JP6791772B2 - Crystal elements and crystal devices - Google Patents

Description

The present invention relates to a crystal element and a crystal device having the crystal element. The crystal device is, for example, a crystal oscillator or a crystal oscillator.

The crystal element is composed of, for example, a crystal piece having a substantially rectangular shape in a plan view and a metal pattern provided on the crystal piece. The metal pattern consists of a pair of excitation electrodes and a pair of connection wirings. A pair of excitation electrode portions are provided on both main surfaces of the crystal piece.

Since such a crystal element is formed in a state where a plurality of crystal pieces are connected to a crystal wafer, it is connected to one short side of the individualized crystal pieces, specifically, the crystal wafer. When the side surface including the side is viewed in a plan view, one recess is formed which is connected to the upper surface of the crystal piece and the lower surface of the crystal piece.

The recess formed only by this one is connected to the entire surface of one short side of the upper surface of the crystal piece and one of the lower surfaces of the crystal piece, for example, in a plan view of the side surface including one short side of the crystal piece. It has a so-called T-shaped side shape connected to the central portion of the short side of the above (see, for example, Patent Document 1).

Further, as another example of the concave portion formed by only one, the side surface including one short side of the crystal piece is flattened and has a shape passing through the center of one short side of the crystal piece (for example,. See Patent Document 2).

Japanese Patent No. 5251082 Japanese Patent No. 4830069

In the conventional crystal element, only one recess is formed, so when an alternating voltage is applied to the metal pattern, the bending vibration, which is a secondary vibration other than the thickness sliding vibration, which is the main vibration, is the short side of the crystal piece. When the vibration occurs in a direction parallel to the above, the thickness slip vibration, which is the main vibration, and the bending vibration, which is the secondary vibration, are combined, and the equivalent series resistance value may increase. In particular, when the crystal element is miniaturized, for example, when the long side of the crystal piece is 920 μm or less, the order of bending vibration, which is a secondary vibration, becomes low, so that it is applied to the thickness sliding vibration, which is the main vibration. There was a risk that the effect would be large, the equivalent series resistance value would be large, and the electrical characteristics would deteriorate.

An object of the present invention is to provide a quartz element capable of improving electrical characteristics while reducing an increase in the equivalent series resistance value even when the quartz element is miniaturized.

The crystal element in the present invention is a crystal piece having a substantially rectangular shape in a plan view, and a connection wiring provided on the crystal piece and extending from the excitation electrode portion and the excitation electrode portion toward the outer edge of the crystal piece. A crystal element composed of a metal pattern consisting of parts, and a plurality of recesses are formed on the side surface including one short side of the crystal piece in a plan view of the side surface including one short side of the crystal piece. It is characterized by being done.

The quartz element according to the present invention is a connection between a quartz piece having a substantially rectangular shape when viewed from the surface, and a connection provided on the quartz piece and extending from the excitation electrode portion and the excitation electrode portion toward the outer edge of the quartz piece. A crystal element composed of a metal pattern consisting of a wiring portion and a side surface including one short side of a crystal piece in a plan view, and a plurality of recesses are formed on the side surface including one short side of the crystal piece. It is formed. By doing so, it is possible to suppress secondary bending vibrations that occur in the short side direction of the crystal piece, reduce the increase in the equivalent series resistance value, and improve the electrical characteristics. Become.

It is a perspective view of the crystal device which concerns on this embodiment. It is sectional drawing in the AA cross section of FIG. It is a partially enlarged view of the part B of FIG. It is sectional drawing in the BB cross section of FIG. It is a perspective view of the crystal element which concerns on this embodiment. (A) is a plan view of the upper surface of the crystal element according to the present embodiment in a plan view, and (b) is a plan view of the lower surface of the crystal element according to the present embodiment as a plan view from the upper surface side. FIG. 5 is a plan view of a side surface including one short side of the crystal element according to the present embodiment.

1 to 4 are views on a crystal device according to the present embodiment. FIG. 1 is a perspective view of the crystal device according to the present embodiment, and FIGS. 2 and 4 are cross-sectional views of the crystal device according to the present embodiment. Further, FIG. 3 is a partially enlarged view of a portion C in FIG. 5 to 7 are views on a quartz element according to the present embodiment. FIG. 5 is a perspective view of the crystal element according to the present embodiment, and FIG. 6 is a plan view of the crystal element according to the present embodiment. Further, FIG. 7 is a plan view of a side surface including one short side of the crystal element according to the present embodiment.

(Outline configuration of crystal device)
A crystal device is, for example, an electronic component having a substantially rectangular parallelepiped shape as a whole. The crystal device has, for example, a long side or a short side having a length of 0.6 mm to 2.0 mm and a vertical thickness of 0.2 mm to 1.5 mm.

The crystal device includes, for example, a base 110 having a recess, a crystal element 120 housed in the recess, a lid 130 for closing the recess, and a conductive adhesive for adhesively mounting the crystal element 120 on the substrate 110. It is composed of 140 and.

The recess of the substrate 110 is sealed by a lid 130, and the inside thereof is, for example, evacuated or filled with a suitable gas (for example, nitrogen).

The substrate 110 includes, for example, a substrate portion 110a that is the main body of the substrate 110, a frame portion 110b provided along the edge of the upper surface of the substrate portion 110a, and a mounting pad 111 for mounting the crystal element 120. It is composed of an external terminal 112 for mounting a crystal device on a circuit board or the like (not shown). The substrate 110 is provided with a frame-shaped frame portion 110b along the edge of the upper surface of the substrate portion 110a, and a recess is formed.

The substrate portion 110a and the frame portion 110b are made of an insulating material such as a ceramic material. The mounting pad 111 and the external terminal 112 are formed of, for example, a conductive layer made of metal or the like, and are electrically connected to each other by a conductor (not shown) arranged in the substrate portion 110a. The lid 130 is made of metal, for example, and is joined to the base 110, specifically, the upper surface of the frame portion 110b by seam welding or the like.

The crystal element 120 is composed of a crystal piece 121 and a metal pattern 122. The metal pattern 122 includes, for example, a pair of excitation electrode portions 123 for applying a voltage to the crystal piece 121, and a pair of connection wiring portions 124 for mounting the crystal element 120 on the mounting pad 111.

The crystal piece 121 is a so-called AT-cut crystal piece. That is, in the crystal, the Cartesian coordinate system XYZ consisting of the X axis (electric axis), the Y axis (mechanical axis), and the Z axis (optical axis) is 30 ° or more and 50 ° or less (for example, 35 ° 15') around the X axis. ) When the orthogonal coordinate system XY'Z'is defined by rotating it, it has a plate shape cut out parallel to the XZ' plane.

The metal pattern 122 is made of a conductive material made of metal or the like. The pair of excitation electrode portions 123 are provided, for example, at the central portions of both main surfaces of the crystal piece 121. The pair of connection wiring portions 124 includes a connection portion 124a and a wiring portion 124b. For example, two connecting portions 124a are provided side by side along the edge of one short side of the crystal piece 121. The wiring portion 124b extends from the excitation electrode portion 123 to the connection portion 124a so as to be parallel to the long side of the crystal piece 121, for example.

The crystal element 120 is housed in a recess of the substrate 110 with the main surface of the crystal piece 121 facing the upper surface of the substrate portion 110a of the substrate 110. The connection wiring portion 124 is adhered to the mounting pad 111 provided on the substrate portion 110a of the substrate 110 by the conductive adhesive 140. As a result, a part of the metal pattern 122 of the crystal element 120 is electrically connected to the mounting pad 111 provided on the substrate portion 110a of the substrate 110, and by extension, the conductor arranged in the substrate portion 110a of the substrate 110. It is electrically connected to the external terminal 112 provided on the substrate 110 by (not shown).

In the crystal device configured in this manner, for example, the lower surface of the substrate 110 (of the substrate portion 110a) is opposed to the mounting surface of the circuit board (not shown), and the external terminal 112 is soldered to the mounting pad of the circuit board (). It is mounted on a circuit board by being joined to (not shown). An oscillation circuit is configured on the circuit board, for example. The oscillation circuit applies an alternating voltage to the excitation electrode portion 123 via the external terminal 112, the conductor (not shown) arranged in the substrate portion 110a, the mounting pad 111, the conductive adhesive 140, and the connection wiring portion 124. To generate an oscillation signal. At this time, the oscillation circuit utilizes, for example, the fundamental wave vibration of the thickness slip vibration of the crystal piece 121.

(Shape of crystal element)
FIG. 5 is a perspective view of the crystal element according to the present embodiment. FIG. 6A is a plan view of the upper surface of the crystal element according to the present embodiment, and FIG. 6B is a plan view of the lower surface of the crystal element according to the present embodiment viewed from the upper surface side. Further, FIG. 7 is a plan view of a side surface including one short side of the crystal element according to the present embodiment as a plan view.

In the present embodiment, when the crystal element 120 is mounted on the substrate 110, the surface that is substantially parallel to the upper surface of the substrate portion 110a of the substrate 110 is the main surface, and the crystal element 120 goes toward the substrate portion 110a of the substrate 110. The direction from the substrate portion 110a of the substrate 110 toward the crystal element 120 will be described as a downward direction, and an upward direction will be described.

The surface of the crystal element 120 facing the substrate portion 110a of the substrate 110 is the lower surface of the crystal element 120, the surface of the crystal element 120 facing the lower surface of the crystal element 120 is the upper surface of the crystal element 120, and the lower surface of the crystal element 120 and the lower surface of the crystal element 120. The upper surface of the crystal element 120 is the main surface of the crystal element 120. Similarly, the surface of the crystal piece 121 facing the substrate portion 110a is the lower surface of the crystal piece 121, the surface of the crystal piece 121 facing the lower surface of the crystal piece 121 is the upper surface of the crystal piece 121, and the lower surface of the crystal piece 121 and the lower surface of the crystal piece 121. The upper surface of the crystal piece 121 is the main surface of the crystal piece 121. In the present embodiment, the upper surface of the crystal element 120 and the upper surface of the crystal piece 121 are used in the same meaning, and similarly, the lower surface of the crystal element 120 and the lower surface of the crystal piece 121 are used in the same meaning. There is.

The crystal element 120 is composed of a crystal piece 121 and a metal pattern 122.

The crystal piece 121 is, for example, a so-called AT cut plate. That is, as shown in FIG. 6, in the crystal, the orthogonal coordinate system XYZ including the X-axis (electric axis), the Y-axis (mechanical axis), and the Z-axis (optical axis) is 30 ° or more and 50 ° around the X-axis. When the orthogonal coordinate system XY'Z'is defined by rotating the following (as an example, 35 ° 15'), the crystal piece 121 has a plate shape cut out parallel to the XZ'plane.

When the outer shape of the crystal piece 121 is formed by etching, a relatively large error (such as a systematic error) occurs due to the anisotropy of the crystal with respect to the etching. The error may be used intentionally. In the description of the present disclosure, the existence of such an error shall be ignored. For example, in an actual crystal piece 121, the side surface may be inclined without being orthogonal to the main surface, or the side surface may not be flat and may have a shape bulging outward. Such inclination and / Alternatively, the illustration and description of the bulge will be omitted. Such errors may also be ignored when determining whether a third party product relates to the technology of the present disclosure. Of course, things like random errors can be ignored.

As shown in FIGS. 5 and 6, the shape of the crystal piece 121 in a plan view is rectangular. The rectangle is, for example, a rectangle (in the present disclosure, a square is included. In the case of a square, a predetermined side of the square is the long side of the one, and the other side is connected to the predetermined side of the square. Is one of the short sides. The same applies to the excitation electrode portion 123), and has a pair of long sides and a short side connecting both ends of the pair of long sides. In the present disclosure, the rectangle or the rectangle includes a shape in which the corners are chamfered (the same applies to the excitation electrode portion 123). In the AT plate cut plate, the main surface is a surface substantially parallel to the XZ'plane, the long side is a side substantially parallel to the X axis, and the short side is a side substantially parallel to the Z'axis.

The thickness of the crystal piece 121 is set based on the desired natural frequency for the thickness slip vibration. For example, when the fundamental wave vibration is used and the natural frequency is F (MHz), the basic formula for obtaining the thickness t (μm) of the crystal piece 121 corresponding to the natural frequency F is t = 1670 / F. is there. Actually, the thickness of the crystal piece 121 is a value finely adjusted from the value of the basic formula in consideration of the weight of the excitation electrode portion 123 and the like.

Various dimensions of the crystal piece 121 may be appropriately set based on simulation calculations, experiments, and the like from various viewpoints such as reduction of the equivalent series resistance value. For example, the length of the long side is 550 μm to 1.1 mm or less, the length of the short side is 350 μm to 750 μm or less (however, it is shorter than the length of the long side), and the thickness is 20 μm to 70 μm or less. ..

The metal pattern 122 provided on the crystal piece 121 is for applying an alternating voltage from the outside of the crystal element 120. The metal pattern 122 may be a single layer, or a plurality of metal layers may be laminated. Although not particularly shown, the metal pattern 122 includes, for example, a first metal layer and a second metal layer laminated on the first metal layer. As the first metal layer, a metal having good adhesion to quartz is used, and for example, any one of nickel, chromium, nichrome or titanium is used. By using a metal having good adhesion to quartz for the first metal layer, a metal having difficulty in adhesion to quartz can be used for the second metal layer. The second metal layer has a low electrical resistivity among metal materials and has a low electrical resistivity.
A stable material is used, for example, any one of gold, an alloy containing gold as a main component, silver, and an alloy containing silver as a main component is used. By using a material having a low electrical resistivity, the resistivity of the metal pattern 122 itself can be reduced.
As a result, it is possible to reduce the increase in the equivalent series resistance value of the crystal element 120. Further, by using a stable metal material, it is possible to reduce the change in the weight of the metal pattern 122 due to the reaction with the surrounding air in which the crystal element 120 exists and the change in the frequency of the crystal element 120.

The metal pattern 122 is composed of an excitation electrode portion 123 and a connection wiring portion 124. The connection wiring unit 124 is composed of a connection unit 124a and a wiring unit 124b.

The excitation electrode unit 123 is for applying an alternating voltage to the crystal piece 121. The excitation electrode portions 123 are paired and are provided so as to face each other at the central portions of both main surfaces of the crystal piece 121. The excitation electrode portion 123 has a substantially rectangular shape in a plan view, and the center of the excitation electrode portion 123 (specifically, the intersection of the diagonal lines of the excitation electrode portion 123) is the center of the crystal piece 121 (specifically, the intersection of the diagonal lines). , The intersection of the diagonal lines of the crystal piece 121), it is located on the other short side side of the crystal piece 121. Here, one short side of the crystal piece 121 is the short side of the crystal piece 121 in which the connection portions 124a of the connection wiring portion 124 are provided side by side, and the other short side of the crystal piece 121 is
This is the short side of the crystal piece 121 to which the connecting portion 124a is not provided. By doing so, the distance from one short side of the crystal piece 121 to the center of the excitation electrode portion 123 is made longer than the distance from one short side of the crystal piece 121 to the center of the crystal piece 121. be able to. As a result, when the connection portion 124a of the connection wiring portion 124 is electrically bonded with the conductive adhesive 140, the vibration of the portion sandwiched between the excitation electrode portions 123 is hindered by the conductive adhesive 140. It is possible to reduce it, and it is possible to reduce the increase in the equivalent series resistance value of the crystal device.

The connection wiring unit 124 is composed of a connection unit 124a and a wiring unit 124b, and is for applying an alternating voltage to the excitation electrode unit 123 from the outside of the crystal element 120.

When the crystal element 120 is used as a crystal device, the connection portion 124a is for mounting on the substrate 110, and is electrically operated by the mounting pad 111 provided on the upper surface of the substrate portion 110a of the substrate 110 and the conductive adhesive 140. Is glued. The connecting portions 124a are paired and are provided at positions facing the mounting pads 111 of the substrate portion 110a, and are provided side by side along the edge of one short side of the crystal piece 121.

The wiring portion 124b is for electrically connecting the connection portion 124a and the excitation electrode portion 123, and one end thereof is connected to the connection portion 124a and the other end is connected to the excitation electrode portion 123. From another point of view, it can be said that the wiring portion 124b extends from the excitation electrode portion 123 to the connection portion 124a along the long side of the crystal piece 121.

(Detailed explanation of crystal element)
As shown in FIGS. 5 to 7, such a crystal element 120 has a plurality of recesses 125 when a side surface including one short side is viewed in a plan view. The recess 125 includes a first recess 125a, a second recess 125b, a third recess 125c, a fourth recess 125d, and a fifth recess 125e. At this time, the respective recesses 125 (specifically, the first recess 125a, the second recess 125b, the third recess 125c, the fourth recess 125d, and the fifth recess 125e) are in an independent state and are connected to each other. It is in a state where it has not been done.

The first recess 125a is one end side of one short side of the crystal piece 121 when a side surface including one short side of the crystal piece 121 is viewed in a plan view, and is formed so as to be continuous with the upper surface of the crystal piece 121. There is. Further, a metal pattern 122 (a part of the connection portion wiring portion 124) is provided on the surface facing the first recess 125a (the bottom surface of the first recess 125a).

The second recess 125b is one end side of one short side of the crystal piece 121 when a side surface including one short side of the crystal piece 121 is viewed in a plan view, and is formed so as to be continuous with the lower surface of the crystal piece 121. There is. Further, a metal pattern 122 (a part of the connection wiring portion 124) is provided on the surface facing the second recess 125b (the bottom surface of the second recess 125b). Further, when the crystal element 120 is used as a crystal device, the conductive adhesive 140 is filled in the second recess 125b.

The third recess 125c is formed so as to be the other end side of one short side of the crystal piece 121 and to be continuous with the upper surface of the crystal piece 121 when the side surface including one short side of the crystal piece 121 is viewed in a plan view. ing. Further, a metal pattern 122 (a part of the connection wiring portion 124) is provided on the surface facing the third recess 125c (the bottom surface of the third recess 125c).

The fourth recess 125d is formed so as to be the other end side of one short side of the crystal piece 121 and to be continuous with the lower surface of the crystal piece 121 when the side surface including one short side of the crystal piece 121 is viewed in a plan view. ing. Further, a metal pattern 122 (a part of the connection wiring portion 124) is provided on the surface facing the fourth recess 125d (the bottom surface of the fourth recess 125d). When the crystal element 120 is used as a crystal device, the fourth recess 125d is filled with a conductive adhesive 140.

The fifth recess 125e is formed on the upper surface of the crystal piece 121 and the lower surface of the crystal piece 121 while including the midpoint of one short side of the crystal piece 121 when the side surface including one short side of the crystal piece 121 is viewed in a plan view. It is formed so as to be continuous. On the bottom surface of the fifth recess 125e, there is a portion where a part of the metal pattern 122 is not provided. As shown in FIGS. 5 and 7, a part of the metal pattern 122 is provided on the bottom surface of the recess of the fifth recess 125e, which passes through the midpoint of one short side of the crystal piece 121. The other portion is provided with a part of the metal pattern 122 so as to connect from the upper surface of the crystal piece 121 to the lower surface of the crystal piece 121.

Here, the bottom surface of the first recess 125a, the bottom surface of the second recess 125b, the bottom surface of the third recess 125c, and the bottom surface of the fourth recess 125d are recesses parallel to the side surface including one short side of the crystal piece 121. The surface is 125.

In a crystal element, when an alternating voltage is applied to a metal pattern 122, the portion sandwiched between the excitation electrode portions 123 vibrates with the thickness slip vibration as the main vibration, and at the same time, the bending vibration is generated as a secondary vibration. Occurs. In the present embodiment, such a configuration makes it possible to reduce the influence of the secondary bending vibration on the thickness sliding vibration which is the main vibration. As a result, it is possible to reduce the increase in the equivalent series resistance value of the crystal element 120 and improve the electrical characteristics.

As described above, the crystal element 120 according to the present embodiment is provided on the crystal piece 121 having a substantially rectangular shape in a plan view and the crystal piece 121, and the excitation electrode portion 123 and the excitation electrode portion 123 to the crystal piece 121. A crystal element 120 composed of a metal pattern 122 composed of a connecting wiring portion 124 extending toward the outer edge of the crystal piece 121, and a side surface including one short side of the crystal piece 121 is viewed in a plan view. A plurality of recesses 125 are formed on the side surface including one short side of the crystal piece 121.

The secondary bending vibration generated when an alternating voltage is applied to the metal pattern 122 is in a state of vibrating so that the entire crystal piece 121 is bent in a direction parallel to the long side and the short side of the crystal piece 121. There is. In this way, by forming a plurality of recesses 125 on the side surface including one short side of the crystal piece 121, the vibration state such as the frequency of bending vibration can be changed more greatly than when the recesses are not formed. Is possible. Therefore, it is possible to suppress the amount of coupling between the thickness slip vibration, which is the main vibration, and the bending vibration, which is the secondary vibration, as compared with the case where the recess 125 is not formed.
As a result, it is possible to improve the electrical characteristics while reducing the increase in the equivalent series resistance value between the thickness slip vibration, which is the main vibration, and the bending vibration, which is the secondary vibration.

In particular, when the length of the long side of the crystal piece 121 is 920 μm or less, the order of bending vibration, which is a secondary vibration, becomes low, so that it tends to be easily combined with the thickness slip vibration, which is the main vibration. There is. Therefore, by forming a plurality of recesses 125 on the side surface including one short side of the crystal piece 121 in this way, the influence of the bending vibration, which is a secondary vibration, on the thickness sliding vibration, which is the main vibration, is reduced. It becomes possible to make it. As a result, it is possible to reduce the increase in the equivalent series resistance value of the crystal element 120 and improve the electrical characteristics.

Further, such a crystal element 120 is one end side of one short side of the side crystal piece 121 including one short side of the crystal piece 121, and is formed so as to be continuous with the upper surface of the crystal piece 121. The first recess 125a and the second recess 125b which is one end side of one short side of the crystal piece 121 on the side surface including one short side of the crystal piece 121 and is formed so as to be continuous with the lower surface of the crystal piece 121. , The third recess 125c, which is the other end side of one short side of the side crystal piece 121 including one short side of the crystal piece 121 and is formed so as to be continuous with the upper surface of the crystal piece 121, and the crystal piece. The other end of one short side of the side crystal piece 121 including one short side of 121.
The crystal piece 121 includes a fourth recess 125d formed so as to be continuous with the lower surface of the crystal piece 121, and a midpoint of one short side of the side crystal piece 121 including one short side of the crystal piece 121. A fifth recess 125e formed so as to be continuous with the upper surface and the lower surface of the crystal piece 121, and a recess 125 are formed from the fifth recess 125e.

With such a configuration, when the side surface including one short side of the crystal piece 121 is viewed in a plan view, the number of continuous portions can be reduced as compared with the case where the recess 125 is not formed. .. Therefore, when an alternating voltage is applied to the metal pattern 122, bending vibration, which is a secondary vibration generated in a direction parallel to the short side of the crystal piece 121, can be further suppressed. Therefore, with such a configuration, it is possible to reduce the increase in the equivalent series resistance value and improve the electrical characteristics.

In such a crystal element 120, the excitation electrode portion 123 of the metal pattern 122 is provided near the center of the crystal piece 121 in a plan view of the crystal element 120, and a part of the connection wiring portion 124 of the metal pattern 122 ( Specifically, the connecting portion 124a) is provided along the edge of one short side of the crystal piece 121.

As described above, a part of the connection wiring portion 124, specifically, the connection portion 124a is provided at a position facing the mounting pad 111 of the substrate 110 when the crystal element 120 is used as a crystal device, and is a conductive adhesive. At 140, it is electrically connected and adhered to the mounting pad 111. From another viewpoint, it can be said that a part of the connection wiring portion 124, specifically, a portion where the connection portion 124a is provided is fixed by the conductive adhesive 140. Therefore, a part of the connection wiring portion 124, specifically, the connection portion 124a is provided on one short side side of the crystal piece 121 in which the recess 125 is formed.
Both ends of the side surface including one short side of the crystal piece 121 in which the recess 125 is formed can be fixed. Therefore, as compared with the case where the connecting portion 124a is provided on the other short side side of the crystal piece 121 in which the recess 125 is not formed, it is possible to suppress the occurrence of bending vibration which is a secondary vibration. .. As a result, it is possible to reduce the influence of the bending vibration, which is a secondary vibration, on the thickness slip vibration, which is the main vibration, and it is possible to improve the electrical characteristics.

Further, in such a crystal element 120, the side surface including one short side of the crystal piece 121 is viewed in a plan view, and the metal pattern 122 has a bottom surface of the first recess 125a, a bottom surface of the second recess 125b, and a third recess 125c. It is provided on the bottom surface of the above and the bottom surface of the fourth recess 125d.

By doing so, a part of the metal pattern 122 provided on the bottom surface of each recess 125 acts as a weight, and secondary vibration generated when an alternating voltage is applied to the metal pattern 122. It is possible to suppress the occurrence of bending vibration. As a result, it is possible to reduce the amount of bending vibration, which is a secondary vibration, combined with the thickness slip vibration, which is the main vibration, reduce the increase in the equivalent series resistance value, and improve the electrical characteristics. Can be done.

Further, the crystal device according to the present embodiment includes a crystal element 120, a substrate 110 having a substrate portion 110a provided with a mounting pad 111 at a position facing a part of the connection wiring portion 124, and a connection wiring portion 124. It is provided with a conductive adhesive 140 provided between a part of the above and the mounting pad 111, and a lid 130 for joining the base 110.

As described above, such a crystal device uses a crystal element 120 capable of reducing an increase in the equivalent series resistance value and improving electrical characteristics. Therefore, the equivalent series resistance also exists in the crystal device. It is possible to reduce the increase in the value and improve the electrical characteristics.

Further, the crystal device according to the present embodiment has a crystal element 120 having a recess 125 formed of a first recess 125a, a second recess 125b, a third recess 125c, a fourth recess 125d and a fifth recess 125e. Is used. By using such a crystal element 120, it is possible to reduce distortion that occurs in a direction parallel to the short side of the crystal piece 121 when a force is applied to both ends of the crystal piece. That is, in the crystal device according to the present embodiment, by using such a crystal element 120, it is parallel to the short side of the crystal piece 121 caused by the contraction stress generated when the conductive adhesive 140 contracts. Distortion caused by orientation,
It can be reduced as compared with the case where a crystal element in which the recess 125 is not formed is used. As a result, it is possible to reduce the increase in the equivalent series resistance value due to the distortion of the crystal element 120 and improve the electrical characteristics.

Further, in the crystal device according to the present embodiment, the fifth recess 125e is formed so as to pass through the center of one short side of the crystal piece 121 and to be connected to the upper surface of the crystal piece 121 and the lower surface of the crystal piece 121. Even if the crushed conductive adhesive 140 spreads when the conductive adhesive 140 applied on the mounting pad 111 is placed so as to be sandwiched between the mounting pad 111 and the connecting portion 124a, two It is possible to reduce the contact of the conductive adhesive 140 applied to the locations. Therefore, it is possible to reduce the fact that the conductive adhesive 140 applied to the two places comes into contact with each other to cause an electrical short circuit and the crystal element 120 does not vibrate.

Further, in the crystal device according to the present embodiment, the conductive adhesive 140 that electrically adheres the mounting pad 111 and the connection wiring portion 124 is filled in the second recess 125b and the fourth recess 125d. ..

By doing so, the adhesive area between the conductive adhesive 140 and the crystal piece 121 can be expanded as compared with the case where the recess 125 is not formed in the crystal piece 121, and the adhesive force can be enhanced. .. Therefore, when the crystal device is dropped, it is possible to reduce the possibility that the crystal element 120 is separated from the mounting pad 111 of the substrate 110 and cannot be used as the crystal device.

The present invention is not limited to the above embodiments, and may be implemented in various embodiments.

The device having a crystal element is not limited to the crystal unit. For example, an oscillator having an integrated circuit element (IC) that generates an oscillation signal by applying a voltage to the crystal element in addition to the crystal element may be used. Further, for example, the crystal device may have an electronic element such as a thermistor in addition to the crystal element. Further, for example, the crystal device may be equipped with a constant temperature bath. In the crystal device, the structure of the substrate on which the crystal element is mounted may be appropriately configured. For example, the substrate may have an H-shaped cross section having recesses on the upper surface and the lower surface.

Quartz pieces are not limited to flat plates and mesas.

110 ... Base 110a ... Board part 110b ... Frame part 111 ... Mounting pad 112 ... External terminal 120 ... Crystal element 121 ... Crystal piece 122 ... Metal pattern 123 ...・ Excitation electrode part 124 ・ ・ ・ Connection wiring part 124a ・ ・ ・ Connection part 124b ・ ・ ・ Wiring part 125 ・ ・ ・ Recess 125a ・ ・ ・ First recess 125b ・ ・ ・ Second recess 125c ・ ・ ・ Third recess 125d・ ・ ・ Fourth recess 125e ・ ・ ・ Fifth recess 130 ・ ・ ・ Lid body 140 ・ ・ ・ Conductive adhesive

Claims (6)

A crystal piece that has a substantially rectangular shape when viewed in a plan view,
A metal pattern provided on the crystal piece and composed of an excitation electrode portion and a connection wiring portion extending from the excitation electrode portion toward the outer edge of the crystal piece.
It is a crystal element composed of
The side surface including one short side of the crystal piece is viewed in a plan view.
A plurality of recesses are formed on the side surface including one short side of the crystal piece so as to be continuous with either the upper surface in which the connection portion of at least the connection wiring portion of the crystal piece is formed or the lower surface in which the connection portion is formed. A quartz element characterized by being formed. A crystal piece that has a substantially rectangular shape when viewed in a plan view,
A metal pattern provided on the crystal piece and composed of an excitation electrode portion and a connection wiring portion extending from the excitation electrode portion toward the outer edge of the crystal piece.
Consists of
The side surface including one short side of the crystal piece is viewed in a plan view.
A crystal element in which a plurality of recesses are formed on a side surface including one short side of the crystal piece .
A first recess on the side surface including one short side of the crystal piece, which is one end side of one short side of the crystal piece and is formed so as to be continuous with the upper surface of the crystal piece.
A second recess on the side surface including one short side of the crystal piece, which is one end side of one short side of the crystal piece and is formed so as to be continuous with the lower surface of the crystal piece.
A third recess on the side surface including one short side of the crystal piece, which is the other end side of one short side of the crystal piece and is formed so as to be continuous with the upper surface of the crystal piece.
A fourth recess on the side surface including one short side of the crystal piece, which is the other end side of one short side of the crystal piece and is formed so as to be continuous with the lower surface of the crystal piece.
A fifth recess formed so as to be continuous with the upper surface of the crystal piece and the lower surface of the crystal piece while including the midpoint of one short side of the crystal piece on the side surface including one short side of the crystal piece. ,
A crystal element characterized in that the recess is formed from the above. The crystal element according to claim 2.
Looking at the crystal element in a plane,
The excitation electrode portion of the metal pattern is provided near the center of the crystal piece.
A crystal element characterized in that a part of the connection wiring portion of the metal pattern is provided along an edge portion of one short side of the crystal piece. The crystal element according to claim 3.
The side surface including one short side of the crystal piece is viewed in a plan view.
A crystal element characterized in that the metal pattern is provided on the bottom surfaces of the first recess, the second recess, the third recess, and the fourth recess. The crystal element according to claim 1 to 4,
A substrate having a substrate portion in which a mounting pad is provided at a position facing a part of the connection wiring portion, and a substrate.
A conductive adhesive provided between a part of the connection wiring portion and the mounting pad,
With the lid bonded to the substrate,
A crystal device characterized by being equipped with. The crystal element according to claim 2 to 4,
A substrate having a substrate portion in which a mounting pad is provided at a position facing a part of the connection wiring portion, and a substrate.
A conductive adhesive provided between a part of the connection wiring portion and the mounting pad,
With the lid bonded to the substrate,
Is a crystal device equipped with
A crystal device characterized in that the conductive adhesive is filled in the second recess and the fourth recess.

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