CN106793577B - A kind of production method and PCB of High-Speed PCB - Google Patents
A kind of production method and PCB of High-Speed PCB Download PDFInfo
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- CN106793577B CN106793577B CN201710028825.8A CN201710028825A CN106793577B CN 106793577 B CN106793577 B CN 106793577B CN 201710028825 A CN201710028825 A CN 201710028825A CN 106793577 B CN106793577 B CN 106793577B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides the production method and PCB of a kind of High-Speed PCB, includes the following steps, 1) it is laminated after normal inner figure production；2) subtract copper to 6 μm -8 μm after being laminated；3) to the whole+4.5mil erosion copper windowing in profound and subtle hole and single order blind hole area；4) laser drill completes profound and subtle hole, single order blind hole machining, 4) first time power auger needs the through-hole of filling holes with resin；6) metallization in the first secondary aperture；7) first time through-hole back drill；8) vacuum taphole；9) dry film cap bore, will be to profound and subtle hole, single order blind hole and the unilateral+5mil lid dry film of first time through-hole；10) chemistry subtracts copper+ceramics nog plate and subtracts copper to 20 μm -25 μm；11) the second through-hole of power auger；12) metallization and POFV nut cap in the second secondary aperture；13) back drill processing is carried out to the second through-hole, processes connecting-type functional hole；14) outer graphics transfer and etching fine-line figure；15) welding resistance and surface treatment are completed.The present invention is able to achieve the production of high complicated High-Speed PCB, and fabrication cycle is short, at low cost.
Description
Technical field
The present invention relates to the production method of circuit board more particularly to the production methods and PCB of a kind of High-Speed PCB.
Background technique
With the high speed development of high density integrated circuit technology and microelectric technique, become the volume of electronic product more
Gently, thinner, smaller, function highly dense, performance is more and more stronger.It is at present the high speed for reaching product, highly dense requirement, PCB design
By process combinings such as profound and subtle hole, blind hole, back drill, POFV (Plating Over Filled Via, need consent), intensive lines one
It rises, to profound and subtle hole machined, high thickness to diameter ratio lead to blind hole plating process capability for this, and high thickness to diameter ratio leads to, blind hole, back drill hole, filling holes with resin
Control, route precision controlling ability, surface treatment compatibility etc. are proposed great challenge, existing conventional equipment and technique side
Method is difficult to realize the production of this High-Speed PCB, needs in critical workflow using more advanced device resource (laser drill, pulse electricity
Plating, vacuum resin plug machine) and new process is developed to realize the production of High-Speed PCB.The prior art is difficult to realize high speed
The production of PCB, quality are difficult to ensure, and fabrication cycle is long, and cost is relatively high.
Summary of the invention
In view of the above, a kind of present invention it is necessary to provide fabrication cycles production method short, at low cost, High-Speed PCB
Production method and the PCB as made from the production method.
A kind of production method of High-Speed PCB, comprising the following steps:
1) several core plates are laminated after inner figure production respectively, form a multi-layer board；
2) multiple-plate face layers of copper is subtracted into copper；
3) it needs to process the region of profound and subtle hole and blind hole in the face layers of copper after copper and opens a window to subtracting；
4) split window shape at fenestra carry out laser drill, profound and subtle hole, ladder blind hole is made；
5) first time machine drilling is carried out to the multi-layer board after laser drill, is made several and subsequent needs the of filling holes with resin
One through-hole；
6) multi-layer board metallize in the first secondary aperture, copper, while multiple-plate face layers of copper layers of copper are covered in first through hole
It thickeies；
7) back drill) is carried out to multiple-plate several first through hole after metallizing in the first secondary aperture, to process functional form
Back drill hole；
8) by vacuum taphole mode to profound and subtle hole, ladder blind hole, functional form back drill hole and first through hole carry out resin
Consent filling；
9) copper is subtracted using dry film cap bore, chemistry and ceramic nog plate mode is subtracted copper to multiple-plate face layers of copper again；
10) second of machine drilling is carried out to subtracting the multi-layer board after copper, to drill out the second through-hole of connecting-type function；
11) metallization and the hole progress nut cap copper facing of filling holes with resin in the second secondary aperture are carried out to multi-layer board；
12) back drill processing is carried out to several second through-holes, processes the via hole of signal transmission；
13) outer graphics transfer and etching fine-line figure are carried out to multi-layer board.
Further, in step 1), the core plate has substrate layer and is formed in the bottom layers of copper of substrate layer bottom surface, and core plate exists
Before pressing, signal transmission line, shielded layer and vacancy section are formed in the bottom layers of copper of several core plates, vacancy section is for laser or machine
Tool drills through.
Further, subtract copper thickness in step 2) to 6 μm -8 μm.
Further, in step 3), when opening, the diameter dimension of fenestra is 4.5mil wider than blind hole diameter size.
Further, in step 4), after substrate layer of the profound and subtle hole for core plate on laser ablation, and pass through substrate layer bottom surface
The vacancy section of bottom layers of copper, until being formed at the bottom layers of copper of lower section core plate.
Further, in step 8), vertical vacuum taphole machine is by low-expansion thermosetting resin to profound and subtle hole, blind
Hole, back drill hole and through-hole carry out consent, and consent needs to fill in from the two sides CS, SS, one side of the first time consent more than the back drill hole count
It first fills in, then the other one side of plug in turn；Consent recess may not exceed 75 μm after plug socket resin solidification, subsequent to carry out POFV nut cap
Copper facing, as pad.
Further, in step 9), the preset thickness of plate face is polished by abrasive belt grinding first, plate face cull is gone
Except clean.
Further, in step 9), the size of dry film capping exceeds orifice edge 5mil.
Further, in step 9), copper is subtracted by chemistry after dry film cap hole, face copper copper thickness is reduced to 20 μm -25 μm.
Further, in step 9), after chemistry subtracts copper, then by abrasive belt grinding the protrusion copper at dry film cap bore is subtracted
Copper polishes.
Compared to the prior art, the production method of High-Speed PCB provided by the invention, by taking one step press mode and depth
Micropore replaces traditional gradually lamination, and the production in profound and subtle hole and single order blind hole is completed using blind hole erosion copper mode laser,
The hole for needing the POFV of filling holes with resin is drilled out again, after completing primary plating, by telltale hole (diameter by way of back drill
Back drill 0.25mm) is carried out, removal influences the extra residual copper of signal transmission, then will be stoppered resin in hole using vacuum taphole machine, makes
Plate face is polished with abrasive belt grinding machine, then carries out subtracting copper after covering hole using dry film, is polished again by abrasive belt grinding machine after subtracting copper
Plate face, then by second of drilling (crimping hole), metallization and POFV nut cap copper facing, outer graphics in hole are completed in second of plating
Transfer and the new manufacturing process of etching fine-line complete the production of High-Speed PCB, fabrication cycle is short, at low cost.
Detailed description of the invention
The above description is only an overview of the technical scheme of the present invention, in order to illustrate more clearly of technical solution of the present invention, under
Face will a brief introduction will be made to the drawings that need to be used in the embodiment or the description of the prior art, and the attached drawing in description is only pair
Should in specific embodiments of the present invention, to those skilled in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings when needed.
Fig. 1 is the flow diagram of the production method of High-Speed PCB of the present invention；
Fig. 2 is the structural schematic diagram of the force fit plate formed after the core plate after inner figure of the present invention production is laminated；
Fig. 3 is the structural schematic diagram after force fit plate subtracts copper on surface and loses copper windowing to blind hole area；
Fig. 4 is that fenestra progress laser drill of the force fit plate after windowing completes the structure after profound and subtle hole, single order blind hole machining
Schematic diagram；
Fig. 5 is structural schematic diagram of the force fit plate after the force fit plate after profound and subtle hole, single order blind hole machining completes machine drilling；
Fig. 6 is that force fit plate carries out the structural schematic diagram after metallizing in first time hole after machine drilling；
Fig. 7 removes extra hole copper by back drill after metallizing in the first secondary aperture for force fit plate and will by vacuum taphole
Profound and subtle hole and the hole VIA carry out the structural schematic diagram after consent；
Fig. 8 carries out subtracting the structural schematic diagram after copper for selection dry film after force fit plate consent；
Fig. 9 is that force fit plate removes the structural schematic diagram after the bump of aperture after subtracting copper using ceramic nog plate；
Figure 10 is that force fit plate carries out the structural schematic diagram after drilling second after removing aperture bump；
Figure 11 is the structural schematic diagram after force fit plate metallizes in the second secondary aperture of carry out after secondary drilling；
Figure 12 is to carry out outer graphics transfer and etched figure, welding resistance and surface after force fit plate metallizes in the second secondary aperture
Treated structural schematic diagram.
Specific embodiment
In order to elaborate the technical solution that the present invention is taken to reach predetermined technique purpose, below in conjunction with this hair
Attached drawing in bright embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described
Embodiment is only section Example of the invention, instead of all the embodiments, also, before not making the creative labor
It puts, the technical means or technical features in the embodiment of the present invention can replace, below with reference to the accompanying drawings and in conjunction with the embodiments
It is next that the present invention will be described in detail.
Referring to Fig. 1, a kind of production method of High-Speed PCB, the production of High-Speed PCB is realized using completely new process route.
Specific production step is as follows:
1) several core plates are laminated after inner figure production respectively, form a multi-layer board；Referring to Fig. 2, multi-layer board
10 are formed by the pressing of several core plates 11, are formed with face layers of copper 111, the thickness of face layers of copper 111 in the upper and lower surface of multi-layer board 10
Standard configuration is 17 μm of -34 μm of copper foils, because mobility is poor when high speed plate pressing plate is easy corrugation using 17 μm of copper foils, to improve this
The problem embodiment of the present invention carries out pressing plate using 34 μm of copper foils.Each core plate 11 has substrate layer 113 and is formed in substrate layer 113
The bottom layers of copper 115 of bottom surface is connected between core plate 11 by prepreg 12 two-by-two, and prepreg 12 is connected to the substrate of core plate 11
Between 113 top surface of layer and the bottom layers of copper 115 of 11 bottom surface of another core plate, relatively 10 middle position of multi-layer board of lamination of face layers of copper 111
The thickness of bottom layers of copper 115 is thick, and face layers of copper 111 can carry out copper facing on 10 surface of multi-layer board and be formed after laminating.Further, core
Plate 11 is formed with vacancy section 1151 before pressing in the bottom layers of copper 115 of several core plates 11, vacancy section 1151 do not have copper and for swashing
Light passes through.
2) multiple-plate face layers of copper is subtracted into copper；Face copper layer thickness is reduced to 6 μm -8 μm, by subtracting copper, so as in subsequent openings
After interior metallization, the face layers of copper after copper will be subtracted and thickeied, so that can to maintain copper appropriate thick for the thickness of face layers of copper, so as to subsequent outer
Layer fine-line etching production, because copper thickness is thinner, otherwise the better control of circuit etching precision exists without subtracting the face layers of copper after copper
In subsequent openings after metallization, face copper layer thickness further thickeies, and is unfavorable for circuit etching precision controlling.Subtract the mode useization of copper
Subtract copper, i.e., is reacted by the liquid medicine that sulfuric acid is combined with hydrogen peroxide with copper, subtracts copper purpose to reach.
3) it needs to process the region of profound and subtle hole and blind hole in the face layers of copper after copper and opens a window to subtracting.Referring to Fig. 3, more
Several fenestras 21 are opened up after being etched in the face layers of copper 111 of 10 top layer of laminate, the present embodiment is illustrated as at two.Opening 21
When, the diameter dimension of fenestra 21 is 4.5mil wider than blind hole integral diameter size or so, by face copper open a window the purpose is to reduce laser
It is lower to absorb heat because copper face is reflective in laser ablation for metal copper face for the difficulty of ablation copper foil, therefore laser is difficult to ablation, leads to
Cross the production efficiency that mechanical windowing improves profound and subtle hole and blind hole, whole+4.5mil windowing the purpose is to reduce blind hole windowing and swash
The contraposition deviation of light ablation influences.
4) split window shape at fenestra carry out laser drill, profound and subtle hole, single order blind hole is made.Referring to Fig. 4, to fenestra 21
It is laser machined, profound and subtle hole 22, single order blind hole 23 is made, wherein profound and subtle hole 22 is the first core plate 11 at the top of laser ablation
After substrate layer 113, and the vacancy section 1151 Jing Guo 11 substrate layer of the first core plate, 113 bottom surface bottom layers of copper, it will be under vacancy section 1151
113 ablation of substrate layer of the prepreg 12 and the second core plate 11 to connect with prepreg 12 of side, until the second core plate 11
At bottom layers of copper 115, it is thusly-formed profound and subtle hole 22；It is appreciated that profound and subtle hole 22 can be according to deep needs be bored, in profound and subtle hole ablation
Vacancy section 1151 is formed on direction in the bottom layers of copper 115 of corresponding core plate, then can meet the depth requirements in profound and subtle hole；In ladder
Profound and subtle hole 22 can make as needed, the first lesser deep hole of ablation diameter, then concentric gradually ablation diameter be gradually increased and
The several segments that hole depth gradually becomes shallower as, in this way, can the obtained stepped profound and subtle hole of ablation.Single order blind hole (the non-shape of blind hole in the present embodiment
At several segments, diameter is identical everywhere in hole section), fenestra 21, which is passed through, for laser is directly ablated at the bottom layers of copper 115 of top layer core plate
It is formed.
5) first time machine drilling is carried out to the multi-layer board after laser drill, is made several and subsequent needs the of filling holes with resin
One through-hole (POFV).Referring to Fig. 5, carrying out machine drilling to multi-layer board 10, several first through hole 24 is obtained.Machine drilling is
It by numerically-controlled machine tool, is drilled using drill at pre-designed place, it is therefore an objective to so that leading to after machine drilling between each sandwich circuit
It is connected after metallization in via hole.
6) multi-layer board metallize in the first secondary aperture, to be covered with the first metal layer, while multilayer in first through hole
Plate subtracts the face layers of copper thickening after copper.Referring to Fig. 6, carrying out metalized to multi-layer board, plating is can be selected in metallization mode, such as
This is formed with the first metal layer 31, the first metal in the profound and subtle hole 22 of multi-layer board 10 in single order blind hole 23 and first through hole 24
Layer 31 can be not quite similar in the thickness of each hole attachment, and profound and subtle hole 22, single order blind hole 23 is relatively thin, and adhere in face layers of copper 111 thicker.
In first secondary aperture after metallization, face layers of copper 111 of the multi-layer board after subtracting thickness thickeies, and the thickness reached does not interfere with subsequent
The production of outer layer fine-line.Outer layer copper thickness is thicker, and chemistry erosion amount of copper is bigger, and side etching quantity is also bigger, the benefit of such route
Repay bigger, fine-line is just difficult to make, so reducing the production that face copper meets fine-line with less etch quantity.
7) back drill is carried out to multiple-plate several first through hole after metallizing in the first secondary aperture, removed more in first through hole
Remaining hole copper, and complete the process functional form back drill hole 32.Referring to Fig. 7, in order to reduce in transmission line in signal transmission line
Middle Stubs (extra coating line length) transmits high-speed signal and generates injury, and making distorted signals, (i.e. and one section of formation filters
Or concussion section), via hole back drill is performed in accordance on multi-layer board.It drills, bores such as at the corresponding through-hole 24 in the top surface of multi-layer board 10
The diameter in hole is big compared with through-hole, and drill preset depth, then reserves metal layer 31 between each core plate of 10 bottom of multi-layer board and be connected；
It is also possible to the predetermined depth that drills at the corresponding through-hole 24 in multiple-plate bottom surface, then in each core plate at the top of multi-layer board 10
Between reserve metal layer 31 be connected；Or the through-hole 24 in 10 top surface of multi-layer board drills preset depth, and accordingly in multilayer
10 bottom surface of plate drills preset depth in same through-hole 24 to top surface, and drills be not connected to twice, then accordingly in non-connectivity part
Corresponding metal layer 31 of reserving between each core plate at multiple-plate middle part is connected.
8) by vacuum taphole mode to several profound and subtle holes, single order blind hole, functional form back drilling hole and first through hole into
The filling of row filling holes with resin.Resin is squeezed by pipeline by low-expansion thermosetting resin by pumping using vertical vacuum taphole machine
In the complete profound and subtle hole for being vacuum formed negative pressure, blind hole, back drill hole and through-hole, consent needs to fill in from the two sides CS, SS, first time consent
One side more than back drill hole count is first filled in, then the other one side of plug in turn；Consent recess may not exceed 75 μm after plug socket resin solidification,
It is subsequent to carry out POFV nut cap copper facing, as pad.
9) subtracting copper using the chemical etching of dry film cap bore combines ceramic nog plate mode to subtract multiple-plate face layers of copper again
Copper.After metallizing in the first secondary aperture, face copper layer thickness reaches 50 μm or so, subtracts copper again for face layers of copper and reduces to 20 μ by 50 μm
m-25μm.Since multi-layer board has opened up profound and subtle hole, single order blind hole, functional form back drill hole and first through hole etc. are various types of
Hole, the mode that nog plate cannot be directlyed adopt when subtracting copper subtract copper, in order to avoid damage aperture coated copper (wrap).Referring to Fig. 8, first
By abrasive belt grinding flat surface grinding layers of copper plate face to preset thickness, plate face cull is removed completely, dry film 50 is then selected
Aperture is covered, the size that dry film 50 covers is beyond orifice edge substantially 5mil or so, then by the face copper of multi-layer board 10
Layer is etched and subtracts copper, if lid dry film does not carry out whole plate directly and subtracts copper, the coated copper in aperture can be stung eating away, existed in this way by liquid medicine
When finished product welding component, be easily broken off causes to open a way under the high temperature conditions.Stop after being etched to preset thickness, then by dry film
50 remove, and are so formed with protrusion in the periphery in aperture, are then abraded the bump in aperture using ceramic nog plate, after etching
Face layers of copper flush (please referring to Fig. 9).If directlying adopt abrasive belt grinding, first is that abrasive belt grinding whole plate removal amount of copper is less,
Each nog plate removes 2 μm or so, to reach removal amount of copper and need to grind more than 10 times, not only inefficiency, at high cost, and is easy plate
Mill deformation；Etching, which subtracts copper, to be chemically reacted by sulfuric acid and hydrogen peroxide and copper, to achieve the purpose that subtract copper, it is logical to subtract amount of copper
It crosses multi-layer board and stops the reaction time (i.e. the limp speed of equipment) in equipment to control.
10) second of machine drilling is carried out to subtracting the multi-layer board after copper, to drill out the second through-hole of connecting-type function；It please join
Figure 10 is read, after subtracting copper again, multi-layer board 10 carries out second of machine drilling, drills out the second through-hole of connecting-type function, such as uses
In crimping hole 34 with the grafting such as electric elements.Second through-hole of connecting-type function is extremely stringent to aperture tolerance, tolerance
Usually within ± 50 μm, if if first time drills out, needed in vacuum resin consent using selective consent,
Consent process is cumbersome, and plates copper thickness in hole enough in the plating of first time whole plate, then carry out finished product when second of plating of POFV
It crimps hole hole tolerance to be difficult to control, therefore in first time, machine drilling does not drill out the second through-hole of connecting-type function.
11) multi-layer board metallize in the second secondary aperture and the hole POFV (i.e. the hole of filling holes with resin) carries out nut cap plating
Copper accordingly encloses second metal layer in the second through-hole inner surface of multiple-plate plate face and connecting-type function, and to need
The second through-hole for filling in resin carries out nut cap.Please refer to Figure 11, to multi-layer board 10 carry out second drilling inner hole metalized and
The upper cap copper facing of the hole POFV, for the second time after drilling inner hole metalized, plate face and functional form back drill hole 32 in multi-layer board 10
Inner surface is formed with second metal layer 41, by the upper cap copper facing of the hole POFV, so that subsequent diagram is etched in filling holes with resin
Solder joint is done on hole.Specifically, its hole tolerance and plates >=6 μm within ± 2mil on the resin of filling holes with resin after copper facing
Copper is thick, to be used as pad to connect herein.
12) back drill processing is carried out to several second through-holes, processes the via hole of signal transmission.
13) outer graphics transfer and etched figure are carried out to multi-layer board.Figure 12 is please referred to, second is completed in multi-layer board and bores
Behind hole and the interior metallization of the second secondary aperture and back drill, one layer of photosensitive material sheet is sticked in plate face, then passes through laser scanning or figure
The shape film is exposed, and the line transitions of design are removed unwanted photosensitive material sheet to plate face, then by liquid medicine,
Expose copper face, then unwanted face copper is reacted by etching solution and is removed, is left line pattern.
14) welding resistance and surface treatment are completed, after the completion of figure, as route is all that copper face is exposed in air, if
Route is exposed for a long time in air, and copper is oxidized easily corrosion, therefore coats protective layer photosensitive-ink in circuit surface, this guarantor
Another effect of sheath is exactly to prevent welding, because the pad and solder joint of many welding components of plate face are cannot to be covered by ink
Lid, need it is exposed outside, for prevent copper face aoxidize and be easy welding, a surface treatment is done at pad and solder joint, is first plated
One layer of nickel, then plate one layer of gold.
To sum up, by above-mentioned process, profound and subtle blind hole can be processed on multilayer boards, single order blind hole sets to increase wiring
Density is counted, and deep micro-aperture technique can regard the design of " 0 " STUB as, realize minimum damage to the transmission of two-forty signal
Consumption；Functional form back drill hole removal edge PTH hole is not used in signal transmission, a useless hole copper, to reduce Stub length, to subtract
Few loss of signal, supports signal transmission integrity；It is (including profound and subtle hole, single order blind hole, through-hole, single two-sided small to carry out filling holes with resin
Hole back drill hole etc.) copper facing is carried out on consent surface is used as solder joint, reduce outer layer wiring space, the raising Technology designs such as wiring density
Production requires to reach High-Speed PCB production.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, though
So the present invention has been disclosed as a preferred embodiment, and however, it is not intended to limit the invention, any technology people for being familiar with this profession
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above are modified or are modified
For the equivalent embodiment of equivalent variations, but without departing from the technical solutions of the present invention, according to the technical essence of the invention,
Within the spirit and principles in the present invention, any simple modifications, equivalent substitutions and improvements to the above embodiments etc., still
Belong within the protection scope of technical solution of the present invention.
Claims (7)
1. a kind of production method of High-Speed PCB, comprising the following steps:
1) several core plates are laminated after inner figure production respectively, are formed a multi-layer board, are formed in the bottom layers of copper of core plate
Vacancy section；
2) multiple-plate face layers of copper is subtracted into copper；
3) it needs to process the region of profound and subtle hole and blind hole in the face layers of copper after copper and opens a window to subtracting；
4) split window shape at fenestra carry out laser drill, profound and subtle hole, ladder blind hole is made；When opening, the diameter ruler of fenestra
It is very little 4.5mil wider than blind hole diameter size, wherein when making profound and subtle hole, the bottom copper of corresponding core plate on profound and subtle hole ablation direction
Layer on form vacancy section, first pass through the lesser deep hole of fenestra ablation diameter, then concentric gradually ablation diameter be gradually increased and
Stepped profound and subtle hole is made in the several segments and the corresponding vacancy section of process, ablation that hole depth gradually becomes shallower as；
5) first time machine drilling is carried out to the multi-layer board after laser drill, is made several and subsequent needs the first logical of filling holes with resin
Hole；
6) multi-layer board metallize in the first secondary aperture, copper is covered in first through hole, while multiple-plate face layers of copper layers of copper thickeies；
7) back drill) is carried out to multiple-plate several first through hole after metallizing in the first secondary aperture, to process functional form back drill
Hole；
8) by vacuum taphole mode to profound and subtle hole, ladder blind hole, functional form back drill hole and first through hole carry out filling holes with resin
Filling；
9) copper is subtracted using dry film cap bore, chemistry and ceramic nog plate mode is subtracted copper to multiple-plate face layers of copper again；
10) second of machine drilling is carried out to subtracting the multi-layer board after copper, to drill out the second through-hole of connecting-type function；Second through-hole
Hole is crimped with what high speed connector was attached including playing, crimps hole hole tolerance within ± 50 μm；
11) metallization and the hole progress nut cap copper facing of filling holes with resin in the second secondary aperture are carried out to multi-layer board；Second through-hole carries out
Hole tolerance after copper facing plates >=6 μm of copper thickness within ± 2mil on the resin of filling holes with resin, with here as
Pad connection；
12) back drill processing is carried out to several second through-holes, processes the via hole of signal transmission；
13) outer graphics transfer and etching fine-line figure are carried out to multi-layer board.
2. the production method of High-Speed PCB according to claim 1, it is characterised in that: the core plate has substrate layer and shape
At the bottom layers of copper in substrate layer bottom surface, core plate is formed with signal transmission line, shielding before pressing in the bottom layers of copper of several core plates
Layer and vacancy section, vacancy section pass through for laser or machine drilling.
3. the production method of High-Speed PCB according to claim 1, it is characterised in that: subtract copper thickness in step 2) to 6 μm -8
μm。
4. the production method of High-Speed PCB according to claim 2, it is characterised in that: in step 4), profound and subtle hole is laser burning
In erosion after the substrate layer of core plate, and the vacancy section Jing Guo substrate layer bottom surface bottom layers of copper, until being formed at the bottom layers of copper of lower section core plate.
5. the production method of High-Speed PCB according to claim 1, it is characterised in that: in step 9), ground first by abrasive band
Plate polishes the preset thickness of plate face and removes plate face cull completely.
6. the production method of High-Speed PCB according to claim 5, it is characterised in that: in step 9), the size of dry film capping
Beyond orifice edge 5mil, then copper is subtracted by chemistry, face copper is reduced to 20 μm -25 μm, it is by sulfuric acid and dioxygen that etching, which subtracts copper,
Water is chemically reacted with copper, is again polished the copper in cap bore area by ceramic nog plate after subtracting copper.
7. a kind of circuit board, it is characterised in that: be made of the production method of High-Speed PCB as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710028825.8A CN106793577B (en) | 2017-01-16 | 2017-01-16 | A kind of production method and PCB of High-Speed PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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