JP5991190B2 - Electronic equipment - Google Patents

Description

  The present invention relates to an electronic device in which a plurality of large through-hole mounting components (hereinafter abbreviated as THD) are mounted horizontally on one surface of a circuit board, and the circuit board is fixed to a housing.

  An electronic device in which the THD is mounted horizontally with the protruding portion of the lead parallel to one surface of the circuit board, and the circuit board is fixed to the housing is disclosed in, for example, Japanese Patent Application Laid-Open No. 2008-033559 ( Patent Document 1) and Japanese Patent Application Laid-Open No. 2012-129305 (Patent Document 2).

  The electronic devices disclosed in Patent Documents 1 and 2 are vehicle engine ECUs (Electric Control Units). In the electronic device, for example, a large THD such as an aluminum electrolytic capacitor is mounted horizontally with the protruding portion of the lead parallel to one surface of the circuit board in order to suppress the mounting height. The tip of the bent lead is inserted into a through hole of the circuit board and soldered to the circuit board (through hole mounting). Further, the circuit board on which the THD is mounted is housed in a housing and directly attached to the engine block.

JP 2008-033559 A JP 2012-129305 A

  Since the electronic devices (engine ECUs) disclosed in Patent Documents 1 and 2 are directly attached to an engine block that is vibrated vigorously, it is necessary to take sufficient measures against vibration. In particular, when a large and heavy THD such as an electrolytic capacitor is mounted on a circuit board, the THD vibrates at a phase different from that of the casing or the circuit board, and the lead is easily broken. For this reason, in the electronic device of Patent Document 2, not only the circuit board and the housing are fixed, but also the THD and the housing mounted on the circuit board are bonded to each other and vibration is applied. The three THDs easily vibrate together, making it difficult for phase differences between the three to occur.

  On the other hand, on the circuit board of the engine ECU, a variety of THDs having different sizes and shapes are mounted in the vertical and horizontal orientations, even if they are limited to large THDs. Therefore, the engine ECU makes it difficult for the above three cases of THD to cause the above three cases of vibrations of the casing, circuit board, and THD, and prevents problems such as breakage of the lead due to vibration. There is a need to.

  Accordingly, an object of the present invention is an electronic device in which a plurality of large-sized THDs are mounted horizontally on one surface of a circuit board, and the circuit board is fixed to a housing. An object of the present invention is to provide an electronic device that can reliably prevent problems such as bending of a lead caused by vibration with respect to all of the plurality of THDs.

In the electronic device according to the present invention, a plurality of THDs having leads projecting outward are mounted horizontally on one surface of the circuit board so that the projecting portions of the leads are parallel to one surface of the circuit board. ing. The plurality of THDs include THDs having different heights from one surface of the circuit board to the protruding portion of the lead when mounted on the circuit board. The circuit board is fixed to the housing such that the one surface faces the bottom surface of the housing formed in a box shape. In addition, a cushioning material is inserted between the plurality of THDs and the bottom surface of the housing. Among the plurality of THD leads, the maximum height from one surface of the circuit board is defined as the minimum reference interval, and among the top portions of the plurality of THDs, the minimum height from one surface of the circuit substrate is defined as the maximum reference interval. In this case, the upper surface of the buffer material is set so as to have an interval larger than the minimum reference interval and smaller than the maximum reference interval between the upper surface of the circuit board.

  The electronic device is configured to have sufficient vibration countermeasures as described below so that the electronic device can operate without problems even when directly attached to an engine block that is vibrated vigorously, such as an engine ECU of a vehicle. For example, on a circuit board of an engine ECU, a variety of THDs having different sizes and shapes are mounted in a vertical orientation and a horizontal orientation, not limited to a large THD. Typical examples of large THD include electrolytic capacitors and coils.

  In the electronic device, a plurality of THDs having leads protruding outward are mounted horizontally on one surface of the circuit board. For example, a large THD such as an aluminum electrolytic capacitor is generally mounted horizontally with the protruding portion of the lead parallel to one surface of the circuit board in order to suppress the mounting height. The tip of the bent lead is inserted into a through hole of the circuit board and soldered to the circuit board (through hole mounting).

  In the electronic device, a circuit board on which a plurality of THDs are mounted horizontally on one surface is fixed to the housing such that the one surface faces the bottom surface of the housing formed in a box shape. The upper surface of the cushioning material inserted between the plurality of THDs and the bottom surface of the housing is set to have an interval larger than the minimum reference interval and smaller than the maximum reference interval.

  In other words, the setting condition larger than the former minimum reference interval is a setting condition in which all the leads of the THD do not come into contact with the buffer material. According to this, since the vibration is not directly transmitted to all the leads of the THD via the cushioning material, it is possible to prevent the inside of the THD from being damaged by the vibration transmitting the lead.

  The setting condition smaller than the latter maximum reference interval is, in other words, the setting condition in which all the tops of the THD are in contact with the cushioning material. According to this, since all of the THDs easily vibrate together with the circuit board and the case via the cushioning material, each THD vibrates at a phase different from that of the case and the circuit board. Problems such as breakage can be prevented.

  For the THD mounted vertically with the protruding portion of the lead being perpendicular to one surface of the circuit board, the former minimum reference interval is zero. For this reason, only the setting conditions smaller than the latter maximum reference interval are necessary for the vertically placed THD, and the setting conditions are gentle compared to the horizontally placed THD.

  In the above-described electronic device, among the plurality of THDs, in particular, a low-profile THD having a low lead protrusion position and a low top part may not satisfy the above-described setting conditions if it is directly mounted on a circuit board. is there. Therefore, in this case, a pedestal for increasing the maximum height of the top and the lead of a predetermined low-profile THD is provided, and the THD is mounted on one surface of the circuit board on the pedestal. As a result, the heights of the tops and leads of the low-profile THD and the other THDs are aligned, and the set conditions described above can be satisfied.

  In the electronic device, it is preferable that a recess along the outer shape of the THD is formed on the bottom surface of the housing. Even when various THDs having different sizes and shapes are mounted on one surface of the circuit board by forming the recess, the thickness of the cushioning material inserted between the THD and the bottom surface of the housing is kept constant. Can be kept in. As a result, the amount of the buffer material necessary for suppressing the vibration of the THD can be minimized, and the holding strength of each THD can be made uniform.

  The thickness of the buffer material is preferably set to be 0.1 mm or more and 5 mm or less between the THD and the bottom surface of the housing. When the thickness of the buffer material is smaller than 0.1 mm, the effect of suppressing the vibration of THD is insufficient, and when the thickness of the buffer material is larger than 5 mm, there are many portions that do not contribute to the vibration suppression effect.

  A silicon resin is suitable as the buffer material. Silicone resin has moderate elasticity for vibration suppression and is inexpensive. Further, unlike the epoxy resin, since the THD and the casing are not completely fixed, the THD is not damaged even if the circuit board on which the THD is mounted is detached from the casing.

  As described above, the electronic device described above is an electronic device in which a plurality of large THDs are mounted horizontally on one surface of a circuit board, and the circuit board is fixed to a housing. Due to inexpensive vibration countermeasures, it is possible to provide an electronic device that can reliably prevent problems such as breakage of leads due to vibration for all of the plurality of THDs.

  Therefore, the electronic device is suitable as an engine control device mounted on an engine of a vehicle having severe vibration.

BRIEF DESCRIPTION OF THE DRAWINGS It is the figure which showed the electronic device 100 which is an example of this invention typically, (a) is sectional drawing of the principal part of the electronic device 100, (b) is the perspective which saw through the electronic device 100 from diagonally upward. FIG. 2A and 2B are diagrams illustrating a circuit board 10 that is a component of the electronic device 100, in which FIG. 1A is a perspective view of the first surface S1 side of the circuit board 10 viewed obliquely from above, and FIG. It is the perspective view which saw through S2 side from diagonally upward. 2A and 2B are diagrams illustrating a housing 20 that is a component of the electronic device 100, in which FIG. 1A is a cross-sectional view of the housing 20 and FIG. 2B is a perspective view of the housing 20 as viewed obliquely from above. In the electronic device according to the present invention, the setting condition to be satisfied by the cushioning material 30 inserted between the plurality of THDs 1f to 1h mounted horizontally on the circuit board 10a and the bottom surface S3a of the housing 20a is shown. is there. 1 is a schematic external view showing a state where an electronic device 100 is attached to an engine block 200. FIG. It is the figure which showed the setting conditions which the buffer material 30 inserted between three THD1f, 1i, 1h mounted horizontally on the circuit board 10a and the bottom face S3a of the housing | casing 20a should satisfy | fill. It is the figure which showed the setting conditions which the buffer material 30 inserted between three THD1f-1h mounted horizontally on the circuit board 10a and the bottom face S3b of the housing | casing 20b should satisfy | fill.

  Embodiments of an electronic device according to the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams schematically showing an electronic device 100 as an example of the present invention. FIG. 1A is a cross-sectional view of a main part of the electronic device 100, and FIG. It is the perspective view seen through from. Note that the cross-sectional view of (a) corresponds to the cross section taken along one-dot chain line AA of (b).

  FIG. 2 is a diagram illustrating a circuit board 10 that is a component of the electronic device 100 of FIG. 1, and FIG. 2A is a perspective view of the first surface S1 side of the circuit board 10 viewed obliquely from above. b) is a perspective view of the second surface S2 side of the circuit board 10 seen through obliquely from above.

  3A and 3B are diagrams illustrating a housing 20 that is a component of the electronic device 100 in FIG. 1. FIG. 3A is a cross-sectional view of the housing 20, and FIG. FIG. Note that the cross-sectional view of (a) corresponds to the cross section taken along one-dot chain line AA in FIG.

  FIG. 4 shows the setting conditions to be satisfied by the buffer material 30 inserted between the plurality of THDs 1f to 1h mounted horizontally on the circuit board 10a and the bottom surface S3a of the housing 20a in the electronic device according to the present invention. FIG.

  FIG. 5 is a schematic external view showing a state in which the electronic device 100 is attached to the engine block 200.

  An electronic device 100 shown in FIG. 1 is an engine control device (engine ECU) used by being attached to an engine block 200 as shown in FIG. In the electronic device 100 of FIG. 1, a circuit board 10 on which a plurality of large THDs 1 a to 1 e, 2 a, 2 b are mounted is fixed to a housing 20.

  As shown in FIG. 2, on one surface (first surface S1) of the circuit board 10, five large THDs 1a to 1e are horizontally placed, and two large THDs 2a and 2b are vertically placed. It is installed in the area. The THDs 1a to 1e, 2a, and 2b mounted on the circuit board 10 are large-sized electronic components that are mounted through holes, and all have leads L1a to L1e, L2a, and L2b protruding outward. On the first surface S1 side of the circuit board 10 shown in (a), a connector 3 which is a large electronic component and a small electronic component 4 having a short height such as a semiconductor element or a resistor are also mounted. On the other hand, although not shown in (b), only a small electronic component with a short height is mounted on the second surface S2 side of the circuit board 10.

  2 are, for example, aluminum electrolytic capacitors. In order to suppress the mounting height, generally, the protruding portions of the leads L1a to L1e are formed on one surface of the circuit board 10, as shown in FIG. It is mounted horizontally so that it is parallel to The tips of the bent leads L1a to L1e are inserted into the through holes of the circuit board 10 and soldered to the circuit board 10 (through hole mounting). The thick and short cylindrical THDs 2a and 2b are, for example, coils, and are mounted vertically such that the protruding portions of the leads L2a and L2b are perpendicular to one surface of the circuit board 10 as shown in FIG. Is done. The leads L2a and L2b protruding from the bottom surface of the thick and short cylinder are inserted into the through holes of the circuit board 10 without being bent, and are soldered to the circuit board 10.

  As shown in FIG. 3, the housing 20 that houses the circuit board 10 is formed in a box shape having a thin schematic shape. As shown in FIG. 1A, the circuit board 10 has a first surface S1 on which large THDs 1a to 1e, 2a, and 2b are mounted facing a bottom surface S3 of a casing 20 formed in a box shape. And accommodated in the housing 20. Further, a buffer material 30 is inserted between the THDs 1a to 1e, 2a, 2b mounted on the first surface S1 side of the circuit board 10 and the bottom surface S3 of the housing 20, and the circuit board 10 is formed as shown in FIG. It is fixed to the housing 20 with a screw N shown in FIG. Then, as shown in FIG. 5, a lid 21 is attached to the housing 20 that houses the circuit board 10, and is attached to the engine block 200.

  Here, the buffer material 30 inserted between the THDs 1a to 1e, 2a, 2b mounted on the first surface S1 side of the circuit board 10 and the bottom surface S3 of the housing 20 in FIG. A setting condition to be satisfied by the cushioning material 30 of the electronic apparatus according to FIG.

  In the example of FIG. 4, three THDs 1f to 1h having different sizes are mounted horizontally on the first surface S1 side of the circuit board 10a so that the first surface S1 faces the bottom surface S3a of the housing 20a. And accommodated in the housing 20a. The three THDs 1f to 1h each have two leads L1f to L1h. Further, the two leads L1f to L1h in the respective THDs 1f to 1h are mounted on the circuit board 10a in a horizontal manner so that the two leads L1f to L1h have the same height from the first surface S1 of the circuit board 10a. .

  In the configuration illustrated in FIG. 4, the cushioning material 30 of the electronic device according to the present invention includes three THDs 1 f to 1 h and a casing that are mounted horizontally on the circuit board 10 a so as to satisfy the following setting conditions. It is inserted between the bottom surface S3a of 20a. That is, among the leads L1f to L1h of the three THDs 1f to 1h, the maximum height from the first surface S1 of the circuit board 10a is set to the minimum reference interval K1, and the circuit is formed in the top of the three THDs 1f to 1h. The minimum height from the first surface S1 of the substrate 10a is defined as the maximum reference interval K2. The upper surface U30 of the cushioning material 30 is set so as to have an interval D30 larger than the minimum reference interval K1 and smaller than the maximum reference interval K2 between the upper surface U30 and the first surface S1 of the circuit board 10a.

  The electronic device 100 illustrated in FIG. 1 is sufficiently equipped with a cushioning material 30 set as shown in FIG. 4 so that it can operate without problems even if it is directly attached to an engine block that is vibrated by a vehicle engine ECU. It has a configuration with various vibration countermeasures.

  For example, on a circuit board of an engine ECU, a variety of THDs having different sizes and shapes are mounted in a vertical orientation and a horizontal orientation, not limited to a large THD. Typical examples of large THD include electrolytic capacitors and coils.

  In the electronic apparatus (engine ECU) 100 illustrated in FIG. 1, five THDs 1 a to 1 e having leads L 1 a to L 1 e projecting outward are mounted horizontally on the first surface S 1 of the circuit board 10. . For example, a large THD such as an aluminum electrolytic capacitor is generally mounted horizontally with the protruding portion of the lead parallel to one surface of the circuit board in order to suppress the mounting height. The tips of the bent leads L 1 a to L 1 e are inserted into the through holes of the circuit board 10 and soldered to the circuit board 10.

  In the electronic device 100 illustrated in FIG. 1, the circuit board 10 on which the five THDs 1 a to 1 e are mounted horizontally on the first surface S <b> 1 is placed on the bottom surface S <b> 3 of the housing 20 in which the first surface S <b> 1 is formed in a box shape. It is fixed to the housing 20 so as to face each other. A cushioning material 30 that satisfies the following setting conditions is inserted between the five THDs 1 a to 1 e and the bottom surface S <b> 3 of the housing 20. That is, the maximum height from the first surface S1 of the circuit board 10 among the leads L1a to L1e of the five THDs 1a to 1e mounted horizontally on the first surface S1 of the circuit board 10 is shown in FIG. The minimum reference interval K1 and the minimum height from the first surface S1 of the circuit board 10 among the tops of the five THDs 1a to 1e are the maximum reference interval K2 shown in FIG. Then, the upper surface U30 of the cushioning material 30 is set so as to have an interval D30 that is larger than the minimum reference interval K1 shown in FIG. 4 and smaller than the maximum reference interval K2 between the first surface S1 of the circuit board 10. .

  The former setting condition in which the distance D30 between the upper surface U30 of the buffer material 30 and the first surface S1 of the circuit board 10 is larger than the minimum reference distance K1 is, in other words, all the leads L1a to L1e of the THDs 1a to 1e are in contact with the buffer material 30. It is a setting condition that does not. According to this, since vibration is not directly transmitted to all the leads L1a to L1e of the THDs 1a to 1e via the cushioning material 30, it is possible to prevent damage to the inside of the THDs 1a to 1e due to vibrations transmitted through the leads L1a to L1e. be able to.

  Further, the setting condition in which the distance D30 between the upper surface U30 of the buffer material 30 and the first surface S1 of the circuit board 10 is smaller than the maximum reference distance K2, in other words, all the tops of the THDs 1a to 1e are in contact with the buffer material 30. This is a setting condition. According to this, since all of the THDs 1a to 1e are easily vibrated together with the circuit board 10 and the casing 20 via the cushioning material 30, the THDs 1a to 1e have a casing relative to all of the THDs 1a to 1e. Problems such as breakage of the leads L1a to L1e due to vibration with a phase different from that of the body 20 and the circuit board 10 can be prevented.

  In the electronic device 100 illustrated in FIG. 1, the formers of the THDs 2a and 2b that are mounted vertically with the protruding portions of the leads L2a and L2b perpendicular to the first surface S1 of the circuit board 10 are The minimum reference interval K1 is zero. Therefore, for the vertically placed THDs 2a and 2b, only the setting condition in which the distance D30 between the upper surface U30 of the latter cushioning material 30 and the first surface S1 of the circuit board 10 is smaller than the maximum reference distance K2 is necessary. The setting conditions are gentle compared to ˜1e.

  As described above, in the electronic device 100 illustrated in FIG. 1, a plurality of large THDs 1 a to 1 e are mounted horizontally on one surface of the circuit board 10, and the circuit board 10 is fixed to the housing 20. The electronic device can reliably prevent problems such as breakage of the leads L1a to L1e due to vibration with respect to all of the plurality of THDs 1a to 1e by simple and inexpensive vibration countermeasures. .

  Next, details of the electronic device according to the present invention will be described.

  As described above, on a circuit board of an electronic device, a variety of THDs having different sizes and shapes are generally mounted in a vertical orientation or a horizontal orientation, not limited to a large THD. . Accordingly, among the plurality of THDs, a low-profile THD with a particularly low lead protrusion position and top portion may not be satisfied if it is mounted on a circuit board as it is.

  Therefore, in this case, a pedestal for increasing the maximum height of the top of the predetermined low-profile THD and leads is provided on one surface of the circuit board, and the THD is mounted on the one surface of the circuit board. It becomes the composition which becomes.

  FIG. 6 is a diagram showing the above configuration example. The setting to be satisfied by the cushioning material 30 inserted between the three THDs 1f, 1i, 1h mounted horizontally on the circuit board 10a and the bottom surface S3a of the housing 20a. It is a figure showing conditions.

  In the configuration example shown in FIG. 6, instead of the THD 1g of the configuration example shown in FIG. 4, a thinner cylindrical and low-profile THD 1i is used. For this reason, if the THD 1g is directly mounted on the circuit board 10a, the above-described setting conditions cannot be satisfied. Therefore, in the configuration example of FIG. 6, the first surface S1 of the circuit board 10a is provided with a base 11 that increases the top of the low-profile THD1i and the maximum height of the lead L1i, and the THD1i is placed on the base 11, The circuit board 10a is mounted on the first surface S1. As a result, the heights of the tops and leads of the low-profile THD1i and the other THD1f, 1h are aligned, and the above-described setting conditions are satisfied.

  FIG. 7 is a diagram illustrating another configuration example, and the setting conditions to be satisfied by the cushioning material 30 inserted between the three THDs 1f to 1h mounted horizontally on the circuit board 10a and the bottom surface S3b of the housing 20b. FIG.

  In the configuration example shown in FIG. 4, the casing 20a having a flat bottom surface S3a is used. On the other hand, in the configuration example shown in FIG. 7, depressions along the outer shapes of the THDs 1f to 1h are formed on the bottom surface S3b of the housing 20b. When the cylindrical THDs 1f to 1h are arranged side by side as in this example, the hollow portion has a waveform shape in which a part of the outer periphery of the arranged cylinders is continuous. In the electronic device 100 illustrated in FIG. 1 as well, a recess is formed on the bottom surface S3 of the housing 20 along the outer shapes of the THDs 1a to 1e, 2a, and 2b.

  As in the configuration example shown in FIG. 7, the bottom surface S3b of the housing 20b is preferably formed with depressions along the outer shapes of the THDs 1f to 1h. Even when various THDs 1f to 1h having different sizes and shapes are mounted on the first surface S1 of the circuit board 10a due to the formation of the depressions, they are inserted between the THDs 1f to 1h and the bottom surface S3b of the housing 20b. The thickness of the buffer material 30 to be applied can be kept constant. As a result, the amount of the buffer material 30 necessary for suppressing the vibration of the THDs 1f to 1h can be minimized, and the holding strengths of the THDs 1f to 1h can be made uniform.

  The thickness of the buffer material 30 is preferably set to 0.1 mm or more and 5 mm or less between the THD and the bottom surface of the housing. When the thickness of the buffer material 30 is smaller than 0.1 mm, the THD vibration suppressing effect is insufficient, and when the thickness of the buffer material 30 is larger than 5 mm, there are many portions that do not contribute to the vibration suppressing effect. Become.

  As the buffer material 30 described above, silicon resin is suitable. Silicone resin has moderate elasticity for vibration suppression and is inexpensive. Further, unlike the epoxy resin, since the THD and the casing are not completely fixed, the THD is not damaged even if the circuit board on which the THD is mounted is detached from the casing.

  In addition, like the electronic device 100 illustrated in FIG. 1, the circuit board 10 on which the plurality of THDs 1 a to 1 e, 2 a, 2 b are mounted is fixed to the housing 20 with screws N at the outer peripheral portion, and the circuit board 10 It is preferable that it is fixed to the housing | casing 20 with the screw Na in the position which surrounds several THD1a-1e, 2a, 2b also inside.

  According to this, in the position surrounding THD1a-1e, 2a, 2b, the flexural resonance of the circuit board 10 by vibration can be suppressed, and the vibration of the housing 20, the circuit board 10 and the THD1a-1e, 2a, 2b is further tuned. be able to. For this reason, even if it mounts in the place where a vibration is severe, excessive stress does not generate | occur | produce in the leads L1a-L1e, L2a, and L2b, and the vibration resistance of the electronic device 100 can be improved more.

  In the electronic device 100 illustrated in FIG. 1, the circuit board 10 is fixed to the housing 20 with an adhesive B indicated by a broken line at the outer periphery, and a plurality of THDs 1 a to 1 e are also provided inside the circuit board 10. , 2a, 2b are fixed to the housing 20 with an adhesive Ba at positions surrounding them. This also provides the same effect as the fixing with the screws N and Na described above. In particular, as in the electronic device 100 illustrated in FIG. 1, by using together with fixing with the screws N and Na, an effect of preventing the screws N and Na from being loosened can be obtained.

  The adhesives B and Ba for fixing the circuit board 10 to the housing 20 have a higher thermal conductivity than the buffer material 30 inserted between the THDs 1a to 1e, 2a and 2b and the housing 20. Is preferred. According to this, not only the function of suppressing the vibration of the circuit board 10 described above but also the function of releasing heat from the heat generating element mounted on the circuit board 10 to the housing 20 with respect to the adhesives B and Ba. Can be made.

  As described above, the electronic device described above is an electronic device in which a plurality of large THDs are mounted horizontally on one surface of a circuit board, and the circuit board is fixed to a housing. Due to inexpensive vibration countermeasures, it is possible to provide an electronic device that can reliably prevent problems such as breakage of leads due to vibration for all of the plurality of THDs.

  Therefore, the electronic device is suitable as an engine control device mounted on an engine of a vehicle having severe vibration.

100 electronic device 10, 10a circuit board S1 1st surface 1a-1i, 2a, 2b THD
K2 Maximum reference interval L1a to L1i, L2a, L2b Lead K1 Minimum reference interval 20, 20a, 20b Housing S3, S3a, S3b Bottom surface 30 Buffer material U30 Upper surface D30 Distance

Claims (9)

A plurality of through-hole mounting components (hereinafter abbreviated as THD, 1a to 1i) having leads (L1a to L1i) protruding outward, and the protruding portions of the leads are provided on one surface of the circuit board (10, 10a) ( S1) is mounted horizontally on one surface of the circuit board so as to be parallel to
The plurality of THDs include the THDs having different heights from one surface of the circuit board to the protruding portion of the lead when mounted on the circuit board.
An electronic device (100) in which the circuit board is fixed to the casing such that the one surface faces a bottom surface (S3, S3a, S3b) of the casing (20, 20a, 20b) formed in a box shape. Because
A cushioning material (30) is inserted between the plurality of THDs and the bottom surface of the housing,
Among the plurality of THD leads, the maximum height from one surface of the circuit board is the minimum reference interval (K1),
Among the tops of the plurality of THDs, a minimum height from one surface of the circuit board is a maximum reference interval (K2).
The upper surface (U30) of the cushioning material is set to have an interval (D30) larger than the minimum reference interval and smaller than the maximum reference interval with respect to one surface of the circuit board. Electronic equipment. On one surface of the circuit board (10a), a pedestal (11) that increases the maximum height of the predetermined THD (1i) and the lead (L1i) is provided,
The electronic device according to claim 1, wherein the THD is mounted on one surface of the circuit board on the pedestal.   3. The electronic device according to claim 1, wherein a recess is formed on the bottom surface of the housing (20, 20 b) along the outer shape of the THD (1 a to 1 h). The electronic device according to claim 1 , wherein the buffer material is a silicon resin . The electronic device according to claim 1 , wherein the THD is an electrolytic capacitor or a coil . The circuit board is fixed to the housing with a screw (N) at the outer periphery,
6. The electronic device according to claim 1, wherein the electronic circuit board is fixed to the housing with a screw (Na) at a position surrounding the plurality of THDs in the circuit board. apparatus. The circuit board is fixed to the housing with an adhesive (B) at the outer periphery,
The inside of the circuit board is also fixed to the housing with an adhesive (Ba) at a position surrounding the plurality of THDs, according to any one of claims 1 to 6. Electronic equipment. The electronic device according to claim 7, wherein the adhesive has a higher thermal conductivity than the buffer material . The electronic device according to any one of claims 1 to 8 , wherein the electronic device is an engine control device mounted on an engine of a vehicle .

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