CN103037637A - Multilayer circuit board and manufacture method of multilayer circuit board - Google Patents
Multilayer circuit board and manufacture method of multilayer circuit board Download PDFInfo
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- CN103037637A CN103037637A CN201110291783XA CN201110291783A CN103037637A CN 103037637 A CN103037637 A CN 103037637A CN 201110291783X A CN201110291783X A CN 201110291783XA CN 201110291783 A CN201110291783 A CN 201110291783A CN 103037637 A CN103037637 A CN 103037637A
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Abstract
The invention provides a manufacture method of a multilayer circuit board. The manufacture method of the multilayer circuit board comprises the steps of providing multiple circuit boards with electroplating holes, providing multiple bonding sheets with conductive paste plug holes, alternately overlapping the multiple circuit boards and the multiple bonding sheets to form a pre-pressing circuit board with preserved layers, and pressing the pre-pressing circuit board to obtain the multiple circuit board. The invention further provides the multiple circuit board manufactured by means of the manufacture method. By means of the manufacture method of the multilayer circuit board, the manufacture time of the circuit board can be greatly shortened, the yield can be improved, blind holes and buried holes can be conveniently formed, and the manufacture cost of the circuit board can be saved.
Description
Technical field
The present invention relates to the circuit board making technology, relate in particular to the manufacture method of a kind of multilayer circuit board and multilayer circuit board.
Background technology
Along with the development of electronic product toward miniaturization, high speed direction, circuit board is also from single-sided circuit board, double-sided PCB toward the multilayer circuit board future development.Multilayer circuit board refers to have the circuit board of multilayer conductive circuit, it has more wiring area, higher interconnect density, thereby be widely used, referring to document Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
At present, the multilayer circuit board with blind hole or buried via hole adopts Layer increasing method to make usually, that is, the mode that is layering is made.The method that traditional Layer increasing method is made the multilayer circuit board with blind hole or buried via hole comprises: the first step, make an inner plating, this inner plating comprises that one deck insulating material forms at least one first through hole by boring the flow processs such as through hole and plating with at least two outermost conducting wire layers on the described inner plating at least.Second step, at the outermost conducting wire of inner plating layer difference pressing one copper foil layer, wherein said copper foil layer is combined with the outermost conducting wire of described inner plating layer by bonding sheet, the described copper foil layer of etching forms circuit, form a multi-layer sheet, at least one first through hole of this on the described inner plating becomes buried via hole at this moment; The 3rd step formed at least one blind hole with methods such as laser drill at described multiple-plate bonding lamella, electroplated the outermost conducting wire layer conducting that this at least one blind hole makes described copper foil layer and described inner plating; The 4th one at described multi-layer sheet by boring the flow processs such as through hole and plating, form at least one second through hole.So just, obtain a multi-layer sheet with blind buried via hole.If need the multi-layer sheet of more multi-layered number, according to the method in the second to three step, continue the copper foil layer surface pressing Copper Foil at described multilayer laminated boards plate, thereby obtain the more multi-layered multi-layer sheet with blind buried via hole.
Obviously, in above-mentioned multiple-plate manufacturing process with blind buried via hole, whenever once increase layer, all need to carry out the one step press process, when making the wiring board of the more number of plies, the pressing number of times is also corresponding more, be unfavorable for like this simplification of technical process, cost of manufacture is also relatively high.
Summary of the invention
In view of this, be necessary to provide a kind of mode by one step press to make the method for the multilayer circuit board with blind hole or buried via hole, and the resulting multilayer circuit board with blind hole or buried via hole of method thus.
A kind of manufacture method of multilayer circuit board, it may further comprise the steps: a plurality of wiring boards are provided, and each described wiring board all offers at least one through hole, is filled with conductive paste in each described at least one through hole; A plurality of bonding sheets are provided, all offer at least one through hole on each described bonding sheet, in each described at least one through hole, be filled with conductive paste; Described a plurality of wiring boards and described a plurality of bonding sheet be superimposed forms the pre-pressing circuit board of predetermined number of layers, so that be combined with respectively at least one described bonding sheet between adjacent two wiring boards in this pre-pressing circuit board; And pre-pressing circuit board obtained above carried out pressing, obtain multilayer circuit board.
A kind of multilayer circuit board, comprise that a plurality of conducting wires layer reaches and the spaced a plurality of insulating barrier of described a plurality of conducting wires layer, offer respectively at least one through hole on the same position of the insulating barrier between any two conducting wire layers reach therein, be filled with conductive paste in described at least one through hole, described conductive paste is communicated with corresponding described two conducting wire layers.
The circuit board of the technical program and the manufacture method of circuit board have following advantage: adopt conductive paste that the wiring board of boring is carried out consent, form the wiring board of interlayer conduction, save plating, saved cost; A plurality of wiring boards with conductive paste consents and bonding sheet one step presses are formed multi-layer sheet, can not only conveniently obtain blind hole and buried via hole, the greatly Production Time of reduction circuit plate and required labour improve the productive rate of circuit board.
Description of drawings
Fig. 1 is the cutaway view of the copper-clad base plate that provides of the technical program execution mode.
Fig. 2 is the cutaway view after the copper-clad base plate perforate that provides of the technical program execution mode.
Fig. 3 is the cutaway view after the copper-clad base plate that provides of the technical program execution mode forms circuit.
Fig. 4 is the cutaway view of the first double-sided wiring board that filled conductive cream forms in the copper-clad base plate hole that provides of the technical program execution mode.
Fig. 5 is the cutaway view of the second double-sided wiring board of providing of the technical program execution mode.
Fig. 6 is the cutaway view of the 3rd double-sided wiring board that provides of the technical program execution mode.
Fig. 7 is the cutaway view of the first bonding sheet of providing of the technical program execution mode.
Fig. 8 is the cutaway view of the second bonding sheet of providing of the technical program execution mode.
Fig. 9 is the cutaway view of the pre-pressing circuit board that provides of the technical program execution mode.
Figure 10 is the cutaway view of the 6-layer circuit board that provides of the technical program execution mode.
The main element symbol description
| The first copper- |
10a |
| The first |
101a |
| The |
102a |
| The second |
103a |
| The |
104a |
| The |
105a |
| The |
106a |
| The first conducting |
107a |
| The second conducting |
108a |
| The |
109a |
| The |
110a |
| The first double-sided |
20a |
| The |
102b |
| The |
104b |
| The |
105b |
| The |
106b |
| The 3rd conducting |
107b |
| The 4th conducting |
108b |
| The |
109b |
| The |
110b |
| The second double-sided |
20b |
| The |
102c |
| The |
104c |
| The |
105c |
| The |
106c |
| The 5th conducting |
107c |
| The 6th conducting |
108c |
| The |
109c |
| The |
110c |
| The 3rd double-sided |
20c |
| The |
30a |
| The |
301a |
| Seven apertures in the |
302a |
| The |
303a |
| The |
30b |
| The |
301b |
| Octal |
302b |
| The |
303b |
| The |
304b |
| The |
305b |
| The pre-pressing multi-layer sheet | 40a |
| Bogey | 41 |
| |
410 |
| |
411 |
| 6- |
40 |
| The first |
401 |
| |
402 |
| Buried via |
403 |
| The second |
404 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with drawings and Examples, the circuit board that the technical program is provided as an example of the making 6-layer circuit board example and the manufacture method of circuit board are described in further detail.
The manufacture method of described 6-layer circuit board may further comprise the steps:
The first step provides one first copper-clad base plate 10a.
See also Fig. 1, one first copper-clad base plate 10a is provided, described the first copper-clad base plate 10a is the double-sided copper-clad substrate, and it comprises the first insulating barrier 102a and is formed at respectively the first conductive layer 101a and the second conductive layer 103a on relative two surfaces of described the first insulating barrier 102a.Described the first copper-clad base plate 10a can be glass fiber fabric base clad copper base, paper substrate copper-clad base plate, composite base copper-clad base plate, aramid fiber nonwoven fabric base copper-clad base plate or synthetic fibers base copper-clad base plate etc.
Second step is offered one first 104a of hole section, one second 105a of hole section and a plurality of the first location hole 106a at described the first copper-clad base plate 10a.
See also Fig. 2, adopt the method for laser drill or machine drilling to offer one first 104a of hole section, one second 105a of hole section and a plurality of the first location hole 106a at described the first copper-clad base plate 10a.Described the first 104a of hole section and the second 105a of hole section are through hole, and it all connects described the first conductive layer 101a, the first insulating barrier 102a and the second conductive layer 103a.Described the first location hole 106a also connects described the first conductive layer 101a, the first insulating barrier 102a and the second conductive layer 103a, and described the first location hole 106a is used for the pressing process and carries out contraposition.Described the first 104a of hole section and the second 105a of hole section also can offer and be blind hole, and it penetrates described the first conductive layer 101a and the first insulating barrier 102a, do not penetrate described the second conductive layer 103a.Be appreciated that described the first copper-clad base plate 10a also can only offer one first 104a of hole section or the first three or more 104a of hole section is set or the second 105a of hole section.
In the 3rd step, the first copper-clad base plate 10a after boring forms circuit.
See also Fig. 3, in the present embodiment, adopt the image transfer method to form photic etched pattern at described the first conductive layer 101a and the second conductive layer 103a surface; Then, via methods such as chemical liquid etching or laser ablations described the first conductive layer 101a and the second conductive layer 103a are formed respectively the first conducting wire layer 107a and the second conducting wire layer 108a.
The 4th step saw also Fig. 4, filled respectively full conductive paste in described the first 104a of hole section and described the second 105a of hole section, formed the first consent thing 109a and the second consent thing 110a, obtained one first double-sided wiring board 20a.
Conductive paste can be copper cream, silver paste or carbon paste etc., is preferably copper cream.In the present embodiment, conductive paste adopts the method for screen painting to be filled among the first 104a of hole section and the second 105a of hole section, wherein the pattern of half tone is corresponding with the first 104a of hole section and the second 105a of hole section, so that conductive paste sees through pattern fills on the half tone in the first 104a of hole section and the second 105a of hole section, after conductive paste further solidifies, form the first consent thing 109a and the second consent thing 110a, and then obtain one first double-sided wiring board 20a.Described the first conducting wire layer 107a and the second conducting wire layer 108a realize conducting by the first consent thing 109a in described the first 104a of hole section and the second consent thing 110a in the second 105a of hole section.
Described conductive paste can be filled in to the first insulating barrier 102a and the second conducting wire layer 108a from described the first conducting wire layer 107a, also can fill in to the first insulating barrier 102a and the first conducting wire layer 107a from described the second conducting wire layer 108a, recommendation is after described the first conducting wire layer 107a fills in to insulating barrier and the second conducting wire layer 108a, fill in to insulating barrier and the first conducting wire layer 107a from described the second conducting wire layer 108a again, or two actions carry out simultaneously, so that conductive paste can not have described the first 104a of hole section of filling up of space and the second 105a of hole section.
Before printing conductive cream; also can on described the first conducting wire layer 107a and the second conducting wire layer 108a, form respectively removable diaphragm; described diaphragm leaves two through holes in the position corresponding with described the first 104a of hole section and the second 105a of hole section; see through the full plate printing conductive of half tone cream; conductive paste is printed onto on the described diaphragm; and conductive paste is filled among the first 104a of hole section and the second 105a of hole section the described diaphragm of rear removal by two through holes on the described diaphragm.Described diaphragm recommendation peelable glue, the diameter of two described through holes are recommended identical or be slightly larger than respectively the diameter of described the first 104a of hole section and the second 105a of hole section respectively with the diameter of described the first 104a of hole section and the second 105a of hole section.
The step that is appreciated that filled conductive cream also can be carried out before the step that namely formed circuit before above-mentioned the 3rd step, was not limited to present embodiment.
In the 5th step, form one second double-sided wiring board 20b.
See also Fig. 5.Method with reference to four steps of the first step to the forms one second double-sided wiring board 20b.Described the second double-sided wiring board 20b comprises the second insulating barrier 102b and is formed at respectively the 3rd conducting wire layer 107b and the 4th conducting wire layer 108b on relative two surfaces of described the second insulating barrier 102b, offer the 3rd 104b of hole section, the 4th 105b of hole section and a plurality of the second location hole 106b on described the second double-sided wiring board 20b, described the 3rd 104b of hole section, the 4th 105b of hole section and a plurality of the second location hole 106b all connect described the 3rd conducting wire layer 107b, the second insulating barrier 102b and the 4th conducting wire layer 108b.Described the 4th 105b of hole section is corresponding with described the second hole section 105a position.Form the 3rd consent thing 109b and the 4th consent thing 110b thereby fill to expire by printing conductive cream respectively in described the 3rd 104b of hole section and the 4th 105b of hole section, described the 3rd consent thing 109b and the 4th consent thing 110b are all with described the 3rd conducting wire layer 107b and the 4th conducting wire layer 108b conducting.Described a plurality of the second location hole 106b is corresponding with described a plurality of the first location hole 106a positions respectively.In addition, described the 3rd 104b of hole section and the 4th 105b of hole section also can offer and be blind hole, and it only penetrates described the 3rd conducting wire layer 107b and the second insulating barrier 102b, do not penetrate described the 4th conducting wire layer 108b.Also can only establish one the 3rd 104b of hole section on described the second double-sided wiring board 20b or three or more the 3rd 104b of hole section are set or the 4th 105b of hole section.
In the 6th step, form one the 3rd double-sided wiring board 20c.
See also Fig. 6, the method that goes on foot with reference to the first step to the four forms one the 3rd double-sided wiring board 20c.Described the 3rd double-sided wiring board 20c comprises the 3rd insulating barrier 102c and is formed at respectively the 5th conducting wire layer 107c and the 6th conducting wire layer 108c on relative two surfaces of described the 3rd insulating barrier 102c, offer the 5th 104c of hole section on described the 3rd double-sided wiring board 20c, the 6th 105c of hole section is to reaching a plurality of the 3rd location hole 106c, described the 5th 104c of hole section connects described the 3rd insulating barrier 102c and the 6th conducting wire layer 108c and does not link to each other with circuit on the 5th conducting wire layer 107c, and described the 6th 105c of hole section and a plurality of the 3rd location hole 106c all connect described the 5th conducting wire layer 107c, the 3rd insulating barrier 102c and the 6th conducting wire layer 108c.Described the 6th 105c of hole section is corresponding with described the second hole section 105a position.Form the 5th consent thing 109c and the 6th consent thing 110c by printing conductive cream respectively in described the 5th 104c of hole section and the 6th 105c of hole section, described the 6th consent thing 110c is with described the 5th conducting wire layer 107c and the 6th conducting wire layer 108c conducting.Described a plurality of the 3rd location hole 106c is corresponding with described a plurality of the first location hole 106a positions respectively.Described the 6th 105c of hole section also can offer and be blind hole, it penetrates described the 6th conducting wire layer 108c and the 3rd insulating barrier 102c, do not penetrate described the 5th conducting wire layer 107c, can only establish one the 5th 104c of hole section on described the 3rd double-sided wiring board 20c yet or three or more the 5th 104c of hole section are set or the 6th 105c of hole section.
The 7th step provided one first bonding sheet 30a, at described the first bonding sheet 30a boring and filled conductive cream.
See also Fig. 7.One first bonding sheet 30a is provided, described the first bonding sheet 30a is prepreg, and it can be glass-fiber-fabric prepreg, paper substrate prepreg, composite base prepreg, aramid fiber nonwoven fabrics prepreg, synthetic fibers prepreg or pure resin prepreg etc.The quantity of described the first bonding sheet 30a also can for a plurality of, generally be selected according to the needs of the designs such as multi-layer sheet thickness.
Adopt the method for laser drill or machine drilling to offer a 302a of seven apertures in the human head section and a plurality of the 4th location hole 301a at described the first bonding sheet 30a.The described seven apertures in the human head 302a of section connects described the first bonding sheet 30a.The described seven apertures in the human head 302a of section is corresponding with described the second hole section 105a position.Described the 4th location hole 301a also connects described the first bonding sheet 30a, and described a plurality of the 4th location hole 301a are corresponding with described a plurality of the first location hole 106a positions respectively, is used for the pressing process and carries out contraposition.The quantity of the described seven apertures in the human head 302a of section also can be designed to a plurality of as required.
Adopt the method for screen painting that conductive paste is filled into formation the 7th consent thing 303a among the described seven apertures in the human head 302a of section.Method for plugging please refer to for the 4th step.
The 8th step provided one second bonding sheet 30b, at described the second bonding sheet 30b boring and filled conductive cream.
See also Fig. 8.With reference to the 7th step, in the present embodiment, provide one second bonding sheet 30b, adopt the method for laser drill or machine drilling to offer a 302b of octal section, one the 9th 303b of hole section and a plurality of the 5th location hole 301b at described the second bonding sheet 30b.The described octal 302b of section and the 9th 303b of hole section connect described the second bonding sheet 30b.The described octal 302b of section is corresponding with described the 5th hole section 104c position, and described the 9th 303b of hole section is corresponding with described the second hole section 105a position.Described the 5th location hole 301b also connects described the second bonding sheet 30b, and described a plurality of the 5th location hole 301b are corresponding with described a plurality of the first location hole 106a positions respectively, is used for the pressing process and carries out contraposition.The quantity of described the second bonding sheet 30b also can for a plurality of, generally be selected according to the needs of the designs such as multi-layer sheet thickness.Certainly, described the second bonding sheet 30b also can only arrange the described octal 302b of section, or the three or more octal 302b of section or the 9th 303b of hole section are set.
Adopt the method for screen painting that conductive paste is filled into formation the 8th consent thing 304b and the 9th consent thing 305b among the described octal 302b of section and the 9th 303b of hole section, the fill method of fill method and the conductive paste in the 4th step is similar.
In the 9th step, superimposed above-mentioned the first to the 3rd double- sided wiring board 20a, 20b, 20c and the first and second bonding sheet 30a, 30b form pre-pressing multi-layer sheet 40a.
See also Fig. 9, above-mentioned wiring board and bonding sheet are carried out superimposed, described lamination process needs a bogey 41, and described bogey 41 comprises a planar support substrate 410 and perpendicular to a plurality of pilot pins 411 of substrate.Concrete lamination process comprises: the surface that described the 3rd double-sided wiring board 20c is arranged on support base 410, and so that described a plurality of the 3rd location hole 106c is sheathed on respectively a plurality of pilot pins 411, described like this 3rd double-sided wiring board 20c can be positioned on the surface of support base 410, and the Surface Contact of described the 3rd double-sided wiring board 20c and support base 410; Then, superimposed the second bonding sheet 30b successively on described the 3rd double-sided wiring board 20c, the second double-sided wiring board 20b, the first bonding sheet 30a and the first double-sided wiring board 20a, make described the 5th location hole 301b, the second location hole 106b, the 4th location hole 301a and the first location hole 106a are sheathed on pilot pin 411 successively, at this moment, described the second 105a of hole section, the 302a of seven apertures in the human head section, the 4th 105b of hole section, the 9th 303b of hole section and the 6th 105c of hole section align at the bearing of trend that is parallel to described pilot pin, described the 5th 104c of hole section is corresponding with the described octal 302b of section, forms pre-pressing multi-layer sheet 40a.
The tenth step, above-mentioned pre-pressing multi-layer sheet 40a is carried out pressing, form 6-layer circuit board 40.
See also Figure 10.Utilize pressing machine that above-mentioned superimposed resulting pre-pressing multi-layer sheet 40a is carried out one step press, thereby obtain 6-layer circuit board 40.
Prefabricating plate 40a resulting 6-layer circuit board 40 after pressing comprises the first to the 6th conducting wire layer 107a of being arranged in order, 108a, 107b, 108b, 107c, 108c and with the first to the 6th conducting wire layer 107a, 108a, 107b, 108b, 107c, the first to the 5th insulating barrier 102a of 108c space, 30a, 102b, 30b, 102c.Described the first conducting wire layer 107a and the second conducting wire layer 108a be by described the first consent thing 109a conducting, and described the first consent thing 109a not with other conducting wire layer conducting, described the first 104a of hole section has formed the first blind hole 401.Described the second consent thing 110a, the 7th consent thing 303a, the 4th consent thing 110b, the 9th consent thing 305b and the 6th consent thing 110c are with described the first conducting wire layer 107a, the second conducting wire layer 108a, the 3rd conducting wire layer 107b, the 4th conducting wire layer 108b, the 5th conducting wire layer 107c and the 6th conducting wire layer 108c conducting, and described the second 105a of hole section, the 302a of seven apertures in the human head section, the 4th 105b of hole section, the 9th 303b of hole section and the 6th 105c of hole section conducting form a via 402.Described the 3rd conducting wire layer 107b and the 4th conducting wire layer 108b be by described the 3rd consent thing 109b conducting, and described the 3rd consent thing 109b not with other conducting wire layer conducting, described the 3rd 104b of hole section has formed buried via hole 403.Described the 5th 104c of hole section does not link to each other with described the 5th conducting wire layer 107c, described the 5th consent thing 109c and the 8th consent thing 304b are with described the 4th conducting wire layer 108b and the 6th conducting wire layer 108c conducting, and described the 5th 104c of hole section and the 302b of octal section conducting form the second blind hole 404.Be appreciated that, the position of blind hole, buried via hole and through hole in the above-mentioned 6-layer circuit board 40 can arrange according to the needs of concrete 6-layer circuit board 40, the conducting wire layer of described blind hole, buried via hole and the conducting of through hole institute also can arrange as required, realizes each layer interconnection, is not limited to present embodiment.
In the present embodiment, the first bonding sheet 30a and the second bonding sheet 30b all adopt the semi-solid preparation film, in the pressing process, because the semi-solid preparation material has certain flowability, all embed through described the second conducting wire layer 108a of pressing process, the 3rd conducting wire layer 107b, the 4th conducting wire layer 108b and the 5th conducting wire layer 107c in the insulating barrier of the first bonding sheet 30a and the second bonding sheet 30b formation, thereby each layer combined closely.
When making the multilayer circuit board of other number of plies, the quantity that only need increase or reduce above-mentioned double face copper and bonding sheet with reference to the manufacture method of foregoing circuit plate gets final product.In addition, one or more in the double face copper in the above-mentioned manufacturing method of multi-layer circuit board also can replace with multi-layer sheet, form at last the more multilayer circuit board of the number of plies, are not limited to present embodiment.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. the manufacture method of a multilayer circuit board, it may further comprise the steps:
A plurality of wiring boards are provided, and each described wiring board all offers at least one through hole, is filled with conductive paste in each described at least one through hole;
A plurality of bonding sheets are provided, all offer at least one through hole on each described bonding sheet, in each described at least one through hole, be filled with conductive paste;
Described a plurality of wiring boards and described a plurality of bonding sheet be superimposed forms the pre-pressing circuit board of predetermined number of layers, so that be combined with respectively at least one described bonding sheet between adjacent two wiring boards in this pre-pressing circuit board; And
Pre-pressing circuit board obtained above is carried out pressing, obtain multilayer circuit board.
2. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, provides the step of a plurality of wiring boards to comprise:
A plurality of copper-clad base plates are provided;
Offer described at least one through hole at each copper-clad base plate;
Copper-clad base plate after offering described at least one through hole forms circuit; And
Filled conductive cream in described at least one through hole.
3. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, at least one in described a plurality of wiring boards is multilayer circuit board.
4. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, at least one in the described wiring board is double-sided wiring board.
5. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, described bonding sheet is prepreg.
6. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterized in that, the fill method of the conductive paste on described wiring board or the bonding sheet is: a web plate is provided, through hole on pattern on the described web plate and the described wiring board or the position of the through hole on the described bonding sheet are corresponding, conductive paste are filled in the through hole of described wiring board by the pattern printing on the described web plate or in the through hole of described bonding sheet.
7. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterized in that, the fill method of the conductive paste on described wiring board and the bonding sheet is: form respectively a diaphragm on described wiring board and bonding sheet, diaphragm corresponding to described wiring board offers the filler opening corresponding with the through hole of described wiring board, offers corresponding filler opening with the through hole of described bonding sheet corresponding to the diaphragm of described bonding sheet; The half tone that corresponds respectively to described wiring board and described bonding sheet is provided, conductive paste is filled in the through hole of the through hole of described wiring board and described bonding sheet by the filler opening on half tone and the described diaphragm successively; Remove described diaphragm.
8. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, described conductive paste is copper cream, silver paste or carbon paste.
9. multilayer circuit board of making of each described manufacture method of claim 1 to 8, it is characterized in that, described circuit board comprises that a plurality of conducting wires layer reaches and the spaced a plurality of insulating barrier of described a plurality of conducting wires layer, insulating barrier between two conducting wire layers of arbitrary neighborhood reach therein has at least one through hole corresponding to position, be filled with conductive paste in described at least one through hole, described adjacent two conducting wire layers of described conductive paste electrical communication.
10. multilayer circuit board as claimed in claim 9 is characterized in that, described conductive paste is copper cream, silver paste or carbon paste.
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| CN201110291783XA CN103037637A (en) | 2011-09-30 | 2011-09-30 | Multilayer circuit board and manufacture method of multilayer circuit board |
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| CN201110291783XA CN103037637A (en) | 2011-09-30 | 2011-09-30 | Multilayer circuit board and manufacture method of multilayer circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015154240A1 (en) * | 2014-04-09 | 2015-10-15 | 史利利 | Multilayer circuit board |
| CN108811370A (en) * | 2017-05-05 | 2018-11-13 | 中华精测科技股份有限公司 | The manufacturing method of high-frequency multi-layer circuit board |
| CN111328215A (en) * | 2020-02-21 | 2020-06-23 | 竞华电子(深圳)有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN111511106A (en) * | 2020-05-21 | 2020-08-07 | 罗真旗 | L ED double-sided circuit board with low-resistance carbon oil filling hole and carbon oil filling hole conduction processing method thereof |
| CN111542178A (en) * | 2020-05-13 | 2020-08-14 | 上海泽丰半导体科技有限公司 | Manufacturing process of multilayer circuit board and multilayer circuit board |
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| WO2015154240A1 (en) * | 2014-04-09 | 2015-10-15 | 史利利 | Multilayer circuit board |
| CN108811370A (en) * | 2017-05-05 | 2018-11-13 | 中华精测科技股份有限公司 | The manufacturing method of high-frequency multi-layer circuit board |
| CN108811370B (en) * | 2017-05-05 | 2020-11-24 | 中华精测科技股份有限公司 | Method for manufacturing high-frequency multilayer circuit board |
| CN111328215A (en) * | 2020-02-21 | 2020-06-23 | 竞华电子(深圳)有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN111542178A (en) * | 2020-05-13 | 2020-08-14 | 上海泽丰半导体科技有限公司 | Manufacturing process of multilayer circuit board and multilayer circuit board |
| CN111542178B (en) * | 2020-05-13 | 2021-07-16 | 上海泽丰半导体科技有限公司 | Manufacturing process of multilayer circuit board and multilayer circuit board |
| CN111511106A (en) * | 2020-05-21 | 2020-08-07 | 罗真旗 | L ED double-sided circuit board with low-resistance carbon oil filling hole and carbon oil filling hole conduction processing method thereof |
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Application publication date: 20130410 |