KR20170084721A - Auxiliary fixture for holding a printed circuit board during electroplating - Google Patents

Auxiliary fixture for holding a printed circuit board during electroplating Download PDF

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Publication number
KR20170084721A
KR20170084721A KR1020160003470A KR20160003470A KR20170084721A KR 20170084721 A KR20170084721 A KR 20170084721A KR 1020160003470 A KR1020160003470 A KR 1020160003470A KR 20160003470 A KR20160003470 A KR 20160003470A KR 20170084721 A KR20170084721 A KR 20170084721A
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KR
South Korea
Prior art keywords
substrate
panel
circuit board
present
holders
Prior art date
Application number
KR1020160003470A
Other languages
Korean (ko)
Inventor
김지윤
Original Assignee
대덕전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 대덕전자 주식회사 filed Critical 대덕전자 주식회사
Priority to KR1020160003470A priority Critical patent/KR20170084721A/en
Publication of KR20170084721A publication Critical patent/KR20170084721A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Abstract

The present invention provides an auxiliary fixture for fixing a substrate panel that is lowered to a plating bath hanging from a substrate transfer device of a vertical type electroplating facility at the bottom.
The present invention relates to a pneumatic tire comprising a pair of substrate holders pivoted as a fan-shaped cylinder, the pair of substrate holders facing each other in a storage space, a clearance being formed between the surfaces to be bonded, When the substrate holder is lowered and both substrate holders are pushed into the gap while the pins for fixing the substrate holder to the pedestal are wound, the both substrate holders act in a direction opposite to each other in the substrate surface due to the restoring force of the spring Thereby firmly fixing the substrate panel.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an auxiliary fixture for fixing a circuit board for an electroplating apparatus,

[0001] The present invention relates to an auxiliary fixture for fixing printed circuit boards (PCBs) for a vertical type electroplating apparatus, and more particularly to a PCB fixture for preventing the PCB substrate from falling down even if the substrate fixing is separated from the transfer clamp, To an auxiliary fixture capable of firmly fixing a substrate without a clearance.

In the vertical type electroplating automation equipment, the upper end of the PCB board is fixed with the clamp of the board, and the PCB board is immersed in the plating tank by the upward and downward movements. When the electroplating is finished, the PCB board is lifted up to the next step .

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a substrate on which a substrate fixture according to the prior art is mounted on a transfer frame. However, in the prior art, the substrate fixation uses an auxiliary fixture in the lower portion of the transfer table to prevent the transfer clamp from being released and the substrate to be dropped downward.

However, during the plating process by immersing the PCB substrate in the plating liquid, a considerable amount of bubbles are generated in the plating liquid. When the inner wall of the via hole of the substrate to be plated is covered with the bubbles, the copper plating can not satisfactorily coat the via hole. An air trap (also referred to as "air bubble" or "void") is generated in the coated copper plating, resulting in poor conduction, that is, open failure.

2 is a cross-sectional micrograph showing a via hole open defect caused by an air trap according to the prior art. In order to solve such a problem that a bubble or an air trap sticks to the inner wall of the via hole to cause plating defects, an ultrasonic vibrator is mounted on the transfer plate of the electroplating automated equipment to generate vibration on the substrate, And the air trap is prevented from sticking to the substrate surface or the inner wall of the via hole by the dam.

3 is a photograph showing an auxiliary fixture according to the prior art. However, the auxiliary jig shown in FIG. 3 merely prevents the PCB from falling down even if the PCB substrate falls down, and basically it does not have a rigidly holding the PCB substrate. Therefore, even if the ultrasonic vibration device vibrates the substrate There is a disadvantage in that ultrasonic vibration can not be uniformly transmitted to the substrate because one end of the substrate is not fixed but is shaken in a state of being left untreated.

1. Korean Patent Publication No. 10-2012-0079414. 2. Korean Patent Publication No. 10-2013-0078669. 3. Korean Patent Publication No. 10-2003-0050715.

A first object of the present invention is to provide an auxiliary fixture capable of firmly holding and fixing the bottom of a PCB substrate in a vertical type electroplating automation equipment.

A second object of the present invention is to provide an auxiliary fixture for efficiently transmitting ultrasonic vibration applied to a substrate in order to prevent an air trap from sticking to a substrate during electroplating.

The present invention provides an auxiliary fixture for fixing a substrate panel that is lowered to a plating bath hanging from a substrate transfer device of a vertical type electroplating facility at the bottom.

The auxiliary jig according to the present invention has a storage space capable of accommodating a circuit board panel that is lowered on the upper portion thereof. The storage space is formed in a hollow rectangular parallelepiped shape with an open upper portion, And the rear surface is cut off in a U-shape from top to bottom to provide a clearance where both side edges of the circuit board panel can protrude out of the storage space when the circuit board panel descends from top to bottom, A columnar pedestal defined by a column portion, a rear right column portion, a rear left column portion, and a front left column portion; A through hole is formed in the shape of a fan-shaped cylinder so as to extend from a point on the end face of the fan-shaped disk to a point of symmetry of the end face of the opposite side of the disk, and between the through hole formed in the front pole and the through hole formed in the rear pole, And a pair of substrate holders for aligning the through holes and fastening the pins so as to penetrate through the through holes, thereby performing pivotal movement with the pins as the rotation axis of the iron.

The pin for fastening the substrate holder of the present invention in the form of a bar is configured to apply a restoring force such that a spring is wound so that the substrate holder is returned from the lower side to the upper side when the substrate holder is pushed from top to bottom, And the substrate panel is lowered by inserting the substrate holder into the gap while pushing both the substrate holders when the substrate panel is lowered, The strong force on the surface of the substrate acts in opposite directions to each other by the restoring force of the spring, thereby firmly fixing the substrate panel.

In the present invention, since the upper part of the PCB panel holds the clamp of the feeding frame and the lower part of the PCB panel holds the pair of substrate holders firmly by closely contacting the surface of the board panel, the board panel moves or falls Can be prevented. In addition, even in the process of applying vibration to the substrate with the ultrasonic vibration device, since both ends of the substrate are firmly held and vibration is applied, the ultrasonic vibration can be efficiently transmitted to the substrate. As a result, it is possible to prevent the air bubble from sticking to the substrate surface during the electroplating process to cause an open defect.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a photograph showing a PCB substrate mounted on a transfer station according to the prior art; FIG.
2 is a cross-sectional micrograph showing a via hole open defect caused by an air trap according to the prior art.
3 is a photograph showing an example of an auxiliary fixture made in accordance with the prior art and commonly used.
Figures 4a and 4b are perspective views of an auxiliary fixture for securing a substrate, which can be applied to a vertical type electroplating facility, according to a preferred embodiment of the present invention, as seen from the front and rear, respectively.
FIGS. 5A to 5D are photographs of various photographs of an auxiliary fixture for fixing a substrate, which can be used in a vertical type electroplating apparatus, according to a preferred embodiment of the present invention. FIG.
FIGS. 6A, 6B, 6C and 6D are respectively a front view, a rear view, a right side view, and a right side view of an auxiliary fixture for fixing a substrate, which can be used in a vertical type electroplating apparatus, according to a preferred embodiment of the present invention, Fig.
7A and 7B are photographs of a pedestal remaining in a state where two pillars of a pedestal constituting an auxiliary fixture according to the present invention are cut.
8A to 8E are photographs showing the state of engagement between the substrate holder and the pillar portion by cutting two pillars of the pedestal constituting the auxiliary jig according to the present invention.
FIG. 9A illustrates the prior art, and FIG. 9B illustrates a case where the technique of the present invention is applied.

The present invention provides an auxiliary fixture for fixing a substrate panel that is lowered to a plating bath hanging from a substrate transfer device of a vertical type electroplating facility at the bottom.

The present invention relates to a pneumatic tire comprising a pair of substrate holders pivoted as a fan-shaped cylinder, the pair of substrate holders facing each other in a storage space, a clearance being formed between the surfaces to be bonded, When the substrate holder is lowered and both substrate holders are pushed into the gap while the pins for fixing the substrate holder to the pedestal are wound, the both substrate holders act in a direction opposite to each other in the substrate surface due to the restoring force of the spring Thereby firmly fixing the substrate panel.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings 4 to 9. Figs. 4A and 4B are perspective views showing an auxiliary fixture for fixing a substrate, which can be applied to a vertical type electroplating apparatus, according to a preferred embodiment of the present invention, respectively.

5A to 5D are photographic images of auxiliary fixtures for fixing a substrate, which can be used in a vertical type electroplating apparatus, in various angles, according to a preferred embodiment of the present invention.

FIGS. 6A, 6B, 6C and 6D are respectively a front view, a rear view, a right side view, and a right side view of an auxiliary fixture for fixing a substrate, which can be used in a vertical type electroplating apparatus according to a preferred embodiment of the present invention, Fig.

First, the structure of the auxiliary jig according to the present invention will be described in detail with reference to a perspective view of FIG. 4, a photograph of FIG. 5, and a view of the hexagonal diagram of FIG.

The auxiliary jig according to the present invention is composed of a pedestal 100 and a pair of substrate holders 200a and 200b and a pair of substrate holders 200a and 200b are connected to pins 120a and 130a and nuts 120b and 130b, As shown in FIG.

4A and 4B, the pedestal 100 has a storage space for accommodating a circuit board panel that descends in a plating bath, and the storage space is a rectangular parallelepiped shape having an upper surface opened the front and rear surfaces are cut in a U-shape from top to bottom, and when the circuit board panel is lowered from the top to the bottom, both side edges of the circuit board panel are provided with a gap that can protrude out of the storage space do.

As a result, referring to FIG. 5 or 6, the rectangular parallelepiped-shaped storage space in which the upper surface is opened eventually has front right side pillar 110a, rear right side pillar 110b, rear left side pillar 110c, Quot; portion 110d. ≪ / RTI >

At this time, reinforcing plates 140a and 140b may be attached to the left and right sides of the storage space in order to reinforce a bracing force. The right reinforcing plate 140a may be formed of a front right column portion 110a and a rear right column portion 110b (150a, 150b, 150c, 150d) passing through the side surface of the frame (150). Likewise, the left reinforcing plate 140b is firmly fixed by screws 155a, 155b, 155c, and 155d that pass through the side surfaces of the front left column portion 110d and the rear left column portion 110c.

 5A to 5D, the substrate holder 200a is fastened between the front right side post 110a and the rear right side post 110b by the pins 120a and the nut 120b, And pivotally moves with the pin 120a as a rotation center axis. That is, the substrate holder 200a rotates as if it hangs on the iron bar.

The other opposing substrate holder 200b is fastened between the front left column 110d and the rear left column 110c by the pin 130a and the nut 130b and mounted in the storage space, ) As a rotation center axis.

That is, when the substrate holders 200a and 200b are pressed from above to down, the substrate holders 200a and 200b are configured such that the pins 120a and 130a connected to the pillar portions 110a, 110b, 110c, Pivots in the opposite direction from the top to the bottom, and when the user releases his / her hand, the spring returns to its original state by the restoring force of the spring (not shown in FIGS. 4, 5 and 6; see FIG. 7).

The pins (120a, 130a) for fastening the substrate holders (200a, 200b) according to the present invention in the form of a bar are wound around a spring (not shown in FIGS. 4, 5 and 6; see FIG. 7) And 200b are pushed from the top to the bottom, it is possible to cause a restoring force to return from the bottom to the top. That is, a clockwise restoring force is applied to the right substrate holder 200a by a spring, and a counter-clockwise restoring force acts on the left substrate holder 200b.

The substrate holder 200a on the right side and the substrate holder 200b on the left side are brought into contact with each other in the storage space and a gap is formed between the bonding surfaces (see FIG. 5B or FIG. 6B). When the thickness of the substrate is equal to or slightly thicker than the clearance when the substrate is lowered, the substrate panel is inserted into the gap while pushing the substrate holders 200a and 200b to be lowered, and the substrate holder 200a on the right side, The substrate holder 200b acts on the substrate surface in a direction opposite to that of the substrate due to the restoring force of the spring. As a result, the substrate is firmly held and fixed by the two side substrate holders 200a and 200b.

The auxiliary jig according to the present invention can be made of a plastic material and can be manufactured by injection molding.

6A to 6D, when the printed circuit board panel is vertically lowered toward the gap between the substrate holders 200a and 200b fastened to the pillars 110a, 110b, 110c, and 110d, The substrate panel is inserted between the clearance spaces, and the substrate holders 200a and 200b firmly fix the panel with a pressing force by the restoring force of the spring.

As a result, when an ultrasonic vibrator equipped with a substrate fixing unit vibrates and vibrates, the substrate is firmly caught and vibrated, thereby effectively preventing the air trap from adhering to the substrate surface or the inner wall of the via hole .

Referring to FIGS. 4, 5, and 6 together, the front and rear surfaces of the storage space are cut in a U-shape to provide a space in which the printed circuit board panel can be housed. However, it is not necessarily required to cut the U-shape, and it is only necessary to provide a space in which the printed circuit board panel can descend.

Referring to FIGS. 4, 5 and 6 together, the substrate holders 200a and 200b fastened to the pillars 110a, 110b, 110c, and 110d are pressed against each other in order to support the reaction force against the restoring force of the spring. Stiffening plates 140a and 140b are attached to both sides of the pillars 110a, 110b, 110c and 110d. 150a, 150b, 150c, 150d, 155a, 155b, 155c, and 155d may be formed on both sides of the storage space by further attaching plates of iron plate or SUS material to form the reinforcing plates 140a and 140b. It can be fixed firmly to the column portion.

FIGS. 7A and 7B are photographs of a still image of a pedestal remaining in a state where two pillars of a pedestal are cut so that the operation of the auxiliary jig according to the present invention can be easily understood. FIG. 8A to 8E are photographs showing the state of fastening between the substrate holder and the column by cutting two pillars of the pedestal constituting the auxiliary jig according to the present invention.

A description will be given of a form in which the substrate holders 200a and 200b of the auxiliary jig according to the present invention are fastened to the pillars 110a, 110b, 110c and 110d of the pedestal 100 and a pivotal motion mechanism, do.

Referring to FIGS. 7A and 7B, a preferred embodiment of the substrate holders 200a and 200b according to the present invention has a fan-shaped cylindrical shape. As a preferred embodiment of the present invention, a disk column having a predetermined depth (height) may have a fan-shaped cylindrical shape cut into slices so as to have a predetermined central angle, such as a cake cut.

As a preferred embodiment of the present invention, the substrate holders 200a and 200b according to the present invention can have a fan-shaped cylindrical shape with a central angle of about 90 degrees. 7A and 7B, a through hole is formed so as to reach a point of symmetry of a cross section of the opposite side circular plate from one end of a section of a circular disk of the substrate holder 200b, and a front left column 110d and a rear left column 110c in a predetermined position.

The through holes of the substrate holder 100b according to the present invention and the front left side column portions 110d and the rear side left column portions 110c are aligned on the straight line and the pins 130a are arranged on the front left column portion 110d The substrate holder 200b is inserted between the pillar portions 110c and 110d so that the substrate holder 200b is suspended in the form of a bar by inserting through the through holes to reach the rear left column portion 110c. At this time, the fin 130a is securely fastened to the end of the column 110c by using the nut 130b.

8A to 8C, the through hole formed at one end of the original plate of the substrate holder 200a and the through hole of the column portions 110a and 110b are passed through the pin 120a, And the pin 120a is used as a rotating shaft of the iron so that the substrate holder 200a is pivotally moved.

8D and 8E are photographs illustrating the pivoting motion of the substrate holder according to the present invention and the restoring force of the spring according to the present invention. 8D and 8E, the pin 120a is inserted into the column portion 110a, the substrate holder 200a, the column portion 110b and is fastened with the nut 120b. The pin 120a And the substrate holder 200a pivotally moves.

8D and 8E, a spring 190 is fixedly attached to the pin 120a and one end of the spring 190 is fixed to the side or side of the column 110a and the column 110b, And exerts a spring restoring force on the plate 140a.

When the substrate holder 200a is pressed downward, the spring 190 presses a reaction force against the side surface of the reinforcing plate 140a on both sides or the side reinforcing plate 140a, and exerts a restoring force in the opposite rotation direction .

The foregoing has somewhat improved the features and technical advantages of the present invention in order to better understand the claims of the invention described below. Additional features and advantages that constitute the claims of the present invention will be described in detail below. It should be appreciated by those skilled in the art that the disclosed concepts and specific embodiments of the invention can be used immediately as a basis for designing or modifying other structures to accomplish the invention and similar purposes.

In addition, the inventive concepts and embodiments disclosed herein may be used by those skilled in the art as a basis for modifying or designing other structures to accomplish the same purpose of the present invention. It will be apparent to those skilled in the art that various modifications, substitutions and alterations can be made hereto without departing from the spirit or scope of the invention as defined in the appended claims.

When the pressing jig according to the present invention is installed, space is not formed at a portion contacting with the PCB product. Therefore, when ultrasonic vibration is applied, bubbles on the surface of the substrate are removed, and it is confirmed that the electroplating is normally performed. As a result, it was confirmed that the yield improvement was improved by 0.5% as compared with the prior art. FIG. 9A illustrates the prior art, and FIG. 9B illustrates a case where the technique of the present invention is applied.

Referring to FIG. 9A, in the case of the conventional art, a copper plating failure occurs due to bubbles on the inner wall of the through hole, while referring to FIG. 9B, it can be visually confirmed that copper plating is uniformly applied to the inner wall of the through hole in the present invention.

In addition, when the product is vertically racked, space is not generated, the product is fixed without moving, and pressure is applied to the auxiliary jig, so that various kinds of thickness sizes can be effectively racked. As the product can be fixed when it is applied to the PCB vertical plating specialist, the quality can be improved and the Q-cost cost can be reduced to minimize the profit. In addition, injection molding can be performed by a user in a desired size, and replacement and manufacture of parts are easy.

Claims (1)

An auxiliary fixture for fixing a substrate panel, which is suspended from a substrate transfer device of a vertical type electroplating facility, in a lowering position in a plating bath,
And a storage space for accommodating the lowering circuit board panel. The storage space is formed in a hollow rectangular parallelepiped shape with an open upper portion. The front and rear surfaces are U-shaped And the side surface corners of the circuit board panel can protrude out of the accommodating space when the circuit board panel is lowered from the top to the bottom, the accommodating space having a front right side post portion and a rear right side post portion, A columnar pedestal defined by a left post portion and a front left post portion;
A through-hole is formed in a cylindrical shape having a predetermined central angle. The through-hole is formed so as to reach the symmetrical point of the cross-section of the opposite-side circular plate from one point of the cross-section of the circular disc. A pair of substrate holders for aligning the through-holes of the fan-shaped circular plate and fastening the pins so as to penetrate into the through-holes, thereby pivoting the pins with the pins as rotation axes;
Wherein the pin for fastening the substrate holder in the form of a bar is wound with a spring so as to exert a restoring force such that when the substrate holder is pushed from top to bottom, the substrate holder is returned from below to the upper side, A space is formed between the joining faces to form a predetermined gap. When the substrate panel is lowered, the substrate panel is inserted into the gap while pushing both the substrate holders, Wherein the holder fixes the substrate panel firmly by applying a strong force to the surface of the substrate in opposite directions by the restoring force of the spring.
KR1020160003470A 2016-01-12 2016-01-12 Auxiliary fixture for holding a printed circuit board during electroplating KR20170084721A (en)

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Application Number Priority Date Filing Date Title
KR1020160003470A KR20170084721A (en) 2016-01-12 2016-01-12 Auxiliary fixture for holding a printed circuit board during electroplating

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Application Number Priority Date Filing Date Title
KR1020160003470A KR20170084721A (en) 2016-01-12 2016-01-12 Auxiliary fixture for holding a printed circuit board during electroplating

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240045408A (en) 2022-09-29 2024-04-08 대덕전자 주식회사 Method of reducing the electroplating deviation for printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240045408A (en) 2022-09-29 2024-04-08 대덕전자 주식회사 Method of reducing the electroplating deviation for printed circuit board

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