JP6787801B2 - Crystal elements and crystal devices - Google Patents

Description

The present invention relates to a crystal element and a crystal device having the crystal element. The crystal device is, for example, a crystal oscillator or a crystal oscillator.

The crystal element is composed of, for example, a crystal piece having a substantially rectangular shape in a plan view and a metal pattern provided on the crystal piece. The metal pattern consists of a pair of excitation electrodes and a pair of connection wirings. A pair of excitation electrode portions are provided on both main surfaces of the crystal piece.

Since such a crystal element is formed in a state where a plurality of crystal pieces are connected to a crystal wafer, it is connected to one short side of the individualized crystal pieces, specifically, the crystal wafer. When the side surface including the side is viewed in a plan view, one recess is formed which is connected to the upper surface of the crystal piece and the lower surface of the crystal piece.

The recess formed only by this one is connected to the entire surface of one short side of the upper surface of the crystal piece and one of the lower surfaces of the crystal piece, for example, in a plan view of the side surface including one short side of the crystal piece. It has a so-called T-shaped side shape connected to the central portion of the short side of the above (see, for example, Patent Document 1).

Further, as another example of the concave portion formed by only one, the side surface including one short side of the crystal piece is flattened and has a shape passing through the center of one short side of the crystal piece (for example,. See Patent Document 2).

Japanese Patent No. 5251082 Japanese Patent No. 4830069

In the conventional crystal element, only one recess is formed, so when an alternating voltage is applied to the metal pattern, the bending vibration, which is a secondary vibration other than the thickness sliding vibration, which is the main vibration, is the short side of the crystal piece. When the vibration occurs in a direction parallel to the above, the thickness slip vibration, which is the main vibration, and the bending vibration, which is the secondary vibration, are combined, and the equivalent series resistance value may increase. In particular, when the crystal element is miniaturized, for example, when the long side of the crystal piece is 920 μm or less, the order of bending vibration, which is a secondary vibration, becomes low, so that it is applied to the thickness sliding vibration, which is the main vibration. There was a risk that the effect would be large, the equivalent series resistance value would be large, and the electrical characteristics would deteriorate.

An object of the present invention is to provide a quartz element capable of improving electrical characteristics while reducing an increase in the equivalent series resistance value even when the quartz element is miniaturized.

The crystal element in the present invention is a crystal piece having a substantially rectangular shape in a plan view, and a connection wiring provided on the crystal piece and extending from the excitation electrode portion and the excitation electrode portion toward the outer edge of the crystal piece. It is a crystal element composed of a metal pattern consisting of parts, and three recesses are formed on the side surface including one short side of the crystal piece in a plan view of the side surface including one short side of the crystal piece. It is characterized by being done.

In the crystal element according to the present invention, the crystal element is provided on a crystal piece having a substantially rectangular shape in a plan view and the crystal piece, and extends from the excitation electrode portion and the excitation electrode portion toward the outer edge of the crystal piece. It is a crystal element composed of a metal pattern composed of connecting wiring portions, and a side surface including one short side of the crystal piece is viewed in a plan view, and the side surface including one short side of the crystal piece is formed. Three recesses are formed. By doing so, it is possible to suppress secondary bending vibrations that occur in the short side direction of the crystal piece, reduce the increase in the equivalent series resistance value, and improve the electrical characteristics. Become.

It is a perspective view of the crystal device which concerns on this embodiment. It is sectional drawing in the AA cross section of FIG. It is a partially enlarged view of part C of FIG. It is sectional drawing in the BB cross section of FIG. It is a perspective view of the crystal element which concerns on this embodiment. (A) is a plan view of the upper surface of the crystal element according to the present embodiment, and (b) is a plan view of the lower surface of the crystal element according to the present embodiment viewed from the upper surface side. It is a top view when the side surface including one short side of the crystal element which concerns on this embodiment is viewed in a plan view.

1 to 4 are views on a crystal device according to the present embodiment. FIG. 1 is a perspective view of the crystal device according to the present embodiment, and FIGS. 2 and 4 are cross-sectional views of the crystal device according to the present embodiment. Further, FIG. 3 is a partially enlarged view of a portion C in FIG. 5 to 7 are views on a quartz element according to the present embodiment. FIG. 5 is a perspective view of the crystal element according to the present embodiment, and FIG. 6 is a plan view of the upper surface and the lower surface of the crystal element. Further, FIG. 7 is a plan view of a side surface including one short side of the crystal element according to the present embodiment.

(Outline configuration of crystal device)
A crystal device is, for example, an electronic component having a substantially rectangular parallelepiped shape as a whole. The crystal device has, for example, a long side or a short side having a length of 0.6 mm to 2.0 mm and a vertical thickness of 0.2 mm to 1.5 mm.

The crystal device includes, for example, a substrate 110 in which a recess is formed, a crystal element 120 housed in the recess, a lid 130 that closes the recess, and a conductive adhesive for adhesively mounting the crystal element 120 on the substrate 110. It is composed of 140 and.

The recess of the substrate 110 is sealed by the lid 130, and the inside thereof is evacuated or filled with a suitable gas (for example, nitrogen).

The substrate 110 includes, for example, a substrate portion 110a that is the main body of the substrate 110, a frame portion 110b provided along the edge of the upper surface of the substrate portion 110a, and a mounting pad 111 for mounting the crystal element 120. It is composed of an external terminal 112 for mounting a crystal device on a circuit board or the like (not shown). The substrate 110 is provided with a frame-shaped frame portion 110b along the edge of the upper surface of the substrate portion 110a, and a recess is formed.

The substrate portion 110a and the frame portion 110b are made of an insulating material such as a ceramic material. The mounting pad 111 and the external terminal 112 are formed of, for example, a conductive layer made of metal or the like, and are electrically connected to each other by a conductor (not shown) arranged in the substrate portion 110a. The lid 130 is made of metal, for example, and is joined to the base 110, specifically, the upper surface of the frame portion 110b by seam welding or the like.

The crystal element 120 is composed of a crystal piece 121 and a metal pattern 122. The metal pattern 122 includes, for example, a pair of excitation electrode portions 123 for applying a voltage to the crystal piece 121, and a pair of connection wiring portions 124 for mounting the crystal element 120 on the mounting pad 111.

The crystal piece 121 is a so-called AT-cut crystal piece. That is, in the crystal, the Cartesian coordinate system XYZ consisting of the X-axis (electrical axis), the Y-axis (mechanical axis), and the Z-axis (optical axis) is 30 ° or more and 50 ° or less (for example, 35 ° 15) around the X-axis. ′) When the orthogonal coordinate system XY ′ Z ′ is defined by rotating it, it has a plate shape parallel to the XZ ′ plane.

The metal pattern 122 uses a conductive material made of metal, and is composed of an excitation electrode portion 123 and a connection wiring portion 124. The excitation electrode portion 123 is provided, for example, in the central portion of the crystal piece 121. The pair of connection wiring portions 124 extend from the excitation electrode portion 123 to the end portion of the crystal piece 121, and are composed of the connection portion 124a and the wiring portion 124b. For example, two connecting portions 124a are provided side by side along the edge of one short side of the crystal piece 121. The wiring portion 124b extends from the excitation electrode portion 123 to the connection portion 124a so as to be parallel to the long side of the crystal piece 121, for example.

The crystal element 120 is housed in a recess of the substrate 110 with the main surface of the crystal piece 121 facing the upper surface of the substrate portion 110a of the substrate 110. The connection wiring portion 124 of the crystal element 120 is adhered to the mounting pad 111 provided on the substrate portion 110a of the substrate 110 by the conductive adhesive 140. As a result, the metal pattern 122 of the crystal element 120 is electrically connected to the mounting pad 111 of the substrate portion 110a of the substrate 110, and is provided on the substrate 110 by a conductor (not shown) arranged in the substrate portion 110a. It is electrically connected to the external terminal 112.

In the crystal device configured in this manner, for example, the lower surface of the substrate 110 (of the substrate portion 110a) is opposed to the mounting surface of the circuit board (not shown), and the external terminal 112 is soldered to the mounting pad (of the circuit board). It is mounted on a circuit board by being joined to (not shown). An oscillation circuit is configured on the circuit board, for example. The oscillation circuit applies an alternating voltage to the excitation electrode portion 123 via the external terminal 112, the conductor (not shown) arranged in the substrate portion 110a, the mounting pad 111, the conductive adhesive 140, and the connection wiring portion 124. To generate an oscillation signal. At this time, the oscillation circuit utilizes, for example, the fundamental wave vibration of the thickness slip vibration of the crystal piece 121.

(Shape of crystal element)
FIG. 5 is a perspective view of the crystal element according to the present embodiment. FIG. 6A is a plan view of the upper surface of the crystal element according to the present embodiment in a plan view, and FIG. 6B is a plan view of the lower surface of the crystal element according to the present embodiment as a plan view from the upper surface. Is. Further, FIG. 7 is a plan view of the crystal element according to the present embodiment, which is a plan view of a side surface including one short side of the crystal piece.

In the present embodiment, when the crystal element 120 is mounted on the substrate 110, the main surface is a surface substantially parallel to the upper surface of the substrate portion 110a of the substrate 110, and the direction from the crystal element 120 toward the substrate portion 110a of the substrate 110. Is described as a downward direction, and the direction from the substrate portion 110a of the substrate 110 toward the crystal element 120 is described as an upward direction.

The surface of the crystal element 120 facing the substrate portion 110a of the substrate 110 is the lower surface of the crystal element 120, and the surface of the crystal element 120 facing the lower surface of the crystal element 120 is the upper surface of the crystal element 120. Further, the upper surface of the crystal element 120 and the lower surface of the crystal element 120 are the main surfaces of the crystal element 120. Similarly, the surface of the crystal piece 121 facing the substrate portion 110a side is the lower surface of the crystal piece 121, and the surface of the crystal piece 121 facing the lower surface of the crystal piece 121 is the upper surface of the crystal piece 121. Further, the lower surface of the crystal piece 121 and the upper surface of the crystal piece 121 are the main surfaces of the crystal piece 121. In the present embodiment, the upper surface of the crystal element 120 and the upper surface of the crystal piece 121 are used in the same meaning, and similarly, the lower surface of the crystal element 120 and the lower surface of the crystal piece 121 are used in the same meaning. There is.

The crystal element 120 is composed of a crystal piece 121 and a metal pattern 122.

The crystal piece 121 is, for example, a so-called AT cut plate. That is, as shown in FIG. 6, in the crystal, the Cartesian coordinate system XYZ including the X-axis (electric axis), Y-axis (mechanical axis), and Z-axis (optical axis) is 30 ° or more and 50 ° around the X-axis. When the orthogonal coordinate system XY'Z'system is defined by rotating the following (as an example, 35 ° 15'), the crystal piece 121 has a shape parallel to the XZ'plane.

When the outer shape of the crystal piece 121 is formed by etching, a relatively large error (such as a systematic error) occurs due to the anisotropy of the crystal with respect to the etching. The error may be used intentionally. In the description of the present disclosure, the existence of such an error shall be ignored. For example, in fact, in the crystal piece 121, the side surface may be inclined without being orthogonal to the main surface, or the side surface may not be flat and may have a shape bulging outward. / Or the illustration and description of the bulge will be omitted. Such errors may also be ignored when determining whether a third party product relates to the technology of the present disclosure. Of course, things like random errors can be ignored.

As shown in FIG. 6, the shape of the crystal piece 121 in a plane is rectangular. The rectangle is, for example, a rectangle (in the present disclosure, it is assumed that a square is included. At this time, a predetermined one side corresponds to one long side, and a side connected to the predetermined one side is one short side. The same applies to the excitation electrode portion 123.) In the present disclosure, the rectangle or the rectangle includes a shape in which the corner portion is chamfered. (The same applies to the excitation electrode portion 123.) In the AT plate cut plate, the main surface is a surface substantially parallel to the XZ'plane, the long side is a side substantially parallel to the X axis, and the short side is the Z'axis. The sides are almost parallel.

The thickness of the crystal piece 121 is set based on the desired natural frequency for the thickness slip vibration. For example, when the fundamental wave vibration is used and the natural frequency is F (MHz), the basic formula for obtaining the thickness t (μm) of the crystal piece 121 corresponding to the natural frequency F is t = 1670 / F. is there. Actually, the thickness of the crystal piece 121 is a value finely adjusted from the value of the basic formula in consideration of the weight of the excitation electrode portion 123 and the like.

Various dimensions of the crystal piece 121 may be appropriately set based on simulation calculations, experiments, and the like from various viewpoints such as reduction of the equivalent series resistance value. For example, the length of the long side is 550 μm to 1.1 mm or less, the length of the short side is 350 μm to 750 μm or less (however, the length of the long side or less), and the thickness is 20 μm to 70 μm or less. ..

The metal pattern 122 provided on the crystal piece 121 is for applying an alternating voltage from the outside of the crystal element 120. The metal pattern 122 may be a single layer, or a plurality of metal layers may be laminated. Although not particularly shown, the metal pattern 122 includes, for example, a first metal layer and a second metal layer laminated on the first metal layer. As the first metal layer, a metal having good adhesion to quartz is used, and for example, any one of nickel, chromium, nichrome or titanium is used. By using a metal having good adhesion to quartz for the first metal layer, a metal having difficulty in adhesion to quartz can be used for the second metal layer. For the second metal layer, a stable material with low electrical resistivity is used among the metal materials.
For example, any one of gold, an alloy containing gold as a main component, and silver or an alloy containing silver as a main component is used. By using a material having a low electrical resistivity, the resistivity of the metal pattern 122 itself can be reduced, and as a result, it is possible to reduce the increase in the equivalent series resistance value of the crystal element 120. Further, by using a stable metal material, it is possible to reduce the change in the weight of the metal pattern 122 due to the reaction with the surrounding air in which the crystal element 120 exists and the change in the frequency of the crystal element 120.

The metal pattern 122 is composed of an excitation electrode portion 123 and a connection wiring portion 124. The connection wiring unit 124 includes a connection unit 124a and a wiring unit 124b.

The excitation electrode unit 123 is for applying an alternating voltage to the crystal piece 121. The excitation electrode portions 123 are paired and are provided so as to face each other at the central portions of both main surfaces of the crystal piece 121. The excitation electrode portion 123 has a substantially rectangular shape in a plan view, and the center of the excitation electrode portion 123 (specifically, the intersection of the diagonal lines of the excitation electrode portion 123) is the center of the crystal piece 121 (specifically). Is located on the other short side of the crystal piece 121 as compared to the intersection of the diagonal lines of the crystal piece 121). Here, one short side of the crystal piece 121 is the short side of the crystal piece 121 in which the connection portions 124a of the connection wiring portion 124 are provided side by side, and is connected to the other short side of the crystal piece 121. This is the short side of the crystal piece 121 to which the portion 124a is not provided. in this way,
By providing the center of the excitation electrode portion 123 on the other short side side of the crystal piece 121 with respect to the center of the crystal piece 121, the distance from one short side of the crystal piece 121 to the center of the excitation electrode portion 123 can be set. It can be made longer than the distance from one short side of 121 to the center of the crystal piece 121. As a result, when the connection portion 124a of the connection wiring portion 124 is bonded with the conductive adhesive 140, the vibration of the portion sandwiched between the excitation electrode portions 123 by the conductive adhesive 140 is reduced. This makes it possible to reduce the increase in the equivalent series resistance value of the crystal device.

The connection wiring unit 124 is composed of a connection unit 124a and a wiring unit 124b, and is for applying an alternating voltage to the excitation electrode unit 123 from the outside of the crystal element 120.

When the crystal element 120 is used as a crystal device, the connection portion 124a is for mounting on the substrate 110, and is electrically operated by the mounting pad 111 provided on the substrate portion 110a of the substrate 110 and the conductive adhesive 140. Be glued. The connecting portions 124a are paired and are provided at positions facing the mounting pads 111 of the substrate portion 110a, and are provided side by side along the edge of one short side of the crystal piece 121.

The wiring portion 124b is for electrically connecting the connection portion 124a and the excitation electrode portion 123, and one end thereof is connected to the excitation electrode portion 123 and the other end is connected to the connection portion 124a. Further, from another viewpoint, the wiring portion 124b extends from the excitation electrode portion 123 to the connection portion 124a. Further, the wiring portion 124b is provided so as to be parallel to the long side of the crystal piece 121, for example, when the crystal element 120 is viewed in a plan view.

(Detailed explanation of crystal element)
As shown in FIGS. 5 and 7, such a crystal element 120 has a side surface including one short side of a crystal piece 121 in which connection portions 124a are provided side by side, and has a position on the side surface thereof. Three recesses 125 are formed, including one recess 125a, a second recess 125b, and a third recess 125c.

The first recess 125a is one end side of one short side of the side crystal piece 121 including one short side of the crystal piece 121, and is formed so as to be continuous with the lower surface of the crystal piece 121. Further, a metal pattern 122 (a part of the connection wiring portion 124) is provided on the surface facing the first recess 125a (the bottom surface of the first recess 125a). Further, when the crystal element 120 is used as a crystal device, the conductive adhesive 140 is filled in the first recess 125a.

The second recess 125b is the other end side of one short side of the side crystal piece 121 including one short side of the crystal piece 121, and is formed so as to be continuous with the lower surface of the crystal piece 121. Further, a metal pattern 122 (a part of the connection wiring portion 124) is provided on the surface facing the second recess 125a (the bottom surface of the second recess 125a). Further, when the crystal element 120 is used as a crystal device, the conductive adhesive 140 is filled in the second recess 125b.

The third recess 125c is formed so as to be continuous with the upper surface of the crystal piece 121 and the lower surface of the crystal piece 121 while including the center of one short side of the side crystal piece 121 including one short side of the crystal piece 121. There is. On the bottom surface of the third recess 125c, there is a portion provided with a part of the metal pattern 122 (connection wiring portion 124) and a portion not provided with a part of the metal pattern 122 (connection wiring portion 124). As shown in FIGS. 5 and 7, a part of the metal pattern 122 is provided on the bottom surface of the third recess 125c, which passes through the midpoint of one short side of the crystal piece 121. However, a part of the metal pattern 122 is provided in the other portion so as to connect from the upper surface of the crystal piece 121 to the lower surface of the crystal piece 121.

Further, in the third recess 125c, the length of the portion connected to the upper surface of the crystal piece 121 (of the third recess 125c) is the length of the portion connected to the lower surface of the crystal piece 121 (of the third recess 125c). It is different, and the length of the portion connected to the upper surface of the crystal piece 121 is longer.

Here, the bottom surface of the first recess 125a, the bottom surface of the second recess 125b, and the bottom surface of the third recess 125c are the surfaces of the respective recesses 124 parallel to the side surface including one short side of the crystal piece 121. ..

In general, when an alternating voltage is applied to the metal pattern 122, the crystal element 120 vibrates with the thickness slip vibration as the main vibration at the portion sandwiched between the excitation electrode portions 123, and at the same time, the bending vibration as a secondary vibration. Occurs. In the present embodiment, such a configuration makes it possible to reduce the influence of the secondary bending vibration on the thickness slip vibration which is the main vibration. As a result, it is possible to reduce the increase in the equivalent series resistance value of the crystal element 120 and the crystal device, and improve the electrical characteristics.

As described above, the crystal element 120 according to the present embodiment is provided on the crystal piece 121 having a substantially rectangular shape in a plan view and the crystal piece 121, and the excitation electrode portion 123 and the excitation electrode portion 123 to the crystal piece 121. A crystal element 120 composed of a metal pattern 122 composed of a connecting wiring portion 124 extending toward the outer edge of the crystal piece 121, and a side surface including one short side of the crystal piece 121 is viewed in a plan view. Three recesses 125 (125a, 125b, 125c) are formed on the side surface including one short side of the crystal piece 121.

Bending vibration, which is a secondary vibration generated when an alternating voltage is applied to the metal pattern 122, vibrates so that the entire crystal piece 121 bends in a direction parallel to the long side and the short side of the crystal piece 121. It has become. In this way, by forming the recess 125 composed of the first recess 125a, the second recess 125b and the third recess 125c on the side surface including one short side of the crystal piece 121, bending vibration which is a secondary vibration is performed. It is possible to greatly change the vibration state such as the frequency of. Therefore, the amount of coupling between the thickness slip vibration, which is the main vibration, and the bending vibration, which is the secondary vibration, can be suppressed as compared with the case where the recess 125 is not formed.
As a result, it is possible to improve the electrical characteristics while reducing the increase in the equivalent series resistance value due to the combination of the thickness slip vibration, which is the main vibration, and the bending vibration, which is the secondary vibration.

Further, by forming the recess 125 including the first recess 125a, the second recess 125b and the third recess 125c on the side surface of the crystal piece 121, one or two recesses are formed on the side surface of the crystal piece 121. It is possible to further reduce the occurrence of bending vibration, which is a secondary vibration, as compared with the case where only the case is used or the case where the recess is not formed. Further, when four or more recesses are formed on the side surface of the crystal piece 121, it is possible to further reduce bending vibration which is a secondary vibration, however, when four recesses are formed, In comparison, from the viewpoint of mechanical strength, there is a possibility that the amount of strain with respect to the stress generated in the direction parallel to the side surface on which the recess is formed when the crystal element 120 is viewed in a plan view becomes large.
Therefore, by forming three recesses 125 composed of a first recess 125a, a second recess 125b, and a third recess 125c on the side surface of the crystal piece 121, a thickness slip whose main vibration is bending vibration, which is a secondary vibration. The amount of distortion of the crystal piece 121 against external stress can be suppressed while reducing the influence on the vibration. As a result, by doing so, it is possible to reduce the increase in the equivalent series resistance value due to the bending vibration and the distortion of the crystal piece 121, which are secondary vibrations, and to suppress the deterioration of the electrical characteristics. it can.

In particular, when the length of the long side of the crystal piece 121 is 920 μm or less, the order of the bending vibration, which is a secondary vibration, becomes low, so that the bending vibration and the main vibration, which are secondary vibrations, are used. It tends to be easily combined with a certain thickness sliding vibration. Therefore, by forming the recess 125 on the side surface including one short side of the crystal piece 121 in this way, the influence of the thickness slip vibration, which is a secondary vibration, on the thickness slip vibration, which is the main vibration, is reduced. It becomes possible. As a result, it is possible to reduce the increase in the equivalent series resistance value of the crystal element 120 and improve the electrical characteristics.

Further, the crystal element 120 is a first recess that is one end side of one short side of the side crystal piece 121 including one short side of the crystal piece 121 and is formed so as to be continuous with the lower surface of the crystal piece 121. 125a, a second recess 125b which is the other end side of one short side of the side crystal piece 121 including one short side of the crystal piece 121 and is formed so as to be continuous with the lower surface of the crystal piece 121. A third recess 125c formed so as to be connected to the upper surface of the crystal piece 121 and the lower surface of the crystal piece 121 while including the midpoint of one short side of the crystal piece 121 on the side surface including one short side of the crystal piece 121. A recess 125 is formed. At this time, when the side surface including one short side of the crystal piece 121 is viewed in a plan view, the first recess 125a is connected to the lower surface of the crystal piece 121, but is not connected to the upper surface of the crystal piece 121.
Further, the second recess 125b is connected to the lower surface of the crystal piece 121, but is not connected to the upper surface of the crystal piece 121.

With such a configuration, when the crystal element 120 is viewed in a plan view and a force is applied to both ends of the short side of the crystal piece 121, the amount of distortion of the crystal piece 121 near the center of the crystal piece 121 is reduced. Can be made to. Specifically, when the crystal element 120 is used as a crystal device, one short side of the crystal piece 121 or both ends of the other short side are electrically bonded with a conductive adhesive 140. It is possible to reduce the amount of distortion of the crystal piece 121 in the vicinity of the center of the crystal piece 121 due to the shrinkage stress generated when the sex adhesive 140 is cured. As a result, it is possible to reduce the increase in the equivalent series resistance value caused by the distortion of the crystal piece 121 near the center of the crystal piece 121, and to improve the electrical characteristics of the crystal element 120 and the crystal device. It will be possible.

Further, in the crystal element 120 according to the present embodiment, the length of the third recess 125c on the upper surface side of the crystal piece 121 is the lower surface of the crystal piece 121 when the side surface including one short side of the crystal piece 121 is viewed in a plan view. It is longer than the length of the third recess 125c on the side. From another viewpoint, the third recess 125c has the length of the third recess 125c connected to the upper surface of the crystal piece 121 and the lower surface of the crystal piece 121 in a plan view of the side surface including one short side of the crystal piece 121. It can be said that the length is different from the length of the third recess 125c connected to the above.

By making the lengths different in this way, the vibration state of the bending vibration, which is a secondary vibration, depends on the length of the crystal piece 121 parallel to the long side or the short side of the crystal piece 121. Therefore, it is possible to disperse the bending vibration which is a secondary vibration generated when the alternating voltage is applied to the metal pattern 122. As a result, since the bending vibration which is a secondary vibration can be dispersed, it is possible to reduce the combination of the bending vibration which is a secondary vibration with the thickness sliding vibration which is the main vibration, and the crystal element 120. It is possible to reduce the increase in the equivalent series resistance value of the above and suppress the deterioration of the electrical characteristics.

Further, by doing so, when the metal pattern 122 is provided on the crystal piece 121, the metal pattern 122 can be surely provided on the side surface of the crystal piece 121. Therefore, the connection wiring portion 124 provided on the upper surface side of the crystal piece 121 and the connection wiring portion 124 provided on the lower surface side of the crystal piece 121 can be more reliably and electrically connected, and the connection wiring portion 124 is partially. It is possible to reduce the increase in the equivalent series resistance value due to the thinning and improve the electrical characteristics.

Further, in the crystal element 120 according to the present embodiment, the excitation electrode portion 123 of the metal pattern 122 is provided near the center of the crystal piece 121 in a plan view of the crystal element 120, and the connection wiring portion 124 of the metal pattern 122 is provided. A part of the crystal piece 121 is provided along the edge of one short side of the crystal piece 121. Therefore, a part of the metal pattern 122 (a part of the connecting portion 124a) is provided at the edge of one short side of the crystal piece 121 in which the first recess 125a, the second recess 125b, and the third recess 125c are formed. Be done.

As described above, a part of the connection wiring portion 124, specifically, the connection portion 124a is provided at a position facing the mounting pad 111 of the substrate 110 when the crystal element 120 is used as a crystal device, and is conductively bonded. The agent 140 is electrically connected to and adhered to the mounting pad 111. From another viewpoint, it can be said that a part of the connection wiring portion 124a, specifically, the portion where the connection portion 124a is provided is fixed by the conductive adhesive 140. Therefore, by providing a part of the connection wiring portion 124 and the connection portion 124a on the short side side of one of the crystal pieces 121 in which the recess 125 is formed, one short of the crystal piece 121 in which the recess 125 is formed is provided. Both ends of the side surface including the side can be fixed by the conductive adhesive 140.
Therefore, as compared with the case where the connecting portion 124a is provided on the other short side side of the crystal piece 121 in which the recess 125 is not formed, it is possible to suppress the occurrence of bending vibration which is a secondary vibration. .. As a result, it is possible to reduce the influence of the bending vibration, which is a secondary vibration, on the thickness slip vibration, which is the main vibration, and it is possible to improve the electrical characteristics.

Further, in the crystal element 120 according to the present embodiment, a part of the metal pattern 122 is provided on the bottom surface of the recess 125 in a plan view of the side surface including one short side of the crystal piece 121. Specifically, the first recess 125a is provided with a part of the metal pattern 122 (a part of the connection wiring portion 124) on three surfaces facing the first recess 125a including the bottom surface of the first recess 125a. Further, the second recess 125b is provided with a part of the metal pattern 122 (a part of the connection wiring portion 124) on three surfaces facing the second recess 125b including the bottom surface of the second recess 125b. Of the three surfaces facing the third recess 125c, the third recess 125c has two surfaces excluding the bottom surface of the third recess 125c and a part of the bottom surface of the third recess 125c, and a part of the metal pattern 122 (connection wiring portion 124). (Part) is provided.

By doing so, a part of the metal pattern 122 acts as a weight, and it is possible to suppress the occurrence of bending vibration, which is a secondary vibration generated when an alternating voltage is applied to the metal pattern 122. Can be done. As a result, it is possible to reduce the amount of bending vibration, which is a secondary vibration, combined with the thickness slip vibration, which is the main vibration, reduce the increase in the equivalent series resistance value, and improve the electrical characteristics. Is possible.

Further, the crystal device according to the present embodiment includes a crystal element 120 according to the present embodiment and a substrate 110 having a substrate portion 110a provided with a mounting pad 111 at a position facing a part of the connection wiring portion 124. A conductive adhesive 140 provided between a part of the connection wiring portion 124 and the mounting pad 111, and a lid 130 bonded to the base 110 are provided. Therefore, since the crystal device according to the present embodiment uses the crystal element 120 whose electrical characteristics are improved while reducing the increase in the equivalent series resistance value, the equivalent series resistance value of the crystal device is increased. It is possible to improve the electrical characteristics while reducing the increase in size.

Further, the crystal device according to the present embodiment uses the crystal element 120 in which the recess 125 including the first recess 125a, the second recess 125b and the third recess 125c is formed as described above. By using such a crystal element 120, when a force is applied to both ends of one short side of the crystal piece 121, the force is generated in a direction parallel to the short side of the crystal piece 121 near the center of the crystal piece 121. It is possible to reduce the distortion. That is, in the crystal device according to the present embodiment, by using such a crystal element 120, the crystal piece near the center of the crystal piece 121 caused by the shrinkage response that occurs when the conductive adhesive 140 shrinks. It is possible to reduce the increase in the equivalent series resistance value due to the distortion generated in the direction parallel to the short side of 121, and improve the electrical characteristics.

Further, in the crystal device according to the present embodiment, as described above, a third recess 125c is formed which passes through the center of the short side of the crystal piece 121 and is connected to the upper surface of the crystal piece 121 and the lower surface of the crystal piece 121. The crystal element 120 is used. Therefore, when the conductive adhesive 140 applied on the mounting pad 111 is placed so as to be sandwiched between the mounting pad 111 and the connection portion 124a of the crystal element 120, the crushed conductive adhesive 140 spreads. Even if this is the case, it is possible to reduce the possibility that the conductive adhesives 140 applied in two places come into contact with each other and are electrically short-circuited so that the crystal element 120 does not vibrate.

Further, in the crystal device according to the present embodiment, the conductive adhesive 140 is filled in the first recess 125a and the second recess 125b.

By doing so, the adhesive area between the conductive adhesive 140 and the crystal piece 121 can be expanded as compared with the case where the first recess 125a and the second recess 125b of the crystal piece 121 are not formed. , Adhesive strength can be increased. Therefore, when the crystal device is dropped, it is possible to reduce the possibility that the crystal element 120 is separated from the mounting pad 111 of the substrate 110 and cannot be used as the crystal device.

The present invention is not limited to the above embodiments, and may be implemented in various embodiments.

The device having a crystal element is not limited to the crystal unit. For example, an oscillator having an integrated circuit element (IC) that generates an oscillation signal by applying a voltage to the crystal element in addition to the crystal element may be used. Further, for example, the crystal device may have an electronic element such as a thermistor in addition to the crystal element. Further, for example, the crystal device may be equipped with a constant temperature bath. In the crystal device, the structure of the substrate on which the crystal element is mounted may be appropriately configured. For example, the substrate may have an H-shaped cross section having recesses on the upper surface and the lower surface.

Quartz pieces are not limited to flat plates and mesas.

110 ... Base 110a ... Board part 110b ... Frame part 111 ... Mounting pad 112 ... External terminal 120 ... Crystal element 121 ... Crystal piece 122 ... Metal pattern 123 ... Excitation electrode part 124 ... Connection wiring part 124a ... Connection part 124b ... Wiring part 125 ... Recessed 125a ... First recess 125b ... Second recess 125c ... Third recess 130 ...・ ・ Lid body 140 ・ ・ ・ Conductive adhesive

Claims (7)

A crystal piece that has a substantially rectangular shape when viewed in a plan view,
A metal pattern provided on the crystal piece and composed of an excitation electrode portion and a connection wiring portion extending from the excitation electrode portion toward the outer edge of the crystal piece.
It is a crystal element composed of
The side surface including one short side of the crystal piece is viewed in a plan view.
Three recesses are formed on the side surface including one short side of the crystal piece so as to be continuous with either the upper surface of the crystal piece where the connection portion of the connection wiring portion is formed or the lower surface of which the connection portion is formed. A quartz element characterized by being formed. A crystal piece that has a substantially rectangular shape when viewed in a plan view,
A metal pattern provided on the crystal piece and composed of an excitation electrode portion and a connection wiring portion extending from the excitation electrode portion toward the outer edge of the crystal piece.
Consists of
The side surface including one short side of the crystal piece is viewed in a plan view.
A crystal element having three recesses formed on a side surface including one short side of the crystal piece .
A first recess on the side surface including one short side of the crystal piece, which is one end side of one short side of the crystal piece and is formed so as to be continuous with the lower surface of the crystal piece.
A second recess on the side surface including one short side of the crystal piece, which is the other end side of one short side of the crystal piece and is formed so as to be continuous with the lower surface of the crystal piece.
A third recess formed so as to be continuous with the upper surface of the crystal piece and the lower surface of the crystal piece while including the midpoint of one short side of the crystal piece on the side surface including one short side of the crystal piece. ,
A quartz element characterized in that the recess is formed from the quartz element. The crystal element according to claim 2.
The side surface including one short side of the crystal piece is viewed in a plan view.
A crystal element characterized in that the length of the third recess on the upper surface side of the crystal piece is longer than the length of the third recess on the lower surface side of the crystal piece. The crystal element according to claim 2 and 3.
Looking at the crystal element in a plane,
The excitation electrode portion of the metal pattern is provided near the center of the crystal piece.
A crystal element characterized in that a part of the connection wiring portion of the metal pattern is provided along an edge portion of one short side of the crystal piece. The crystal element according to claim 4.
The side surface including one short side of the crystal piece is viewed in a plan view.
A crystal element characterized in that the metal pattern is provided on the bottom surface of the recess. The crystal element according to claim 1 to 5,
A substrate having a substrate portion in which a mounting pad is provided at a position facing a part of the connection wiring portion, and a substrate.
A conductive adhesive provided between a part of the connection wiring portion and the mounting pad,
With the lid bonded to the substrate,
A crystal device characterized by being equipped with. The crystal element according to claim 2 to 5,
A substrate having a substrate portion in which a mounting pad is provided at a position facing a part of the connection wiring portion, and a substrate.
A conductive adhesive provided between a part of the connection wiring portion and the mounting pad,
With the lid bonded to the substrate,
Is a crystal device equipped with
A crystal device in which the conductive adhesive is filled in the first recess and the second recess.

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