CN102170759B - Method for processing blind buried hole on multilayer circuit board - Google Patents
Method for processing blind buried hole on multilayer circuit board Download PDFInfo
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- CN102170759B CN102170759B CN201110102240A CN201110102240A CN102170759B CN 102170759 B CN102170759 B CN 102170759B CN 201110102240 A CN201110102240 A CN 201110102240A CN 201110102240 A CN201110102240 A CN 201110102240A CN 102170759 B CN102170759 B CN 102170759B
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Abstract
The invention relates to a method for processing a blind buried hole on a multilayer circuit board, which belongs to the technical field of laser drilling. The technical key point of the invention comprises the following steps of: (1) confirming a position needing hole opening of the traditional mechanical blind buried hole circuit board; (2) processing a buried hole on an inner-layer plate of the position needing hole opening and electroplating again after filling resin into the buried hole for grinding to form a butting joint pad; and (3) drilling a laser blind hole on an upper-layer circuit board at at least one side of the processing buried hole and butting the laser blind hole with the pad formed electroplating on the mechanical buried hole to form a blind buried hole. Compared with the prior art, the invention has the advantages of shortening the process flow, thoroughly overcoming the phenomenon of board bending generated by asymmetric laminating structure design due to asymmetric hole layer distribution, solving the problem that a copper layer is relatively thicker and is adverse to the manufacture of a thin circuit because the traditional mechanical blind buried hole process outer layer is electroplated for many times, reducing the pressing frequency of board layers and the manufacture difficulty and improving the product quality.
Description
Technical field
The present invention relates to a kind of method of on multilayer circuit board, processing blind buried via hole, relate in particular to method how to utilize radium-shine boring on the blind buried via hole designed lines of a kind of machinery plate, belong to radium-shine drilling technique field.
Background technology
Along with the continuous maturation and the popularization of radium-shine drilling technique, traditional mechanical blind buried via hole plate arena of history that fades out gradually, but the plate that the part special purpose still arranged is still with traditional mechanical blind buried via hole design.Use the printed wiring board long flow path of the blind buried via hole technology of traditional mechanical, mostly pressing is asymmetric pressing, and the plate prying is serious, and simultaneously because skin will experience repeatedly plating, the thick fine rule road that is unfavorable for of copper makes.
Example 1; A kind of four layers of mechanical blind hole board structure of circuit (seeing accompanying drawing 1) in the former technology, a kind of 4 each layers of layer circuit board are followed successively by: top layer L1, second layer L2, the 3rd layer of L3, bottom L4 have dielectric layer 5 between each layer; The pore structure of flaggy is to have blind hole D13 at three layers of L3 of top layer L1 to the; Second layer L2 has blind hole D24 to bottom L4, blind hole size 0.25mm, and four layer line road slab integrals have through hole D14.Its technical flow design is to make second layer L2 and the 3rd layer of L3 circuit earlier, and top layer L1 is to bottom L4 pressing, and the mechanical blind hole D13 of three layers of L3 of blind brill top layer L1 to the, blind brill bottom L4 bore top layer L1 to bottom L4 through hole to the mechanical blind hole D24 of second layer L2.
Example 2; A kind of six layers of mechanical blind hole board structure of circuit (seeing accompanying drawing 2) in the former technology; A kind of 6 each layers of layer circuit board are followed successively by: top layer L1, second layer L2, the 3rd layer of L3, the 4th layer of L4, layer 5 L5, bottom L6; Dielectric layer 5 is arranged between each layer, and the pore structure of flaggy is to have blind hole D15 at top layer L1 to layer 5 L5, and six layer line road slab integrals have through hole D16.Its technical flow design is to make four layers of L4 circuit of second layer L2 to the earlier; Top layer L1 bores the mechanical blind hole of top layer L1 to layer 5 L5 to layer 5 L5 pressing, electroplates; Resin plug machinery blind hole D15; Make top layer L1 (reservation of top layer L1 layer copper face) and layer 5 L5 circuit, top layer L1 bores top layer L1 to bottom L6 through hole to bottom L6 pressing.
Example 3; A kind of six layers of mechanical blind hole board structure of circuit (seeing accompanying drawing 3) are arranged in the former technology in addition; A kind of 6 each layers of layer circuit board are followed successively by: top layer L1, second layer L2, the 3rd layer of L3, the 4th layer of L4, layer 5 L5, bottom L6, dielectric layer 5 is arranged between each layer, and the pore structure of former flaggy is to have 0.25mm blind hole D13 at three layers of L3 of top layer L1 to the; Four layers of L4 of bottom L6 to the have 0.25mm blind hole D46, and six layer line road slab integrals have through hole D16.Its technical flow design is to make second layer L2 and the 3rd layer of L3 circuit (the 3rd layer of L3 copper face keeps) earlier; Three layers of L3 pressing of top layer L1 to the; Bore the mechanical blind hole of three layers of L3 of top layer L1 to the; Electroplate, the mechanical blind hole of three layers of L3 of resin plug top layer L1 to the is made top layer L1 (reservation of top layer L1 layer copper face) and the 3rd layer of L3 circuit; Make the 4th layer of L4 (the 4th layer of L4 copper face keeps) and layer 5 L5 circuit; Four layers of L4 pressing of bottom L6 to the, the mechanical blind hole D46 of four layers of L4 of brill bottom L6 to the electroplates; The 4th layer of L4 of resin plug is to the mechanical blind hole D46 of bottom L6; Make the 4th layer of L4 to bottom L6 circuit (reservation of bottom L6 layer copper face), top layer L1 bores top layer L1 to layer 6 L6 through hole to bottom L6 pressing.
Above-mentioned case 1 needs blind brills of machinery technological, the control of blind hole depth and plating are required high, finished product yield less than 80%; Case 2,3 technologies are made needs at least twice asymmetric lamination, the plate prying of the finished product 100% that this technology is produced, and finished product electrical measurement yield about 80%, the plate prying is corrected the back shipment and is given the client, and very a high proportion of plate distortion is arranged behind the part on the client feedback; In addition, top layer L1 or bottom L6 experience twice plating, and copper is thick, make 0.1/0.1mm and difficult with line.
Summary of the invention
To above-mentioned deficiency, the present invention provides a kind of method of on multilayer circuit board, processing blind buried via hole.
Technical scheme of the present invention is following: a kind of method of on multilayer circuit board, processing blind buried via hole; Described multilayer circuit board has three layers at least; It is characterized in that this method in turn includes the following steps: 1) the earlier definite blind buried via hole design circuit of former machinery plate need be torn the position in hole open; 2) after inner plating processing buried via hole and resin plug buried via hole that needs are torn the hole site open polish, electroplate once more and form the butt joint pad; 3) in the radium-shine blind hole of last layer circuit twist drill of processing buried via hole at least one side, the pad of electroplating formation on radium-shine blind hole and the mechanical buried via hole is docked, form blind buried via hole.
Above-mentioned a kind of method of on multilayer circuit board, processing blind buried via hole, wherein, described buried via hole is that one deck machine drilling at least forms.
Above-mentioned a kind of method of on multilayer circuit board, processing blind buried via hole, wherein, described blind hole is that the radium-shine boring of one deck forms at least.
Above-mentioned a kind of on multilayer circuit board the method for the blind buried via hole of processing, on it, be one deck machine drilling at least dock formation with the radium-shine boring of one deck at least to described blind buried via hole.
Further, above-mentioned a kind of method of on multilayer circuit board, processing blind buried via hole, wherein, described radium-shine boring aperture is 0.1～0.2mm, for the boring of aperture greater than 0.2mm, utilizes a plurality of radium-shine borings to replace.
Further, above-mentioned a kind of method of on multilayer circuit board, processing blind buried via hole, on it, the dielectric thickness between the two-layer circuit that described radium-shine boring connects should be less than 0.1mm.
With former compared with techniques, the present invention has following advantage:
1, shortens technological process, thoroughly overcome the asymmetric asymmetric plate prying phenomenon that produces of stepped construction design that causes that distributes owing to the hole layer;
2, be reduced to one step press from pressing repeatedly, avoided traditional mechanical blind buried via hole technology skin repeatedly to electroplate and make the copper layer thicker relatively, be unfavorable for the problem of the making on fine rule road; Reduce cost of manufacture and shorten the making friendship phase;
3, quality of finished carries out an acceptance inspection according to IPC-A-600G CLASS2 and IPC-6016 CLASS2 newest standards, and finished product does not have plate prying defective, and finished product electrical measurement yield is more than 95%, and shipment does not feed back plate metaboly behind the part for the client, promotes product quality greatly.
Description of drawings
Fig. 1 is a kind of four-layer circuit board pore structure of the former technology of the present invention sketch map;
Fig. 2 is a kind of 6-layer circuit board pore structure of the former technology of the present invention sketch map;
Fig. 3 is the another kind of 6-layer circuit board pore structure of the former technology of a present invention sketch map;
Fig. 4 is the structural representation of practical implementation 1 of the present invention;
The structural representation of Fig. 5 practical implementation 2 of the present invention;
The structural representation of Fig. 6 practical implementation 3 of the present invention.
The structural representation of Fig. 7 practical implementation 4 of the present invention.
Embodiment
Below in conjunction with accompanying drawing invention is explained further details, but do not constitute any restriction of the present invention.
Embodiment 1
As shown in Figure 4, a kind of 4 each layers of layer circuit board are followed successively by: top layer L1, second layer L2, the 3rd layer of L3, bottom L4 have dielectric layer 5 between each layer; The thickness of dielectric layer 5 is 0.08mm, opens 0.25mm machinery buried via hole la at second layer L2 and the 3rd layer of L3, then with resin plug buried via hole 1a; The platen surface of regrinding cull is electroplated core manufacturing flaggy circuit once more; Whole pressing; Open the radium-shine blind hole 1b of 0.15mm at top layer L1 at last, bottom L4 opens the radium-shine blind hole 1b of 0.15mm, and the radium-shine blind hole 1b of top layer L1 goes up plating formation pad with the mechanical buried via hole la of second layer L2 and docks; The radium-shine blind hole 1b of bottom L4 goes up plating formation pad with the mechanical buried via hole la of the 3rd layer of L3 and docks, and last four layer line road slab integrals drill through hole 1c.
Embodiment 2
As shown in Figure 5, a kind of 6 each layers of layer circuit board are followed successively by: top layer L1, second layer L2, the 3rd layer of L3, the 4th layer of L4, layer 5 L5, bottom L6 have dielectric layer 5 between each layer; The thickness of dielectric layer 5 is 0.08mm, opens 0.25 mm machinery buried via hole 1a at second layer L2 to layer 5 L5, then with resin plug buried via hole 1a; The platen surface of regrinding cull is electroplated core manufacturing flaggy circuit once more; Whole pressing; Open the radium-shine blind hole 1b of 0.15mm at top layer L1 at last, the radium-shine blind hole 1b of top layer L1 goes up plating formation pad with the mechanical buried via hole la of second layer L2 and docks, and last six layer line road slab integrals drill through hole 1c.
Embodiment 3
As shown in Figure 6, a kind of 6 each layers of layer circuit board are followed successively by: top layer L1, second layer L2, the 3rd layer of L3, the 4th layer of L4, layer 5 L5, bottom L6 have dielectric layer 5 between each layer; Interlayer dielectric layer 5 thickness are 0.08mm, bore radium-shine buried via hole la at three layers of L3 of second layer L2 to the, and the 4th layer of L4 bores radium-shine blind hole la to layer 5 L5; Radium-shine blind hole pore size 0.1mm; Fill and lead up radium-shine blind hole la with the plating process for filling hole then, copper particle and burr that the platen surface of regrinding is outstanding, core manufacturing flaggy circuit; Whole pressing; Open the radium-shine blind hole 1b of 0.15mm at top layer L1 at last, bottom L6 opens the radium-shine blind hole 1b of 0.15mm, and the radium-shine blind hole 1b of top layer L1 electroplates the formation pad with the radium-shine buried via hole la filling perforation of second layer L2 and docks; The radium-shine blind hole 1b of bottom L6 electroplates the formation pad with the radium-shine buried via hole la filling perforation of layer 5 L5 and docks, and last six layer line road slab integrals drill through hole 1c.
Embodiment 4
As shown in Figure 7, a kind of 4 each layers of layer circuit board are followed successively by: top layer L1, second layer L2, the 3rd layer of L3, bottom L4 have dielectric layer 5 between each layer; The thickness of dielectric layer 5 is 0.08mm, opens 0.40mm machinery buried via hole la at second layer L2 and the 3rd layer of L3, then with resin plug buried via hole 1a; The platen surface of regrinding cull; Electroplate core manufacturing flaggy circuit, whole pressing once more.Because the aperture of buried via hole la is greater than 0.20m; Can two radium-shine blind holes be set in the same connection of same position, the single big mechanical blind hole before replacing is promptly opened 2 radium-shine blind hole 1b of 0.10mm at top layer L1; Bottom L4 opens 2 radium-shine blind hole 1b of 0.10mm; The radium-shine blind hole 1b of top layer L1 upward electroplates the formation pad with the mechanical buried via hole la of second layer L2 and docks, and the radium-shine blind hole 1b of bottom L4 goes up plating formation pad with the mechanical buried via hole la of the 3rd layer of L3 and docks, and last four layer line road slab integrals drill through hole 1c.
The folded structure symmetry of method pressing involved in the present invention, flow process is simple, and can satisfy the client carries out high density designs at skin requirement.
Claims (6)
1. the method for the blind buried via hole of processing on multilayer circuit board, described multilayer circuit board has three layers at least, it is characterized in that, and this method in turn includes the following steps: confirm earlier that 1) the blind buried via hole design circuit of former machinery plate need tear the position in hole open; 2) after inner plating processing buried via hole and resin plug buried via hole that needs are torn the hole site open polish, electroplate once more and form the butt joint pad; 3) in the radium-shine blind hole of last layer circuit twist drill of processing buried via hole at least one side, the pad of electroplating formation on radium-shine blind hole and the mechanical buried via hole is docked, form blind buried via hole.
2. a kind of method of on multilayer circuit board, processing blind buried via hole according to claim 1 is characterized in that, described buried via hole is that one deck machine drilling at least forms.
3. a kind of method of on multilayer circuit board, processing blind buried via hole according to claim 1 is characterized in that, described blind hole is that the radium-shine boring of one deck forms at least.
4. according to claim 1 a kind of on multilayer circuit board the method for the blind buried via hole of processing, it is characterized in that, be one deck machine drilling at least with the radium-shine boring of one deck at least the dock formation of described blind buried via hole.
5. a kind of method of on multilayer circuit board, processing blind buried via hole according to claim 1 is characterized in that described radium-shine boring aperture is 0.1～0.2mm, for the boring of aperture greater than 0.2mm, utilizes a plurality of radium-shine borings to replace.
6. a kind of method of on multilayer circuit board, processing blind buried via hole according to claim 1 is characterized in that the dielectric thickness between the two-layer circuit that described radium-shine boring connects should be less than 0.1mm.
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| CN201110102240A CN102170759B (en) | 2011-04-22 | 2011-04-22 | Method for processing blind buried hole on multilayer circuit board |
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| CN201110102240A CN102170759B (en) | 2011-04-22 | 2011-04-22 | Method for processing blind buried hole on multilayer circuit board |
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| CN102170759B true CN102170759B (en) | 2012-10-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858098A (en) * | 2012-08-20 | 2013-01-02 | 长沙牧泰莱电路技术有限公司 | Production method of asymmetric PCB (printed circuit board) |
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|---|---|---|---|---|
| CN103179807B (en) * | 2013-03-07 | 2015-12-02 | 深圳崇达多层线路板有限公司 | A kind of method improving blind buried via hole PCB warpage |
| CN104661436B (en) * | 2015-02-06 | 2019-04-30 | 深圳市五株科技股份有限公司 | Printed circuit board blind slot processing method |
| CN106455368A (en) * | 2016-11-25 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Production method for first-order HDI (high density interconnector) resin plug hole circuit board |
| CN110300498A (en) * | 2019-06-26 | 2019-10-01 | Oppo广东移动通信有限公司 | A kind of multilayer circuit board laminated structure |
| CN110809376A (en) * | 2019-10-22 | 2020-02-18 | 胜宏科技（惠州）股份有限公司 | Process flow for replacing HDI plate back drill |
| CN111343800B (en) * | 2020-03-18 | 2023-03-24 | 四川英创力电子科技股份有限公司 | Processing technology for local electroplating of blind buried hole |
| CN111757602A (en) * | 2020-06-02 | 2020-10-09 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of blind hole |
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| CN101365291A (en) * | 2007-03-23 | 2009-02-11 | 华为技术有限公司 | Printed circuit board, design method thereof and terminal product main board |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
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Cited By (2)
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| CN102858098A (en) * | 2012-08-20 | 2013-01-02 | 长沙牧泰莱电路技术有限公司 | Production method of asymmetric PCB (printed circuit board) |
| CN102858098B (en) * | 2012-08-20 | 2015-07-29 | 长沙牧泰莱电路技术有限公司 | The manufacture method of asymmetric PCB |
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Address after: 514768 Guangdong Province, Meizhou Dongsheng Industrial Park B District of Meizhou fm-true Electronics Co. Ltd. Applicant after: Bomin Electronic Co., Ltd. Address before: 514768 Guangdong Province, Meizhou Dongsheng Industrial Park B District of Meizhou fm-true Electronics Co. Ltd. Applicant before: Meizhou Bomin Electronic Co., Ltd. |
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Effective date of registration: 20170207 Address after: 514768 Guangdong city of Meizhou Province Dongsheng Industrial Park B District Patentee after: Bomin Electronic Co., Ltd. Patentee after: JIANGSU BOMIN ELECTRONICS CO., LTD. Address before: 514768 Guangdong Province, Meizhou Dongsheng Industrial Park B District of Meizhou fm-true Electronics Co. Ltd. Patentee before: Bomin Electronic Co., Ltd. |