JP2008205999A - Lame-mode vibration device and package for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a Lame-mode vibration device which reduces an influence when a Lame-mode vibration chip is supported and is made compact, and a package for an electronic component. <P>SOLUTION: The Lame-mode vibration device 10 has a first support base 20 and a second support base 30. The first support base 20 has a first inclined plane 22 inclined upward at an end. A mount electrode 24 is provided on the first inclined plane. Further, the second support base 30 has a second inclined plane 32 inclined downward at an end. The mount electrode 24 is coated with a conductive adhesive 28, and a Lame-mode vibration chip 12 is arranged on the conductive adhesive 28. At this time, the Lame-mode vibration chip 12 has corner portions, which are at diagonal positions on the reverse surface, joined to the conductive adhesive 28. The second inclined plane 32 of the second support base 30 comes into contact with other corner portions other than the corner portions to which the first support base 20 and Lame-mode vibration chip 12 are joined. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a package for a lame mode vibration device and an electronic component.

  When the lame mode resonator element is subjected to contour vibration in lame mode, the vibrating portion is displaced, but the four corners (corner portions) and the center of the vibrating portion are places where the displacement is zero (nodes). Therefore, when supporting the vibrating portion of the lame mode vibrating piece, as shown in FIG. 9, the connecting portion 3 is provided at the corner of the vibrating portion 1 and the supporting portion 2 is provided at the end of the connecting portion 3. Supports part 1. In FIG. 9, positions indicated by dots are nodes.

Non-Patent Document 1 is disclosed as such a lame mode vibrating piece. The lowest order lame mode quartz crystal resonator disclosed in Non-Patent Document 1 includes a square-shaped vibrating portion and support portions respectively provided at corner portions at diagonal positions in the vibrating portion. The part and the support part are integrally formed. The higher-order Lame mode quartz crystal resonator disclosed in Non-Patent Document 1 has a rectangular vibrating portion and support portions provided at each corner (four corners) of the vibrating portion.
Hirofumi Kawashima and one other, “Lame Mode Quartz Crystal Formed by Etching”, May 18, 1995, EM Symposium (Figures 2 and 3)

  As described above, in the lame mode vibrating piece, the node is at each corner of the vibrating portion. That is, the node exists as a point when the vibration part is viewed in plan, and exists at the corner of the vibration part along the side in the thickness direction at the corner. However, in the conventional lame mode vibrating piece, as shown in FIG. 9, since the connecting portion 3 has a width E, the vibrating portion 1 cannot be supported by a point (side). In this case, when the vibration part 1 performs contour vibration, the connection part 3 performs bending vibration in accordance with the contour vibration. For this reason, the contour vibration is transmitted to the outside through the connecting portion 3 and vibration leakage occurs, resulting in a loss of the lame mode vibration piece and a deterioration of the Q value.

  Further, in order to reduce the above-described influence when the connecting portion 3 is connected to the vibrating portion 1 with the width E, a higher-order lame mode vibrating piece may be used. However, the higher-order lame mode resonator element has a large planar size and cannot be miniaturized.

  It is an object of the present invention to provide a package for a lame mode vibration device and an electronic component that is reduced in size and has a reduced effect when supporting a lame mode vibration piece.

  The lame mode vibration device according to the present invention has two first support bases each having a mount electrode provided at an end thereof, and each first support base is disposed with the end portions of the first support base facing each other. A corner portion on the lower surface side of the lame mode vibrating piece is disposed on the conductive adhesive provided on the mount electrode, and the lame mode vibrating piece is supported on the first support base.

In the lame mode vibrating piece, the nodes of the lame mode contour vibration are located at the corners or the like. In this invention, since the corner | angular part of a lame mode vibration piece is supported, it can reduce that a contour vibration is transmitted to a 1st support stand via a conductive adhesive. That is, since the influence when supporting the lame mode vibrating piece can be reduced, the loss can be reduced and the Q value can be improved. As a result, the lame mode vibrating piece can be reduced in size. In addition, the corner part in the diagonal position on the lower surface of the lame mode vibrating piece can be joined to the conductive adhesive in a dotted manner.

  Further, the above-described first support base is provided with a first inclined surface inclined upward and a mount electrode provided on the first inclined surface. In other words, the lame mode vibration device has a first inclined surface inclined upward and provided with two first support bases provided with mount electrodes on the first inclined surface, and the first inclined surface is opposed to the first inclined surface. The first support base is disposed, and the corner portion on the lower surface side of the lame mode vibrating piece is disposed on the conductive adhesive provided on the mount electrode. Thereby, since the corner | angular part of a lame mode vibration piece can be supported, a vibration leak can be made small. Therefore, the loss can be reduced and the Q value can be improved.

  Further, in the lame mode vibrating device according to the present invention, the corner portion located diagonally of the lame mode vibrating piece is disposed on the conductive adhesive, and the second inclined surface inclined downward is an end portion. The second inclined surface is provided at a corner other than the corner where the first support and the lame mode vibrating piece are joined using the conductive adhesive. It is characterized by touching. That is, in the lame mode vibrating piece, the other corner portion at a diagonal position on the upper surface thereof is in contact with the second inclined surface. Thereby, since the 2nd support stand can support a lame mode vibration piece in the shape of a point from the upper part, it can support a lame mode vibration piece stably. In addition, since the second inclined surface and the other corners come into contact with each other in a dot shape, the influence when the lame mode vibrating piece is supported can be reduced, and the lame mode vibrating piece can be reduced in size.

  Further, the lame mode vibration device according to the present invention has two second support bases, each of the second support bases is disposed with the end portions of the second support bases facing each other, and the facing directions thereof. In contrast, the second inclined surfaces are inclined in the same lateral direction. As a result, even if a force that rotates in the horizontal direction is applied to the lame mode vibrating piece, the rotation of the lame mode vibrating piece can be suppressed by either one of the second inclined surfaces.

  The conductive adhesive described above is characterized by being softer than the material forming the lame mode vibrating piece. Thereby, even if the lame mode vibrating piece performs contour vibration in the lame mode, the conductive adhesive can be easily deformed according to the contour vibration. Therefore, the influence when supporting the lame mode vibrating piece can be reduced.

  The lame mode vibrating device according to the present invention is characterized in that an oscillation circuit is connected to the lame mode vibrating piece. As a result, a lame mode oscillator can be configured. Since the lame mode resonator element is supported as described above, the loss is reduced and the Q value is also improved. Therefore, the lame mode oscillator can reduce current consumption.

  The electronic component package according to the present invention includes two first support bases each having a first inclined surface inclined upward and having an end portion provided with a mount electrode on the first inclined surface. The first support bases are arranged on the base with the one inclined surfaces facing each other. Accordingly, the lower side of the electronic component can be supported by the first inclined surface of the first support base.

In the electronic component package according to the present invention, two second support bases each having a second inclined surface inclined downward are provided on the base, and the first support bases face each other. Each of the second support bases is arranged along a direction intersecting with respect to. In this case, the first inclined surface and the second inclined surface are directed to the inside of a region where the outer edge is formed by these inclined surfaces. In addition, the said area | region can be used as an area | region which mounts electronic components, for example, a lame mode vibration piece. Thereby, the upper side of the electronic component can be supported by the second inclined surface of the second support base.

  Embodiments of a lame mode vibration device and a package for electronic components according to the present invention will be described below. First, the first embodiment will be described. FIG. 1 is a perspective view showing a part of the lame mode vibration device according to the first embodiment. The lame mode vibrating device 10 includes a lame mode vibrating piece (hereinafter referred to as “vibrating piece”) 12 that performs contour vibration in the lame mode. For this reason, the resonator element 12 has a rectangular shape, and has nodes at the corners and the center where the displacement of the contour vibration in the lame mode is zero.

  Excitation electrodes 14 are respectively provided on the upper surface and the lower surface of the resonator element 12 (see FIG. 3A). Since the excitation electrode 14 is provided in the entire vicinity of the center excluding the peripheral portion of the resonator element 12, one excitation electrode 14a provided on the upper surface and the other excitation electrode 14b provided on the lower surface face each other. A connection electrode 16 is drawn from each excitation electrode 14 toward one corner. That is, one connection electrode 16a is drawn out from one excitation electrode 14a provided on the upper surface of the resonator element 12 toward a certain corner. Also, the other connection electrode 16b is drawn out from the other excitation electrode 14b provided on the lower surface toward a corner that is diagonal to the corner where the one connection electrode 16a is provided. As a result, an electric field is not applied to the portion where the connection electrode 16 is provided.

  As shown in FIG. 1, the lame mode vibrating device 10 includes a first support 20 and a second support 30 on two bases (not shown) in order to support the resonator element 12. Yes. This base, the 1st support stand 20, and the 2nd support stand 30 comprise the package for electronic components. A first inclined surface 22 that is inclined upward is provided at an end of the first support base 20. A mount electrode 24 is provided on the first inclined surface 22 and is electrically connected to the wiring pattern 26 provided on the upper surface of the first support base 20. Each first support 20 is disposed with the first inclined surfaces 22 facing each other. At this time, the first support bases 20 are arranged at intervals such that the corners of the resonator element 12 and the first inclined surface 22 overlap in plan view.

  A second inclined surface 32 that is inclined downward is provided at the end of the second support 30. Each second support 30 is disposed with the second inclined surfaces 32 facing each other. And each 2nd support stand 30 is arrange | positioned along the direction which crosses with respect to the direction where each 1st support stand 20 has faced, for example, the orthogonal direction in the case shown in FIG.

  Further, each of the first inclined surface 22 and each second supporting table 30 and second inclined surface 32 of each first support base 20 is directed to a certain point. That is, the first support base 20 and the second support base 30 are such that when the vibration piece 12 is supported, the vibration piece 12 can be supported by the first inclined surface 22 and the second inclined surface 32. 12 is arranged so that the first inclined surface 22 and the second inclined surface 32 face the center.

  The first support base 20 and the second support base 30 can be made of various materials, but an anisotropic crystal such as quartz is used, and the crystal surface is obtained by wet etching the crystal. Thus, the first inclined surface 22 and the second inclined surface 32 can be obtained. Since the first and second support bases 20 and 30 produced by wet etching of anisotropic crystals in this way have no variation in the angle of inclination, an inclined surface can be obtained easily and with high accuracy. it can.

In such a first support 20, a conductive adhesive 28 is provided on the mount electrode 24. Then, the resonator element 12 is disposed on the conductive adhesive 28 so that the conductive adhesive 28 and the corner provided with the connection electrode 16 are joined. As a result, the corner portion at the diagonal position on the lower surface of the resonator element 12 is supported by the first support base 20, and the excitation electrode 14 and the mount electrode 24 are electrically connected via the conductive adhesive 28. The conductive adhesive 28 may be softer than the material forming the resonator element 12 even after being cured. For example, a silicone-based conductive adhesive or the like can be used as the conductive adhesive 28. The material forming the resonator element 12 is a piezoelectric material such as quartz.

  Further, the second support base 30 is in contact with the other corner of the vibration piece 12 where the vibration piece 12 and the first support base 20 are not joined. That is, the second inclined surface 32 of the second support 30 is in contact with the other corner portion located on the upper surface of the vibrating piece 12. At this time, the second support base 30 is disposed so as to press the vibrating piece 12 from above with the second inclined surface 32. In some embodiments, the second inclined surface 32 and the other corner may be joined with an adhesive. Similar to the conductive adhesive 28 described above, this adhesive may be softer than the material forming the resonator element 12, and for example, a silicone-based adhesive may be used.

  Next, a manufacturing method of the lame mode vibrating device 10 will be described. First, an electronic component package that houses the resonator element 12 will be described. FIG. 2 is a perspective view of the package base. The electronic component package 40 includes a package base 42 (base) and a lid (not shown) joined to the upper side of the package base 42. The package base 42 includes a recess 44 that opens upward. The first support base 20 is fixed to the bottom surface of the recessed portion 44. The wiring pattern 26 formed on the first support base 20 is electrically connected to the external terminal 46 provided on the back surface of the package base 42. In the electronic component package 40, the above-described second support 30 can be mounted in the recessed portion 44.

  The process of mounting the resonator element 12 on the package base 42 is as follows. FIG. 3 is an explanatory diagram of a process of mounting the lame mode vibrating piece on the package base. 3A and 3B are cross-sectional views corresponding to the line AA in FIG. 1, and FIGS. 3C and 3D are cross-sectional views corresponding to the line BB in FIG. is there. First, as shown in FIG. 3A, a conductive adhesive 28 is applied on the mount electrode 24 formed at the end of the first support base 20.

  Then, as shown in FIG. 3B, the resonator element 12 is disposed on the conductive adhesive 28. At this time, the corner portion of the resonator element 12 provided with the connection electrode 16 and the conductive adhesive 28 come into contact with each other. Further, the vibrating element 12 comes into contact with the mount electrode 24 as it further descends after contacting the conductive adhesive 28. Even in this case, since the corner portion of the resonator element 12 and the mount electrode 24 are merely in point contact, the contour vibration of the resonator element 12 is not adversely affected. When the corner of the vibrating piece 12 and the conductive adhesive 28 come into contact, the other connection electrode 16 b provided on the lower surface of the vibrating piece 12 comes into contact with the conductive adhesive 28. That is, the mount electrode 24 of the other first support base 20b shown on the right side in FIG. 3B and the other excitation electrode 14b provided on the lower surface of the resonator element 12 are electrically connected.

  Thereafter, one first support base 20a (shown on the left side in FIG. 3B) and one excitation electrode 14a provided on the upper surface of the resonator element 12 are electrically connected to each other. A conductive adhesive 28 is further applied on the conductive adhesive 28 applied to the support base 20a. That is, the conductive adhesive 28 is further applied along the side in the thickness direction at the corner of the resonator element 12 and is brought into contact with one connection electrode 16 a provided on the upper surface of the resonator element 12. As a result, the mount electrode 24 provided on one first support base 20a and the one excitation electrode 14a provided on the upper surface of the resonator element 12 are electrically connected. The conductive adhesive 28 used for the top coating may be the same as the conductive adhesive 28 applied on the mount electrode 24.

Thereafter, as shown in FIG. 3C, the second support base 30 is placed in the package base 42 and placed on the bottom surface of the recessed portion 44, and the end provided with the second inclined surface 32 is brought close to the vibrating piece 12. . Then, as shown in FIG. 3D, the second inclined surface 32 and another corner portion on the upper surface of the resonator element 12 are brought into contact with each other. Thereafter, the adhesive 36 is applied around the lower side of the second support base 30 to fix the second support base 30 and the package base 42 together. The adhesive 36 may be conductive or non-conductive. The adhesive 36 may be softer than the material forming the resonator element 12, and for example, a silicone-based adhesive can be used. The adhesive 36 may be applied to the lower surface of the second support 30 in advance before the second support 30 is disposed on the bottom surface of the recessed portion 44. In this case, the second support 30 may be brought close to the vibrating piece 12 and the second inclined surface 32 may be brought into contact with the other corner before the adhesive 36 is cured. By arranging the first support base 20 and the second support base 30 in this way, the first support base 20 supports the lower side of the vibration piece 12 and the second support base 30 supports the upper side of the vibration piece 12. is doing. As a result, the resonator element 12 is mounted on the package base 42.

  Then, the lid body is joined onto the package base 42 and the recessed portion 44 is hermetically sealed to obtain the lame mode vibration device 10.

  According to such a lame mode vibrating device 10, the soft conductive adhesive 28 is bonded to the corner of the vibrating piece 12. In the resonator element 12, the side in the thickness direction at the corner portion becomes a node of contour vibration, and the vicinity of the corner portion performs contour vibration with slight displacement. The displacement of the contour vibration in the vicinity of this corner is smaller than the portion that becomes the antinode of the contour vibration. For this reason, the conductive adhesive 28 bonded to the corner of the vibrating piece 12 can be deformed in accordance with the contour vibration of the vibrating piece 12. Further, the end portion of the first support base 20 is inclined upward so that the corner portion of the resonator element 12 can be supported in a more dotted manner. Therefore, when the conductive adhesive 28 is applied to the first inclined surface 22 and the corners of the vibrating piece 12 are joined, the conductive adhesive 28 is joined to the vicinity of the lower corner of the vibrating piece 12. Therefore, it is possible to make it difficult to inhibit the contour vibration of the resonator element 12. Therefore, the vibration leakage of the resonator element 12 can be reduced, so that the loss is reduced and the Q value can be improved. As a result, the necessity of making the resonator element 12 in a higher order mode is reduced, so that the planar size of the resonator element 12 can be reduced, and consequently the planar size of the lame mode resonator device 10 can be reduced.

  Further, the second inclined surface 32 of the second support base 30 is in contact with the other corner of the resonator element 12. As described above, since the corner portion is a node of contour vibration, the displacement of vibration is zero. Therefore, the second support 30 does not hinder the contour vibration of the resonator element 12 and the vibration is not transmitted to the second support 30, so there is no loss and the Q value can be improved.

  The vibrating piece 12 and the first support base 20 are joined by a soft conductive adhesive 28, and the second support base 30 and the base are joined by a soft adhesive 36. Since the vibrating piece 12 is supported in a dot shape, the influence of the support on the vibrating piece 12 can be reduced.

  Further, since the second inclined surface 32 of the second support base 30 faces downward, even if an upward force is applied to the vibrating piece 12, the second inclined surface 32 causes the vibrating piece 12 to move upward. Can be suppressed. Therefore, by using the second support base 30, it is possible to prevent the vibration piece 12 from dropping from the first support base 20.

  In the first embodiment, the vibration piece 12 is supported in four points at the four points using both the first support base 20 and the second support base 30, but only the first support base 20 is used. The form which supports the vibration piece 12 may be sufficient. Even if the resonator element 12 is supported only by the first support base 20, the resonator element 12 can be supported in a point-like manner at two locations, so that the loss of the resonator element 12 can be reduced and the Q value can be improved. Can be made.

Next, a second embodiment will be described. In the second embodiment, since a modified example of the second support base will be described, description of the same components as those in the first embodiment is omitted, and a part of the configuration in FIG. 4 is also omitted. FIG. 4 is an explanatory diagram of the second embodiment. 4A is a perspective view of the end portion of the second support base, FIG. 4B is a schematic plan view showing a part of the lame mode vibration device, and FIG. 2 is a cross-sectional plan view illustrating a place where a support base and a vibrating piece are in contact with each other. FIG. 5 is a perspective view of the end portion of the second support base described in the first embodiment.

  As shown in FIG. 4 (A), the second inclined surface 32 provided at the end of the second support base 30 is inclined downward and inclined laterally. That is, the second inclined surface 32 has a form in which the inclined surface facing downward is further rotated in the horizontal direction. In addition, since the 2nd inclined surface 32 of the 2nd support stand 30 demonstrated in 1st Embodiment inclines only below, it has the shape shown in FIG. In FIGS. 4A and 5, as a reference, the shape of the end portion of the second support base 30 made square is shown by a one-dot chain line.

  When the vibrating reed 12 is supported by using the second support base 30 of the present embodiment, two second support bases 30 are necessary, so that the second support faces each other as shown in FIG. Each second inclined surface 32 of the base 30 faces downward and faces in the same lateral direction with respect to the direction in which the second support base 30 faces. That is, the second inclined surfaces 32 face downward and rotate in opposite directions in the horizontal direction. For example, in the case shown in FIG. 4B, the direction in which each second inclined surface 32 faces sideways is the right direction.

  As in the first embodiment, the resonator element 12 is supported on the first inclined surface 22 of the first support base 20 by the conductive adhesive 28 and supported by the second inclined surface 32 of the second support base 30. Has been. At this time, as shown in FIG. 4C, the vibrating reed 12 is supported at a location that is in the shape of a letter C in plan view by making the second inclined surfaces 32 face each other. That is, when each second inclined surface 32 is viewed in plan, it has a line-symmetric shape with respect to a line orthogonal to the direction in which the end portions of the second support base 30 face each other. Therefore, as shown by the arrow C, even when a rotating force is applied to the vibrating piece 12, the rotation of the vibrating piece 12 can be suppressed by either one of the second inclined surfaces 32. That is, in the lame mode vibrating device 10 according to the present embodiment, the vibrating piece 12 is difficult to peel off from the first support base 20.

  In order to prevent horizontal rotation of the resonator element 12 using the second support base 30 (see FIG. 5 and the like) described in the first embodiment, the second support base is provided at the other corner of the resonator element 12. What is necessary is just to contact 30 from the diagonal direction.

  Next, a third embodiment will be described. In the third embodiment, a modification of the package for electronic components will be described. FIG. 6 is an exploded perspective view of the electronic component package according to the third embodiment. The electronic component package 50 according to the third embodiment includes a package base 52, a first support base 64, a second support base 70, and a lid 78.

  The package base 52 has a recessed portion 54 that opens upward. The recessed portion 54 is provided with a first support base 64 that is inclined upward at two opposing sides of the four sides formed by the bottom surface 56 and the side surface 58. The inclined portion is a first inclined surface 66. In addition, a mount electrode 68 is provided on the first inclined surface 66 in the center portion of the first support base 64 in the length direction (the depth direction in FIG. 6). The first inclined surface 66 is electrically connected to the external terminal 60 provided on the back surface of the package base 52 in a one-to-one relationship.

In addition, a second support base 70 having a width equal to or smaller than the distance D between the portions where the first inclined surfaces 66 and the bottom surface 56 of the recessed portion 54 are in contact with each other can be mounted on the recessed portion 54. Note that the width of the second support 70 may be the same as or slightly narrower than the interval D. The second support base 70 includes a main body 72 having a width equal to or smaller than the distance D and a contact portion 74 protruding in one direction from the center of the main body 72. That is, the second support base 70 has a T shape in plan view. The tip (end) of the contact portion 74 is inclined downward, and this inclined surface is a second inclined surface 76.
In FIG. 6, only one second support base 70 is shown. However, when the resonator element 12 is mounted on the package base 52, two second support bases 70 are used. In this case, each 2nd support stand 70 is arrange | positioned so that the 2nd inclined surface 76 may mutually oppose.

  When the resonator element 12 is mounted on the package base 52, the conductive adhesive 28 is applied on the mount electrode 68 in the same manner as described in the first embodiment, and this conductive adhesive is applied. The vibration piece 12 is disposed on the surface 28. Thereafter, the second support surface 70 is put into the recessed portion 54 of the package base 52 with the second inclined surface 76 facing the vibrating piece 12. Since the 1st inclined surface 66 of the 1st support stand 64 can also serve as a guide at this time, the 2nd support stand 70 can be brought close to the center side of the width direction (left-right direction in FIG. 6) of the recessed part 54. it can. When the width of the second support base 70 is the same as or slightly narrower than the distance D, the second support base 70 is arranged so that the second inclined surface 76 and the other corners of the resonator element 12 are aligned on a straight line. The position can be adjusted.

  Thereafter, the second support base 70 is moved toward the vibrating piece 12. When the width of the main body 72 of the second support base 70 is the same as the distance D or slightly narrower than the distance D, the second support base 70 may be moved toward the vibrating piece 12. The first support bases 64 disposed on both sides of the second support base 70 serve as a guide, and the second inclined surface 76 can be reliably brought into contact with the other corners of the resonator element 12. After the vibrating piece 12 and the second inclined surface 76 come into contact, the second support base 70 is fixed to the package base 52.

  Thereafter, the lid 78 is joined to the upper surface of the package base 52, that is, the portion where the recessed portion 54 is open, and the recessed portion 54 is hermetically sealed.

  If such an electronic component package 50 is used, the resonator element 12 can be supported easily and reliably. Further, since the planar size of the second support base 70 is increased, the bonding area between the second support base 70 and the package base 52 can be increased. Therefore, even if a larger force is applied to the second support base 70, the second support base 70 is not peeled off from the package base 52, and the vibrating piece 12 can be stably supported.

  In addition, although the 2nd support stand 70 demonstrated in this embodiment is carrying out the planar view and is T-shaped, the 2nd support stand may have another shape. That is, the 2nd support stand may be a rectangle in plane view, for example. In this case, the entire end portion may be the second inclined surface.

  Further, in the package base 52, any one of the two second support bases 70 may be disposed in the recessed portion 54 in advance together with the first support base 64. Then, after mounting the resonator element 12 on the package base 52, the other second support base 70 may be placed in the recessed portion 54 to support the resonator element 12.

  Next, a fourth embodiment will be described. The lame mode vibrating device 10 has a configuration such as a lame mode vibrator in which only the vibrating piece 12 is accommodated in an electronic component package, or a lame mode oscillator in which an oscillation circuit is accommodated in the electronic component package together with the vibrating piece 12. Can do. In the fourth embodiment, a lame mode oscillator of the lame mode vibrating device 10 having the above-described configuration and the like will be described. FIG. 7 is a cross-sectional view of a lame mode oscillator. FIG. 7 does not show the second support base.

The lame mode oscillator 80 has a package base 82. The package base 82 includes a first recessed portion 84 opened upward and a second recessed portion 8 opened downward.
8. The resonator element 12 is disposed in the first recessed portion 84, and the first recessed portion 84 is hermetically sealed by providing a lid 86a at a position where the first recessed portion 84 is open. In the case shown in FIG. 7, the resonator element 12 is supported by the first support base 20 and the second support base 30 in the same manner as described in the first embodiment. The first support base 64 and the second support base 70 may support the same as described in the form. The mount electrode 24 provided on the first support 20 is electrically connected to the bonding pad 92 provided on the second recessed portion 88 via the wiring pattern 26 and the like.

  In addition, an oscillation circuit is fixed to the bottom surface located above the second recess 88. This oscillating circuit is a circuit that oscillates the resonator element 12 and may be constituted by an integrated circuit (IC) chip 90. An IC side pad 90 a is provided on the outer surface of the IC chip 90. A plurality of bonding pads 92 are provided around the IC chip 90 on the bottom surface of the second recessed portion 88. A wire 94 is bonded to the bonding pad 92 and the IC side pad 90a, and these are electrically connected. Further, an external terminal 96 is provided on the back surface of the package base 82 and is electrically connected to another bonding pad 92 that is not electrically connected to the resonator element 12. A lid body 86b is provided at a location where the second recessed portion 88 is open, and the second recessed portion 88 is sealed.

  With this configuration, the lame mode oscillator 80 can be obtained. Since the lame mode oscillator 80 uses the above-described support method that does not adversely affect the contour vibration of the resonator element 12, the loss can be reduced and the current consumption can be reduced.

  Next, a fifth embodiment will be described. In the fifth embodiment, a modified example of the first support base will be described. FIG. 8 is a perspective view showing a part of the lame mode vibrating device according to the fifth embodiment. The 1st support stand 100 of 5th Embodiment does not provide the 1st inclined surface in the edge part, but has a shape which made this edge part the square. A mount electrode 24 is provided at the end of the first support base 100, and a wiring pattern 26 is connected to the mount electrode 24. The first support bases 100 are arranged at intervals such that the corners and ends of the resonator element 12 slightly overlap in plan view. If the conductive adhesive 28 is applied on the mount electrode 24 of the first support base 100 and the corners of the resonator element 12 are disposed thereon, the corners of the resonator element 12 and the conductive adhesive 28 are disposed. Can be joined. In addition, the 2nd support stand 30 and the vibration piece 12 are the same structures as 1st Embodiment. Even when the configuration of the first support base 100 is used, the same effects as those of the first embodiment can be obtained.

  In the first to fifth embodiments described above, when the resonator element 12 is disposed on the first support base, the conductive adhesive is used to connect the connection electrode 16 provided on the upper surface of the resonator element 12 and the mount electrode. The embodiment in which 28 is overcoated has been described. However, if one of the connection electrodes 16 a provided on the upper surface of the vibrating piece 12 is further routed to the side surface and the lower surface of the vibrating piece 12, it is not necessary to apply the conductive adhesive 28 on top. In this case, the other excitation electrode 14b provided on the lower surface of the resonator element 12 and the one connection electrode 16a routed on the upper surface, side surface, and lower surface of the resonator element 12 may be formed so as not to conduct.

  In the embodiment described above, the configuration in which the resonator element 12 is formed by using a piezoelectric material such as quartz is described. However, the resonator element may be one (MEMS: microelectromechanical system) manufactured using a microfabrication technique of silicon.

It is the perspective view which showed a part of the lame mode vibration device which concerns on 1st Embodiment. It is a perspective view of a package base. It is explanatory drawing of the process of mounting a lame mode vibration piece on a package base. It is explanatory drawing of 2nd Embodiment. It is a perspective view of the edge part of the 2nd support stand demonstrated in 1st Embodiment. It is a disassembled perspective view of the package for electronic components which concerns on 3rd Embodiment. It is sectional drawing of a lame mode oscillator. It is the perspective view which showed a part of lame mode vibration device which concerns on 5th Embodiment. It is a top view of the lame mode vibration piece which concerns on a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ......... Lame mode vibration device, 12 ......... Lame mode vibration piece, 20, 64, 100 ......... 1st support stand, 22,66 ......... 1st inclined surface, 24,68 ......... Mount electrode 28 ......... Conductive adhesive, 30, 70 ......... Second support base, 32,76 ......... Second inclined surface, 40, 50 ......... Package, 42, 52, 82 ......... Package base , 80 ... Ramame mode oscillator, 90 ... IC chip.

Claims (8)

It has two first support bases provided with mount electrodes at the ends,
The first support bases are arranged with the ends of the first support bases facing each other,
A corner portion on the lower surface side of the lame mode vibrating piece is disposed on the conductive adhesive provided on the mount electrode, and the lame mode vibrating piece is supported on the first support.
A lame mode vibration device characterized by that.   The lame mode according to claim 1, wherein a first inclined surface inclined upward is provided at an end portion of the first support base, and the mount electrode is provided on the first inclined surface. Vibration device. A corner located diagonally of the lame mode vibrating piece is disposed on the conductive adhesive,
A second support base provided with an end portion of a second inclined surface inclined downward is provided;
The second inclined surface is brought into contact with another corner portion different from the corner portion where the first support base and the lame mode vibrating piece are joined using the conductive adhesive,
The lame mode vibration device according to claim 2.   Two second support bases are provided, the second support bases are disposed with the ends of the second support bases facing each other, and the second inclined surfaces are arranged in the opposite direction. The lame mode vibration device according to claim 3, wherein each of the lame mode vibration devices is inclined toward the same lateral direction.   The lame mode vibrating device according to any one of claims 1 to 4, wherein the conductive adhesive is softer than a material forming the lame mode vibrating piece.   6. The lame mode vibrating device according to claim 1, wherein an oscillation circuit is connected to the lame mode vibrating piece.   Each of the first inclined surfaces is provided with two first support bases each provided with a first inclined surface inclined upward and provided with a mount electrode on the first inclined surface. The first inclined surfaces are opposed to each other. A package for electronic parts, wherein one support base is disposed on a base.   Two second support bases each having a second inclined surface inclined downward are provided on the base, and the second support bases are arranged along a direction intersecting a direction in which the first support bases face each other. 8. The electronic component package according to claim 7, wherein each second support is disposed.

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