JP4324342B2 - Electronic component alignment method and electronic component alignment apparatus - Google Patents

Electronic component alignment method and electronic component alignment apparatus Download PDF

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Publication number
JP4324342B2
JP4324342B2 JP2002090426A JP2002090426A JP4324342B2 JP 4324342 B2 JP4324342 B2 JP 4324342B2 JP 2002090426 A JP2002090426 A JP 2002090426A JP 2002090426 A JP2002090426 A JP 2002090426A JP 4324342 B2 JP4324342 B2 JP 4324342B2
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Prior art keywords
electronic component
thickness
aligning
upper plate
lower plate
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JP2003289197A (en
Inventor
正敏 奥野
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Citizen Finetech Miyota Co Ltd
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Citizen Finetech Miyota Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品の整列方法及び電子部品整列装置に関するものである。
【０００２】
【従来の技術】
図４は電子部品の斜視図でる。図８はサーモモジュールの斜視図である。図８に示すサーモモジュールは、上基板１２、下基板１３、複数の電子部品１１により構成されるもので、電子部品のＷＴ面と、上基板１２と下基板１３の電極パターン（不図示）が接続されて成るものである。
たとえば、上記サーモモジュールの組み立て工程においては、直方体形状の電子部品を所定の整列位置にならべる工程があるが、電子部品のＷＬ面を下面にして整列するのが一般的である。従来、このような工程において、１．直方体形状の電子部品を１つずつピンセットで上下面を合わせながら並べていた。２．パーツフィーダーで直方体形状の電子部品を整列させＰ＆Ｐユニットで一つずつ供給していた。３．振込プレートを用いて電子部品を振り込んだあと供給していた。
【０００３】
【発明が解決しようとする課題】
上記１の方法では、作業者がピンセットにて１つずつ処理するため作業時間がかかってしまう。また、電子部品にキズをつけてしまうという問題があった。２の方法では、装置が高価な物になってしまいその割に生産性が低いという問題がある。３の方法では、ＷＬ面またはＴＬ面を下面にして振込を行うのが一般的で、その方法の場合ＷＴ面を下面にするため振込後一度向きを変更する作業または装置が必要となる。
【０００４】
本発明は、上記問題点を解決するものであり、電子部品などを効率よく整列させることが可能な電子部品整列方法および電子部品整列装置を提供することを目的とする。
【０００５】
【課題を解決するための手段】
横Ｗ、厚みＴ、長さＬ（ただしＷ≧Ｔ、Ｗ＜Ｌ）の直方体形状の電子部品を整列させるための方法であって、横Ｗ、厚みＴで規定されるＷＴ面の対角寸法よりも大きく、横Ｗ、長さＬのＷＬ面の対角寸法および厚みＴ、長さＬのＴＬ面の対角寸法より小さい直径を有する円形の穴が所定の整列位置関係となるように複数個配設された上プレートと、横Ｗ、厚みＴよりそれぞれわずかに大きな寸法を有する正方形または長方形の穴が前記所定の整列位置関係となるように複数個配設された下プレートを、整列された電子部品を支持して搬送させる搬送治具上に、前記複数の円形の穴と前記複数の正方形または長方形の穴とがそれぞれ重なり合う位置関係になるように固定する工程と、上プレートに供給された電子部品を振動または揺動させることにより、電子部品を上プレートから下プレートに振り込んで搬送治具上に整列させる工程とを具備する電子部品の整列方法とする。
【０００６】
横Ｗ、厚みＴ、長さＬ（ただしＷ≧Ｔ、Ｗ＜Ｌ）の直方体形状の電子部品を整列させるための装置であって、横Ｗ、厚みＴで規定されるＷＴ面の対角寸法よりも大きく、横Ｗ、長さＬのＷＬ面の対角寸法および厚みＴ、長さＬのＴＬ面の対角寸法より小さい直径を有する円形の穴が所定の整列位置関係となるように複数個配設された上プレートと、横Ｗ、厚みＴよりそれぞれわずかに大きな寸法を有する正方形または長方形の穴が前記所定の整列位置関係となるように複数個配設された下プレートと、整列された電子部品を支持して搬送させる搬送治具と、前記複数の円形の穴と前記複数の正方形または長方形の穴とがそれぞれ重なり合う位置関係になるように、上プレートと下プレートを搬送治具上に固定する固定手段とを具備する電子部品を上プレートから下プレートに振り込んで搬送治具上に整列させるための電子部品整列装置とする。
【０００７】
上プレート及び、下プレートの厚みが電子部品の長さＬと同等かまたは、それよりわずかに大きいか小さい電子部品整列装置とする。
【０００８】
少なくとも、上プレートに供給された電子部品を振動または揺動させることにより部品のＷＴ面が上下面となるような姿勢で前記搬送治具上に整列させるための振動、揺動印加手段を備えている電子部品整列装置とする。
【０００９】
【発明の実施の形態】
図１は、本発明による電子部品整列装置の斜視図、図２は平面図、図３は正面図の部分断面図である。
【００１０】
電子部品１１が振り込まれる穴Ｄ１が所定の整列位置関係となるように多数個配設された上プレート１と、上プレート１と同じピッチで穴Ｄ２が多数個配設された上プレート下面側に配置された下プレート２と、下プレート下面側に配置された搬送治具３と、振動手段５及び揺動手段６を備えている。
【００１１】
電子部品１１は、その寸法が、横がＷ（０．５ｍｍ）、厚みがＴ（０．５ｍｍ）、長さがＬ（０．８ｍｍ）である。
【００１２】
上プレート１の厚みｔ１は、電子部品１１の長さＬとほぼ同等に設定されている。電子部品１１が振り込まれる穴Ｄ１は所定の整列位置関係となるように設定されている。また下プレート２の厚みｔ２は、電子部品１１の長さＬとほぼ同等に設定されている。電子部品の振り込まれる正方形の穴Ｄ２は所定の整列位置関係となるように設定されている。上プレート１、下プレート２の厚みを電子部品１１の長さＬとほぼ同等に設定することにより、振り込まれた電子部品１１が上プレート上１の電子部品１１の動きを妨げることがなく振込の信頼性を増している。上プレート１、下プレート２は樹脂や金属で構成されている。また上プレート１、下プレート２は、加工上特に問題無ければ、一体で製作してもかまわない。
【００１３】
上プレート１、下プレート２および搬送時治具３の整列位置関係を確保するため、穴の空いていない場所に位置関係を確保した基準穴１ａ、２ａ、３ａをそれぞれ２カ所ずつ設け、電子部品整列装置にガイドピン４を２本設けることでそれぞれの整列位置関係を確保している。
【００１４】
上記発明の実施形態の電子部品整列装置においては、上プレート１に電子部品を供給して振動手段５、揺動手段６により振動、揺動を電子部品に印加することにより上プレート１のＷＴ面の対角寸法よりも大きくＷＬ面、ＴＬ面の対角寸法より小さい直径を有する円形の穴Ｄ１にＷＴ面を下面にして振り込ませることができる。
【００１５】
図５は本発明の実施の形態の一つにおいて上プレート１の穴Ｄ１、下プレート２の穴Ｄ２に電子部品１１を振り込む状態を示す断面図である。図６は本発明の実施の形態の一つにおいて上プレート１の穴Ｄ１に電子部品１１が振り込まれた状態を示す平面図である。図７は本発明の実施の形態の一つにおいて下プレート２の穴Ｄ２に部品が振り込まれた状態を示す平面図である。
振動、揺動を継続させることにより、上プレート１の円形の穴Ｄ１に振り込まれた電子部品１１は穴の側面をガイドに回転を始める。回転を始めた電子部品１１は下プレートの横Ｗ、厚みＴよりもわずかに大きな寸法を持つ角穴Ｄ２と角度が一致したとき下プレートの角穴に振り込まれる。まず上プレート１で電子部品をＷＴ面を下面にして振り込ませることにより、下プレート２への振込、搬送治具３への所定の整列位置関係での整列を確実なものにしている。
【００１６】
【発明の効果】
本発明の電子部品の整列方法によれば、上プレートの穴から下プレートの穴と順番に構成しているので、電子部品が安定した姿勢で振り込まれるため結果的に確実に電子部品を整列できた。
【００１７】
本発明の電子部品整列装置によれば、上プレートのＷＴ面の対角寸法よりも大きく、ＷＬ面、ＴＬ面の対角寸法よりも小さな寸法を有する穴Ｄ１の重心を下プレートのＷ、Ｔ寸法よりもそれぞれわずかに大きな寸法を持つ正方形又は、長方形の穴Ｄ２の重心が一致するように配設されかつ搬送治具３を備えた部品整列装置を用いることにより、請求項１の部品整列方法を確実に実施することが可能になり、所定の整列位置関係で効率良く整列させることが可能となる。
【００１８】
また、振動手段、揺動手段を備えたことにより短時間で整列可能となり作業時間の短縮になった。
【００１９】
直径が、ＷＴ面の対角寸法よりも大きく、ＷＬ面及びＴＬ面の対角寸法よりも小さい上プレート１の穴Ｄ１は、確実にＷＴ面を上下面として振込が行え、Ｗ、Ｔそれぞれよりわずかに大きな寸法を有する正方形または長方形の穴Ｄ２の空いた下プレート２に確実に振り込んで部品を支持、搬送治具上に所定のピッチ、向きで整列させることが可能となる。
【００２０】
上プレート１の厚み方向の寸法ｔ１および、下プレート２の厚み方向の寸法ｔ２を電子部品の高さＬ寸法と同等か、またはそれより多少大きいか、小さくすることにより電子部品が上プレート１上を自由に移動して振込の確実性を上げることができる。
【００２１】
上プレート１で所定のピッチで、ＷＴ面を上下面にさせる整列を行い下プレート２上面で振動または揺動で電子部品に回転を加えながら、下プレート２の正方形または長方形の方向を合わせて搬送治具３に整列させることが可能となる。
【図面の簡単な説明】
【図１】本発明の実施の形態の一つを説明するための斜視図。
【図２】本発明の実施の形態の一つを説明するための平面図。
【図３】本発明の実施の形態の一つを説明するための正面図。
【図４】電子部品の斜視図。
【図５】本発明の実施の形態の一つにおいて上プレート１の穴Ｄ１、下プレート２の穴Ｄ２に電子部品を振り込む状態を示す断面図。
【図６】本発明の実施の形態の一つにおいて上プレート１の穴Ｄ１に電子部品が振り込まれた状態を示す平面図。
【図７】本発明の実施の形態の一つにおいて下プレート２の穴Ｄ２に電子部品が振り込まれた状態を示す平面図。
【図８】サーモモジュールの斜視図。
【符号の説明】
１ 上プレート
２ 下プレート
３ 搬送治具
４ プレート固定手段
５ 振動手段
６ 揺動手段
１１ 電子部品
１２ 上基板
１３ 下基板
Ｌ 電子部品の長さ
Ｔ 電子部品の厚み
Ｗ 電子部品の幅
Ｄ１ 上プレートの穴
Ｄ２ 下プレートの穴
ｔ１ 上プレートの厚み
ｔ２ 下プレートの厚み[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component alignment method and an electronic component alignment apparatus.
[0002]
[Prior art]
FIG. 4 is a perspective view of the electronic component. FIG. 8 is a perspective view of the thermo module. The thermo module shown in FIG. 8 includes an upper substrate 12, a lower substrate 13, and a plurality of electronic components 11. The WT surface of the electronic components and electrode patterns (not shown) of the upper substrate 12 and the lower substrate 13 are provided. It is connected.
For example, in the process of assembling the thermo module, there is a process of arranging the rectangular parallelepiped electronic components at a predetermined alignment position, but the electronic components are generally aligned with the WL surface of the electronic component as the bottom surface. Conventionally, in such a process, 1. The rectangular parallelepiped electronic components were arranged one by one with the tweezers while aligning the upper and lower surfaces. 2. The rectangular parallelepiped-shaped electronic parts were aligned by the parts feeder and supplied one by one by the P & P unit. 3. Electronic components were transferred using a transfer plate and then supplied.
[0003]
[Problems to be solved by the invention]
In the method 1 described above, it takes time for the operator to process each piece with tweezers. In addition, there is a problem that the electronic component is scratched. The method 2 has a problem that the apparatus becomes expensive and the productivity is low. In the method 3, transfer is generally performed with the WL or TL surface as the bottom surface. In this method, work or a device that changes the orientation once after transfer is required to make the WT surface the bottom surface.
[0004]
The present invention solves the above-described problems, and an object thereof is to provide an electronic component alignment method and an electronic component alignment apparatus that can efficiently align electronic components and the like.
[0005]
[Means for Solving the Problems]
Horizontal W, thickness T, a length L (provided that W ≧ T, W <L) method for aligning an electronic component having a rectangular parallelepiped shape, horizontal W, diagonal dimension of WT plane defined by the thickness T A plurality of circular holes having a diameter larger than the diagonal dimension and thickness T of the WL surface having the lateral W and length L and smaller than the diagonal dimension of the TL surface having the length L have a predetermined alignment positional relationship. a plate on which are pieces arranged, lateral is W, the lower plate is square or rectangular holes of the plurality arranged such that said predetermined alignment position relationship with a large slightly dimensions respectively than the thickness T, are aligned A step of fixing the plurality of circular holes and the plurality of square or rectangular holes so as to overlap each other on a conveying jig that supports and conveys the electronic components, and is supplied to the upper plate. Vibrate or swing electronic components Accordingly, the method for aligning an electronic component comprising a step of aligning on the conveying jig remit the lower plate electronic components from the upper plate.
[0006]
Horizontal W, thickness T, a device for aligning a rectangular parallelepiped electronic component length L (provided that W ≧ T, W <L) , horizontal W, diagonal dimension of WT plane defined by the thickness T A plurality of circular holes having a diameter larger than the diagonal dimension and thickness T of the WL surface having the lateral W and length L and smaller than the diagonal dimension of the TL surface having the length L have a predetermined alignment positional relationship. a plate on which are pieces disposed, horizontal W, and a lower plate which is square or rectangular holes of the plurality arranged such that said predetermined alignment position relationship with a large slightly dimensions respectively than the thickness T, are aligned The upper plate and the lower plate are placed on the conveying jig such that the conveying jig that supports and conveys the electronic component and the plurality of circular holes and the plurality of square or rectangular holes overlap each other. electronics comprising a fixing means for fixing the An electronic component alignment apparatus for aligning on a conveying jig remit the lower plate from the top plate.
[0007]
An electronic component aligning apparatus in which the thicknesses of the upper plate and the lower plate are equal to or slightly larger or smaller than the length L of the electronic component.
[0008]
At least vibration and swing applying means for aligning the electronic component supplied to the upper plate on the conveying jig in such a posture that the WT surface of the component becomes the upper and lower surfaces by vibrating or swinging the electronic component is provided. It is assumed that the electronic component aligning apparatus.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
1 is a perspective view of an electronic component aligning device according to the present invention, FIG. 2 is a plan view, and FIG. 3 is a partial sectional view of a front view.
[0010]
A large number of upper plates 1 are arranged so that the holes D1 into which the electronic components 11 are transferred are in a predetermined alignment position, and a lower surface side of the upper plate where a large number of holes D2 are arranged at the same pitch as the upper plate 1. The lower plate 2 arranged, the conveying jig 3 arranged on the lower surface side of the lower plate, the vibration means 5 and the rocking means 6 are provided.
[0011]
The dimensions of the electronic component 11 are W (0.5 mm) laterally, T (0.5 mm) thick, and L (0.8 mm) long.
[0012]
The thickness t1 of the upper plate 1 is set substantially equal to the length L of the electronic component 11. The hole D1 into which the electronic component 11 is transferred is set to have a predetermined alignment positional relationship. Further, the thickness t2 of the lower plate 2 is set substantially equal to the length L of the electronic component 11. The square holes D2 into which the electronic components are transferred are set to have a predetermined alignment positional relationship. By setting the thicknesses of the upper plate 1 and the lower plate 2 to be substantially equal to the length L of the electronic component 11, the transferred electronic component 11 does not interfere with the movement of the electronic component 11 on the upper plate 1. Increased reliability. The upper plate 1 and the lower plate 2 are made of resin or metal. Further, the upper plate 1 and the lower plate 2 may be manufactured integrally if there is no particular problem in processing.
[0013]
In order to ensure the alignment positional relationship between the upper plate 1, the lower plate 2 and the transport jig 3, two reference holes 1a, 2a, 3a each having a positional relationship are provided in places where no holes are provided, By providing two guide pins 4 in the alignment device, the alignment positional relationship between each is ensured.
[0014]
In the electronic component aligning apparatus according to the embodiment of the present invention, the WT surface of the upper plate 1 is supplied by supplying the electronic component to the upper plate 1 and applying vibration and swinging to the electronic component by the vibrating means 5 and the swinging means 6. The circular hole D1 having a diameter larger than the diagonal dimension of the WL surface and smaller than the diagonal dimension of the TL surface can be transferred with the WT surface as the lower surface.
[0015]
FIG. 5 is a cross-sectional view showing a state in which the electronic component 11 is transferred into the hole D1 of the upper plate 1 and the hole D2 of the lower plate 2 in one embodiment of the present invention. FIG. 6 is a plan view showing a state in which the electronic component 11 is transferred into the hole D1 of the upper plate 1 in one embodiment of the present invention. FIG. 7 is a plan view showing a state in which components are transferred into the hole D2 of the lower plate 2 in one embodiment of the present invention.
By continuing to vibrate and swing, the electronic component 11 slid into the circular hole D1 of the upper plate 1 starts rotating with the side surface of the hole as a guide. The electronic component 11 which has started to rotate is transferred into the square hole of the lower plate when the angle coincides with the square hole D2 having dimensions slightly larger than the lateral W and thickness T of the lower plate. First, electronic components are transferred on the upper plate 1 with the WT surface facing down, thereby ensuring transfer to the lower plate 2 and alignment with a predetermined alignment position with respect to the conveying jig 3.
[0016]
【The invention's effect】
According to the electronic component alignment method of the present invention, since the holes of the upper plate are arranged in order from the holes of the lower plate, the electronic components are transferred in a stable posture, and as a result, the electronic components can be reliably aligned. It was.
[0017]
According to the electronic component aligning apparatus of the present invention, the center of gravity of the hole D1 having a dimension larger than the diagonal dimension of the WT surface of the upper plate and smaller than the diagonal dimension of the WL surface and TL surface is set to the center of the lower plate. 2. The component aligning method according to claim 1, wherein the component aligning device is provided so that the centers of gravity of the square or rectangular holes D2 each having a size slightly larger than the size coincide with each other and provided with the conveying jig 3. Can be carried out reliably, and can be efficiently aligned in a predetermined alignment position relationship.
[0018]
Further, since the vibration means and the rocking means are provided, the alignment can be performed in a short time, and the working time is shortened.
[0019]
The hole D1 of the upper plate 1 having a diameter larger than the diagonal dimension of the WT surface and smaller than the diagonal dimension of the WL surface and the TL surface can be reliably transferred with the WT surface as the upper and lower surfaces. It is possible to support the components by reliably swinging them into the lower plate 2 having a square or rectangular hole D2 having a slightly large dimension and aligning them on the conveying jig at a predetermined pitch and orientation.
[0020]
By making the dimension t1 in the thickness direction of the upper plate 1 and the dimension t2 in the thickness direction of the lower plate 2 equal to, slightly larger or smaller than the height L dimension of the electronic component, the electronic component is placed on the upper plate 1. Can be moved freely to increase the certainty of transfer.
[0021]
The upper plate 1 is aligned with the WT surface up and down at a predetermined pitch, and the lower plate 2 is rotated or vibrated on the upper surface of the lower plate 2 while rotating the electronic component so that the square or rectangular direction of the lower plate 2 is aligned. It is possible to align with the jig 3.
[Brief description of the drawings]
FIG. 1 is a perspective view for explaining one embodiment of the present invention.
FIG. 2 is a plan view for explaining one embodiment of the present invention.
FIG. 3 is a front view for explaining one embodiment of the present invention.
FIG. 4 is a perspective view of an electronic component.
FIG. 5 is a cross-sectional view showing a state in which an electronic component is transferred into a hole D1 of the upper plate 1 and a hole D2 of the lower plate 2 in one embodiment of the present invention.
FIG. 6 is a plan view showing a state where an electronic component is transferred into a hole D1 of the upper plate 1 in one embodiment of the present invention.
FIG. 7 is a plan view showing a state where an electronic component is transferred into a hole D2 of the lower plate 2 in one embodiment of the present invention.
FIG. 8 is a perspective view of a thermo module.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Upper plate 2 Lower plate 3 Conveying jig 4 Plate fixing means 5 Oscillating means 6 Oscillating means 11 Electronic component 12 Upper substrate 13 Lower substrate L Electronic component length T Electronic component thickness W Electronic component width D1 Upper plate Hole D2 Lower plate hole t1 Upper plate thickness t2 Lower plate thickness

Claims (4)

横Ｗ、厚みＴ、長さＬ（ただしＷ≧Ｔ、Ｗ＜Ｌ）の直方体形状の電子部品を整列させるための方法であって、横Ｗ、厚みＴで規定されるＷＴ面の対角寸法よりも大きく、横Ｗ、長さＬのＷＬ面の対角寸法および厚みＴ、長さＬのＴＬ面の対角寸法より小さい直径を有する円形の穴が所定の整列位置関係となるように複数個配設された上プレートと、横Ｗ、厚みＴよりそれぞれわずかに大きな寸法を有する正方形または長方形の穴が前記所定の整列位置関係となるように複数個配設された下プレートを、整列された電子部品を支持して搬送させる搬送治具上に、前記複数の円形の穴と前記複数の正方形または長方形の穴とがそれぞれ重なり合う位置関係になるように固定する工程と、上プレートに供給された電子部品を振動または揺動させることにより、電子部品を上プレートから下プレートに振り込んで搬送治具上に整列させる工程とを具備することを特徴とする電子部品の整列方法。Horizontal W, thickness T, a length L (provided that W ≧ T, W <L) method for aligning an electronic component having a rectangular parallelepiped shape, horizontal W, diagonal dimension of WT plane defined by the thickness T A plurality of circular holes having a diameter larger than the diagonal dimension and thickness T of the WL surface having the lateral W and length L and smaller than the diagonal dimension of the TL surface having the length L have a predetermined alignment positional relationship. a plate on which are pieces arranged, lateral is W, the lower plate is square or rectangular holes of the plurality arranged such that said predetermined alignment position relationship with a large slightly dimensions respectively than the thickness T, are aligned A step of fixing the plurality of circular holes and the plurality of square or rectangular holes so as to overlap each other on a conveying jig that supports and conveys the electronic components, and is supplied to the upper plate. Vibrate or swing electronic components The alignment method of the electronic component, characterized by comprising the step of aligning on the conveying jig remit the lower plate electronic components from the upper plate. 横Ｗ、厚みＴ、長さＬ（ただしＷ≧Ｔ、Ｗ＜Ｌ）の直方体形状の電子部品を整列させるための装置であって、横Ｗ、厚みＴで規定されるＷＴ面の対角寸法よりも大きく、横Ｗ、長さＬのＷＬ面の対角寸法および厚みＴ、長さＬのＴＬ面の対角寸法より小さい直径を有する円形の穴が所定の整列位置関係となるように複数個配設された上プレートと、横Ｗ、厚みＴよりそれぞれわずかに大きな寸法を有する正方形または長方形の穴が前記所定の整列位置関係となるように複数個配設された下プレートと、整列された電子部品を支持して搬送させる搬送治具と、前記複数の円形の穴と前記複数の正方形または長方形の穴とがそれぞれ重なり合う位置関係になるように、上プレートと下プレートを搬送治具上に固定する固定手段とを具備すること特徴とする、電子部品を上プレートから下プレートに振り込んで搬送治具上に整列させるための電子部品整列装置。Horizontal W, thickness T, a device for aligning a rectangular parallelepiped electronic component length L (provided that W ≧ T, W <L) , horizontal W, diagonal dimension of WT plane defined by the thickness T A plurality of circular holes having a diameter larger than the diagonal dimension and thickness T of the WL surface having the lateral W and length L and smaller than the diagonal dimension of the TL surface having the length L have a predetermined alignment positional relationship. a plate on which are pieces disposed, horizontal W, and a lower plate which is square or rectangular holes of the plurality arranged such that said predetermined alignment position relationship with a large slightly dimensions respectively than the thickness T, are aligned The upper plate and the lower plate are placed on the conveying jig such that the conveying jig that supports and conveys the electronic component and the plurality of circular holes and the plurality of square or rectangular holes overlap each other. JP be provided with a fixing means for fixing the To, electronic component alignment apparatus for aligning on a conveying jig remit the lower plate electronic components from the upper plate. 上プレート及び、下プレートの厚みが電子部品の長さＬと同等かまたは、それよりわずかに大きいか小さいことを特徴とする請求項２記載の電子部品整列装置。  3. The electronic component aligning apparatus according to claim 2, wherein the thicknesses of the upper plate and the lower plate are equal to or slightly larger or smaller than the length L of the electronic component. 少なくとも、上プレートに供給された電子部品を振動または揺動させることにより部品のＷＴ面が上下面となるような姿勢で前記搬送治具上に整列させるための振動手段、揺動手段を備えていることを特徴とする請求項２又は３記載の電子部品整列装置。  At least vibration means and a swinging means are provided for aligning the electronic component supplied to the upper plate on the conveying jig in such a posture that the WT surface of the component is an upper and lower surface by vibrating or swinging the electronic component. The electronic component aligning apparatus according to claim 2 or 3, wherein
JP2002090426A 2002-03-28 2002-03-28 Electronic component alignment method and electronic component alignment apparatus Expired - Fee Related JP4324342B2 (en)

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