CN106735387A - Multiple-plate boring method - Google Patents
Multiple-plate boring method Download PDFInfo
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- CN106735387A CN106735387A CN201611226690.8A CN201611226690A CN106735387A CN 106735387 A CN106735387 A CN 106735387A CN 201611226690 A CN201611226690 A CN 201611226690A CN 106735387 A CN106735387 A CN 106735387A
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- Prior art keywords
- hole
- diameter
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- layer sheet
- pad
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention discloses a kind of multiple-plate boring method, and the multi-layer sheet includes pad, and the multi-layer sheet is provided with default drilling region, comprises the following steps：It is determined that default drilling region；Etch Wu Tongqu on the pad, it is described without copper area in the default drilling region；The first hole is bored on the multi-layer sheet, first hole is in the default drilling region；The second hole is bored on the multi-layer sheet, second hole is not at least part of Chong Die with first hole, and second hole is in the default drilling region.Multiple-plate boring method that the present invention is provided can effectively solve the problems, such as pad drawing crack during drilling.
Description
Technical field
The present invention relates to board production processing technique field, more particularly to a kind of multiple-plate boring method.
Background technology
The development of industry, market are produced and processed with printed circuit board (PCB) (Printed Circuit Board, abbreviation PCB)
, weldering shallow bid multiple-plate demand thick to copper coin is increasing.And in multiple-plate process, because copper coin thickeies it
Afterwards, when being drilled perpendicular to copper coin, the pulling force increase that drill bit is produced to pad, and after pad diminishes, its tensile strength declines,
So often occurring causing the problem of pad drawing crack due to drilling in multiple-plate production process, product rejection is caused.
Peel strength, the increasing for causing the method for pad drawing crack mainly to include increasing material because of drilling are solved the problems, such as at present
Big pad radius, reduction drilling terminal-velocity etc., but effect is not apparent.The space being improved in terms of material is smaller,
Difficulty is larger；Increasing pad radius can change the original design requirement of product, and often client can not receive；And reduce falling for drilling
Speed influences whether the processing efficiency of PCB, nor a good method.
So being badly in need of a kind of boring method at present to solve the problems, such as multiple-plate pad drawing crack.
The content of the invention
It is an object of the present invention to：A kind of multiple-plate boring method is provided, to solve pad drawing crack during drilling
Problem.
It is that, up to this purpose, the present invention uses following technical scheme：
A kind of multiple-plate boring method, the multi-layer sheet includes pad, and the multi-layer sheet is provided with default drilling region,
Comprise the following steps：
S10：It is determined that default drilling region；
S20：Etch Wu Tongqu on the pad, it is described without copper area in the default drilling region；
S30：The first hole is bored on the multi-layer sheet, first hole is in the default drilling region；
S40：The second hole is bored on the multi-layer sheet, second hole is not at least part of Chong Die with first hole,
And second hole is in the default drilling region.
Specifically, as long as Wu Tongqu, the first hole and the second hole are located at default drilling region, Wu Tongqu, the first hole and
The axis in the second hole can be with the axis in default drilling region in a plane, it is also possible to not in a plane, Ke Yixiang
It is mutually parallel, it is also possible to intersecting.
Specifically, without copper area the section on pad direction shape can for circle, rectangle, ellipse or
Person other irregular figures.
Further, the S10~S40 is specially：
S10：It is determined that the diameter in default drilling region, is set to preset diameters；
S20：Wu Tongqu is etched on the pad, its a diameter of first diameter, first diameter is less than described pre-
If diameter；The axis without copper area and the default drilling region is point-blank；
S30：The first hole is bored on the multi-layer sheet, its a diameter of Second bobbin diameter；It is described without copper area and first hole
Axis is point-blank；The Second bobbin diameter is less than the preset diameters；
S40：The second hole is bored on the multi-layer sheet, its a diameter of 3rd diameter；First hole and second hole
Axis is point-blank；3rd diameter is less than or equal to the preset diameters.
As one kind preferred embodiment, the multi-layer sheet also includes core plate, includes between the S20 and the S30：
S21：The pad is compressed to multi-layer sheet with the core plate.
As one kind preferred embodiment, the preset diameters are more than 2mm.
As it is a kind of preferred embodiment, the difference of first diameter and the preset diameters for 0.3mm~
0.5mm。
As one kind preferred embodiment, first diameter and the difference of the preset diameters are 0.4mm.
As it is a kind of preferred embodiment, the difference of the Second bobbin diameter and the preset diameters for 0.8mm~
1.1mm。
As one kind preferred embodiment, the Second bobbin diameter and the difference of the preset diameters are 1mm.
As one kind preferred embodiment, the 3rd diameter and the difference of the preset diameters are 0mm~0.3mm.
As one kind preferred embodiment, include between the S20 and the S30：
S22：Determine the projected depth in the first hole, be predetermined depth；
The S30 is specially：
First the first hole drill to the first depth, then the first hole drill to predetermined depth；First depth is less than described pre-
If depth.
As one kind preferred embodiment, the S40 is specially：
First the second hole drill to the second depth, then the second hole drill to predetermined depth；Second depth is less than described pre-
If depth.
Beneficial effects of the present invention are：A kind of multiple-plate boring method is provided, by being first etched place to multi-layer sheet
Reason, then using brill boring method is drawn, produces pad drawing crack when effectively solving the problems, such as that multi-layer sheet drills.
Brief description of the drawings
The present invention is described in further detail below according to drawings and Examples.
Fig. 1 is the multiple-plate boring method block diagram described in embodiment one；
Fig. 2 is the multiple-plate boring method block diagram described in embodiment two；
Fig. 3 is the multiple-plate boring method block diagram described in embodiment three；
Fig. 4 is the multiple-plate boring method block diagram described in example IV.
Specific embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
Embodiment one
Current embodiment require that making one block of multi-layer sheet for being provided with via, multiple-plate building block includes pad and core
Plate, its boring method is as shown in Figure 1：
S10：Position where determining via, the position is defined as default drilling region, and the aimed dia of via is
Preset diameters.Preferably, preset diameters are 2mm, or 2.5mm, 3.5mm or other numerical value more than 2mm.
S20：, diameter coaxial with default drilling region is etched on pad than preset diameters little Wu Tong areas, Wu Tongqu
Diameter be designated as the first diameter.The difference of the first diameter and preset diameters is preferably 0.4mm, or 0.3mm, 0.5mm or
Any number between person 0.3mm~0.5mm.
S21：Pad and core plate are pressed into multi-layer sheet.
S30：Get out on multilayer boards with without the first hole that copper area is coaxial, diameter is smaller than preset diameters, the diameter in the first hole
It is designated as Second bobbin diameter.Second bobbin diameter is preferably 1mm with the difference of preset diameters, or and 0.8mm, 1.1mm or 0.8mm~
Any number between 1.1mm.
S40：, diameter coaxial with the first hole second hole equal with preset diameters is got out on multilayer boards.
First lead to overetched method on pad and etch Wu Tongqu, can greatly reduce bore on multilayer boards the first hole
When the pulling force that is produced at drill bit of pad, it is possible to the problem of pad drawing crack when avoiding drilling.And when drilling on multilayer boards,
The first smaller hole of first drill diameter, then drill diameter can avoid the hole because directly boring on multilayer boards than the second larger hole
It is excessive and cause multi-layer sheet or pad to be damaged.
When etching is without copper area, make the first diameter less than preset diameters, then when multi-layer sheet is drilled into preset diameters, on pad
Copper in preset diameters can be drilled, it is ensured that the aperture on pad is finally equal with preset diameters.If etched at the beginning
When, just the first diameter without copper area is etched to it is equal with preset diameters, frequently can lead to pad be difficult to and need welding electricity
Device contacts, and multi-layer sheet is failed.Because the aperture of etching is difficult to be precisely controlled, if it is desired in the first step just direct handle
Aperture without copper area is etched to preset diameters, often causes first with diameter greater than preset diameters, or causes the part of pad
Place is etched to beyond default drilling region.Even if being so drilled via, when the pin reeve via electrical part
When, pad cannot also touch the pin of electrical part, cause multi-layer sheet to fail.
Specifically, in other embodiments, as long as Wu Tongqu, the first hole and the second hole are located at default drilling region,
Axis without copper area, the first hole and the second hole can be with the axis in default drilling region in a plane, it is also possible to not one
In individual plane, can be parallel to each other, it is also possible to intersecting.
Specifically, in other embodiments, without copper area the section on pad direction shape can for it is circular,
Rectangle, ellipse or other irregular figures.
Embodiment two
Current embodiment require that making one block of multi-layer sheet for being provided with via, multiple-plate building block includes pad and core
Plate, its boring method is as shown in Figure 2：
S10：Position where determining via, the position is defined as default drilling region, and the aimed dia of via is
Preset diameters.
S20：, diameter coaxial with default drilling region is etched on pad than preset diameters little Wu Tong areas, Wu Tongqu
Diameter be designated as the first diameter.
S21：Pad and core plate are pressed into multi-layer sheet.
S30：Get out on multilayer boards with without the first hole that copper area is coaxial, diameter is smaller than preset diameters, the diameter in the first hole
It is designated as Second bobbin diameter.
S40：, diameter coaxial with the first hole is got out on multilayer boards less than preset diameters and more than the second of Second bobbin diameter
Hole.The diameter in the second hole is designated as the 3rd diameter, and the 3rd diameter is preferably 0.15mm with the difference of preset diameters, or
Any number between 0.05mm, 0.3mm or 0mm~0.3mm.
S50：, diameter coaxial with the second hole threeth hole equal with preset diameters is got out on multilayer boards.
Drilling when, according to length the and multiple-plate thickness of preset diameters, can also at twice, three times or repeatedly
Through hole is got out, progressively borehole enlargement to preset diameters.So it is possible to prevente effectively from multi-layer sheet breaks because the external force being subject to is too big
Split.
Embodiment three
Current embodiment require that making one block of multi-layer sheet for being provided with via, multiple-plate building block includes pad and core
Plate, its boring method is as shown in Figure 2：
S10：Position where determining via, the position is defined as default drilling region, and the aimed dia of via is
Preset diameters.
S20：, diameter coaxial with default drilling region is etched on pad than preset diameters little Wu Tong areas, Wu Tongqu
Diameter be designated as the first diameter.
S21：Pad and core plate are pressed into multi-layer sheet.
S22：According to multiple-plate thickness, the projected depth of via is determined, be set to predetermined depth.
S30：Get out on multilayer boards with without the first hole that copper area is coaxial, diameter is smaller than preset diameters.During drilling, first the
One hole drill is extremely less than the first depth of predetermined depth, then the first hole drill to predetermined depth.
S40：, diameter coaxial with the first hole second hole equal with preset diameters is got out on multilayer boards.
In drilling, according to length the and multiple-plate thickness of preset diameters, when boring same hole, can in two steps,
Three steps even multistep gets out through hole, progressively the depth down in hole to predetermined depth.When multi-layer sheet is thicker, substep drills, will
The depth in hole is gradually deepened to predetermined depth, can effectively improve drilling efficiency, and avoid multi-layer sheet and bit copper because of drill bit
Overheat and be damaged.
Example IV
Current embodiment require that making one block of multi-layer sheet for being provided with via, multiple-plate building block includes pad and core
Plate, its boring method is as shown in Figure 2：
S10：Position where determining via, the position is defined as default drilling region, and the aimed dia of via is
Preset diameters.
S20：, diameter coaxial with default drilling region is etched on pad than preset diameters little Wu Tong areas, Wu Tongqu
Diameter be designated as the first diameter.
S21：Pad and core plate are pressed into multi-layer sheet.
S22：According to multiple-plate thickness, the projected depth of via is determined, be set to predetermined depth.
S30：Get out on multilayer boards with without the first hole that copper area is coaxial, diameter is smaller than preset diameters.During drilling, first the
One hole drill is extremely less than the first depth of predetermined depth, then the first hole drill to predetermined depth.
S40：, diameter coaxial with the first hole second hole equal with preset diameters is got out on multilayer boards；During drilling, first
Second hole drill is extremely less than the second depth of predetermined depth, then the second hole drill to predetermined depth.
In drilling, according to length the and multiple-plate thickness of preset diameters, often bore a hole, can in two steps,
Three steps even multistep gets out through hole, progressively the depth down in hole to predetermined depth.When multi-layer sheet is thicker, substep drills, will
The depth in hole is gradually deepened to predetermined depth, can effectively improve drilling efficiency, and avoid multi-layer sheet and bit copper because of drill bit
Overheat and be damaged.
Embodiment five
Current embodiment require that making one block of multi-layer sheet for being provided with via, multiple-plate building block includes pad and core
Plate, step is as follows：
S10：Position where determining via, the position is defined as default drilling region.
S20：Etched on pad positioned at default drilling region Nei Wutong areas, be square hole without copper area；Certainly, Wu Tongqu
Can also be triangle, trapezoidal or other polygons in the cross sectional shape perpendicular to its axis direction.
S21：Pad and core plate are pressed into multi-layer sheet.
S30：First hole smaller than preset diameters with the diameter parallel without copper area, diameter is got out on multilayer boards.
S40：Get out on multilayer boards with the axis in default drilling region point-blank, diameter it is equal with preset diameters
The second hole.
Embodiment six
Current embodiment require that making one block of multi-layer sheet for being provided with via, multiple-plate building block includes pad and core
Plate, step is as follows：
S10：Position where determining via, the position is defined as default drilling region.
S20：Etched on pad positioned at default drilling region Nei Wutong areas, be through hole without copper area；Certainly, Wu Tongqu
It can also be blind hole.
S21：Pad and core plate are pressed into multi-layer sheet.
S30：Get out on multilayer boards intersect with the axis without copper area, the first hole that diameter is smaller than preset diameters.
S40：Get out on multilayer boards intersect with the axis in default drilling region, the second hole that diameter is smaller than preset diameters,
And second hole axis and the first hole axis not point-blank.
S50：Get out on multilayer boards with the axis in default drilling region point-blank, diameter be equal to preset diameters
3rd hole.
Embodiment seven
Current embodiment require that making one block of multi-layer sheet for being provided with via, multiple-plate building block includes pad and core
Plate, step is as follows：
S10：Position where determining via, the position is defined as default drilling region.
S20：Etched on pad positioned at default drilling region Nei Wutong areas, axis and default bore area without copper area
The axis in domain is not in a plane；Certainly, the axis without copper area can also be with the diameter parallel or phase in default drilling region
Hand over.
S21：Pad and core plate are pressed into multi-layer sheet.
S30：Get out the first hole on multilayer boards, the first hole position in default drilling region, and its axis with without copper area
Axis is not in a plane.
S40：Get out on multilayer boards with the axis in default drilling region point-blank, diameter be equal to preset diameters
Second hole.
" first ", " second ", " the 3rd ", " the 4th " herein just for the sake of being distinguish between in description, not
Special implication.
It is to be understood that, above-mentioned specific embodiment is only former presently preferred embodiments of the present invention and institute's application technology
Reason, in technical scope disclosed in this invention, change that any one skilled in the art is readily apparent that or
Replace, should all cover within the scope of the present invention.
Claims (10)
1. a kind of multiple-plate boring method, the multi-layer sheet includes pad, and the multi-layer sheet is provided with default drilling region, its
It is characterised by, comprises the following steps：
S10：It is determined that default drilling region；
S20：Etch Wu Tongqu on the pad, it is described without copper area in the default drilling region；
S30：The first hole is bored on the multi-layer sheet, first hole is in the default drilling region；
S40：The second hole is bored on the multi-layer sheet, second hole is not at least part of Chong Die with first hole, and institute
The second hole is stated in the default drilling region.
2. multiple-plate boring method according to claim 1, it is characterised in that the multi-layer sheet also includes core plate, institute
State includes between S20 and the S30：
S21：The pad is compressed to multi-layer sheet with the core plate.
3. multiple-plate boring method according to claim 1, it is characterised in that the S10~S40 is specially：
S10：It is determined that the diameter in default drilling region, is set to preset diameters；
S20：Wu Tongqu is etched on the pad, its a diameter of first diameter, first diameter is default straight less than described
Footpath；The axis without copper area and the default drilling region is point-blank；
S30：The first hole is bored on the multi-layer sheet, its a diameter of Second bobbin diameter；The axis without copper area and first hole
Point-blank；The Second bobbin diameter is less than the preset diameters；
S40：The second hole is bored on the multi-layer sheet, its a diameter of 3rd diameter；First hole and the axis in second hole
Point-blank；3rd diameter is less than or equal to the preset diameters.
4. multiple-plate boring method according to claim 3, it is characterised in that the preset diameters are more than 2mm.
5. multiple-plate boring method according to claim 3, it is characterised in that first diameter is default straight with described
The difference in footpath is 0.3mm~0.5mm.
6. multiple-plate boring method according to claim 5, it is characterised in that first diameter is default straight with described
The difference in footpath is 0.4mm.
7. multiple-plate boring method according to claim 3, it is characterised in that the Second bobbin diameter is default straight with described
The difference in footpath is 0.8mm~1.1mm.
8. multiple-plate boring method according to claim 7, it is characterised in that the Second bobbin diameter is default straight with described
The difference in footpath is 1mm.
9. multiple-plate boring method according to claim 3, it is characterised in that wrapped between the S20 and the S30
Include：
S22：Determine the projected depth in the first hole, be predetermined depth；
The S30 is specially：
First the first hole drill to the first depth, then the first hole drill to predetermined depth；First depth is less than the default depth
Degree.
10. multiple-plate boring method according to claim 9, it is characterised in that the S40 is specially：
First the second hole drill to the second depth, then the second hole drill to predetermined depth；Second depth is less than the default depth
Degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611226690.8A CN106735387A (en) | 2016-12-27 | 2016-12-27 | Multiple-plate boring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611226690.8A CN106735387A (en) | 2016-12-27 | 2016-12-27 | Multiple-plate boring method |
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| CN106735387A true CN106735387A (en) | 2017-05-31 |
Family
ID=58921617
Family Applications (1)
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|---|---|---|---|
| CN201611226690.8A Pending CN106735387A (en) | 2016-12-27 | 2016-12-27 | Multiple-plate boring method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109601220A (en) * | 2018-12-17 | 2019-04-12 | 山东省地质矿产勘查开发局第地质大队（山东省第地质矿产勘查院） | Method for greening quartz high-steep slope in arid and rainless area |
| CN111356292A (en) * | 2020-03-03 | 2020-06-30 | 广州兴森快捷电路科技有限公司 | Circuit board and drilling method thereof |
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| CN111356292A (en) * | 2020-03-03 | 2020-06-30 | 广州兴森快捷电路科技有限公司 | Circuit board and drilling method thereof |
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Application publication date: 20170531 |