copper ablation also affects the resin dielectric layer below the surface copper around the opening of the blind hole, and a relatively large gap or excessive resin damage is generated between the surface copper and the resin dielectric layer around the opening of the blind hole. On one hand, even if the opening size of the blind hole of the surface copper meets the requirement, the actual size of the resin hole wall at the opening of the blind hole actually exceeds the specification requirement; on the other hand, the gaps between the base copper and the resin, which are too large, at the periphery of the opening of the blind hole influence the copper deposition electroplating and the reliability of the blind hole. Therefore, although the LDD hole forming process can realize accurate alignment of laser and lower layer patterns, the laser with high heat quantity is difficult to obtain the required blind hole size and good blind hole quality, so that the size of the manufactured blind hole is not required or the quality of the blind hole is poor.
Another blind hole alignment method is to adopt a CFM (mask hole forming) process, firstly, a blind hole opening graph is manufactured through an exposure machine, then surface copper at the blind hole opening is etched, the surface copper is not required to be ablated during laser, resin can be directly ablated by small energy, and a micro blind hole with better quality is formed.
Disclosure of Invention
In view of the above technical problems, an object of the present invention is to provide a laser alignment method and system for micro blind vias, which solve the problems that the size of the blind via manufactured by the conventional blind via alignment method is not satisfactory, or the quality of the blind via is poor, or the blind via cannot be accurately positioned.
The invention adopts the following technical scheme:
a laser alignment method for micro blind holes comprises the following steps:
removing surface copper and a first resin medium layer with a first set thickness on an inner layer alignment target of the printed board through a laser machine, wherein a second resin medium layer with a second set thickness is covered on the alignment target;
grabbing the position of the alignment target by an exposure machine according to the second resin medium layer and manufacturing a blind hole opening image;
and according to the blind hole opening image, ablating a second resin medium layer through a laser machine to obtain a blind hole consistent with the blind hole opening image.
Optionally, when the second resin medium layer is ablated by the laser machine, the laser energy emitted by the laser machine does not ablate the surface copper around the second resin medium layer.
Optionally, the laser machine is an ultraviolet laser machine, and the laser wavelength emitted by the laser machine is 355 nm.
Optionally, the diameter of the blind hole is smaller than 50 um.
Optionally, the grabbing the position of the alignment target and manufacturing a blind hole opening image by an exposure machine according to the second resin medium layer includes: and aligning the alignment target through the second resin medium layer, attaching a dry film at the position of the alignment target, and developing an opening image of the blind hole.
Optionally, after the step of developing the image of the opening of the blind hole, the method further includes: and cleaning and drying the dry film residue at the blind hole.
A micro blind hole laser alignment system comprises a laser machine and an exposure machine;
the laser machine is used for removing surface copper and a first resin medium layer with a first set thickness on an inner layer alignment target of the printed board, and a second resin medium layer with a second set thickness is covered on the alignment target;
the exposure machine is used for grabbing the position of the alignment target and manufacturing a blind hole opening image according to the second resin medium layer; and according to the blind hole opening image, ablating a second resin medium layer to obtain a blind hole consistent with the blind hole opening image.
Optionally, when the second resin medium layer is ablated by laser energy emitted by the laser machine, the surface copper around the second resin medium layer is not ablated.
Optionally, the laser machine is an ultraviolet laser machine, and the laser wavelength emitted by the laser machine is 355 nm.
Optionally, the diameter of the blind hole is smaller than 50 um.
Compared with the prior art, the invention has the beneficial effects that:
according to the micro blind hole laser alignment method, surface copper and a first resin medium layer with a first set thickness on an inner layer alignment target of a printed board are removed through a laser machine, and a second resin medium layer with a second set thickness is covered on the alignment target; grabbing the position of the alignment target by an exposure machine according to the second resin medium layer and manufacturing a blind hole opening image; according to the blind hole opening image, a second resin medium layer is ablated through a laser machine, and a blind hole consistent with the blind hole opening image is obtained; when the blind hole opening image is manufactured, the alignment is carried out according to the position of the alignment target, the blind hole opening image is manufactured, and the accurate positioning of the blind hole is realized; meanwhile, after the blind hole is developed, the hole is formed only by small-energy ablation on the second resin medium layer, and the copper surface around the alignment target cannot be ablated due to the small-energy ablation, so that the aperture of the blind hole is not enlarged, the size requirement of the aperture of the blind hole can be met, and the quality of the blind hole is ensured.
Drawings
Fig. 1 is a schematic flow chart of a laser alignment method for micro blind holes according to an embodiment of the present invention;
fig. 2 is a schematic view of a printed board used in a laser alignment method for blind micro-vias according to an embodiment of the present invention, where 1, alignment targets.
Detailed Description
The present invention is further described with reference to the accompanying drawings and the detailed description, and it should be noted that, in the premise of no conflict, the following described embodiments or technical features may be arbitrarily combined to form a new embodiment:
the first embodiment is as follows:
the invention is explained below by the technical names:
blind hole: the through holes connecting the surface layer and the inner layer do not penetrate through the holes of the whole plate.
Micropore: in printed circuit boards, holes having a diameter of less than 6 millimeters (150 micrometers) are referred to as microvias.
An exposure machine: refers to a machine that transfers image information on a film or other transparent body to a surface coated with a photosensitive material by turning on a lamp to emit ultraviolet rays having a UVA wavelength.
The laser machine uses laser beam to etch or mark on the surface of various materials. The specific principle is that deep substances are exposed through evaporation of surface substances, so that holes or patterns and the like are carved.
Referring to fig. 1 and 2, fig. 1 shows a laser alignment method for blind via holes, and fig. 2 shows a schematic diagram of a printed board used in the laser alignment method for blind via holes, the laser alignment method for blind via holes includes the following steps:
step S1, removing surface copper and a first resin medium layer with a first set thickness on an inner layer alignment target 1 of the printed board through a laser machine, wherein a second resin medium layer with a second set thickness covers the alignment target 1;
in this embodiment, the laser machine is an ultraviolet laser machine, and the laser wavelength emitted by the laser machine is 355 nm.
In the implementation process, the surface copper on the inner layer alignment target 1 of the plate and the first resin medium layer with the first set thickness are removed by adopting an ultraviolet laser machine, and before the surface copper on the inner layer alignment target 1 of the plate and the first resin medium layer with the first set thickness are removed, the surface of the printed plate does not need to be subjected to laser pretreatment (browning), and the surface copper layer can be directly ablated.
Step S2, grabbing the position of the alignment target 1 through an exposure machine according to the second resin medium layer and manufacturing a blind hole opening image;
optionally, the grabbing the position of the alignment target 1 and manufacturing a blind hole opening image by an exposure machine according to the second resin medium layer includes: and aligning the second resin medium layer to the alignment target 1, attaching a dry film at the position of the alignment target 1, and developing an opening image of the blind hole.
Optionally, after the step of developing the image of the opening of the blind hole, the method further includes: and cleaning and drying the dry film residue at the blind hole.
And step S3, according to the blind hole opening image, a second resin medium layer is ablated through a laser machine, and a blind hole consistent with the blind hole opening image is obtained.
In this embodiment, when the second resin dielectric layer is ablated by the laser machine, the laser energy emitted by the laser machine does not ablate the surface copper around the second resin dielectric layer.
In this embodiment, the diameter of the blind hole is less than 50 um.
In the prior art, the manufacturing of micro blind holes with the diameter of less than 50um has a bottleneck, and mainly reflects two aspects of sub blind hole position precision and blind hole quality. The copper surface is directly ablated by laser through an LDD (laser direct hole forming process), the aperture of the blind hole is large, the quality of the blind hole is poor, and the requirements of the micro blind hole process are not met; the blind holes are easy to deviate through CFM hole forming (mask hole forming process), and the alignment precision is poor.
In this embodiment, the surface copper and the resin medium layer with a certain thickness at the position of the plate alignment target 1 are removed, the medium layer with a certain thickness is retained, and the alignment target 1 on the lower layer can be seen through the residual medium layer; in the CFM mask manufacturing process, the LDI exposure machine captures a lower layer alignment target 1Pad through a residual dielectric layer to perform alignment, and a micro blind hole opening graph is manufactured so as to accurately position the position of a micro blind hole and the size of the micro blind hole opening; then, in the laser process, the laser machine still grabs the lower layer of alignment target 1Pad for alignment, and ablates the resin medium layer at the opening position of the micro blind hole, so that the precise positioning and high-quality hole forming of the micro blind hole are realized.
The following is a detailed comparison of the conventional process flow and the process flow of the method of the present invention, as shown in the following table:
1) the traditional process flow is as follows: the LDD (laser direct via) alignment specification is shown in table 1:
table 1: LDD (laser direct hole forming process) alignment description
The laser direct reference lower layer figure is used for alignment, the blind hole position precision is high, the laser directly ablates a copper surface, the blind hole aperture is large, the quality of the blind hole is poor, and the micro blind hole process requirement is not met.
2) The traditional process flow is as follows: the CFM via formation (mask via formation process) alignment specification is shown in Table 2:
table 2: CFM pore-forming (mask pore-forming process) alignment description
The alignment method process of the CFM pore-forming (mask pore-forming process) has the advantages that surface copper at the opening of the blind hole is removed in advance, then the laser machine can drill holes on the resin medium layer with small energy, the quality of the blind hole is good, but the defects are obvious, the blind hole is easy to deviate, and the alignment accuracy is poor.
3) According to the laser alignment method, a UV laser machine is used for cutting off surface copper on an alignment Pad, then a blind hole opening pattern is formed, and alignment instructions are shown in a table 3:
table 3: laser alignment description of the invention
According to the invention, the added process is simple in process flow, only aiming at the lower layer para-position Pad processing, the time consumption is short, the cost increase is less, and compared with the realization of a micro blind hole process, the increased processing time consumption and cost are very little. Moreover, the alignment method disclosed by the invention integrates the advantages of LDD (laser induced deposition) hole forming and CFM (circulating fluid bed) hole forming processes, avoids the defects of the two processes through a new alignment method, and well meets the position precision and the blind hole quality of the micro blind hole.
In the implementation process, the laser alignment method for the micro blind holes, disclosed by the invention, is used for performing alignment according to the position of the alignment target 1 when the blind hole opening image is manufactured, so that the blind hole opening image is manufactured, and the blind holes are accurately positioned; meanwhile, after the blind hole is developed, the hole is formed on the second resin medium layer only through small-energy ablation, and the copper surface around the alignment target 1 cannot be ablated due to the small-energy ablation, so that the aperture of the blind hole is not enlarged, and the quality of the blind hole is ensured.
The second embodiment:
the invention discloses a micro blind hole laser alignment system, which comprises a laser machine and an exposure machine;
the laser machine is used for removing surface copper and a first resin medium layer with a first set thickness on an inner layer alignment target 1 of the printed board, and a second resin medium layer with a second set thickness covers the alignment target 1;
the exposure machine is used for grabbing the position of the alignment target 1 according to the second resin medium layer and manufacturing a blind hole opening image; and according to the blind hole opening image, ablating a second resin medium layer to obtain a blind hole consistent with the blind hole opening image.
Optionally, when the second resin medium layer is ablated by laser energy emitted by the laser machine, the surface copper around the second resin medium layer is not ablated.
Optionally, the laser machine is an ultraviolet laser machine, and the laser wavelength emitted by the laser machine is 355 nm.
Optionally, the diameter of the blind hole is smaller than 50 um.
Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the scope of the claims of the present invention.
Claims (10)
1. A laser alignment method for micro blind holes is characterized by comprising the following steps:
removing surface copper and a first resin medium layer with a first set thickness on an inner layer alignment target of the printed board through a laser machine, wherein a second resin medium layer with a second set thickness is covered on the alignment target;
grabbing the position of the alignment target by an exposure machine according to the second resin medium layer and manufacturing a blind hole opening image;
and according to the blind hole opening image, ablating the second resin medium layer through a laser machine to obtain a blind hole consistent with the blind hole opening image.
2. The laser alignment method for micro blind holes of claim 1, wherein when the second resin medium layer is ablated by the laser machine, the laser machine emits laser energy that does not ablate the surface copper around the second resin medium layer.
3. The laser alignment method for micro blind holes of claim 1, wherein the laser machine is an ultraviolet laser machine, and the laser wavelength emitted by the laser machine is 355 nm.
4. The laser alignment method for blind micro-vias of claim 1, wherein the diameter of the blind micro-vias is smaller than 50 um.
5. The laser alignment method for micro blind holes according to claim 1, wherein the grabbing the alignment target position and producing the blind hole opening image by an exposure machine according to the second resin medium layer comprises: and aligning the alignment target through the second resin medium layer, attaching a dry film at the position of the alignment target, and developing an opening image of the blind hole.
6. The laser alignment method for blind micro-vias of claim 5, wherein after the step of developing the image of the opening of the blind via, the laser alignment method further comprises: and cleaning and drying the dry film residue at the blind hole.
7. A laser alignment system for micro blind holes is characterized by comprising a laser machine and an exposure machine;
the laser machine is used for removing surface copper and a first resin medium layer with a first set thickness on an inner layer alignment target of the printed board, and a second resin medium layer with a second set thickness is covered on the alignment target;
the exposure machine is used for grabbing the position of the alignment target and manufacturing a blind hole opening image according to the second resin medium layer; and according to the blind hole opening image, ablating a second resin medium layer through a laser machine to obtain a blind hole consistent with the blind hole opening image.
8. The laser alignment system for blind micro-vias of claim 7, wherein the laser machine emits laser energy that does not ablate the surface copper around the second resin dielectric layer while ablating the second resin dielectric layer.
9. The laser alignment system for micro blind holes of claim 7, wherein the laser machine is an ultraviolet laser machine, and the laser wavelength emitted by the laser machine is 355 nm.
10. The laser alignment system for blind micro-holes of claim 7, wherein the diameter of said blind holes is smaller than 50 um.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210518223.1A CN114885504A (en) | 2022-05-12 | 2022-05-12 | Micro blind hole laser alignment method and system |
| PCT/CN2022/095520 WO2023216334A1 (en) | 2022-05-12 | 2022-05-27 | Laser alignment method and system for micro-blind holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210518223.1A CN114885504A (en) | 2022-05-12 | 2022-05-12 | Micro blind hole laser alignment method and system |
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| Publication Number | Publication Date |
|---|---|
| CN114885504A true CN114885504A (en) | 2022-08-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210518223.1A Pending CN114885504A (en) | 2022-05-12 | 2022-05-12 | Micro blind hole laser alignment method and system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114885504A (en) |
| WO (1) | WO2023216334A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135910A (en) * | 1999-11-04 | 2001-05-18 | Mitsubishi Gas Chem Co Inc | Boring method for copper-plated multilayer board with carbon dioxide laser |
| JP2001230518A (en) * | 2000-02-16 | 2001-08-24 | Mitsubishi Gas Chem Co Inc | Method for forming hole by using carbon dioxide gas laser and its post-treatment method |
| TW200614891A (en) * | 2005-10-20 | 2006-05-01 | Hushi Electronic Kunsuan Co Ltd | Direct carbon dioxide laser drilling method |
| CN102711382B (en) * | 2012-06-14 | 2015-02-25 | 广州美维电子有限公司 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
| CN102695375B (en) * | 2012-06-14 | 2015-05-20 | 广州美维电子有限公司 | Method for processing 2mil micro via |
| CN104244589B (en) * | 2014-05-23 | 2017-06-13 | 胜宏科技（惠州）股份有限公司 | A kind of method of raising HDI wiring board exposure accuracies |
| CN106341961B (en) * | 2016-09-12 | 2019-04-16 | 深圳市景旺电子股份有限公司 | High density interconnected printed circuit board and the method for improving blind hole and pattern alignment degree |
| CN106376186B (en) * | 2016-09-12 | 2019-01-25 | 深圳市景旺电子股份有限公司 | A kind of production method for interconnecting PCB and its improving blind hole and line layer Aligning degree |
-
2022
- 2022-05-12 CN CN202210518223.1A patent/CN114885504A/en active Pending
- 2022-05-27 WO PCT/CN2022/095520 patent/WO2023216334A1/en unknown
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| WO2023216334A1 (en) | 2023-11-16 |
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