JP2021054572A - Parts aligner, parts-aligning plate and method of manufacturing parts-aligning plate - Google Patents

Abstract

To provide a parts aligner adapted for easily taking out parts after alignment.SOLUTION: A parts aligner comprises a parts aligning unit 10 and a vibrations applying unit 20 that can apply vibrations to the parts aligning unit 10. The parts aligning unit 10 comprises a parts tray 11 that has a parts-resting surface and a parts-aligning plate that is attachable/removable to/from the parts-resting surface of the parts tray 11 and has parts-aligning holes H allowing, in an attached state, parts P to be aligned to fall down and rest on the parts-resting surface of the parts tray 11.SELECTED DRAWING: Figure 1

Description

The present invention relates to a component alignment device capable of aligning bulk parts, a component alignment plate used in the component alignment device, and a method for manufacturing the component alignment plate.

In Patent Document 1 described later, a pallet in which a component alignment hole (bottomed hole) is formed, a mounting table on which the pallet can be placed, and a means capable of adding horizontal movement and vertical swing to the mounting table are provided. A component alignment device comprising the above is disclosed. In this component alignment device, by adding horizontal movement and vertical swing to the mounting table, bulk-shaped components on the pallet are dropped into the component alignment holes (bottomed holes) to be aligned.

Since the above-mentioned component alignment device only drops bulk-shaped components on the pallet into the component alignment holes (bottomed holes), if the components that could not be dropped remain around the component alignment holes, the remaining components will be removed. There is a concern that it will be an obstacle when the parts after alignment (parts dropped into the component alignment holes) are taken out from the pallet and used.

Japanese Unexamined Patent Publication No. 2000-038213

An object to be solved by the present invention is to provide a component alignment device capable of easily taking out parts after alignment, a component alignment plate useful for the component alignment device, and a method for manufacturing the component alignment plate. ..

In order to solve the above problems, the component alignment device according to the present invention is a component alignment device including a component alignment unit and a vibration addition unit capable of adding vibration to the component alignment unit. , A component tray having a component mounting surface and a component that can be attached to and detached from the component mounting surface of the component tray and that is to be aligned in the mounted state are dropped and mounted on the component mounting surface of the component tray. It is provided with a component alignment plate having a component alignment hole that can be placed.

Further, the component alignment plate according to the present invention relates to the component alignment plate described above, and the component alignment hole is a virtual inclined horizontal straight line inclined by an angle θ with respect to the X direction with respect to the virtual XY plane set on the upper surface of the component alignment plate. In a virtual state in which a virtual tilted vertical line having a virtual tilted vertical line tilted by the same angle θ with respect to the Y direction is set, the component is at the odd-th intersection of the odd-order virtual tilted horizontal straight line in the virtual tilted grid line. The center of the alignment hole is located, and the center of the component arrangement hole is located at the even-th intersection of the even-th virtual inclined horizontal straight line.

Further, the method for manufacturing a component alignment plate according to the present invention relates to the above-described method for manufacturing a component alignment plate, which includes a step of setting a virtual XY plane on the upper surface of a base plate which is a base material of the component alignment plate, and the virtual XY. A step of setting a virtual inclined grid line having a virtual inclined horizontal straight line inclined by an angle θ with respect to the X direction and a virtual inclined vertical straight line inclined by θ with respect to the Y direction on a plane, and an odd number in the virtual inclined grid line The element so that the center of the component alignment hole is located at the odd-th intersection of the second virtual inclined horizontal line and the center of the component arrangement hole is located at the even-th intersection of the even-th virtual inclined horizontal line. The plate is provided with a step of forming the component alignment hole.

According to the present invention, it is possible to provide a component alignment device that can easily take out parts after alignment, a component alignment plate useful for the component alignment device, and a method for manufacturing the component alignment plate.

FIG. 1 is an external perspective view of a component aligning device to which the present invention is applied. 2 (A) is a top view of the component alignment unit shown in FIG. 1, FIG. 2 (B) is a vertical sectional view of the same, FIG. 2 (C) is an exploded vertical sectional view of the same, and FIG. 2 (D) is FIG. 2 (D). It is a top view which shows the formation area of the component alignment hole of the component alignment plate shown in A) to FIG. 2C. FIG. 3 (A) is a configuration explanatory view of a component (one example), FIG. 3 (B) is a configuration explanatory view of a component alignment plate having a component alignment hole corresponding to the component shown in FIG. 3 (A), and FIG. 3 (C). ) Is a sectional view taken along line CC of FIG. 3 (B), and FIG. 3 (D) is an explanatory view of an arrangement mode of the component alignment holes shown in FIG. 3 (B). 4 (A) to 4 (C) are explanatory views of a method for manufacturing the component alignment plate shown in FIGS. 3 (B) to 3 (D). FIG. 5 is an explanatory diagram of an operation method of the component alignment device shown in FIG. FIG. 6 is an explanatory diagram of an operation method of the component alignment device shown in FIG. FIG. 7 is an explanatory diagram of an operation method of the component alignment device shown in FIG. FIG. 8 is an explanatory diagram of an operation method of the component alignment device shown in FIG. FIG. 9 is an explanatory diagram of an operation method of the component alignment device shown in FIG. FIG. 10 is experimental data showing the relationship between the angle θ shown in FIG. 3 (B) and the alignment rate.

<< Configuration of parts alignment device >>
First, the configuration of the component alignment device (reference numeral omitted) illustrated in FIG. 1 will be described with reference to FIGS. 1 and 2. This component alignment device includes a component alignment unit 10 and a vibration addition unit 20 capable of applying vibration to the component alignment unit 10.

The component alignment unit 10 includes a component tray 11, a component holding plate 12, a component alignment plate 13, and a pressing plate 14. Note that, for convenience, FIG. 1 and FIG. 2 omit the illustration of the component alignment hole H (see FIGS. 3 (B) to 3 (D)) included in the component alignment plate 13.

The component tray 11 has a top-view rectangular outer shape, and has a top-view rectangular recess 11a having a flat bottom surface and smaller than the top-view outer shape of the component tray 11.

The component holding plate 12 has a rectangular outer shape that is slightly smaller than the top view outer shape of the concave portion 11a of the component tray 11, is removable from the bottom surface of the concave portion 11a, and has an upper surface that is attached to the lower surface. This is the component mounting surface (reference numeral omitted) of the component tray 11. That is, the component mounting surface of the component tray 11 is composed of the upper surface of the component holding plate 12 attached to the component tray 11.

Supplementing the component holding plate 12, the component holding plate 12 is preferably a plate capable of holding the component P (see FIG. 3A) by its own surface frictional resistance, and more preferably the upper surface of the synthetic resin sheet. A plate coated with a synthetic resin adhesive containing hard fine particles made of ceramics, metal, etc. and cured. When such a plate is used as the component holding plate 12, it is possible to prevent the component P from being displaced due to the surface frictional resistance, and the component P can be taken out without any trouble.

Although it is possible to use a plate having a soft layer or an adhesive layer as a surface layer for the component holding plate 12, if the adhesion to the component P is too high, the aligned component P may stick to the component P and be difficult to remove. Since there is a concern that the component holding plate 12 may be lifted when the component P is taken out, it is desirable to adjust the adhesion force in consideration of the size and mass of the component P.

The component alignment plate 13 has a rectangular outer shape that is substantially the same as the top view outer shape of the component holding plate 12, and is removable and attached to the upper surface (part mounting surface) of the component holding plate 12. In this state, the component P placed on the upper surface of the component alignment plate 13 can be dropped and placed on the upper surface (component mounting surface) of the component holding plate 12 to be mounted on the component alignment hole H (hole penetrating the component holding plate 12, FIG. 3). (B) to FIG. 3 (D)). The component alignment plate 13, the component alignment hole H, and the like will be described in detail later.

The pressing plate 14 has substantially the same top-view rectangular outer shape as the top-view outer shape of the component tray 11, and has a top-view rectangular hole 14a smaller than the top-view rectangular hole 14a of the component alignment plate 13. , The recess 11a of the component tray 11 has a rectangular frame-shaped pressing portion 14b that is slightly smaller than the top view outer shape (the hole 14a extends from the upper surface of the pressing plate 14 to the lower end of the pressing portion 14b). .. Of course, the top view outer shape of the pressing plate 14 may be larger or smaller than the top view outer shape of the component tray 11.

The downward protrusion dimension (Z direction dimension) of the pressing portion 14b is the thickness of the component holding plate 12 (Z direction dimension) and the thickness of the component alignment plate 13 (Z direction dimension) from the depth (Z direction dimension) of the recess 11a of the component tray 11. It is slightly larger than the value obtained by subtracting the Z-direction dimension). That is, the pressing plate 14 can be attached to and detached from the component tray 11, and the component alignment plate 13 can be pressed against the upper surface (component mounting surface) of the component holding plate 12 in the mounted state.

Incidentally, since the outer peripheral portion of the component alignment plate 13 is a region where the pressing portion 14b of the pressing plate 14 is pressed, the formation area 13a of the component alignment hole H in the component alignment plate 13 is preferably shown in FIG. 2 (D). As described above, the hole 14a of the pressing plate 14 has a rectangular shape in the top view, which is smaller than the outer shape in the top view.

When the number of usable component alignment holes H is to be increased as much as possible, the top view outer shape of the forming area 13a may be substantially the same as the top view outer shape of the holes 14a of the pressing plate 14, or the component alignment plate 13 can be used. Any component alignment hole H other than the component alignment hole H in which the pressing portion 14b of the pressing plate 14 is in contact with the component alignment hole H formed as much as possible may be used as the component alignment hole H.

The vibration adding unit 20 includes a rectangular parallelepiped base 21, a vibration source 22 provided in the base 21, and a vibration plate 23 capable of adding vibration from the vibration source 22.

The vibrating plate 23 has a top-view rectangular outer shape that is larger than the top-view outer shape of the component tray 11, and has a flat bottom surface and is slightly larger than the bottom-view outer shape of the part tray 11 from a top-view rectangular recess. It has a tray support portion 23a, and the depth (Z direction dimension) of the tray support portion 23a is smaller than the height (Z direction dimension) of the component tray 11. That is, the component tray 11 can be attached to and detached from the tray support portion 23a of the vibration plate 23, and vibration from the vibration source 22 can be added in the attached state.

Supplementing the vibration source 22, the vibration that can be applied from the vibration source 22 to the vibration plate 23 is a virtual XY surface VXYP set on the upper surface of the component alignment plate 13 of the component alignment unit 10 (see FIG. 3B). X-direction vibration and Y-direction vibration in. The mechanism of the vibration source 22 is not particularly limited, but preferably a vibration mechanism using a piezoelectric element or a vibration mechanism using an electric motor and a cam mechanism can be used.

<< Configuration of parts alignment plate >>
Next, using FIG. 3, the configuration of the above-mentioned component alignment plate 13 is constructed.
-Electronic components in which the component P to be aligned has a rectangular parallelepiped shape defined by reference length Lp> reference width Wp = reference thickness Tp (see FIG. 3 (A)).
This case will be described as an example.

As shown in FIG. 3 (B), the component alignment hole H is a virtual inclined horizontal straight line (reference numeral omitted, omitted) that is inclined by an angle θ with respect to the X direction with respect to the virtual XY plane VXYP set on the upper surface of the component alignment plate 13. (Refer to the four diagonally horizontal lines in FIG. 3B) and the virtual inclined vertical straight line tilted by θ at the same angle with respect to the Y direction (sign omitted, four diagonally vertical lines in FIG. 3B). In the virtual state in which the virtual inclined grid line VIGL having (see line) is set, the center Hc of the component alignment hole H is located at the odd-order intersection of the odd-order virtual inclined horizontal straight line in the virtual inclined grid line VIGL. Moreover, the center Hc of the component arrangement hole H is arranged so as to be located at the even-th intersection of the even-th virtual inclined horizontal straight line.

Further, since the component alignment hole H has a rectangular shape when viewed from above, the two opposite sides of each component alignment hole H (reference notation omitted, refer to the upper and lower two sides in FIG. 3B) are parallel to the X direction. And the other two opposite sides (signed out, see the two left and right sides in FIG. 3B) are parallel to the Y direction. That is, as shown in FIG. 3D, in the component alignment hole H of the component alignment plate 13, the component P moving in the X direction on the component alignment plate 13 always passes over the component alignment hole H, and Y The component P that moves in the direction always passes over the component alignment hole H.

Further, the dimensions Dhx (see FIG. 3B) of the two opposing sides of each component alignment hole H are slightly larger than the reference length Lp of the component P, and the dimensions of the other two opposing sides. Dhy (see FIG. 3B) is slightly larger than the reference width Wp and reference thickness Tp of the component P. Since the actual component P has tolerances for each of the reference length Lp, the reference width Wp, and the reference thickness Tp, the dimension Dhx is preferably 1.1 of the reference length Lp in consideration of the tolerance on the plus side. It is preferable that the dimension Dhy is double to 1.3 times, more preferably 1.2 times, and the dimension Dhy is 1.1 to 1.3 times, more preferably 1.2 times the reference width Wp and the reference thickness Tp of the component P. Double it.

Supplementing the dimension Dhx and the dimension Dhx, the dimension Dhx is less than 1.1 times the reference length Lp of the component P, and the dimension Dhy is 1.1 times the reference width Wp and the reference thickness Tp of the component P. If it is less than, there is a concern that it will be difficult to drop the component P into the component alignment hole H in the normal posture. Further, assuming that the dimension Dhx exceeds the reference length Lp of the component P by 1.3 times and the dimension Dhy exceeds the reference width Wp and the reference thickness Tp of the component P by 1.3 times, the component alignment hole H There is a concern that the swinging motion of the component P dropped in the normal posture due to the additional vibration becomes large and the component P comes out of the alignment hole H due to the swinging motion.

Further, the depth Dhz of each component alignment hole H (see FIG. 3C, corresponding to the thickness T13 of the component alignment plate 13) is less than 1/2 of the reference length Lp of the component P, and the component. It is preferable that the reference width Wp and the reference thickness Tp of P exceed 1/2, and {(1/2 of the reference length Lp + 1/2 of the reference width Wp and the reference thickness Tp) / 2}. Is more preferable.

Supplementing the depth Dhz, if the depth Dhz is 1/2 or more of the reference length Lp of the component P, the component P dropped into the component alignment hole H in a vertical posture (abnormal posture) vibrates. Even if it is added, there is a concern that it will stop without coming out of the component alignment hole H. Further, assuming that the depth Dhz is 1/2 or less of the reference width Wp and the reference thickness Tp of the component P, the component P dropped into the component alignment hole H in a normal posture is removed from the component alignment hole H by additional vibration. There is a concern that it will come out.

Further, the shortest distance IN1 (see FIG. 3B) between the two parts alignment holes H adjacent to each other in the X direction and the shortest distance between the two parts alignment holes H adjacent to each other in the Y direction. It is preferable that N2 (see FIG. 3B) has a reference length Lp or more of the component P or more.

Supplementing the shortest intervals IN1 and IN2, the shortest intervals IN1 and IN2 serve as a path for the component P when vibrations (vibration in the X direction and vibration in the Y direction) are applied to the component alignment plate 13, and the component P is used. If the component P can pass through regardless of the orientation when viewed from above, the probability that the component P will be dropped into the component alignment hole H in a normal posture (alignment rate) is higher. Therefore, the minimum values of the shortest intervals IN1 and IN2 are preferable. Is the reference length Lp of the component P. On the other hand, the maximum values of the shortest intervals IN1 and IN2 are not particularly limited, but if the shortest intervals IN1 and IN2 are increased, the total number of component alignment holes H per unit area is reduced by that amount. It is desirable to adjust the shortest intervals IN1 and IN2 in consideration of the points.

Here, regarding the dimensions Dhx, dimensions Dhy, and depth Dhz of the component alignment hole H, the main commercially available product (for example, a capacitor element, a varistor element, an inductor element, an array element, a composite element, etc.) when the component P is an electronic component (for example, a capacitor element, a varistor element, an inductor element, an array element, a composite element, etc.). The size is 0402, 0603, 1005, 1608, 2012, 3216, 3225) as an example to be specifically described.

When the dimension Dhx is 1.2 times the reference length Lp and the dimension Dhy is 1.2 times the reference width Wp and the reference thickness Tp, the dimension Dhx in the case of 0402 size is 0.48 mm and the dimension Dhy is 0.24 mm. In the case of 0603 size, the dimension Dhx is 0.72 mm and the dimension Dhy is 0.36 mm, in the case of 1005 size, the dimension Dhx is 1.2 mm, the dimension Dhy is 0.6 mm, and in the case of 1608 size, the dimension Dhx is 1. At .92 mm, the dimension Dhy is 0.96 mm, in the case of 2012 size, the dimension Dhx is 2.4 mm and the dimension Dhy is 1.5 mm, and in the case of 3216 size, the dimension Dhx is 3.84 mm and the dimension Dhy is 1.92 mm, 3225. In the case of size, the dimension Dhx is 3.84 mm and the dimension Dhy is 3 mm.

Further, when the depth Dhz of the component alignment hole H is {(1/2 of the reference length Lp + 1/2 of the reference width Wp and the reference thickness Tp) / 2}, the depth Dhz in the case of 0402 size is 0. It becomes .15 mm, the depth Dhz in the case of 0603 size is 0.225 mm, the depth Dhz in the case of 1005 size is 0.375 mm, the depth Dhz in the case of 1608 size is 0.6 mm, and in the case of 2012 size. The depth Dhz is 0.813 mm, the depth Dhz in the case of 3216 size is 1.2 mm, and the depth Dhz in the case of 3225 size is 1.425 mm.

<< Manufacturing method of parts alignment plate >>
Next, using FIG. 4, a preferred manufacturing method of the above-mentioned component alignment plate 13 (see FIGS. 3 (B) to 3 (D)) is described.
-Electronic component in which the component P to be aligned has a rectangular parallelepiped shape defined by the reference length Lp> reference width Wp = reference thickness Tp.-The dimension Dhx of the component alignment hole H is 1 of the reference length Lp of the component P. .2 times, said dimension Dhy
Is 1.2 times the reference width Wp and the reference thickness Tp of the component P. ・ The dimension Dhz of the component alignment hole H is {(1/2 of the reference length Lp + 1/2 of the reference width Wp and the reference thickness Tp). ÷ 2}
This case will be described as an example. The steps other than the step of forming the component alignment hole H in the following manufacturing method can be performed on the display using a computer.

An original plate 13'having a rectangular outer shape in a top view as the component alignment plate 13 is prepared, and a virtual XY plane VXYP is set on the upper surface thereof (see FIG. 4A). When the original plate 13'has a rectangular outer shape when viewed from above, if the two sides facing each other on the top and bottom are parallel to the X direction and the other two sides facing each other on the left and right are parallel to the Y direction, the original plate 13' The upper surface itself becomes a virtual XY plane VXYP.

Subsequently, on the virtual XY plane VXYP, a virtual horizontal straight line parallel to the X direction (sign omitted, see the four horizontal lines in FIG. 4 (A)) and a virtual vertical straight line parallel to the Y direction (sign omitted, Draw a virtual grid line VGL with (see the four vertical lines in FIG. 4 (A)).

Subsequently, the center Hc of the virtual component alignment hole H is located at the odd-numbered intersection of the odd-numbered virtual horizontal lines in the virtual grid line VGL, and the virtual component is located at the even-numbered intersection of the even-numbered virtual horizontal lines. In addition to locating the center Hc of the alignment hole H, the other two facing each other on the left and right so that the directions of the two opposite sides of each virtual component alignment hole H are parallel to the X direction. A virtual component alignment hole H is drawn so that the direction of the side is parallel to the Y direction (see FIG. 4 (see A)).

Incidentally, the shortest distance INx of the two virtual component alignment holes H adjacent to each other in the X direction shown in FIG. 4A is the same as the reference length Lp of the component P, and the two virtual component alignment holes H adjacent to each other in the Y direction. The shortest distance INy of the component alignment holes H is also the same as the reference length Lp of the component P. In other words, the step of drawing the virtual grid line VGL described above is a step of drawing a virtual horizontal line parallel to the X direction and a virtual vertical line parallel to the Y direction so that the shortest intervals INx and INy can be obtained. Is.

Subsequently, in the virtual XY plane VXYP, all of the virtual grid line VGL and the virtual component alignment hole H are tilted by an angle θ (see FIG. 4B). As a result, the virtual tilted horizontal straight line tilted by θ with respect to the X direction (sign omitted, see the four diagonally horizontal lines in FIG. 4B) and the virtual tilted with the same angle θ with respect to the Y direction. A virtual inclined grid line VIGL having a vertical straight line (reference omitted, see four diagonally vertical lines in FIG. 4B) is obtained. Although FIG. 4B shows a tilting direction as a counterclockwise direction, the tilting direction may be a clockwise direction.

Subsequently, each virtual component alignment hole H is tilted by an angle θ in the direction opposite to the above with its center Hc as a fulcrum, and the directions of the two opposite sides of each virtual component alignment hole H are parallel to the X direction. Then, the directions of the other two sides facing each other on the left and right sides are returned so as to be parallel to the Y direction (see FIG. 4C).

Subsequently, the component alignment holes H are formed in the actual original plate 13'according to the arrangement and orientation of the virtual component alignment holes H in FIG. 4C. There is no particular limitation on the method of forming the component alignment hole H, but in consideration of accuracy, when the original plate 13'is made of a metal such as stainless steel, it is preferable to use photoetching regardless of the size of the component alignment hole H. ..

The step of drawing the virtual grid line VGL described with reference to FIG. 4 (A) and the step of tilting the virtual grid line VGL described with reference to FIG. 4 (B) by an angle θ are directly on the virtual XY plane VXYP. It may be omitted by drawing the virtual grid line VIGL shown in FIG. 4 (B), and even in this way, the component alignment holes H can be formed in the actual original plate 13'in the same arrangement and orientation. ..

Further, in the step of drawing the virtual component alignment hole H described with reference to FIG. 4A, after drawing the virtual grid line VGL and tilting the virtual grid line VGL by an angle θ, or directly drawing the virtual grid line VIGL as described above. It may be performed after drawing, and in this way, the component alignment holes H can be formed in the actual original plate 13'in the same arrangement and orientation.

<< How to operate the parts alignment device >>
Next, using FIGS. 5 to 9, the operation method of the above-mentioned parts alignment device using the above-mentioned parts alignment plate 13 (see FIGS. 3 (B) to 3 (D)) is described.
-Electronic component in which the component P to be aligned has a rectangular parallelepiped shape defined by the reference length Lp> reference width Wp = reference thickness Tp.-The dimension Dhx of the component alignment hole H is 1 of the reference length Lp of the component P. .2 times, said dimension Dhy
Is 1.2 times the reference width Wp and the reference thickness Tp of the component P. ・ The dimension Dhz of the component alignment hole H is {(1/2 of the reference length Lp + 1/2 of the reference width Wp and the reference thickness Tp). ÷ 2}
A case where the shortest intervals IN1 and IN2 of the component alignment holes H are equal to or larger than the reference length Lp of the component P will be described as an example.

In the component alignment unit 10 of the component alignment device shown in FIG. 5, the component holding plate 12 is attached to the bottom surface of the recess 11a of the component tray 11 as shown in FIG. 2 (B), and the upper surface of the component holding plate 12 ( The component alignment plate 13 is attached to the component mounting surface), and the component alignment plate 13 is pressed against the component holding plate 12 by the pressing portion 14a of the pressing plate 14 attached to the recess 11a of the component tray 11 to substantially contact the surface. ing.

When a sufficient coupling force that can withstand vibration can be obtained by fitting the pressing plate 14 to the recess 11a of the component tray 11, a means for fixing the pressing plate 14 to the component tray 11 is not required, but the coupling force is weak. A means for fixing the pressing plate 14 to the component tray 11, for example, a combination of a bolt and a screw hole, a clamp using a screw, an air suction hole, or the like may be used.

Further, the lower part of the component tray 11 of the component alignment unit 10 is attached to the tray support portion 23a of the vibration plate 23 of the vibration addition unit 20 of the component alignment device shown in FIG. If a sufficient coupling force that can withstand vibration can be obtained by fitting the component tray 11 to the tray support portion 23a of the vibration plate 23, a means for fixing the component tray 11 to the vibration plate 23 is not necessary, but the component tray 11 is required. As a means for fixing the vibration plate 23, the same means as described above may be used.

When performing the desired alignment with respect to the bulk-shaped (disjoint state) component P, the component alignment hole is preferably in the center of the upper surface of the component alignment plate 13 of the component alignment unit 10 of the component alignment device shown in FIG. Place an appropriate number of parts P corresponding to the size of H.

To supplement the appropriate number, when the number of usable component alignment holes H of the component alignment plate 13 is, for example, 1000, the number of components P placed on the upper surface of the component alignment plate 13 is preferably around 1000 (for example, 800). 1 to 1200). When the number of parts P placed on the upper surface of the component alignment plate 13 is less than or equal to the number of usable component alignment holes H, the alignment rate (the probability that the component P is dropped into the component alignment holes H in the normal posture) is adversely affected. However, if the number of the parts P is much larger than the number of usable part alignment holes H, there is a concern that the alignment rate may be adversely affected because the movement of the parts P due to the additional vibration described later is deteriorated.

Then, the vibration source 22 of the vibration addition unit 20 is driven to add X-direction vibration and Y-direction vibration to the component alignment unit 10, that is, the component alignment plate 13. Incidentally, the time for adding vibration (alignment time) is generally in the range of 30 seconds to 60 seconds when the number of usable component alignment holes H is, for example, 1000.

Supplementing each vibration, it is preferable that the amplitude of the vibration in the X direction and the amplitude of the vibration in the Y direction are equal to or less than the reference length Lp of the component P (see FIG. 3A). Since the amplitude of each vibration is reflected in the movement of the component P on the upper surface of the component alignment plate 13 in the X and Y directions, the alignment rate may be adversely affected when the amplitude is equal to or less than the reference length Lp of the component P. However (however, if the amplitude is too small, the alignment time becomes long), but if the amplitude exceeds the reference length Lp of the component P, the movement of the component P due to the additional vibration described later becomes large, which adversely affects the alignment rate. There are concerns.

When X-direction vibration and Y-direction vibration are applied to the component alignment plate 13, the component P placed on the upper surface of the component alignment plate 13 is diffused, and as shown in FIG. 6, the component P is located on the upper surface of the component alignment plate 13. It moves mainly in the X and Y directions. For example, if the component P on the upper surface of the component alignment plate 13 has four different orientations (Pa to Pd), the component Pa in the first orientation is aligned in the process of moving in the X direction or in the process of moving in the Y direction. It is dropped into the hole H in a normal posture. Further, the parts Pb to Pd having the second to fourth orientations are corrected in their orientations by the component alignment holes H in the process of moving in the X direction or in the process of moving in the Y direction, and are the same as the parts Pa in the first orientation. It is dropped into the component alignment hole H in a normal posture (see FIG. 7).

To supplement the alignment behavior, the dimension Dhx of the component alignment hole H is 1.2 times the reference length Lp of the component P, and the dimension Dhy is 1.2 times the reference width Wp and the reference thickness Tp of the component P. Since Dhz is {(1/2 of the reference length Lp + 1/2 of the reference width Wp and the reference thickness Tp) / 2}, it is easy to drop the component P into the component alignment hole H in the normal posture, and the component alignment is performed. The component P dropped into the hole H in the normal posture does not come out of the component alignment hole H due to additional vibration, and even if the component P is dropped into the component alignment hole H in the vertical posture (abnormal posture), the component concerned Since P is unstable, it will come out of the component alignment hole H and be rearranged due to additional vibration.

Further, since the shortest intervals IN1 and IN2 of the component alignment holes H are equal to or larger than the reference length Lp of the component P, even if the component P has already been dropped into the two adjacent component alignment holes H in the normal posture. The portion of the component P exposed upward from the component alignment hole H (see FIG. 7) does not hinder the movement of the unaligned component P in the X direction and the Y direction. That is, the unaligned component P is dropped into the component alignment hole H in a normal posture in the process of moving in the X direction through the shortest intervals IN1 and IN2 or in the process of moving in the Y direction.

After the alignment is completed, the component alignment unit 10 is removed from the tray support portion 23a of the vibration plate 23 of the vibration addition unit 20 of the component alignment device, and the pressing plate 14 is removed from the component tray 11 of the component alignment unit 10 before component alignment. Remove the plate 13 (see FIG. 8).

Since the component P dropped into each component alignment hole H of the component alignment plate 13 in a normal posture is placed on the upper surface (component mounting surface) of the component holding plate 12 below the component P (see FIG. 7). ), Even if the unaligned component P remains on the upper surface of the component alignment plate 13, the unaligned component P will be removed together with the component alignment plate 13 when the component alignment plate 13 is removed. Further, when the component alignment plate 13 is removed from the component tray 11, the components P dropped into the component alignment holes H in the normal posture are placed on the upper surface (component mounting surface) of the component holding plate 12 in the same arrangement and orientation. It will be in the placed state (see FIG. 9).

That is, it is possible to obtain the component tray 11 on which the component P is mounted in the desired arrangement and orientation on the upper surface (component mounting surface) of the component holding plate 12. The component tray 11 is transferred to a storage place or the like, but since the component holding plate 12 holds the component P by its own surface frictional resistance, it prevents the component P from being displaced during the transfer. be able to.

<< How to use the parts tray in which parts are placed in the desired arrangement and orientation >>
Next, a method of using the component tray 11 on which the component P is placed in the desired arrangement and orientation will be described by taking the case where the component P is an electronic component as an example.

The component tray 11 on which the component P is placed in the desired arrangement and orientation is a taping device (a device that stores components in a carrier tape pocket and closes them with a cover tape to produce a component storage tape) or a mounter (circuit board). It can be used as a parts supply source for parts such as (devices for mounting parts on).

For example, a taping device has a complicated mechanism including a parts storage unit, a parts supply unit, a parts insertion unit, and the like for storing parts to be stored in a carrier tape pocket. However, the above-mentioned parts tray 11 can be used. For example, it is possible to take out the component P from the component tray 11 and store the component P in the pocket of the carrier tape by using a component transport mechanism (for example, a mechanism capable of transporting the component in three dimensions).

Further, for example, in a mounter, a tape feeder (a device in which a cover tape is peeled off from the component storage tape so that a component can be taken out) is generally used, but if the component tray 11 is used, the mounter is provided. The component transport mechanism (for example, a mechanism capable of transporting components in three dimensions) makes it possible to take out the component P from the component tray 11 and mount the component P on the circuit board.

<< Main effects obtained by the component alignment device and component alignment plate >>
Next, the main functions and effects obtained by the component alignment device and the component alignment plate 13 will be described.

Since the component alignment plate 13 of the component alignment unit 10 is removed from the upper surface (component mounting surface) of the component holding plate 12 after the component P is aligned, the unaligned component P remains on the upper surface of the component alignment plate 13. Even in this case, the unaligned part P can be removed together with the part arrangement plate 13. That is, since the aligned parts P can be placed on the upper surface (part mounting surface) of the component holding plate 12 in the desired arrangement and orientation, the aligned parts P can be easily taken out. ..

Further, since the component holding plate 12 holds the component P by its own surface friction resistance, even if the component tray 11 on which the component P is placed is transferred in the desired arrangement and orientation, the component P is transferred at the time of the transfer. It is possible to prevent the component P from being displaced, and the component P can be taken out from the component tray 11 without any trouble.

Further, since the component alignment plate 13 is provided with the component alignment holes H in a unique arrangement and orientation, the component alignment plate 13 is subjected to the X-direction vibration and the Y-direction vibration to be formed on the component alignment plate 13. It is possible to increase the probability (alignment rate) that the component P is dropped into the component alignment hole H in a normal posture.

Further, after the component alignment plate 13 is removed, the two opposing sides of the component P mounted on the upper surface (component mounting surface) of the component holding plate 12 are parallel to the X direction and the other two facing each other. Since the sides are parallel to the Y direction, the change in the orientation (direction when viewed from above) when the component P is taken out by the component transport mechanism (for example, a mechanism capable of transporting the component in three dimensions) described above can be changed. This can be performed with reference to the X direction and the Y direction, and thereby the burden of changing the direction can be reduced.

<< Experimental data related to alignment rate >>
Next, the experimental data for verifying the alignment rate described above will be described with reference to FIG.

The component sizes used in the experiment are 0402, 0603, 1005, 1608, 2012, 3216, and 3225, and the component type is a capacitor element (multilayer ceramic capacitor). The angle θ in FIG. 10 indicates the angle θ shown in FIG. 3 (B).

In the experiment, each component size has 1000 component alignment holes H corresponding to the component size in the arrangement and orientation shown in FIG. 3B, and the angle θ is 1 ° in the range of 2 ° to 13 °. Twelve different types of component alignment plates were prepared. In addition, according to the operation method described above, 900 bulk-shaped parts are placed on 12 types of parts alignment plates for each part size, and X-direction vibration and Y-direction vibration (the amplitude of each vibration is the reference of the parts). The same as the length) was added for 60 seconds, and the alignment rate (probability that the component P was dropped into the component alignment hole H in the normal posture) after the vibration was added was measured as a percentage.

According to the experiment, it was confirmed that an alignment rate of 95% or more can be obtained when the angle θ is in the range of 3 ° to 12 ° regardless of the component size. Although the alignment rate does not reach 95% when the angles θ are 2 ° and 13 °, they both exceed 90%, so there is no problem when the quality boundary of the practical alignment rate is 90%. It was also confirmed that it can be used. Although not shown in FIG. 10, it has been confirmed that it is not suitable for practical use because the alignment rate is 80% or less when the angles θ are 1 ° and 14 °.

<< Modification example >>
Next, a modification of the above-mentioned component alignment device and component alignment plate 13 will be described.

(1) Although FIGS. 1 and 2 show the component holding plate 12 detachable from the component tray 11, the component holding plate 12 does not necessarily have to be detachable, and the component holding layer corresponding to the component holding plate 12 is provided as a component. It may be integrally formed on the bottom surface of the recess 11a of the tray 11. In other words, if the component holding plate 12 is configured to be removable, the component holding plate can no longer obtain the desired surface frictional resistance on the upper surface (part mounting surface) of the component holding plate 12 due to repeated use. Only 12 can be exchanged.

(2) Although FIGS. 1 and 2 show a component alignment unit and a component alignment plate 13 having a square top view, the component alignment unit and components are used in order to increase the number of component alignment holes H that can be used. The top view outer shape of the alignment plate 13 may be a rectangle extending in the X direction. In this case, when the parts alignment plate 13 is not sufficiently pressed by the pressing plate 14, a partition portion for dividing the hole 14a of the pressing plate 14 in the X direction is provided, and the partition portion and the pressing portion 14b provide the component alignment plate 13. It is advisable to press.

(3) Fig. 3 (A) shows an electronic component having a rectangular parallelepiped shape defined by reference length Lp> reference width Wp = reference thickness Tp as an example of component P, but electronic components having the same dimensional relationship. The desired alignment is possible even for parts other than the above, and the desired alignment is possible even if the reference width Wp and the reference thickness Tp are slightly different.

(4) FIGS. 3 (B) to 3 (D) show a rectangular shape in the top view as the component alignment hole H, but instead of this, a circular shape in the top view or an elliptical shape in the top view is used. Even if it is adopted, the first of the above-mentioned effects can be obtained, and this is the same even when parts having a shape other than the rectangular parallelepiped are to be aligned.

10 ... Parts alignment unit, 11 ... Parts tray, 12 ... Parts holding plate, 13 ... Parts alignment plate, 13'... Original plate of parts alignment plate, 14 ... Pressing plate, 20 ... Vibration addition unit, 21 ... Base, 22 ... Vibration source, 23 ... Vibration plate, 23a ... Tray support, P ... Parts, H ... Parts alignment hole of parts alignment plate, Hc ... Center of component alignment hole, VXYP ... Virtual XY plane, VIGL ... Virtual inclined grid line, θ … Angle, IN1, IN2… Shortest interval.

Claims (18)

A component alignment device including a component alignment unit and a vibration addition unit capable of adding vibration to the component alignment unit.
The component alignment unit is detachable from a component tray having a component mounting surface and the component mounting surface of the component tray, and the component to be aligned is dropped in the mounted state to drop the component of the component tray. A component alignment plate having a component alignment hole that can be mounted on the mounting surface is provided.
Parts alignment device. The component alignment unit further includes a pressing plate that can be attached to and detached from the component tray and that can press the component alignment plate against the component mounting surface of the component tray in the mounted state.
The component alignment device according to claim 1. The component mounting surface of the component tray can hold the component by its own surface frictional resistance.
The component alignment device according to claim 1 or 2. The component mounting surface of the component tray is composed of an upper surface of a component holding plate that can be attached to and detached from the component tray.
The component alignment device according to any one of claims 1 to 3. The vibration adding unit includes a vibration plate having a tray support portion to which the component tray can be attached and detached, and a vibration source capable of applying vibration to the vibration plate.
The component alignment device according to any one of claims 1 to 4. The vibration comprises X-direction vibration and Y-direction vibration in a virtual XY plane set on the upper surface of the component alignment plate.
The component alignment device according to claim 5. The component alignment plate according to any one of claims 1 to 6.
The component alignment hole is a virtual tilt grid line having a virtual tilted horizontal straight line tilted by θ in the X direction and a virtual tilted vertical line tilted by θ in the same angle as the Y direction on a virtual XY plane set on the upper surface of the component alignment plate. In the virtual state in which is set, the center of the component alignment hole is located at the odd-th intersection of the odd-th virtual inclined horizontal line in the virtual inclined grid line, and the even-th intersection of the even-th virtual inclined horizontal line is located. Is arranged so that the center of the component arrangement hole is located in
Parts alignment plate. When the component alignment holes form a rectangular shape when viewed from above, the two opposing sides of the component alignment holes are parallel to the X direction, and the other two opposing sides are parallel to the Y direction.
The component alignment plate according to claim 7. When the component forms a rectangular parallelepiped shape defined by reference length> reference width = reference thickness, the dimensions of the two opposing sides of the component alignment hole are slightly larger than the reference length and are opposed to each other. The dimensions of the other two sides are slightly larger than the reference width and the reference thickness.
The component alignment plate according to claim 8. The depth of the component alignment hole is less than 1/2 of the reference length and more than 1/2 of the reference width and the reference thickness.
The component alignment plate according to claim 9. The shortest distance between the two adjacent component alignment holes in the X direction and the shortest distance between the two adjacent component alignment holes in the Y direction are equal to or greater than the reference length.
The part alignment plate according to claim 9 or 10. The angle θ is in the range of 3 ° to 12 °.
The component alignment plate according to any one of claims 9 to 11. The method for manufacturing a component alignment plate according to any one of claims 1 to 6.
A step of setting a virtual XY plane on the upper surface of the original plate to be the component alignment plate,
A step of setting a virtual inclined grid line having a virtual inclined horizontal straight line inclined by θ in the X direction and a virtual inclined vertical line inclined by θ in the same angle as the Y direction on the virtual XY plane.
The center of the component alignment hole is located at the odd-numbered intersection of the odd-numbered virtual inclined horizontal straight lines in the virtual inclined lattice line, and the center of the component arrangement hole is located at the even-numbered intersection of the even-numbered virtual inclined horizontal straight lines. The original plate is provided with a step of forming the component alignment hole so as to be located.
Manufacturing method of parts alignment plate. When the component alignment holes form a rectangular shape when viewed from above, in the step of forming the component alignment holes, the two opposing sides of the component alignment holes are parallel to the X direction, and the other two opposing sides are said. The component alignment hole is formed so as to be parallel to the Y direction.
The method for manufacturing a component alignment plate according to claim 13. When the component forms a rectangular parallelepiped shape defined by reference length> reference width = reference thickness, the dimensions of the two opposing sides of the component alignment hole are slightly larger than the reference length and are opposed to each other. The dimensions of the other two sides are slightly larger than the reference width and the reference thickness.
The method for manufacturing a component alignment plate according to claim 14. The depth of the component alignment hole is less than 1/2 of the reference length and more than 1/2 of the reference width and the reference thickness.
The method for manufacturing a component alignment plate according to claim 15. The shortest distance between the two adjacent component alignment holes in the X direction and the shortest distance between the two adjacent component alignment holes in the Y direction are equal to or greater than the reference length.
The method for manufacturing a component alignment plate according to claim 15 or 16. The angle θ is in the range of 3 ° to 12 °.
The method for manufacturing a component alignment plate according to any one of claims 15 to 17.

Images