JP6163085B2 - Pallet for parts alignment and manufacturing method thereof - Google Patents

Description

  The present invention relates to a component aligning pallet for storing components in component receiving holes formed in the pallet and aligning the components on the pallet, and a method for manufacturing the same.

  When manufacturing an electronic device or the like, it is desired to automate the stage of supplying a large number of chip parts to an automatic supply device in order to improve the manufacturing efficiency. For this purpose, it is required to efficiently accommodate and align the chip components in the component accommodation holes provided in the pallet. Therefore, for example, in Patent Document 1, a large number of component receiving holes are formed in the pallet, a vibration part that vibrates the pallet and a rocking part that rocks the pallet are provided, and vibration and rocking are applied to the pallet. There is disclosed a minimal component aligning machine in which a large number of micro screws supplied on a pallet are accommodated and aligned in respective component accommodating holes.

Japanese Patent Laid-Open No. 05-043042

  By the way, the shape of the chip component accommodated in the component accommodation hole of the pallet has been miniaturized year by year. For this reason, it is not always easy to accommodate one chip component in each component accommodation hole, and development of a more efficient chip component accommodation means is desired.

When a thin chip component is accommodated in the component accommodation hole, if the component accommodation hole on the pallet is formed, for example, in a circular shape, two chip components are chipped in one component accommodation hole due to variations in the size of the component accommodation hole. In some cases, the parts are housed in a state where they overlap in the thickness direction of the parts.
Thus, it is conceivable to form, for example, a long hole-shaped component accommodating hole corresponding to the shape (thin shape) of the chip component. However, forming a long hole-shaped component accommodating hole increases the processing time. Also, since it is usually necessary to form several thousand to several tens of thousands of component receiving holes in the pallet, it takes a lot of processing time to create one pallet compared to the case of forming circular component receiving holes. Or processing may not be possible.

  Therefore, the present invention can easily form a component accommodation hole that matches the shape of the chip component, reduces the probability that two chip components are accommodated in one component accommodation hole, and is used for component alignment. It is an object of the present invention to provide a parts alignment pallet that can be manufactured in a short processing time and a manufacturing method thereof.

In order to achieve the above-mentioned object, the component aligning pallet according to the present invention includes a plurality of components in which chip components distributed and placed on one surface of the pallet accommodate the chip components provided on the one surface. A component aligning pallet in which the chip components are aligned on the pallet by being accommodated in the accommodating holes,
Each of the plurality of component receiving holes includes a first hole having a first diameter and a second hole having a second diameter,
The first hole and the second hole are formed so as to partially overlap each other,
The chip component accommodated in the component accommodation hole has a rectangular parallelepiped shape, the size in the thickness direction is T, the size in the width direction is W, the size in the length direction is L, and the thickness direction is Assuming that the size of the diagonal line of the surface formed by the side with the width direction is X and T ≦ W ≦ L,
The first diameter and the second diameter have a size of X or less,
A boundary portion between the inner wall surface of the first hole and the inner wall surface of the second hole in the inner wall surface of the first hole and the inner wall surface of the second hole forming the inner wall surface of the component housing hole. The distance between the inner wall surfaces facing each other has a size of 2T or less.

  In addition, a method for manufacturing a component aligning pallet according to the present invention is the above method for manufacturing a component aligning pallet, wherein the second diameter of the second hole is larger than the first diameter of the first hole. If it is larger, the method includes a first step of forming the first hole after the first step and a second step of forming the second hole.

  In the method for manufacturing a parts alignment pallet of the present invention, the first hole in the first step may be formed using a drill, and the second hole in the second step may be formed using an end mill. preferable.

  According to the component alignment pallet and the manufacturing method thereof of the present invention, it is possible to reduce the probability that two chip components are accommodated in one component accommodating hole, and a component in which a plurality of component accommodating holes are formed. The alignment pallet can be manufactured in a short processing time.

It is a figure which shows the structure of the components alignment pallet which concerns on this invention. It is a figure which shows an example of the component accommodation hole formed in the pallet for components alignment, (a) is the top view, (b) shows EE sectional drawing of (a). It is a figure which shows an example of the chip component accommodated in a component accommodation hole. It is a flowchart which shows the manufacture procedure of the components alignment pallet. It is a figure which shows the comparative example of a component accommodation hole, (a) is a round hole shape, (b) shows the component accommodation hole of a long hole shape. It is a figure which shows the modification of a component accommodation hole.

  Hereinafter, an example of an embodiment of a parts alignment pallet and a manufacturing method thereof according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view showing a configuration of a component alignment pallet 1 according to the present embodiment. The component aligning pallet 1 is used by being fixed to a component aligner (not shown), for example. The component aligning pallet 1 is configured so that each chip is subjected to vibration and swinging from the component aligning machine to the component aligning pallet 1 in a state where a large number of chip components are dispersedly placed on the component aligning pallet 1. The components can be accommodated respectively in a plurality of component accommodation holes formed in the component alignment pallet 1. Further, the chip components can be aligned on the component aligning pallet 1 by storing the chip components one by one in each component receiving hole.

  As shown in FIG. 1, the component aligning pallet 1 includes a main body substrate 2 and a frame portion 3 provided on a peripheral portion of the main body substrate 2. On one surface 2 a of the main body substrate 2, a plurality of component housing holes 5 are formed in a region surrounded by the frame portion 3.

  The main body substrate 2 is formed by, for example, a rectangular plate-shaped member, and the material thereof is made of bakelite (phenol resin) or the like. The material is not limited to bakelite, but may be made of other resin containing carbon powder.

  The frame portion 3 is formed on the peripheral portion of the one surface 2 a of the main body substrate 2 so as to protrude from the one surface 2 a and is made of the same material as that of the main body substrate 2.

  A plurality of component housing holes 5 are formed in a matrix on one surface 2 a of the main body substrate 2. The number of component housing holes 5 to be formed is, for example, several thousands to several tens of thousands.

  FIG. 2 is a partially enlarged view showing only a portion where one component accommodating hole 5 is formed from the main body substrate 2. 2A is a plan view, and FIG. 2B is a cross-sectional view taken along the line EE in FIG. 2A and the line EE in FIG. In this example, the plurality of component housing holes 5 of the main board 2 are described as having the same structure, but manufacturing tolerances may occur for each hole.

  As shown in FIG. 2, the component receiving hole 5 includes a hole (an example of the first hole) 5a having a diameter R1 (an example of the first diameter) centered on O1, and an R2 centered on O2. A hole (an example of the second hole) 5b having a diameter (an example of the second diameter) is provided. The diameter of the hole 5a is different from the diameter of the hole 5b. In this embodiment, the diameter R1 of the hole 5a is smaller than the diameter R2 of the hole 5b.

  The component accommodation hole 5 is formed by cutting perpendicularly from the one surface 2a of the main body substrate 2 toward the one surface 2b opposite to the one surface 2a. In this embodiment, the hole 5a and the hole 5b are formed such that a part on the left side of the hole 5a and a part on the right side of the hole 5b overlap each other in plan view so that a part of each hole overlaps. The hole 5a is formed deeper than the hole 5b. The deeper hole 5a is cut using a drill, and the shallower hole 5b is cut using an end mill.

  A chamfered portion 6 is provided at the opening edge of the component housing hole 5 on the one surface 2a side. The chamfered portion 6 has a circular shape with a diameter R6 at the upper end of the opening of the component receiving hole 5, and the center position thereof is a line segment passing through the center O1 of the hole 5a and the center O2 of the hole 5b, and It is located at the center of the line segment from the end to the end of the hole 5b (position slightly closer to the center O1 than the center O2). The chamfered portion 6 is inclined in a direction in which the diameter decreases as the distance from the one surface 2a increases.

  Here, in each of the component receiving holes 5, a chip component 10 having a rectangular parallelepiped shape as shown in FIG. The chip component 10 has, for example, a thickness of T [mm], a width of W [mm], and a length of L [mm]. There is a relationship of T ≦ W ≦ L between W and the length L. Further, the diagonal line of the surface formed by the side in the thickness direction and the side in the width direction of the chip component 10 has a size of X [mm]. The component housing hole 5 accommodates a thin type chip component 10, specifically, a chip component such as a resistor or a capacitor.

  The chip component 10 accommodated in the component accommodating hole 5 is indicated by a broken line in FIG. The chip component 10 is accommodated in such a posture that the length direction of the chip component 10 is along the depth direction of the component accommodation hole 5. That is, one of the pair of surfaces formed by the thickness direction side and the width direction side of the chip component 10 is accommodated in the component accommodation hole 5 in a posture close to parallel to the one surface 2 a of the main body substrate 2. The

  In order to accommodate only one chip component 10 having the shape as shown in FIG. 3 in the component accommodation hole 5 in the posture as shown in FIG. 2, the component accommodation hole 5 has a diameter R1 of the hole 5a and a diameter of the hole 5b. The size of R2 satisfies at least R1, R2 ≦ X in relation to the diagonal line X of the surface formed by the side in the thickness direction and the side in the width direction of the chip component 10.

  In addition, the distance r between the inner wall surfaces facing each other at the boundary between the inner wall surface of the hole 5a and the inner wall surface of the hole 5b in the inner wall surface of the hole 5a and the inner wall surface of the hole 5b forming the inner wall surface of the component housing hole 5. However, T <r ≦ 2T is satisfied in relation to the thickness T of the chip component 10.

  Further, in the plan view shown in FIG. 2 (a), it is separated from the straight line connecting the center O1 of the hole 5a and the center O2 of the hole 5b by T / 2 (a distance half the thickness T of the chip part 10) on both the upper and lower sides. The distance s between the inner wall surfaces facing each other in the left-right direction of the component housing hole 5 at the position satisfies W <s in relation to the width W of the chip component 10.

  Next, the manufacturing procedure of the component alignment pallet 1 will be described with reference to the flowchart shown in FIG.

  First, a drill is used as a cutting tool for forming the component accommodation hole 5, and a hole 5a having a diameter R1 is formed at a preset position on the component alignment pallet 1 (step S1: example of the first step). .

  Subsequently, an end mill is used as a cutting tool for forming the component accommodation hole 5, and a hole 5b having a diameter R2 larger than the diameter R1 is formed in the component alignment pallet 1 (step S2: an example of a second step). The hole 5b to be formed later is formed so that a part of the hole 5b overlaps a part of the hole 5a formed previously. At this time, in the hole 5b, the distance r between the inner wall surfaces of the boundary portion (see FIG. 2A) is T <r ≦ 2T with respect to the thickness T of the chip component 10 to be accommodated, and the chip component 10 The distance s (see FIG. 2A) between the inner wall surfaces of the component receiving hole 5 is formed so as to overlap the hole 5a at a preset position such that W <s. Further, the depth of the component accommodation hole 5 is formed such that the chip component 10 is entirely accommodated in the component accommodation hole 5. That is, the shallow hole 5 b is formed so that the depth thereof is larger than the length L of the chip component 10.

  Subsequently, the chamfered portion 6 is formed at the edge of the component housing hole 5 (step S3).

  The machining of one component housing hole 5 is completed by the manufacturing process from step S1 to step S3.

  Subsequently, it is determined whether or not processing of all the component receiving holes 5 has been completed (step S4). As a result of the determination, when the machining of all the component accommodation holes 5 has not been completed (step S4: No), the process moves to the machining position of the next component accommodation hole 5 and the manufacturing process from step S1 to step S3. repeat. The position where the component accommodation hole 5 is formed is set in advance according to the number of the component accommodation holes 5 to be formed. For example, when 10,000 component housing holes 5 are formed on one surface 2a, the component housing holes 5 are set to be arranged in 100 rows and 100 columns on the one surface 2a.

  When the machining of all the component accommodation holes 5 is completed (step S4: Yes), the production of the component alignment pallet 1 is finished. Thereby, the component aligning pallet 1 in which the plurality of component receiving holes 5 are arranged in a matrix is manufactured.

  According to the component aligning pallet 1 and the manufacturing method thereof according to the present embodiment described above, the component receiving hole 5 on the component aligning pallet 1 is a hole 5a in consideration of the width W of the chip component 10 in the width direction. The diameter R1 and the diameter R2 of the hole 5b are designed to be equal to or smaller than the diagonal X of the chip component 10 [mm]. As a result, the chip component 10 accommodated in the component accommodation hole 5 is prevented from being accommodated in a direction that does not extend over the two holes (hole 5a and hole 5b).

  In consideration of the size T of the chip component 10 in the thickness direction, the distance r between the opposing inner wall surfaces at the boundary between the inner wall surface of the hole 5a and the inner wall surface of the hole 5b is T <r ≦ 2T [ mm]. This prevents the chip components 10 housed between the inner wall surfaces of the boundary portion from being housed in a state where two chip components 10 are overlapped in the thickness direction, and the thickness of one chip component 10 between the inner wall surfaces of the boundary portion is prevented. A space that can accommodate the vertical portion is secured.

  Further, considering the size W in the width direction of the chip component 10, in the plan view shown in FIG. 2 (a), T / T is formed on both the upper and lower sides from the straight line connecting the center O1 of the hole 5a and the center O2 of the hole 5b. The distance s between the inner wall surfaces of the component receiving holes 5 at positions separated by two is designed so that W <s [mm]. As a result, a space that can accommodate the widthwise portion of one chip component 10 is secured in a space that spans the two holes (hole 5a and hole 5b) of the component accommodation hole 5.

  Here, the comparative example of a component accommodation hole is shown in FIG. 5A shows the component receiving hole 25 formed in a round hole shape, and FIG. 5B shows the component receiving hole 35 formed in a long hole shape. Also, the chip component 20 accommodated in the component accommodation hole 25 and the chip component 30 accommodated in the component accommodation hole 35 are indicated by broken lines. The chip components 20 and 30 are both rectangular parallelepiped and thin type like the chip component 10 shown in FIG.

  As shown in FIG. 5A, when the component accommodation hole 25 is formed by a single circular hole, the component accommodation hole 25 is sized in consideration of only the width W1 of the chip component 20 in the width direction. (Diameter R25) is designed. For this reason, the space margin (t1 + t2) in the thickness T1 direction of the chip component 20 in the component accommodation hole 25 is larger than the thickness T1 of the chip component 20 due to the processing variation of the component accommodation hole 25 and the size variation of the chip component 20. Sometimes it becomes. In this case, two chip components 20 can be accommodated in one component accommodation hole 25 in a state where the chip components 20 overlap in the thickness direction. This can occur with higher probability as the chip component becomes thinner.

  On the other hand, the component receiving hole 5 formed in the component aligning pallet 1 of the present embodiment is formed by a combination of two types of holes having different diameters as described above. The accommodation space of the component accommodation hole 5 can be designed in consideration of not only the length W but also the size T of the chip component 10 in the thickness direction. Since the size of the component accommodation hole 5 can be designed in accordance with the shape (thin shape) of the chip component 10, the probability that two chip components 10 are accommodated in one component accommodation hole 5 is reduced. Can do.

  Further, in order to reduce the probability of entering two chip components into the component housing hole, a long hole shaped component housing hole 35 is formed as shown in FIG. 5B in accordance with the shape of the thin chip component. It is possible. In the case of forming the long hole-shaped component receiving hole 35, for example, a drill can be used to move the center position along the center line Y to form round holes continuously and repeatedly. However, in this case, the cutting blade is likely to escape (bend) during cutting, and the load on the cutting blade is large. And since the cutting blade with a small diameter is used, the possibility of breakage is high. Further, even if it can be formed without breaking, the processing accuracy is low, and enormous processing time is required to complete all of the plurality of holes in the component aligning pallet 1. Further, for example, an end mill can be used instead of the drill. However, in this case, it is possible to reduce the clearance of the cutting blade at the time of cutting and improve the processing accuracy, but enormous processing time is required to complete all of the plurality of holes.

  On the other hand, the component alignment pallet 1 of this embodiment can form the component receiving holes 5 by two round holes, that is, the holes 5a and 5b. 5 can be processed. As a result, it is possible to shorten the processing time required for processing and completing the plurality of component receiving holes 5 in the component aligning pallet 1. Moreover, since the hole 5a with a small diameter is formed first using a drill, and then the hole 5b with a large diameter is formed using an end mill, the load on the cutting blade at the time of cutting the hole can be reduced. As a result, it is possible to reduce the escape (bending) of the cutting blade when the cutting blade bites into the component aligning pallet 1, so that the processing accuracy of the component receiving hole 5 can be increased. Therefore, variation in the size of the component accommodation holes 5 can be suppressed, and the probability that two chip components 10 are accommodated in one component accommodation hole 5 can be reduced.

  Further, since bakelite (phenolic resin) is used as the material of the component aligning pallet 1, when the component aligning pallet 1 is vibrated or shaken, the chip components 10 dispersedly placed on the pallet are arranged. It is easy to slide and roll on the pallet and is easily accommodated in the component accommodating hole 5.

  Further, since the chamfered portion 6 is provided at the edge of the component accommodation hole 5, the chip component 10 on the component alignment pallet 1 can be smoothly guided into the component accommodation hole 5.

  In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimension, numerical value, form, number, location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

  For example, the component accommodation hole is not limited to the component accommodation hole 5 shown in FIG. 2, but may be a component accommodation hole 50 as shown in FIG. The component receiving hole 50 includes a hole 50a having a diameter R1 ', a hole 50b having a diameter R2', and a hole 50c having a diameter R3 '. The relationship between the hole 50a and the hole 50b and the relationship between the hole 50c and the hole 50b are the same as the relationship between the hole 5a and the hole 5b in the above-described embodiment. The hole 50c is provided on the opposite side of the hole 50b from the side where the hole 50a is provided (on the left side of the hole 50b in the plan view 6).

  As shown in FIG. 6, the chip component 60 is accommodated in such a state that the chip component 60 extends over three holes (hole 50 a, hole 50 b, and hole 50 c). The component housing hole 50 is suitable for housing when the chip component 60 is further thinned. When configured with three holes, it is possible to ensure a large length in the width direction in which the chip component 60 is accommodated, so that the diameter of each hole is made smaller than when configured with two holes. And the size of the component receiving hole 50 can be reduced.

Moreover, in the said embodiment, the case where the diameter R1 of the hole 5a was smaller than the diameter R2 of the hole 5b was illustrated. However, the present invention is not limited to this, and any diameter may be used as long as the diameters of the holes to be formed are different.
In addition, the depth of the hole 5a and the hole 5b is exemplified as the depth at which all the chip components 10 are accommodated, but is not limited thereto, and may be shallower than the length L of the chip components 10.
Moreover, although the case where the shallow hole 5a was cut using a drill and the deep hole 5b was cut using an end mill was illustrated, it is not limited to this, Any hole is cut with a drill or an end mill. Also good.

  Moreover, in the said embodiment, although the components alignment pallet 1 illustrated the structure which has the frame part 3 in the peripheral part of the main body board | substrate 2, it is not restricted to this example. For example, the component aligning pallet 1 may not have the frame portion 3.

  1: Pallet for parts alignment, 2: Main board, 2a: One side, 3: Frame part, 5: Part accommodation hole, 5a: Hole (first hole), 5b: Hole (second hole), 6: Chamfer Part: 10: chip part, T: thickness, W: width, L: length

Claims (3)

The chip components dispersed and placed on one surface of the pallet are respectively accommodated in a plurality of component accommodation holes for accommodating the chip components provided on the one surface, so that the chip components are placed on the pallet. A component alignment pallet to be aligned,
Each of the plurality of component receiving holes includes a first hole having a first diameter and a second hole having a second diameter,
The first hole and the second hole are formed so as to partially overlap each other,
The chip component accommodated in the component accommodation hole has a rectangular parallelepiped shape, the size in the thickness direction is T, the size in the width direction is W, the size in the length direction is L, and the thickness direction is Assuming that the size of the diagonal line of the surface formed by the side with the width direction is X and T ≦ W ≦ L,
The first diameter and the second diameter have a size of X or less,
A boundary portion between the inner wall surface of the first hole and the inner wall surface of the second hole in the inner wall surface of the first hole and the inner wall surface of the second hole forming the inner wall surface of the component housing hole. The part alignment pallet has a distance between opposing inner wall surfaces of 2T or less. A method for manufacturing a component alignment pallet according to claim 1,
If the second diameter of the second hole is larger than the first diameter of the first hole,
A first step of forming the first hole;
A second step of forming the second hole after the first step;
A method of manufacturing a parts alignment pallet including The first hole in the first step is formed using a drill,
The method for manufacturing a parts alignment pallet according to claim 2, wherein the second hole in the second step is formed using an end mill.

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