JP2011155183A - Method for manufacturing printed wiring board, apparatus for manufacturing printed wiring board, and printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To detect that a board and a member are set to be opposedly facing in a wrong direction. <P>SOLUTION: A method for manufacturing a printed circuit board has a process to set in a predetermined position a board body 1 in which a plurality of marks 13, 14 for position alignment formed in a processing region P that is in a relation of point symmetry which makes the center of the processing region P of a main plane 1A of the board body 1 in which the relative position is set with members 20, 30, as a symmetry point Q, or that is in a relation of line symmetry which makes straight lines including middle point of two facing sides of the processing region and the symmetry point Q as symmetry axes Ra, Rb and marks 11, 12 for determining front and rear formed in a non-symmetry region that is not in the relation of point symmetry and is not in the relation of line symmetry with either of these are formed, a process to set the members 20, 30 in which marks 21, 32 for determining member side front and rear are formed in an opposedly facing position of the marks 11, 12 for determining front and rear in the opposedly facing position of the board body 1, and a process to determine whether the opposedly facing direction of the members 20, 30 and the board body 1 is correct or wrong based on the position relation of the marks 11, 12 for front and rear determination and marks 21, 32 for member side front and rear determination. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a printed wiring board manufacturing method, a printed wiring board manufacturing apparatus, and a printed wiring board in which processing is performed using a member on a main surface of the printed wiring board.

  A method in which the alignment mark provided on the printed circuit board is imaged with a CCD camera, and the mask alignment mark provided on the photomask is imaged with a CCD camera, and the positions of the two are compared to align the photomask and the substrate. Is known (Patent Document 1).

JP 2002-333721 A

  By the way, when processing the main surface of the printed wiring board using a member such as a photomask, it is necessary to set both the printed wiring board and the orientation and position of the member correctly, and the operator can set the board or member. If the orientation (front and back and / or up / down / left / right directions) is wrong, the positions of the contacts and the circuit are shifted, and a desired printed wiring board cannot be obtained.

  In addition, when processing both main surfaces of the printed wiring board using members, after finishing the processing of one main surface, the substrate is turned over and the other main surface is processed. If the wrong side is used, the board and members are set in an incorrect combination, or contacts and circuits are formed on the main surface, so that a desired printed wiring board cannot be obtained.

  Similarly, when processing is performed on both main surfaces of the printed wiring board using members, if the operator turns the board upside down, the board is set in the wrong direction, so it is formed on one main surface. Since the position of the contact or circuit is shifted from the position of the contact or circuit formed on the other main surface, a desired printed wiring board cannot be obtained.

  However, it is difficult to completely prevent the occurrence of such a human error. When a human error occurs, a desired printed wiring board cannot be obtained, and the materials used for the substrate and processing and the processing work are not required. There is a problem that the labor done is wasted.

  Incidentally, an alignment mark is provided on the substrate in order to prevent displacement of contacts and circuits. However, when the alignment mark is provided with point symmetry with respect to the center of the substrate or line symmetry with respect to the center line of the substrate, the position of the alignment mark does not change even if the orientation of the substrate and the member is incorrect. . Therefore, there is an inconvenience that it cannot be detected that the board and the member are set in the wrong direction.

  The problem to be solved by the present invention is to provide a printed wiring board manufacturing method, a manufacturing apparatus thereof, and a printed wiring board capable of detecting that a board or member is set in an incorrect direction.

  The present invention is a method for manufacturing a printed wiring board in which processing is performed using a member on a main surface of a substrate body of the printed wiring board, and a processing region of the main surface of the substrate body in which a relative position is set with the member A plurality of positions formed in a symmetric region having a point symmetry with the center of the point of symmetry, or a line symmetric relationship with a straight line including the symmetry point and a midpoint of two opposite sides of the processing region as a symmetry axis A substrate body on which an alignment mark and at least one front / back determination mark are formed in an asymmetric region that is not in the point-symmetrical relationship or the line-symmetrical relationship with any of the alignment marks is placed at a predetermined position. A step of setting, a step of setting the member on which a member-side front / back determination mark is formed at a position corresponding to the front / back determination mark of the substrate body at a position opposed to the substrate body, and the front / back determination mark; The member side Based on the positional relationship between the back judgment marks, by providing a method for manufacturing a printed wiring board having a determination step of determining relative orientation of correctness of the substrate main body and the member, to solve the above problems.

In the above invention, the front / back determination mark is formed by providing a through hole in the substrate body, and the member is smaller than the diameter of the through hole at a position corresponding to the front / back determination mark of the substrate body. A light-shielding member-side front / back determination mark is formed, and the determination step includes a step of imaging a region of the substrate body including the front / back determination mark of the front / back determination mark, and the captured image. And determining the correctness of the relative orientation between the substrate body and the member based on the image of the front / back determination mark and the image of the member-side front / back determination mark included in the table.

In the above invention, the front / back determination mark is formed by providing a through-hole in the substrate body, and the member has a translucent or light-shielding property at a position corresponding to the front / back determination mark of the substrate body. A member-side front / back determination mark is formed, and the center of the processing area of the member where the relative position to the substrate body is set with respect to the translucent or light-shielding member-side front / back determination mark is a symmetric point Or a symmetrical region having a line-symmetrical relationship with the symmetry point and a straight line including the midpoints of the two opposite sides of the processing region as the symmetry axis. A light-blocking or translucent member-side front / back determination mark opposite to the member-side front / back determination mark is formed, and the determination step includes irradiating the front / back determination mark of the substrate body with light, Front / back determination mark A step of detecting light passing through the front / back determination mark when irradiated with light, and a step of determining whether the relative direction between the substrate body and the member is correct based on the detection result of the light. Can be.

In the above invention, a member-side alignment mark is formed on the member at a position corresponding to the alignment mark of the substrate body, and after the step of setting the member at a position facing the substrate body, And determining whether or not the relative position between the substrate body and the member is appropriate based on the positional relationship between the alignment mark and the member-side alignment mark.

  The present invention is a printed wiring board manufacturing apparatus that performs processing using a member on a main surface of a substrate body of a printed wiring board, and a processing region of a main surface of the substrate body in which a relative position to the member is set. A plurality of alignments formed in a symmetric region having a point symmetry with a center as a symmetric point, or a line symmetric relationship with a straight line including the symmetric point and a midpoint of two opposite sides of the processing region as a symmetric axis A substrate body on which one or more front / back determination marks are formed in an asymmetric region that is not in the point-symmetrical relationship or the line-symmetrical relationship with either the mark for positioning or the alignment mark is held at a predetermined position. A first holding means; a second holding means for holding the member on which the member side front / back determination mark is formed at a position corresponding to the front / back determination mark of the substrate main body at a position opposed to the substrate main body; Judgment mark and the above The printed circuit board manufacturing apparatus according to the present invention solves the above-mentioned problems by providing a front and back judgment means for judging whether the relative orientation of the board body and the member is correct based on the positional relationship with the material side front and back judgment marks. can do.

In the above invention, the front / back determination mark is formed by providing a through hole in the substrate body, and the member is smaller than the diameter of the through hole at a position corresponding to the front / back determination mark of the substrate body. A light-shielding member-side front / back determination mark is formed, and the determination unit includes a camera that captures an area of the substrate body including the front / back determination mark of the front / back determination mark, and the captured image. A front / back determination unit that determines whether the relative orientation of the substrate body and the member is correct based on the image of the front / back determination mark and the image of the member-side front / back determination mark included in .

In the above invention, there is further provided a moving mechanism for reciprocating the camera between a first position facing the front / back determination mark and a second position facing the alignment mark. Can be provided.

In the above invention, the front / back determination mark is formed by providing a through-hole in the substrate body, and the member has a translucent or light-shielding property at a position corresponding to the front / back determination mark of the substrate body. A member-side front / back determination mark is formed, and the center of the processing area of the member where the relative position to the substrate body is set with respect to the translucent or light-shielding member-side front / back determination mark is a symmetric point Or a symmetrical region having a line-symmetrical relationship with the symmetry point and a straight line including the midpoints of the two opposite sides of the processing region as the symmetry axis. A light-shielding or translucent member-side front / back determination mark opposite to the member-side front / back determination mark is formed, and the determination unit includes an irradiation device that irradiates the front / back determination mark of the substrate body with light. , The front and back judgment A light transmission sensor that detects light passing through the front and back determination marks when light is irradiated to the front and back, and based on the detection result of the light, determines whether the relative orientation of the substrate body and the member is correct or incorrect And a determination unit.

In the above invention, the member is formed with a member-side alignment mark at a position corresponding to the alignment mark of the substrate body, and the determination means sets the member at a position facing the substrate body. A position determination unit that determines whether the relative position between the substrate body and the member is appropriate based on a positional relationship between the alignment mark and the member-side alignment mark in the state of it can.

The present invention includes a substrate body, and the substrate body is point-symmetric with respect to the center of the processing region of the main surface of the substrate body, the relative position of which is set with the member, or the symmetry point and the processing region. A plurality of alignment marks formed in a symmetrical region having a line symmetry with a straight line including the midpoint of the two opposite sides of the line, and both of the alignment marks are point-symmetric The above problem can be solved by providing a printed wiring board having one or more front / back determination marks in an asymmetric region that does not have the relationship and the line symmetry.

In the present invention, a front / back determination mark provided in an asymmetric area that is asymmetric with any of a plurality of alignment marks in the processing area of the main surface of the substrate body, and a position corresponding to the front / back determination mark are provided on the member side. The correctness of the orientation of the substrate body and the member can be determined based on the positional relationship with the member side front / back determination mark.

That is, since the front / back determination mark according to the present invention is provided in an asymmetric region, if the front / back and top / bottom / left / right arrangement directions of the substrate body are mistaken, the position of the front / back determination mark does not come to the normal detection position, and the alignment is performed. The mark does not come to the normal detection position of the front / back determination mark. That is, when the orientation of the substrate body and the member (front and back and / or up / down / left / right directions, hereinafter the same in this specification) is correct, the front / back determination mark and the member side front / back determination mark face each other. If the orientation is incorrect, the front / back determination mark and the member side front / back determination mark do not face each other, and the alignment mark and the member side front / back determination mark do not face each other. By observing the difference in positional relationship with the mark for use, it is possible to detect the correctness of the orientation of the substrate body and the member. As a result, it is possible to detect that the board body and the member are set in the wrong direction due to human error.

1 is a schematic diagram of an exposure apparatus according to a first embodiment of the present invention. It is the figure of the board | substrate body seen from the arrow II direction of FIG. 1, and a photomask. It is a figure which shows the example of arrangement | positioning of the mark for alignment provided in a board | substrate body. It is a figure which shows the one main surface of the board | substrate main body corresponding to A area | region of FIG. It is a figure which shows the other main surface of the board | substrate body corresponding to A area | region of FIG. It is a figure which shows the one main surface of the photomask which covers the A area | region of FIG. It is a figure which shows the other main surface of the photomask which covers A area | region of FIG. It is a figure which shows the one main surface of the substrate main body and photomask corresponding to A area | region of FIG. It is a figure which shows the other main surface of the board | substrate body and photomask corresponding to A area | region of FIG. It is sectional drawing which follows the XX line of FIG. It is sectional drawing which follows the XI-XI line of FIG. It is a figure which shows an example of the captured image of the area | region containing the mark for front and back determination. It is sectional drawing which follows the XX line | wire of FIG. 8 when the direction of a photomask is set accidentally. It is sectional drawing equivalent to sectional drawing which follows the XX line | wire of FIG. 8 of the substrate main body and photomask which concern on 2nd Embodiment of this invention. It is sectional drawing equivalent to sectional drawing which follows the XI-XI line | wire of FIG. 9 of the substrate main body and photomask which concern on 2nd Embodiment of this invention. It is a figure which shows an example of the captured image of the area | region containing the mark for front and back determination which concerns on 2nd Embodiment of this invention. It is sectional drawing equivalent to sectional drawing in alignment with the XX line of FIG. 8 when the direction of the photomask which concerns on 2nd Embodiment of this invention is set accidentally. It is a figure which shows the example of arrangement | positioning (one main surface side) of the member side alignment mark and the member side front / back determination mark of the photomask which concerns on 3rd Embodiment of this invention. It is a figure which shows the example of arrangement | positioning (the other main surface side) of the member side alignment mark and the member side front / back determination mark of the photomask which concerns on 3rd Embodiment of this invention. It is a figure which shows the state by which the photomask was opposingly arranged by the one main surface of the board | substrate main body which concerns on 3rd Embodiment of this invention. It is a figure which shows the state by which the photomask was opposingly arranged by the other main surface of the board | substrate main body which concerns on 3rd Embodiment of this invention. It is sectional drawing which follows the XXII-XXII line | wire of FIG. It is sectional drawing which follows the XXIII-XXIII line of FIG. It is sectional drawing which follows the XXII-XXII line | wire of FIG. 20 when the front and back of the photomask which concerns on 3rd Embodiment of this invention are set accidentally.

<First Embodiment>
Hereinafter, a printed wiring board manufacturing method, a printed wiring board manufacturing apparatus, and a printed wiring board according to a first embodiment of the present invention will be described with reference to the drawings.

  The method for manufacturing a printed wiring board according to the first embodiment of the present invention includes a processing step performed using a member on the main surface of the board body of the printed wiring board. In the present embodiment, an example in which the printed wiring board manufacturing apparatus according to the present invention is applied to an exposure apparatus that performs an exposure process using a photomask on a substrate body will be described.

First, the exposure apparatus 1000 according to the first embodiment of the present invention will be described.

FIG. 1 is a schematic diagram of an exposure apparatus 1000 according to the first embodiment of the present invention. The exposure apparatus 1000 according to this embodiment includes a base plate 101 and a housing 102 installed on the base plate 101. A dark room 102a is formed in the housing 102, and an illumination device 140 for exposure processing is provided on the upper surface thereof.

The exposure apparatus 1000 of this embodiment includes a transport apparatus 103 that transports the belt-shaped substrate body 1 along a predetermined transport direction T. The transport device 103 includes a feed roller 104 that feeds the strip-shaped substrate body 1 along the transport direction T, a take-up roller 105 that winds the fed strip-shaped substrate body 1, and a strip-shaped substrate body 1 for transport to the strip-shaped substrate body 1. A driving roller 107 that exerts a force, and guide rollers 106 a to 106 l that support the belt-like substrate body 1 along a conveyance path between the feeding roller 104 and the winding roller 105 are provided. These feed roller 104, take-up roller 105, drive roller 107, and guide rollers 106a to 106l constitute a substrate frame (first holding means) 110 that holds the belt-like substrate body 1. Guide rollers 106e and 106f hold the substrate body 1 in a predetermined position.

The substrate body in this embodiment is a conductor-clad laminate in which a metal foil such as copper is attached to both main surfaces of an insulating base material such as polyimide (PI) having a thickness of 10 μm to 250 μm. is there. The insulating substrate can be polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyester (PE). Note that a photosensitive material layer is formed on the main surface of the substrate main body 1 conveyed by the conveying device 103.

The exposure apparatus 1000 of this embodiment also includes a mask frame 121 that holds members such as the photomasks 20 and 30, second holding means 120 that holds the mask frame 121, and position adjustment that adjusts the position. A device 130 is provided. The position adjusting device 130 of this embodiment has a drive mechanism that moves the second holding means 120 arranged in parallel with the main surface of the substrate body 1, and based on a command from a control device (not shown), The relative position of the second holding means 120 with respect to 1 is adjusted. Thereby, members such as the photomasks 20 and 30 held by the mask frame 121 can be set at a desired position.

In the present embodiment, two different photomasks are prepared: a first photomask 20 used for the exposure process on one main surface of the substrate body 1 and a second photomask 30 used for the exposure process on the other main surface of the substrate body. Has been. In the present embodiment, the photomasks 20 and 30 are made of resin such as polyethylene terephthalate or glass. Moreover, the photomasks 20 and 30 of this embodiment are transparent.

Incidentally, in addition to the photomasks 20 and 30, the “member” in the present embodiment includes a member whose relative position to the substrate body 1 is set in the printed wiring board manufacturing process. For example, in addition to the manufacturing members (including jigs) of the printed wiring board manufacturing apparatus including the exposure apparatus 1000 as in the photomasks 20 and 30 exemplified in the present embodiment, a reinforcing plate that reinforces the substrate body 1, It also includes product parts such as a cover lay for protecting a predetermined area of the substrate body 1 and product processing materials such as dry resist used in the manufacturing process.

The transport apparatus 103 according to the present embodiment drives the driving roller 107 to feed the substrate body 1 along the transport direction T from the feed roller 104 around which the belt-like substrate body 1 is wound. The other end side of the sent substrate body 1 is taken up by the take-up roller 105. The transport device 103 stops the driving roller 107 when the processing area (the exposure area in this example) of the substrate body 1 comes to a position facing the photomasks 20 and 30.

In addition, the exposure apparatus 1000 of this embodiment includes a camera 50 provided above the second holding unit 120. Specifically, the camera 50 of the present embodiment is provided at a position corresponding to alignment marks such as alignment marks 13 and 14 and front and back determination marks 11 and 12 of the substrate body 1 described later during the exposure process. Yes. When the processing area (exposure area in this example) of the substrate body 1 comes to a position facing the photomasks 20 and 30, the camera 50 captures a predetermined area including the marks of the photomasks 20 and 30 and the substrate body 1. . Image processing is performed based on the image data of each mark imaged by the camera 50, and the photomasks 20, 30 and the substrate body 1 can be aligned based on the result.

FIG. 2 is a view showing the substrate and the photomasks 20 and 30 viewed from the direction of arrow II in FIG. 1 when the processing region P of the substrate body 1 comes to a position facing the photomasks 20 and 30. As shown in FIG. 2, a plurality of processing regions P to be exposed are formed at predetermined intervals in the longitudinal direction of the belt-shaped substrate body 1, and sequentially face the photomasks 20 and 30 by the transfer device 103. Sent to position. In the present embodiment, an example of processing a band-shaped substrate body 1 in which a plurality of processing regions P are continuously provided will be described. However, batch processing is performed on the substrate body 1 in which only one processing region is provided. However, the method according to the present embodiment can be applied.

As shown in FIG. 2, four circular first alignment marks 13 are formed in the vicinity of each vertex of the processing region P of the substrate body 1 (see also FIG. 4). Four circular second alignment marks 14 are also formed at the same position on the back surface (see also FIG. 5).

The form of the alignment marks 13, 14 is not particularly limited, and the concave first alignment mark 13 is formed at a predetermined position on one main surface of the substrate body 1 and the predetermined on the other main surface of the substrate body 1. The concave second positioning marks 14 can be separately formed at the positions. Specifically, the concave portion can be formed by removing a predetermined region of the metal foil on the surface of the substrate body 1 by an etching process.

  Further, the first alignment mark 13 and the second alignment mark 14 can be formed simultaneously by providing a through-hole at a predetermined position of the substrate body 1. Specifically, the through hole can be formed by drilling a predetermined position of the substrate body 1 using a drill or a laser.

  The member-side alignment marks 23 and 34 shown inside the alignment marks 13 and 14 in FIG. 2 are alignment marks provided on the photomasks 20 and 30 (see also FIGS. 7 and 8). ). Note that the photomasks 20 and 30 have a processing region where a predetermined resist pattern is formed, and this processing region is set at the same position in the XY coordinates as the processing region P of the substrate body 1.

Next, the alignment marks 13 and 14 provided on the substrate body 1 will be described with reference to FIG. FIG. 3 is a diagram illustrating an arrangement example of the alignment marks 13 and 14.

  As shown in FIG. 3, the alignment marks 13 and 14 of the present embodiment have a symmetry point Q at the center of the processing region P of the main surface of the substrate body 1 where the relative position to the photomasks 20 and 30 is set. It is formed in a symmetric region having a point symmetry or a line symmetric relationship in which a straight line including the symmetry point Q and the midpoint of two opposite sides of the processing region P is a symmetry axis Ra and Rb.

In the present embodiment, it is preferable to provide a plurality of alignment marks 13 and 14, and the plurality of alignment marks 13 and 14 are configured as a group of marks having a point-symmetric or line-symmetric relationship. FIG. 3 exemplifies candidate positions where the alignment marks 13 and 14 can be provided, and the position is not limited to the mode shown in FIG.

In general, the alignment marks 13 and 14 are provided at positions that are point-symmetric or line-symmetric with respect to each other, for the following reason. When processing is performed using members such as the photomasks 20 and 30, it is desirable that positioning be performed with reference to the center of the workpiece (processing area P of the substrate body 1). However, since it is impossible to provide an alignment mark at the center of the workpiece, it is necessary to set a group of alignment marks 13 and 14 that can geometrically determine the center of the workpiece. Then, the alignment marks 13 and 14 group are necessarily set at a point-symmetrical or line-symmetrical position with respect to the center of the workpiece and an axis passing through the center.

Further, front and back determination marks 11 and 12 for determining the relative orientation of the substrate body 1 and the photomasks 20 and 30 are formed in the vicinity of the alignment marks 13 and 14 of the substrate body 1. The member side front / back determination marks 21, 32 shown inside the front / back determination marks 11, 12 are marks used for front / back determination provided on the photomasks 20, 30. Incidentally, the “correction of relative orientation” between the substrate main body 1 and the photomasks 20 and 30 in this embodiment is the correctness of the front and back of the surface where the photomasks (members) 20 and 30 and the substrate main body 1 facing each other face each other. In addition, this is a concept that includes both right and left directions of the photomasks (members) 20 and 30 and the substrate body 1 that are disposed to face each other.

When the photomasks 20 and 30 are set at positions facing the substrate body 1, the illumination device 140 irradiates the main surface of the substrate body 1 with light. Thereby, the photosensitive material applied to the main surface of the substrate body 1 is exposed. By this exposure process, the patterns drawn on the photomasks 20 and 30 are transferred to the main surface of the substrate body 1 to form a resist that can be developed with an alkaline aqueous solution.

  Incidentally, the exposure apparatus 1000 of this embodiment is an apparatus that performs processing on both main surfaces of the substrate body 1. First, the exposure apparatus 1000 performs a first process using a first photomask (first member) 20 for one main surface on one main surface of the substrate body 1. Next, the operator turns over the substrate body 1 that has been subjected to the first processing and has been taken up by the take-up roller 105 so that the front and back of the processing surface are opposite to each other, and sets the substrate body 1 on the feed roller 104 again. Further, the operator replaces the first photomask 20 for one main surface with the second photomask 30 for the other main surface. After that, the exposure apparatus 1000 performs the second process again using the second photomask (second member) 30 on the other main surface of the substrate body 1.

  When the operator turns the winding roller 105 upside down and sets it again at the position of the feeding roller 104, the orientation of the substrate body 1 (front and back and / or up / down / left / right directions) may be set incorrectly. In this way, if the operator mistakes the front and back of the board, the board and members are set in the wrong combination, or contacts and circuits are formed on one main surface, so the desired printed wiring board can be Can't get.

In particular, when the substrate body 1 is not in the shape of a belt but in the form of a rectangular sheet, the operator rotates the substrate body 1 during handling, and the vertical and horizontal directions of the substrate body 1 change. There is a case. As described above, if the operator makes a mistake in the direction of the board or member (front and back and / or up / down / left / right directions), the positions of the contacts and the circuit are shifted, so that a desired printed wiring board cannot be obtained.

  Also, even if the operator sets the first photomask 20 for one main surface and the second photomask 30 for the other main surface by mistake, the contact and circuit positions are shifted, so that a desired printed wiring board can be obtained. Can't get

  While it is difficult to completely prevent the occurrence of this type of human error, if such a human error occurs, the desired printed wiring board cannot be obtained, and the material used for the substrate and processing And the labor spent on the processing work is lost.

  For this reason, in the present embodiment, even when a human error occurs, the orientations (front and back and front and back) of the substrate body 1 and the members 20 and 30 are determined based on the front and back determination marks 11 and 12 and the member side front and back determination marks 21 and 32. A method and apparatus for detecting errors in (or up / down / left / right directions) is proposed.

In the following, a method for determining whether the relative position of the substrate body 1 and the photomasks 20 and 30 in the present embodiment is correct and whether the relative orientation is correct or not will be described with reference to FIGS.

First, the alignment marks 13 and 14 and the front and back determination marks 11 and 12 provided on the substrate body 1 will be described with reference to FIGS.

4 and 5 are both views showing the main surface of the substrate body 1 corresponding to the area A in FIG. FIG. 4 is a view showing the first alignment mark 13 and the first front / back determination mark 11 provided on one main surface of the substrate body 1, and FIG. 5 is provided on the other main surface of the substrate body 1. It is the figure which shows the 2nd position alignment mark 14 and the 2nd front-and-back determination mark 12.

  As shown in FIGS. 4 and 5, four first alignment marks 13 having the same shape and size are provided in the vicinity of the apex of the processing region P on one main surface of the substrate body 1 of the present embodiment. The second alignment mark 14 is provided at the same position on the other main surface.

The board body 1 of the present embodiment is further provided with front and back determination marks 11 and 12. The front and back determination marks 11 and 12 are provided in an asymmetric region that is not point-symmetrical or line-symmetrical with any of the alignment marks 13 and 14. In the example shown in the figure, one first front / back determination mark 11 is formed on one main surface of the substrate body 1, and one second front / back determination mark 12 is formed on the other main surface. The first front / back determination mark 11 and the second front / back determination mark 12 can be formed separately on the front and back, and can also be formed simultaneously on the front and back like a through hole.

  4 and 5 are compared, the position of the first alignment mark 13 formed on one main surface of the substrate body 1 and the position of the second alignment mark 14 formed on the other main surface of the substrate body 1 are compared. The position is the same. That is, the arrangement pattern indicated by the first alignment mark group 13 on the one main surface of the substrate body 1 matches the arrangement pattern indicated by the second alignment mark group 14 on the other main surface of the substrate body 1. This is the same not only when the front and back are turned upside down, but also when the substrate body 1 is rotated 180 degrees along the XY plane around the symmetry point Q.

In the present embodiment, the position, shape and size of the first alignment mark 13 and the second alignment mark 14 are the same, so depending on the first alignment mark 13 and the second alignment mark 14. The orientation of the substrate body 1 such as the front and back of the substrate body 1 and the presence / absence of rotation cannot be detected.

  On the other hand, when the positions of the first front / back determination mark 11 and the second front / back determination mark 12 in FIGS. 4 and 5 are compared, the XY coordinates of the first front / back determination mark 11 formed on one main surface of the substrate body 1 are compared. The position on the XY coordinates of the second front / back determination mark 12 formed on the other main surface of the substrate body 1 is different from the upper position. This is the same not only when the front and back are turned upside down, but also when the substrate body 1 is rotated 180 degrees along the XY plane around the symmetry point Q. That is, by observing the positions of the first front / back determination mark 11 and the second front / back determination mark 12, the orientation of the substrate main body 1 such as the front / back of the substrate main body 1 and the presence / absence of rotation can be detected.

  A plurality of the first front / back determination marks 11 and the second front / back determination marks 12 may be provided. However, in that case, it is preferable that the front and back determination marks 11 and 12 formed on the same main surface have an asymmetric relationship with each other. In other words, the positions of the two front and back determination marks 11 and 12 are point-symmetric with the center of the processing area P on the main surface of the substrate body 1 as the symmetry point Q, or two sides facing the symmetry point Q and the processing area P. It is preferable that the straight line including the midpoint is not in a line-symmetric relationship with the symmetry axes Ra and Rb, and not on the symmetry point Q and the symmetry axes Ra and Rb.

When the two front and back determination marks 11 and 12 are formed in the symmetric area, when the substrate body 1 is turned upside down or when the substrate body 1 is rotated 180 degrees around the symmetry point Q, the alignment marks 13 and 12 described above are used. This is because the positions of the two front and back determination marks 11 and 12 coincide with each other as in FIG. 14, and the function as the front and back determination marks 11 and 12 of this embodiment cannot be performed.

  The positions of the alignment marks 13 and 14 described above are compared with the positions of member-side alignment marks 23 and 34 formed on the photomasks 20 and 30 described later, and the positions of the front and back determination marks 11 and 12 are compared. Is compared with the positions of the member side front / back determination marks 21 and 32 formed on the photomasks 20 and 30 described later.

Next, the member-side alignment marks 23 and 34 and the member-side front / back determination marks 21 and 32 provided on the photomasks 20 and 30 will be described with reference to FIGS. 6 and 7 are views showing the main surfaces of the photomasks 20 and 30 covering the region A in FIGS. 4 and 5. Note that the processing areas P of the photomasks 20 and 30 are at the same position on the XY plane as the processing area P of the substrate body 1.

FIG. 6 is a diagram showing a first member side alignment mark 23 and a first member side front / back determination mark 21 provided on one main surface of the photomasks 20 and 30, and FIG. 7 shows the photomasks 20 and 30. It is a figure which shows the 2nd member side alignment mark 34 and the 2nd member side front-and-back determination mark 32 which were provided in the other main surface.

The member-side alignment marks 23 and 34 and the member-side front / back determination marks 21 and 32 in the present embodiment are formed by printing with ink or the like. When the photomasks 20 and 30 are transparent, it is preferable to use black ink.

As shown in FIGS. 6 and 7, the member-side alignment marks 23 and 34 are positioned at the reference position where the exposure processing of the exposure apparatus 1000 is performed, and the alignment marks 13 and 14 shown in FIGS. 4 and 5 and the XY plane. It is provided so that it may become the same position on the top. For this reason, when the photomasks 20 and 30 are set at correct positions with respect to the substrate body 1, the member-side alignment marks 23 and 34 and the alignment marks 13 and 14 of the substrate body 1 are the same at the reference position. opposite.

Similarly, the member-side front / back determination marks 21, 32 are the same on the XY plane as the front-back determination marks 11, 12 of the substrate body 1 shown in FIGS. 4 and 5 at the reference position where the exposure processing of the exposure apparatus 1000 is performed. It is provided to be in position. For this reason, when the photomasks 20 and 30 are set at correct positions with respect to the substrate body 1, the member-side front and back determination marks 21 and 32 and the front and back determination marks 11 and 12 of the substrate body 1 are at the reference position. opposite.

Next, based on FIG. 8 and FIG. 9, the alignment marks 13 and 14 and the member side alignment marks 23 and 34 when the photomasks 20 and 30 are opposed to the substrate body 1, and front / back determination The marks 11 and 12 and the member side front / back determination marks 21 and 32 will be described. 8 and 9 are views showing main surfaces of the photomasks 20 and 30 covering the region A of the substrate body 1 shown in FIGS.

FIG. 8 is a top view of a state in which the first photomask 20 is disposed opposite to one main surface of the substrate body 1, and FIG. 9 is a top view of the state in which the second photomask 30 is disposed to face the other main surface of the substrate body 1. FIG.

When the first photomask 20 is set at the correct position (position on the XY coordinates in the figure) with respect to the one main surface of the substrate body 1, as shown in FIG. And the first alignment mark 13 of the substrate body 1 are overlapped. Further, when the first photomask 20 is set in the correct orientation (including front and back and / or up / down / left / right directions) with respect to the one main surface of the substrate body 1, as shown in FIG. The front / back determination mark 21 and the first front / back determination mark 11 of the substrate body 1 overlap each other.

Similarly, when the second photomask 30 is set at the correct position (position on the XY coordinates in the figure) with respect to the other main surface of the substrate body 1, as shown in FIG. 9, the second member side alignment is performed. The mark 34 and the second alignment mark 14 of the substrate body 1 overlap each other. Further, when the second photomask 30 is set in the correct orientation (including front and back and / or up / down / left / right directions) with respect to the other main surface of the substrate body 1, as shown in FIG. The front / back determination mark 32 and the second front / back determination mark 12 of the substrate body 1 overlap each other.

  A cross-sectional view of this state is shown in FIGS. 10 is a cross-sectional view taken along line XX of FIG. 8, and FIG. 11 is a cross-sectional view taken along line XI-XI of FIG.

The first front / back determination mark 11 and the second front / back determination mark 12 shown in FIG. 10 and FIG. 11 are constituted by recesses formed on the surface of the substrate body 1. When light is applied to the region including the recess, the intensity of the reflected light of the light hitting the recess and the intensity of the reflected light of the light hitting the surrounding main surfaces 1A and 1B change. When an area including the first front / back determination mark 11 and the second front / back determination mark 12 is imaged by the camera 50 along the directions of arrows A1 and B1 in the state of light irradiation, the first front / back determination mark 11 and the second A captured image including the first member side front / back determination mark 21 and a captured image including the second front / back determination mark 12 and the second member side front / back determination mark 32 can be obtained. By analyzing this captured image, information regarding the positional relationship between the two marks can be obtained.

  The exposure apparatus 1000 of the present embodiment has a positional relationship between the first alignment mark 13 and the first member side alignment mark 23 obtained from the captured image, and the second alignment mark 14 and the second member side. Based on the positional relationship with the alignment mark 34, it is possible to determine whether the relative position (position on the XY coordinates in FIGS. 8 and 9) between the substrate body 1 and the photomasks 20 and 30 is correct.

  Further, the exposure apparatus 1000 of the present embodiment has a positional relationship between the first front / back determination mark 11 and the first member side front / back determination mark 21 obtained from the captured image, and the second front / back determination mark 12 and the second. Based on the positional relationship between the member-side front / back determination marks 32, it is possible to determine whether the relative orientation (including front / back and / or up / down / left / right directions) of the substrate body 1 and the photomasks 20 and 30 is correct.

  FIG. 12 shows the front and back determination marks 11 and 12 obtained when the photomasks 20 and 30 are set in the correct orientation (including front and back and / or up, down, left and right directions) with respect to the main surface of the substrate body 1. And images of the member-side front / back determination marks 21 and 32. Even when the photomasks 20 and 30 are set at correct positions (positions on the XY coordinates in the drawing) with respect to the main surface of the substrate body 1, the images of the alignment marks 13 and 14 similar to those in FIG. Images of the member side alignment marks 23 and 34 can be obtained.

Note that FIG. 12 shows the images of the alignment marks 13 and 14 and the image of the member side alignment marks 23 and 34 viewed from the direction along the arrow A1 shown in FIGS. 10 and 11, or the direction along the direction B1. These are the images of the front and back determination marks 11 and 12 and the images of the member side front and back determination marks 21 and 32.

As shown in FIG. 12, when the photomasks 20 and 30 are set in the correct orientation (including front and back and / or up and down, left and right directions) with respect to the main surface of the substrate body 1, the front and back determination marks 11 and The analysis result indicating that the 12 images and the image of the member side front / back determination marks 21 and 32 are superimposed, or the image of the alignment marks 13 and 14 and the image of the member side alignment marks 23 and 34 are superimposed. The analysis result can be obtained.

As described above, when the positions of the front and back determination marks 11 and 12 and the positions of the member side front and back determination marks 21 and 32 are overlapped, the photomasks 20 and 30 are correctly oriented with respect to the main surface of the substrate body 1. If the image of the alignment marks 13 and 14 and the image of the member-side alignment marks 23 and 34 are superimposed, the photomask 20 is placed on the main surface of the substrate body 1. , 30 are determined to be set at the correct positions.

  On the other hand, as shown in FIG. 13, when the front and back of the photomasks 20 and 30 are mistakenly set on the substrate body 1, the images of the alignment marks 13 and 14 and the member-side alignment are used if the positions are correct. Although an image as shown in FIG. 12 in which the images of the marks 23 and 34 are superimposed can be obtained, the image of the front and back determination marks 11 and 12 and the image of the member side front and back determination marks 21 and 32 are superimposed in FIG. The image shown cannot be obtained.

  In such a case, it can be determined that the photomasks 20 and 30 are set in the wrong direction with respect to the substrate body 1. FIG. 13 illustrates the case where the front and back of the photomasks 20 and 30 are mistakenly set on the substrate body 1. However, the vertical and horizontal directions of the photomasks 20 and 30 with respect to the main surface of the substrate body 1 are illustrated. The same applies when the setting is relatively wrong.

  In the exposure apparatus 1000 of the present embodiment, the photomasks 20 and 30 are placed on the substrate body 1 based on the positional relationship between the images of the front and back determination marks 11 and 12 and the image of the member side front and back determination marks 21 and 32. After determining that it is set in the correct orientation, the positions of the photomasks 20 and 30 relative to the substrate body 1 are aligned based on the positional relationship between the images of the alignment marks 13 and 14 and the images of the member-side alignment marks 23 and 34. be able to.

As a result, when the work includes turning the substrate body 1 upside down, the worker sets the photomasks 20 and 30 in the wrong direction (front and back and / or up / down / left / right directions) with respect to the substrate body 1. Can also detect that error.

As described above, since the front and back determination marks 11 and 12 in the present embodiment are provided in the asymmetric region, when the orientation of the substrate body 1 and the photomasks 20 and 30 is correct, the front and back determination marks 11 and 12 and members When the side front / back determination marks 21 and 32 face each other and the direction of the substrate body and the member is wrong, the front / back determination marks 11 and 12 do not face the member side front / back determination marks 21 and 32. Therefore, by observing the difference in the positional relationship between the front / back determination marks 11 and 12 and the member-side front / back determination marks 21 and 32, it is possible to detect the correctness of the orientation of the substrate body and the member. As a result, it is possible to detect that the board body and the member are set in the wrong direction due to human error.

Second Embodiment
Next, an exposure apparatus 1000 and a printed wiring board manufacturing method according to the second embodiment of the present invention will be described. The exposure apparatus 1000 and the printed wiring board manufacturing method of the present embodiment are basically the same as those of the first embodiment. In order to avoid redundant description, different points will be mainly described here, and for the common points, the detailed description of the first embodiment and the drawings will be cited.

14 and 15 are cross-sectional views of the substrate body 1 and the photomasks 20 and 30 according to the second embodiment of the present invention, and FIG. 14 is a cross-sectional view taken along the line XX of FIG. 8 described in the first embodiment. FIG. 15 is a sectional view corresponding to the sectional view taken along line XI-XI in FIG.

As shown in FIGS. 14 and 15, the front and back determination marks 11 and 12 and the alignment marks 13 and 14 in the second embodiment are formed by through holes having a circular cross section. The through hole can be formed by a general method such as drilling or laser processing.

The photomasks 20 and 30 have circular light-shielding member-side front and back determination marks 21 and 32 that are smaller than the diameter of the through-holes at positions corresponding to the front and back determination marks 11 and 12, Circular light-shielding member-side alignment marks 23 and 34 smaller than the diameter of the through hole are formed at positions corresponding to the alignment marks 13 and 14.

In the present embodiment, the member side front / back determination marks 21 and 32 and the member side alignment marks 23 and 34 are formed of black ink in order to shield a predetermined region of the transparent photomasks 20 and 30.

When the photomasks 20 and 30 are correctly set at the opposing positions of the substrate body 1, the front / back determination marks 11 and 12 and the member-side front / back determination marks 21 and 32 face each other, and the alignment marks 13 and 14 and the member-side alignment are aligned. The use marks 23 and 34 face each other.

Since the front and back determination marks 11 and 12 and the alignment marks 13 and 14 of the substrate body 1 are formed by through holes, the region including the through holes is viewed from the directions of arrows A1 and A2 shown in FIGS. When the image is taken by the camera 50, an image in which the member side front / back determination marks 21 and 32 or the member side alignment marks 23 and 34 exist inside the outline of the through hole and the inner edge of the through hole can be obtained. Specifically, a double circle captured image including the first front / back determination mark 11 and the first member side front / back determination mark 21 positioned inside the first front / back determination mark 12, the second front / back determination mark 12, and the inner position thereof Thus, a double circle captured image including the second member side front / back determination mark 32 can be obtained. By analyzing the captured image, information on the positional relationship can be obtained.

  The determination device 70 of the exposure apparatus 1000 according to the present embodiment includes the positional relationship between the first alignment mark 13 and the first member side alignment mark 23 obtained from the captured image, and the second alignment mark 14. Based on the positional relationship with the second member side alignment mark 34, it is possible to determine whether the relative position (position on the XY coordinates in FIGS. 8 and 9) of the substrate body 1 and the photomasks 20 and 30 is correct.

  In addition, the determination device 70 of the exposure apparatus 1000 according to the present embodiment includes the positional relationship between the first front / back determination mark 11 and the first member-side front / back determination mark 21 obtained from the captured image, and the second front / back determination mark. Based on the positional relationship between the first member 12 and the second member side front / back determination mark 32, it is possible to determine whether the relative orientation (including front / back and / or up / down / left / right directions) of the substrate body 1 and the photomasks 20 and 30 is correct. .

  FIG. 16 shows the front / back determination marks 11, 12 obtained when the photomasks 20, 30 are set in the correct orientation (including front / back and / or up / down / left / right directions) with respect to the main surface of the substrate body 1. These are images of through holes and images of the member-side front / back determination marks 21 and 32. Even when the photomasks 20 and 30 are set at correct positions (positions on the XY coordinates in the drawing) with respect to the main surface of the substrate body 1, the images of the alignment marks 13 and 14 similar to those in FIG. Images of the member side alignment marks 23 and 34 can be obtained.

Note that FIG. 16 shows the image of the alignment marks 13 and 14 and the image of the member-side alignment marks 23 and 34 viewed from the direction along the arrow A1 shown in FIGS. 14 and 15 or the direction along the direction B1. These are the images of the front and back determination marks 11 and 12 and the images of the member side front and back determination marks 21 and 32.

As shown in FIG. 16, when the photomasks 20 and 30 are set in the correct orientation (including front and back and / or up and down, left and right directions) with respect to the main surface of the substrate body 1, the front and back determination marks 11 and It is possible to observe a double circle in which the images of the member side front / back determination marks 21 and 32 are present inside the contour image of the 12 through holes. Similarly, when the photomasks 20 and 30 are set at correct positions with respect to the main surface of the substrate body 1, the member-side alignment is positioned inside the image of the outline of the through hole of the alignment marks 13 and 14. A double circle in which the images of the marks 23 and 34 are present can be observed.

As described above, when the member side front / back determination marks 21, 32 are present inside the front / back determination marks 11, 12, the photomasks 20, 30 are set in the correct orientation with respect to the main surface of the substrate body 1. Can be determined. When the images of the member side alignment marks 23 and 34 are present inside the alignment marks 13 and 14, the photomasks 20 and 30 are set at correct positions with respect to the main surface of the substrate body 1. Can be determined.

  On the other hand, as shown in FIG. 17, when the front and back of the photomasks 20 and 30 are set on the substrate body 1 by mistake, the image of the member side alignment marks 23 and 34 is located inside the alignment marks 13 and 14. Can be obtained (see FIG. 16), but the images of the member-side front / back determination marks 21, 32 are present inside the outlines of the through holes of the front / back determination marks 11, 12 (FIG. 16). Can't get).

  In such a case, it can be determined that the photomasks 20 and 30 are set in the wrong direction (front / back or up / down / left / right directions) with respect to the substrate body 1. FIG. 17 illustrates the case where the front and back of the photomasks 20 and 30 are mistakenly set on the substrate body 1. However, the vertical and horizontal directions of the photomasks 20 and 30 with respect to the main surface of the substrate body 1 are illustrated. The same applies when set incorrectly.

In addition, the exposure apparatus 1000 according to the present embodiment includes a camera between a first position K1 facing the front and back determination marks 11 and 12 and a second position K2 facing the alignment marks 13 and 14. A moving mechanism for manually reciprocating 50 is further provided. Specifically, the moving mechanism in this embodiment includes a slide rail 51 and a support body 52 that supports the camera 50 and reciprocates along the slide rail 51. The support body 52 includes a lock pin (not shown), and fixes the positioned camera 50 at least temporarily.

Thus, by providing the moving mechanism of the camera 50, the camera 50 that images the front and back determination marks 11 and 12 and the camera 50 that images the alignment marks 13 and 14 can be shared. It is not necessary to add a camera 50 for the determination marks 11 and 12, and the equipment cost can be reduced.

Further, since the position of the camera 50 can be changed by a simple manual structure moving mechanism between the slide rail 51 and the support body 52, a drive mechanism such as an actuator or a control circuit for automatically changing the position of the camera 50 is provided. It is not necessary, and the equipment cost can be reduced. In addition, it is possible to prevent the product quality from being adversely affected by the dust generated from the drive mechanism having many parts.

Although not shown, the camera 50 is provided with a position sensor that recognizes the position of the camera 50. The camera 50 stores in advance the position of the camera 50 when one main surface of the substrate body 1 is a processing surface (imaging surface) and the position of the camera when the other main surface of the substrate body is a processing surface (imaging surface). is doing. The camera 50 according to the present embodiment includes the position of the camera 50 detected by the position sensor and the processing surface specification information (the specification of one main surface or the other main surface) input via the production line management system. Based on (information), the appropriateness of the position of the camera 50 is determined with reference to the correspondence relationship between the processing surface and the camera position stored in advance. If the position of the camera 50 is not appropriate, an alarm to that effect is output via an output device such as a speaker (not shown).

According to the present embodiment configured as described above, the same operations and effects as those of the first embodiment can be achieved.

<Third Embodiment>
Next, an exposure apparatus 1000 and a printed wiring board manufacturing method according to the third embodiment of the present invention will be described. The exposure apparatus 1000 and the printed wiring board manufacturing method of the present embodiment are basically the same as those of the first embodiment. In order to avoid redundant description, different points will be mainly described here, and for the common points, detailed descriptions and drawings of the first embodiment and the second embodiment will be cited.

In the third embodiment, the front / back determination marks 11 and 12 and the alignment marks 13 and 14 formed on the substrate body 1 are formed by through holes. The through hole can be formed by the same method as in the first embodiment. The positions at which the front and back determination marks 11 and 12 and the alignment marks 13 and 14 are formed are the same as those in the first embodiment shown in FIGS.

18 and 19 are diagrams showing examples of arrangement of the member-side front / back determination marks 21 and 32 and the member-side alignment marks 23 and 34 formed on the photomasks 20 and 30 according to the present embodiment. 18 shows one main surface side of the photomasks 20 and 30, and FIG. 19 shows the other main surface side of the photomasks 20 and 30. 18 and 19 are views showing the main surface of the photomask covering the region A in FIGS. 4 and 5.

As shown in the figure, the photomasks 20 and 30 according to the present embodiment have translucent member-side front and back determination marks 21 a and 32 a at positions corresponding to the front and back determination marks 11 and 12 of the substrate body 1. Is formed.

Further, in the photomasks 20 and 30 according to the present embodiment, the processing regions of the photomasks 20 and 30 in which the relative positions with respect to the substrate main body 1 are set with respect to the translucent member side front / back determination marks 21a and 32a. Light shielding property in a symmetric region having a point symmetry with the center of the symmetry point Q or a line symmetry including a straight line including the symmetry point Q and the midpoint of two opposite sides of the processing region as symmetry axes Ra and Rb. The member side front / back determination marks 21b and 32b are formed.

That is, the translucent member-side front / back determination marks 21a, 32a and the light-shielding member-side front / back determination marks 21b, 32b are point-symmetric with respect to the symmetry point Q or lines with respect to the symmetry axes Ra, Rb. Symmetrical relationship. As in the first embodiment, the translucent member-side front / back determination marks 21a, 32a and the light-shielding member-side front / back determination marks 21b, 32b are preferably not arranged on the symmetry axes Ra, Rb. .

In the present embodiment, the member side front / back determination marks 21a, 32a provided at positions corresponding to the front / back determination marks 11, 12 and the member side front / back determination marks provided in a symmetric area with respect to these. 21b and 32b may be distinguished from each other, the member-side front / back determination marks 21a and 32a and the member-side front / back determination marks 21b and 32b only have to have the opposite properties with respect to the translucency / light shielding properties.

Specifically, on the photomasks 20 and 30 according to the present embodiment, light-shielding member-side front and back determination marks 21a and 32a are formed at positions corresponding to the front and back determination marks 11 and 12 of the substrate body 1, With respect to the light-shielding member-side front / back determination marks 21a and 32a, point symmetry with respect to the center of the processing region of the photomasks 20 and 30 where the relative position to the substrate body 1 is set, or symmetry point Q And translucent member-side front / back determination marks 21b and 32b are formed in a symmetric region having a line-symmetric relationship with a straight line including the midpoints of two opposite sides of the processing region as symmetry axes Ra and Rb. Also good.

Further, the light-shielding member side front / back determination marks 21 b and 32 b are formed larger than the diameter of the through hole so as to cover the opening of the through hole formed in the substrate body 1. In the present embodiment, black ink that shields a predetermined area of the transparent photomasks 20 and 30 is printed on the light-shielding member-side front / back determination marks 21b and 32b and the member-side alignment marks 23b and 34b. Form. On the other hand, in forming the translucent member-side front / back determination marks 21a, 32a and the member-side alignment marks 23a, 34a, nothing is required to transmit the predetermined areas of the transparent photomasks 20, 30. By not providing, the translucent member-side front / back determination marks 21a, 32a and the member-side alignment marks 23a, 34a are formed.

FIG. 20 is a top view of a state in which the first photomask 20 is disposed opposite to the first main surface 1A of the substrate body 1, and FIG. 21 is a view illustrating the second photomask 30 disposed opposite to the other main surface 1B of the substrate body 1. It is a top view of a state.

As shown in FIGS. 20 and 21, when the first photomask 20 is set at the correct position (position on the XY coordinates in the drawing) with respect to the one main surface of the substrate body 1, the same as in the first embodiment. In addition, the first member-side alignment mark 23 and the first alignment mark 13 of the substrate body 1 overlap each other.

In addition, as shown in FIG. 20, when the first photomask 20 is set in the correct orientation (including front and back and / or up / down / left / right directions) with respect to the one main surface of the substrate body 1, The first member side front / back determination mark 21a and the first front / back determination mark 11 of the substrate body 1 overlap each other, and the light-shielding first member side front / back determination mark 21b and the first front / back determination mark of the substrate body 1 are overlapped. 11 is not superimposed.

Similarly, as shown in FIG. 21, when the second photomask 30 is set in the correct orientation (including front and back and / or up / down / left / right directions) with respect to the other main surface of the substrate body 1, the translucency is obtained. The second member side front / back determination mark 32a and the second front / back determination mark 12 of the substrate main body 1 overlap each other, and the light-shielding second member side front / back determination mark 32b and the second front / back determination mark of the substrate main body 1 are overlapped. 12 does not overlap.

The state of the cross section in this state is shown in FIGS. 22 is a cross-sectional view taken along line XXII-XXII in FIG. 20, and FIG. 23 is a cross-sectional view taken along line XXIII-XXIII in FIG. The first front / back determination mark 11 and the second front / back determination mark 12 shown in FIG. 22 and FIG. When the region including the through hole is irradiated with the light L1, the light incident on the through hole is transmitted through the translucent first member side front / back determination mark 21a of the transparent photomask 20, and therefore, on the side opposite to the light source. Light that has passed through the through hole can be detected. The light L1 can be irradiated by the illumination device 140.

In the present embodiment, since the translucent sensor 60 is provided at a position facing the opening portion of the through hole that becomes the first front / back determination mark 11 and the second front / back determination mark 12, the presence or absence of light that has passed through the through hole. Can be detected.

As shown in FIG. 22, when the first photomask 20 is set in the correct orientation (including front and back and / or up / down / left / right directions) with respect to the one main surface of the substrate body 1, the first translucent first. Since the member-side front / back determination mark 21a and the first front / back determination mark 11 of the substrate body 1 overlap each other, when the light L1 is irradiated, the light incident through the through hole is transmitted through the first member-side front / back side. The light passing through the determination mark 21a can be detected by the translucent sensor 60.

  Similarly, as shown in FIG. 23, when the second photomask 30 is set in the correct orientation (including front and back and / or up / down / left / right directions) with respect to the other main surface of the substrate body 1, translucency is obtained. Since the second member side front / back determination mark 32a and the second front / back determination mark 12 of the substrate body 1 overlap each other, when the light L1 is irradiated, the light incident through the through-hole is reflected on the transparent photomask 20 The translucent second member side front / back determination mark 32a is transmitted, and the translucent sensor 60 can detect light.

As described above, when the light transmission sensor 60 can detect the light transmitted through the front and back determination marks 11 and 12, the photomasks 20 and 30 are set in the correct orientation with respect to the main surface of the substrate body 1. Can be judged. Whether or not the photomasks 20 and 30 are set at correct positions with respect to the main surface of the substrate body 1 can be determined by the same method as in the first and second embodiments.

On the other hand, when the photomasks 20 and 30 are not set in the correct orientation (including front and back and / or up and down, left and right directions) with respect to the other main surface of the substrate body 1, the light-shielding second member side for front and back determination Since the mark 32b and the second front / back determination mark 12 of the substrate body 1 overlap, even if the light L1 is irradiated, the light incident through the through hole is light-shielding second member side front / back determination mark 32b. The light transmission sensor 60 cannot detect light.

  Specifically, as shown in FIG. 24, when the front and back of the photomasks 20 and 30 are set on the substrate body 1 by mistake, the alignment marks 13 and 14 and the member-side alignment marks 23 and 34 However, since the light L1 is blocked by the light-shielding second member side front / back determination mark 32b, the translucent sensor 60 cannot detect the light.

  The exposure apparatus 1000 according to the present embodiment determines the positional relationship between the first front / back determination mark 11 and the first member-side front / back determination mark 21a and the second front / back determination mark 12 from the light detection result of the translucent sensor 60. Based on the positional relationship between the second member side front / back determination marks 32a, it is possible to determine whether the relative orientation (including front / back and / or up / down / left / right directions) of the substrate body 1 and the photomasks 20 and 30 is correct.

  In addition, as in the first embodiment, the exposure apparatus 1000 of the present embodiment has a positional relationship between the first alignment mark 13 obtained from the translucent sensor 60 and the first member-side alignment mark 23, Based on the positional relationship between the second alignment mark 14 and the second member side alignment mark 34, the relative position of the substrate body 1 and the photomasks 20 and 30 (positions on the XY coordinates in FIGS. 20 and 21). It is possible to determine whether the error is correct.

According to the present embodiment configured as described above, the same operations and effects as those of the first embodiment can be achieved.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1000 ... Exposure apparatus, Printed wiring board manufacturing apparatus 101 ... Base plate, 102 ... Housing, 102a ... Dark room 103 ... Conveying device, 104 ... Delivery roller, 105 ... Winding roller,
106a to 106l ... guide roller, 107 ... drive roller 110 ... substrate frame, first holding means 120 ... second holding means 121 ... mask frame 130 ... position adjusting device 140 ... illuminating device 1 ... substrate body, belt-like substrate body DESCRIPTION OF SYMBOLS 1A ... One main surface 1B of a substrate body ... The other main surface P of a substrate body ... Processing area Q ... Symmetry point Ra, Rb ... Symmetry axis 11 ... First front / back determination mark, Through hole 12 ... Second front / back determination mark, Through hole 13 ... first alignment mark 14 ... second alignment mark 20 ... first member, first photomask 21, 21a, 21b ... first member side front / back determination mark 23 ... first member side alignment Mark 30 ... second member, second photomask 32 ... second member side front / back determination mark 34 ... second member side alignment mark 50 ... camera 51 ... slide rail 52 ... support
60 ... Light transmission sensor 70 ... Determination device

Claims (10)

A method of manufacturing a printed wiring board in which processing is performed using a member on the main surface of the substrate body of the printed wiring board,
Symmetrical point symmetry with the center of the processing area of the main surface of the substrate body, the relative position of which is set relative to the member, or a straight line including the symmetry point and the midpoint of two opposite sides of the processing area A plurality of alignment marks formed in a symmetric region having a line-symmetric relationship with respect to the axis, and at least one of the alignment marks in the point-symmetric relationship and the asymmetric region not in the line-symmetric relationship A step of setting the substrate body on which the front and back determination marks are formed at a predetermined position;
A step of setting the member on which the member side front / back determination mark is formed at a position corresponding to the front / back determination mark of the substrate body at a position opposed to the substrate body;
And a determination step of determining whether the relative direction of the substrate body and the member is relative based on a positional relationship between the front / back determination mark and the member-side front / back determination mark. In the manufacturing method of the printed wiring board according to claim 1,
The front and back determination mark is formed by providing a through hole in the substrate body,
The member is formed with a light-shielding member side front / back determination mark smaller than the diameter of the through hole at a position corresponding to the front / back determination mark of the substrate body,
The determination step includes a step of imaging a region of the substrate body including the front / back determination mark of the front / back determination mark, and an image of the front / back determination mark included in the captured image and a member side front / back determination. And a step of determining whether the relative direction of the substrate body and the member is relative to each other based on the image of the mark for use. In the manufacturing method of the printed wiring board according to claim 1,
The front and back determination mark is formed by providing a through hole in the substrate body,
The member is formed with a translucent or light-shielding member side front / back judgment mark at a position corresponding to the front / back judgment mark of the substrate body, and the translucent or light-shielding member side front / back judgment. A point symmetry with respect to the mark for use as a symmetric point with respect to the center of the processing region of the member whose relative position is set with respect to the substrate body, or a midpoint between two opposite sides of the processing region. In the symmetrical area having a line symmetry relationship with a straight line as the symmetry axis, a member-side front / back determination mark having a light shielding property or translucency opposite to the member-side front / back determination mark at a position corresponding to the front / back determination mark is provided. Formed,
The determining step includes irradiating light on the front / back determination mark of the substrate body, and detecting light passing through the front / back determination mark when the front / back determination mark is irradiated with light. And a step of determining whether or not the relative orientation of the substrate body and the member is correct based on the detection result of the light. In the manufacturing method of the printed wiring board as described in any one of Claims 1-3,
In the member, a member side alignment mark is formed at a position corresponding to the alignment mark of the substrate body,
After the step of setting the member at a position facing the substrate main body, whether or not the relative position between the substrate main body and the member is appropriate is determined based on the positional relationship between the alignment mark and the member-side alignment mark. A method of manufacturing a printed wiring board. In a printed wiring board manufacturing apparatus that performs processing using a member on the main surface of the substrate body of the printed wiring board,
Symmetrical point symmetry with the center of the processing area of the main surface of the substrate body, the relative position of which is set relative to the member, or a straight line including the symmetry point and the midpoint of two opposite sides of the processing area A plurality of alignment marks formed in a symmetric region having a line-symmetric relationship with respect to the axis, and at least one of the alignment marks in the point-symmetric relationship and the asymmetric region not in the line-symmetric relationship First holding means for holding the substrate body on which the front / back determination mark is formed at a predetermined position;
Second holding means for holding the member on which the member side front / back determination mark is formed at a position corresponding to the front / back determination mark of the substrate body at a position facing the substrate body;
An apparatus for manufacturing a printed wiring board, comprising: a front / back determination unit that determines whether the relative direction of the substrate body and the member is relative based on a positional relationship between the front / back determination mark and the member-side front / back determination mark. In the printed wiring board manufacturing apparatus according to claim 5,
The front and back determination mark is formed by providing a through hole in the substrate body,
The member is formed with a light-shielding member side front / back determination mark smaller than the diameter of the through hole at a position corresponding to the front / back determination mark of the substrate body,
The determination unit includes a camera that captures an area of the substrate body that includes the front / back determination mark of the front / back determination mark, and an image of the front / back determination mark included in the captured image and a member-side front / back determination. An apparatus for manufacturing a printed wiring board, comprising: a front / back determination unit that determines whether the relative direction of the substrate body and the member is relative to each other based on an image of the mark for use. In the manufacturing apparatus of the printed wiring board of Claim 6,
An apparatus for manufacturing a printed wiring board, further comprising a moving mechanism for reciprocating the camera between a first position facing the front / back determination mark and a second position facing the alignment mark. In the printed wiring board manufacturing apparatus according to claim 5,
The front and back determination mark is formed by providing a through hole in the substrate body,
The member is formed with a translucent or light-shielding member side front / back judgment mark at a position corresponding to the front / back judgment mark of the substrate body, and the translucent or light-shielding member side front / back judgment. A point symmetry with respect to the mark for use as a symmetric point with respect to the center of the processing region of the member whose relative position is set with respect to the substrate body, or a midpoint between two opposite sides of the processing region. In the symmetrical area having a line symmetry relationship with a straight line as the symmetry axis, a member-side front / back determination mark having a light shielding property or translucency opposite to the member-side front / back determination mark at a position corresponding to the front / back determination mark is provided. Formed,
The determination means includes an irradiation device that irradiates light to the front / back determination mark of the substrate body, and a light that detects light passing through the front / back determination mark when the front / back determination mark is irradiated with light. An apparatus for manufacturing a printed wiring board, comprising: an optical sensor; and a front / back determination unit that determines whether the relative direction of the substrate body and the member is relative to each other based on a detection result of the light. In the manufacturing apparatus of the printed wiring board as described in any one of Claims 5-8,
In the member, a member side alignment mark is formed at a position corresponding to the alignment mark of the substrate body,
The determination unit is configured to determine a relative position between the substrate body and the member based on a positional relationship between the alignment mark and the member side alignment mark in a state where the member is set at a position facing the substrate body. An apparatus for manufacturing a printed wiring board, further comprising a position determination unit that determines the suitability of the printed circuit board. Equipped with a substrate body,
The substrate body is point-symmetric with respect to the center of the processing area of the main surface of the substrate body, the position of which is set relative to the member, or the midpoint of two sides facing the processing area. A plurality of alignment marks formed in a symmetry region having a line symmetry relationship with a straight line including a symmetry axis, and any of the alignment marks asymmetry not in the point symmetry relationship or the line symmetry relationship A printed wiring board having one or more front / back determination marks in a region.

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