JP4557956B2 - Electronic component with insulating support - Google Patents

Description

  The present invention relates to an electronic component, and more particularly to an electronic component including an insulating support. More specifically, the present invention relates to an electronic component including an insulating support for mounting an electronic component having a chip shape, for example, on a circuit board or other member including an electric circuit. The electronic component of the present invention can be advantageously used when attached to a circuit board or other member that is subject to vibration during operation, such as in an engine room of an automobile. A typical example of the electronic component is a chip-type aluminum electrolytic capacitor, but it can be advantageously used for other electronic components as well.

  Surface mounting of a chip-type aluminum electrolytic capacitor on a printed board or the like is widely performed. For example, Patent Document 1 describes a chip-type aluminum electrolytic capacitor in which a capacitor element 101 is accommodated in a metal case 102, sealed with an elastic sealing body 107, and an insulating plate 108 is attached, as shown in FIG. Yes. Since the insulating plate 108 is provided with a through hole 108a through which the lead wire 104 passes and a recess 108b in which the leading end portion 104a of the lead wire is accommodated, there is no inclination or wobbling when the aluminum electrolytic capacitor is surface-mounted.

  Recently, chip-type aluminum electrolytic capacitors tend to be exposed to harsh usage conditions. For example, there is a case where an aluminum electrolytic capacitor is used in an engine room of an automobile. In this case, it is necessary that the aluminum electrolytic capacitor surface-mounted on the printed board keeps high vibration resistance. However, in the chip-type aluminum electrolytic capacitor as described above, when the capacitor is vibrated, there is a problem such as peeling of the solder joint portion of the lead wire and the substrate or breaking of the bent portion of the lead wire housed in the concave portion of the insulating plate. May occur.

  Patent Document 2 proposes to solve this problem. For example, as shown in FIG. 2, in this chip-type aluminum electrolytic capacitor 110, the capacitor element 111 is housed in a cylindrical aluminum case 112 and sealed with an elastic sealing body 113. The insulating plate 124 includes a slit 125 and a claw 116 extending vertically from the peripheral portion thereof, and a protrusion 117 that can be engaged with the annular groove 115 of the capacitor element 111 is formed on the inner surface of the tip of the claw 116. Is formed. Further, the capacitor element 111 has a lead 114 whose tip 114a is bent. However, in the case of this aluminum electrolytic capacitor, since the projection is attached to the claw, it is difficult to attach the insulating plate to the capacitor. Further, since the projection is annular, the claw of the insulating plate is difficult to engage with the concave groove of the capacitor. Furthermore, there is a problem that vibration resistance is still insufficient.

  Further, Patent Document 3 is characterized in that a support column that comes in contact with the outer peripheral side surface of the capacitor body is provided above the insulating plate above the groove portion of the capacitor body, and further, the support column can be elastically deformed outward. In addition, a chip-type capacitor is described in which the upper end of the support column is inclined so as to be located inward of the lower end. However, in the case of this capacitor, since the support pillar is configured to contact the outer peripheral side surface of the capacitor body at a position higher than the vicinity of the groove portion of the capacitor body, the capacitor body is near the lead wire terminal located at the lower end of the capacitor body. Insufficient contact between the support pillars and the vibration is transmitted to the terminals of the bent lead wires, and the vibration resistance is not sufficient. In addition, since the upper end of the support column is inclined inward from the lower end, there is a problem that it is difficult to attach an insulating plate to the capacitor body.

  Further, in Patent Document 4, at least the periphery of the insulating terminal plate intersects with the bending direction of the lead wire and is formed to have a height higher than the annular drawing portion of the capacitor main body, and the peripheral surface of the metal case is the inner surface. A chip-type aluminum electrolytic capacitor is described in which a wall portion is provided so as to be held in contact with the chip. Further, an annular holding member may be disposed between the metal case and the wall portion of the capacitor. However, in the case of this capacitor as well as the capacitor of Patent Document 3, the wall portion of the insulating terminal plate is in contact with the outer peripheral side surface of the capacitor body at a position higher than the vicinity of the annular drawn portion of the capacitor body. Therefore, there is a problem that vibration resistance is not sufficient. In addition, an improvement in vibration resistance is expected by disposing an annular holding member, but problems such as a decrease in yield in the manufacturing process newly occur.

JP 59-2111214 (Claims, page 2, Fig. 3) Japanese Patent No. 3549653 (Claims, paragraphs 0011 to 0012, FIG. 1) JP 2001-52959 A (Claims, paragraphs 0007 and 0014, FIG. 1) JP 2001-217148 A (Claims, paragraphs 0021 to 0023, FIGS. 1 and 2)

  The object of the present invention is to solve the above-mentioned problems in the conventional chip-type aluminum electrolytic capacitor, and it is easy to mount the capacitor body and the insulating plate or the insulating terminal plate, and the manufacturing yield can be improved. In addition, it is an object of the present invention to provide a chip-type aluminum electrolytic capacitor and other electronic components having an insulating plate or an insulating terminal plate, which have better vibration resistance than conventional capacitors.

  Objects of the present invention will be readily understood from the following detailed description.

In one aspect, the present invention is an insulating support attached to an electronic component that can be mounted on a member having an electric circuit,
When the electronic component is supported by the support, the two support columns and / or the support that are arranged at positions facing each other with the electronic component interposed therebetween and extend upward from the outer peripheral side surface of the support, respectively. And a component support space for accommodating the electronic component defined by the support column and / or the support wall and the bottom surface of the support has a diameter c of the electronic component, The insulating support for electronic components is characterized by satisfying the condition of s1 <c <s2, where s1 is the length of the lower end of the component support space and s2 is the length of the upper end. Here, the electronic component is provided with an external terminal for electrical connection with the member, and a through-hole for penetrating the external terminal is provided on the bottom surface of the support, and the member A concave portion for accommodating the external terminal may be provided on the outer surface of the support that comes into contact with the external terminal in a state of being connected to the through hole. Note that the term “insulating support” is intended to explain that when it is used in the present specification, the configuration differs from that of a conventional insulating plate or insulating terminal plate.

  Further, the present invention resides in an electronic component using such an insulating support, particularly an electronic component mounted via a support related to a member that can be vibrated during use.

  In the implementation of the present invention, the electronic component is not particularly limited, and includes various electronic components. Preferably, the electronic component is a component vertically disposed on a component of a circuit board or other electronic device, For example, a chip-type electronic component, typically a chip-type aluminum electrolytic capacitor can be mentioned.

  According to the present invention, as will be understood from the following detailed description, it is possible to obtain a remarkable effect not found in conventional insulating plates or insulating terminal plates and electronic components (typically, electrolytic capacitors) using the same. Can do. For example, according to the present invention, various effects such as easy insertion of electronic components, easy manufacture of an insulating support, improved vibration resistance of electronic components, and the like can be obtained. be able to.

  Subsequently, the present invention will be described with respect to preferred embodiments thereof with reference to the accompanying drawings. In the following description, in order to facilitate understanding of the present invention, the present invention will be described particularly when the electronic component is a chip-type aluminum electrolytic capacitor. However, the implementation of the present invention is not limited to this electrolytic capacitor. I want you to understand.

  FIG. 3 is a cross-sectional view showing a preferred example of a chip-type aluminum electrolytic capacitor according to the present invention. FIG. 4 is an insulating support (so-called “insulating plate”) according to the present invention used in the capacitor shown in FIG. FIG. 5 is a partial cross-sectional side view showing the configuration of a chip-type aluminum electrolytic capacitor used in the capacitor shown in FIG. It is sectional drawing along line segment VB-VB of the insulating support body shown to A) and FIG.

  First, a chip type aluminum electrolytic capacitor 10 used as a typical example of an electronic component will be described with reference to FIG. The aluminum electrolytic capacitor 10 is not particularly limited in the practice of the present invention, can have a general configuration, and can be manufactured according to a conventional technique. For example, the illustrated aluminum electrolytic capacitor 10 can be manufactured as follows.

  In general, after etching the aluminum foil to increase the surface area, the anode foil that has been anodized to form an oxide film and the cathode foil that has been etched on the surface are placed facing each other, and a separator (separating paper) is interposed between them. Thus, the capacitor element 1 having a wound structure is manufactured. Next, the obtained capacitor element 1 is impregnated with an electrolytic solution or a solid electrolyte. After impregnation with the electrolytic solution or the solid electrolyte, the capacitor element 1 is accommodated in a case 2 (generally made of aluminum) and further sealed with an elastic sealing member 3 to complete an aluminum electrolytic capacitor 10. For details of the aluminum electrolytic capacitor, refer to, for example, the following patent documents: JP 2000-173862 A, JP 2000-173863 A, JP 2003-31443 A, and JP 2003-2003 A. Japanese Patent No. 31444 and Japanese Patent Application Laid-Open No. 2004-26932.

  The insulating support 6 of the present invention is mounted on a member provided with an electric circuit, particularly a component (part) that tends to be subjected to vibration during use, for example, a circuit board 20 of an automobile component. An electronic component (in the figure, a chip-type aluminum electrolytic capacitor) 10 is attached to the body.

  The electrolytic capacitor 10 includes an external terminal 4 for electrical connection with an electric circuit (not shown) of the circuit board 20 as shown in the figure. Here, the external terminals 4 are preferably in the form of lead wires as shown, but may have other forms if necessary. The lead wires and other external terminals can be preferably made of, for example, copper, nickel, aluminum, gold, silver, iron, tin, or an alloy of such conductive metals.

  The insulating support 6 of the present invention is formed from any material having electrical insulation. Examples of suitable insulating materials include, but are not limited to, those listed below, plastic materials, fiber reinforced plastic materials, ceramic materials, glass fibers, and the like. In view of moldability and product price, a plastic material can be advantageously used as a support material. Examples of suitable plastic materials include polyphenyl sulfide resin (PPS resin), nylon resin, and liquid crystal polymer. In particular, PPS resin is suitable in terms of high temperature heat resistance during reflow and electrical insulation. Such a material may be blended with an additional material such as a flame retardant as necessary.

  The insulating support 6 is usually used in a substantially rectangular or square shape as shown. The size of the support 6 can be arbitrarily changed according to the size of the electrolytic capacitor 10 and the details of the circuit board 20. Moreover, it is preferable to provide a notch part in one or more corner parts of such a support body 6 as shown in the figure.

  Furthermore, the insulating support 6 has a through hole 14 for inserting and penetrating the external terminal 4 of the electrolytic capacitor 10 in the base (bottom surface) 6a. The through hole 14 can have a size sufficient to pass through the external terminal 4, typically a lead wire. Further, in addition to the through hole 14, the support 6 has a recess 15 for housing the external terminal 4 in a state of being connected to the through hole 14 on the outer surface thereof, that is, the outer surface in contact with the member 20. have.

  In addition, the insulating support 6 of the present invention has at least two support columns and / or support walls at positions facing each other with the electrolytic capacitor 10 sandwiched when the electrolytic capacitor 10 is supported by the support 6. 6b. As illustrated and described below, the support column and the support wall 6b may be used only by the support column, may be used only by the support wall, or may be used by arbitrarily combining the support column and the support wall. May be. Here, “support column” and “support wall” are used in the present invention for defining these members, and when used in the present specification, the length of one side of the support is used as a reference. It is said. Specifically, referring to FIG. 8, which will be described below, the support column 6b-1 has a horizontal length b of 1 side length a based on the length a of one side of the support. Less than / 2. Further, the support wall 6b-2 has a lateral length b that is ½ or more of the side length a.

  In the insulating support 6 of the present invention, each support column and the support wall 6b extend upward from the outer peripheral side surface of the base 6a of the support 6 as shown in the figure. The height h of the support column and the support wall 6b may be the same or different. By giving different heights h to the support 6, the anode side and the cathode side can be easily distinguished.

  Further, the support body 6 of the present invention forms a component support space 16 for housing the electrolytic capacitor 10 by the support column and / or the support wall 6 b and the bottom surface 6 a of the support body 6. The component support space 16 satisfies the condition of s1 <c <s2, where c is the diameter of the electrolytic capacitor 10, s1 is the length of the lower end of the component support space 16, and s2 is the length of the upper end. By satisfying such a dimensional relationship, the work of inserting the capacitor body into the support becomes smoother, and the contact strength between the capacitor body and the support column and / or the support wall can be increased, and vibration resistance Can be improved.

  Furthermore, it is preferable that the base 6a and the support pillar and / or the support wall 6b are integrally molded from the insulating material as described above. Examples of suitable molding methods include injection molding, transfer molding, and compression molding.

  As described above, the insulating support of the present invention satisfies the condition of s1 <c <s2 when the electrolytic capacitor 10 is stored in the component support space 16. This can also be defined by the inclination angle of the support column and / or the support wall 6b. That is, it is preferable that the support column and / or the support wall 6b form an inclined surface having an inclination angle of about 0.2 to 1 degree on the inner surface. By providing such an appropriate inclination angle, contact at an optimum portion can be achieved. The inclined surface only needs to be provided by at least one of a plurality of support columns or support walls 6b, but all the support columns or support walls 6b have the same or substantially the same inclination angle. It is preferable. Further, such an inclination angle can be given according to various techniques. Usually, when forming the support column or the support wall 6b, it is convenient to use a mold having a shape corresponding to the inclination angle. In this case, the inclined surface is derived from the longitudinal cross-sectional shape of the support column or the support wall. Therefore, in this case, the thickness of the support column or the support wall decreases from the base side toward the tip side. By doing so, the capacitor can be inserted more smoothly.

  If it is desired to have the same cross-sectional shape in the longitudinal direction of the support column or the support wall, when the support column or the support wall is attached to the base, the support column or the tilted wall is inclined at a desired angle. What is necessary is just to attach a support wall. That is, the inclined surface can be derived from the vertical mounting angle of the support column or the support wall.

  FIGS. 6 to 8 illustrate some preferred methods for forming the component support space, in other words, for arranging the support columns or the support walls. As understood from the drawing, the component support space can be formed from a combination of a support column and a support column, a combination of a support wall and a support wall, or a combination of a support column and a support wall. Moreover, in the combination of the support column and the support column, the combination of the support wall and the support wall, or the combination of the support column and the support wall, it is preferable that any member satisfies the above-described condition of s1 <c <s2. If necessary, at least one member may satisfy this condition.

  More specifically, FIG. 6 shows a combination of four support pillars 6b-1 disposed at the four corners of the rectangular base 6a. The two corners of the base 6a are provided with notches so that the polarity of the electrolytic capacitor (not shown) can be easily determined. In the case of the illustrated example, two sets (four in total) of support pillars 6b-1 are provided across a capacitor body (not shown), but one set or three or more sets of support pillars are provided as necessary. 6b-1 may be provided. However, a state in which the support pillars 6b-1 are arranged at all four corners of the base 6a is particularly preferable.

  The height h of the support column 6b-1 can be arbitrarily determined. For example, the height h of each support column 6b-1 can be different, or the height h of the support column 6b-1 can be different between the anode lead side and the cathode lead side. The height h of the support column 6b-1 is desirably increased to a size where s2 is 0.05 mm or more than c at a height where c <s2.

  FIG. 7 shows a combination of two linear support walls 6b-2 arranged on two opposite sides of the rectangular base 6a. Although the illustrated example is preferable, in some cases, although not illustrated, the support walls 6b-2 may be provided on the remaining two sides in FIG. 7, and the support walls 6b-2 may be provided on all four sides of the base 6a. May be provided. By providing the support wall 6b-2, the contact area between the capacitor main body (not shown) and the support wall increases, so that the vibration resistance can be improved compared to the case of using only the support columns.

  The height h of the support wall 6b-2 can be arbitrarily determined. For example, the height h of each support wall 6b-2 may be different, or the height h of the support wall 6b-2 may be different on the anode lead side and the cathode lead side. The height h of the support wall 6b-2 is desirably increased to a size where s2 is 0.05 mm or more than c at a height where c <s2.

  FIG. 8 shows a combination of a support wall 6b-2 disposed on one side of the rectangular base 6a and two support columns 6b-1 disposed at both ends of the opposite side. Thus, the support pillar 6b-1 and the support wall 6b-2 can be provided in any combination. In particular, as shown in the figure, a structure in which a support column is provided at each corner portion of one of two sides facing each other across the capacitor body and a support wall is provided on the opposite side is advantageous. By adopting this structure, the area in contact with the capacitor main body is increased as compared with the case of using only the support pillars, so that the vibration resistance of the capacitor can be improved. Although not shown, a plurality of support columns 6b-1 may be arbitrarily provided on the side of the base 6a in addition to the support columns 6b-1 and the support wall 6b-2.

  The height h of the support column 6b-1 and the support wall 6b-2 can be arbitrarily determined. For example, the height h of the support column 6b-1 and the height h of the support wall 6b-2 may be different from each other, or the height h of the support column 6b-1 on the anode lead side and the cathode lead side. Further, the height h of the support wall 6b-2 may be different. These heights h are desirably increased to a size where c <s2 is such that s2 is 0.05 mm or more than c.

  Further, according to another method, although not shown, the component support space may be formed by a cylindrical support wall surrounding the periphery of the rectangular base.

  Referring to FIG. 3 again, an electronic component 10 suitable for carrying out the present invention has an annular recess 5 below the center of its height as shown in the drawing, typically chip-type electrolysis. It is a capacitor.

  The electronic component, in particular, the chip-type electrolytic capacitor 10 includes an annular recess 5 below the center of its height, and when the diameter of the main body portion above the recess 5 is c, it is larger than the recess 5. The diameter d of the lower part is preferably smaller than the diameter c. Moreover, it is preferable that the diameter d of the part below the recessed part 5 of the electronic component 10 is smaller than the diameter s1 of the lower end of the component support space of a support body.

  Further, it is preferable that the electronic component 10 is in contact with the inner side of the support column and / or the support wall at a half or less of the length of the portion above the annular recess 5, but in the vicinity of the annular recess 5. More preferably, the contact is made at By configuring in this way, the electronic component can be strongly held at a position below the center of gravity, and vibration resistance can be improved.

By the way, the place where the outer peripheral surface of the capacitor main body and the support pillar and / or the inside of the support wall come into contact with each other can be variously changed. Suitable contact locations include, for example,
1. 1. Both the part below the capacitor groove and the part above the capacitor groove 2. A part above the groove of the capacitor 3. A part below the groove of the capacitor. 4. Both the portion below the capacitor groove and the portion above the capacitor groove and occupying 1/2 or less of the height of the capacitor case A portion that is above the groove portion of the capacitor and occupies 1/2 or less of the height of the capacitor case can be exemplified. Of these contact locations, contact locations 1, 2, 4 and 5 are preferred, contact locations 4 and 5 are more preferred, and contact location 5 is most preferred. As in the contact places 2 and 5, d <s1 may be set.

  The insulating support of the present invention can be implemented in other preferred embodiments. For example, as shown in FIG. 9, the support body 6 further includes an auxiliary connection terminal 17 extending along the length direction of the narrow groove of the concave portion in addition to the concave portion 15 connected to the through hole 14. Can do.

  In addition, when the electronic component includes the above-described annular recess, the support 6 has an annular recess of the electronic component inside the support column and / or the support wall 6b as shown in FIG. A groove portion 18 that at least partially fits the lower portion may be formed. The groove portion 18 may be provided in only one of the support pillar and / or the support wall 6b, or may be provided in all of them. When the groove portion 18 is disposed, a stronger contact can be achieved because the support column and / or the support wall of the support body can contact the upper diaphragm portion of the capacitor in addition to the side surface of the capacitor.

  Furthermore, in the insulating support of the present invention, it is preferable that the part support space side is chamfered at a portion of the support column and / or the base of the support wall with respect to the support. The chamfering of the support can be carried out in various forms, but is preferably the R surface or the C surface or a combination thereof.

  The chamfering can preferably be performed as shown in FIG. For example, the support 6 shown in FIG. 11A has a chamfered R surface, and the size thereof is preferably in the range of about 0.2 to 2 mm. In addition, the support 6 in FIG. 11B has a chamfered c-plane, and the size thereof is preferably in the range of about 0.2 to 2 mm. In carrying out the present invention, a method is adopted in which an electronic component is inserted into an insulating support from above and fitted, so that the R surface and the C surface are imparted to the joint portion of the support as described above. As a result, the strength of the support, particularly the bending strength, can be increased. Further, the strength can be improved at the time of manufacturing the support or at the time of vibration of the member on which the electronic component is mounted.

  In summary, according to the present invention, the support column and / or the support wall are slightly opened outwardly, and the part is defined by the support column and / or the support wall and the bottom surface (base surface) of the support body. By configuring the support space so as to satisfy the condition of s1 <c <s2, the electronic support can be easily inserted, the manufacture of the insulating support can be facilitated, and the insulating support is inserted. In this way, it is possible to reduce problems such as bending of the lead wires that occur during the process. Further, in the electronic component, when an annular recess (drawing portion) is provided, the diameter d of the lower part thereof is configured to be smaller than the diameter c of the upper body part (c> d). In use, the heat resistance of the electronic component can be improved. In addition, as described above, the support pillar and / or the tip of the support wall are open to the outside, so that the insulating support and the main body of the electronic component are near the annular recess provided in the electronic component. Therefore, when an electronic component is mounted on a member having an electric circuit, the vibration resistance of the electronic component can be improved, and vibrations are not easily transmitted to the lead wire. The improvement in vibration resistance is particularly useful when, for example, the insulating support and the electronic component of the present invention are mounted on an appropriate member of an automobile or other transportation means in which vibration is always easily transmitted during driving.

  Moreover, although the height of a support pillar and / or a support wall may be the same, you may mutually differ. By configuring the supporting columns and / or supporting walls of the electronic component to have different heights, the anode (anode lead wire side) and the cathode (cathode lead wire side) can be easily distinguished. Furthermore, by configuring the support pillars and / or the support walls to be all different heights, it is possible to suppress a decrease in vibration resistance due to changes in L dimension in electronic components of any size, and to provide stable vibration resistance. Can be achieved.

  Furthermore, the diameter d of the lower part of the recess of the electronic component is made smaller than the length s1 of the lower end of the component support space so that it does not contact the inner surface of the support column and / or the support wall. The contact force between the component and the support column and / or the support wall can be made constant, and vibration from the member on which the electronic component is mounted is not easily transmitted to the lead wire portion. Thereby, the fracture | rupture of the bending part of the lead wire accommodated in the recessed part of an insulating support body can be prevented. Actually, if the portion below the annular recess hits the support column and / or the support wall strongly, the contact force between the electronic component and the support column and / or the support wall becomes weak, and the wobbling during vibration occurs. Cannot be prevented. In addition, by setting d <s1, it becomes easy to attach the insulating support to the capacitor body, and it is possible to reduce problems such as defective insertion at the time of manufacture and cracks in the support columns or support walls.

  Since such an excellent effect can be obtained, the present invention can be advantageously used in various technical fields. Since the present invention can ensure excellent vibration resistance and stability compared to conventional products, members having electric circuits that tend to be subject to large vibrations during use, such as automobiles, motorcycles, trains, motor boats, etc. The present invention can be advantageously applied to circuit boards and other members of parts of the transportation means. For example, an aluminum electrolytic capacitor held by an insulating support of the present invention can be connected to a printed circuit board that constitutes a part in an automobile, and can be stably fixed.

  The aluminum electrolytic capacitor is as described above, but will be described supplementarily. The aluminum electrolytic capacitor is preferably a chip-type aluminum electrolytic capacitor. The electrolytic capacitor has an annular recess below it and a lead wire as an external connection terminal. The lead wire passes through the through hole of the insulating support of the present invention and is used for electric wiring such as a circuit board. Alternatively, it is connected to other electrical means.

  Subsequently, the present invention will be described with reference to examples thereof. Needless to say, the present invention is not limited to these examples.

Example 1
Production of Chip Type Aluminum Electrolytic Capacitor A lead terminal was connected to each of the aluminum anode foil and the cathode foil, and wound between the anode foil and the cathode foil via a separator to form a capacitor element. Thereafter, the capacitor element was impregnated with an electrolytic solution.

  After the impregnation with the electrolytic solution was completed, the capacitor element was housed in an aluminum case. The opening of the case was sealed with an elastic sealing body. An aluminum electrolytic capacitor having a cross section schematically shown in FIG. 5A was obtained. The electrolytic capacitor had a diameter of 18 mm and a length of 15 mm.

  Next, the portion of the lead wire of the obtained electrolytic capacitor is crushed into a through hole of a rectangular insulating support (see FIG. 8) in which support pillars are integrally formed at the four corners as shown in FIG. I was inserted. All of the support columns satisfy the condition of s1 <c <s2, where c is the diameter of the capacitor, s1 is the length of the lower end of the component support space, and s2 is the length of the upper end. The height of c <s2 was such that s2 was 0.05 mm or more larger than c, that is, 11.0 mm on the anode side and 10.0 mm on the cathode side. Further, an R surface (dimension: 0.5 mm) was provided as a chamfer between the support and the support column attached thereto.

  After that, the crushed portion of the lead wire protruding from the through hole of the support is bent at 90 °, and stored in a groove formed in advance on the outer surface of the support, and the chip type aluminum in which the electrolytic capacitor and the support are integrated. An electrolytic capacitor was produced. As shown in FIG. 9, the groove portion of the support has metal auxiliary terminals formed along the groove portion. Further, it was observed that the capacitor main body was in strong contact with the support column slightly above the annular recess.

Comparative Example 1 (Conventional product)
Although the method described in Example 1 was repeated, in this example, a support column was attached so that s1 = c = s2 for comparison. The height of the support column was the same as in Example 1. In the obtained chip-type aluminum electrolytic capacitor, it was observed that the capacitor body was in contact with the support column above the annular recess.

Comparative Example 2 (Conventional product)
Although the method described in Example 1 was repeated, in this example, for comparison, instead of the support column, for example, as shown in FIG. 7, a support wall was attached to the opposite sides across the capacitor body. . The height of the support wall was the same as the height of the support column of Example 1. In the obtained chip-type aluminum electrolytic capacitor, it was observed that the capacitor body was in contact with the support wall above the annular recess.

Test example 1
In this example, assuming that the chip-type aluminum electrolytic capacitors produced in Example 1 and Comparative Examples 1 and 2 are used in an automobile, 36 electrolytic capacitors are each mounted on a test circuit board with through holes. After that, a vibration test was performed under the following vibration conditions.

(Vibration conditions)
Frequency range: 50-2000Hz
Acceleration: 30G
Period: 50Hz-2000Hz-50Hz (every 20 minutes)
Time: y direction 48 hours, x direction 48 hours, z direction 48 hours
(See Fig. 4 and Fig. 5 (B) for the vibration direction)
The number of abnormalities occurring in the electrolytic capacitor after vibration in each of vibration in the y direction, vibration in the x direction, vibration in the z direction and continuous vibration in the y direction → x direction → z direction was counted. Results as described in Table 1 were obtained.

  As understood from the results shown in Table 1 above, in the case of the electrolytic capacitor of Example 1, the abnormality in the electrolytic capacitor even after the vibration in the y direction, the x direction and the z direction was applied for 48 hours, that is, The capacitor was not dropped from the substrate, the lead wire was disconnected, and the terminal was not detached. On the other hand, in the case of the electrolytic capacitor of Comparative Example 1 (conventional product), in each of vibrations in the y direction, the x direction, and the z direction, dropping from the substrate and cutting of the lead wires occurred at the time of vibration for 24 hours. Admitted. Moreover, in the case of the electrolytic capacitor of Comparative Example 2 (conventional product), no abnormality was observed after 24 hours, but after 48 hours, almost half of the capacitors had problems such as dropping or cutting of lead wires. Admitted. Furthermore, in the case of the electrolytic capacitor of Example 1, when the vibrations in the y direction, the x direction, and the z direction were continuously applied, no abnormality of the capacitor was caused and an excellent effect was shown. On the other hand, in the case of Comparative Example 1, defects were found in all the capacitors. Moreover, in the case of the comparative example 2, the malfunction was recognized by the capacitor more than half.

  From these results, it can be seen that the chip-type aluminum electrolytic capacitor using the insulating support according to the present invention has significantly improved vibration resistance as compared with the conventional product.

Examples 2-6
The method described in Example 1 was repeated. In this example, the size of the diameter d below the annular recess of the aluminum electrolytic capacitor (see FIG. 3) is as shown in Table 2 below. We examined the effects of changing to.

  As the examination items, (1) the number of defects at the time of manufacture and (2) vibration resistance were selected. The number of defects at the time of production was determined by counting the number of defective products (such as cracks in the support and insertion failure) when 75 insulating capacitors were prepared and then an insulating support was mounted thereon. In addition, the vibration resistance is the result after vibrating in the y → x → z direction continuously for 48 hours in accordance with the method described in Test Example 1. Evaluation results as described in Table 3 below were obtained.

  As can be understood from the results shown in Table 3 above, when the diameter d below the annular recess of the capacitor is changed, even when the same example is used, the number of defects at the time of manufacture is compared. Examples 2, 3 and 4 showed no defects during production, whereas Examples 5 and 6 showed some insertion defects during production. Here, by making the diameter d smaller than s1, it becomes easy to insert the capacitor into the insulating support, and the number of defects at the time of manufacture can be reduced and stable manufacture can be achieved.

  In addition, in the vibration resistance test in which the y direction → x direction → z direction was continuously performed for 48 hours, abnormal capacitors were slightly observed in Examples 5 and 6, whereas Examples 2, 3 and 4 were observed. Then there was no abnormal capacitor at all. It is considered that by making the diameter d smaller than s1, the adhesion strength between the support column or the support wall and the capacitor body in the vicinity of the concave portion of the capacitor is increased, and the vibration resistance is further improved. Furthermore, it is considered that the influence on the adhesive strength between the capacitor main body, the support column, and the support wall due to the variation in the size of the diameter d could be suppressed. The defects in Examples 5 and 6 were in an acceptable range.

It is sectional drawing which showed an example of the conventional chip-type aluminum electrolytic capacitor. It is sectional drawing which showed another example of the conventional chip-type aluminum electrolytic capacitor. It is sectional drawing which showed a preferable example of the chip-type aluminum electrolytic capacitor by this invention. It is the top view which showed the structure of the insulating support body by this invention used with the capacitor | condenser shown in FIG. FIG. 5 is a partial cross-sectional side view (A) showing the configuration of a chip-type aluminum electrolytic capacitor used in the capacitor shown in FIG. 3 and a cross-sectional view taken along the line segment VB-VB of the insulating support shown in FIG. is there. It is the bottom view which showed an example of the preferable arrangement | positioning of the support pillar in the insulating support body of this invention. It is the bottom view which showed an example of the preferable arrangement | positioning of the support wall in the insulating support body of this invention. It is the bottom view which showed an example of the preferable arrangement | positioning of the support pillar and support wall in the insulating support body of this invention. It is the bottom view which showed the usage example of the auxiliary | assistant connection terminal in the insulating support body of this invention. It is the bottom view which showed the usage example of the auxiliary groove in the insulating support body of this invention. It is the fragmentary sectional view which showed the preferable example of the chamfering in the insulating support body of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Case 3 Elastic sealing body 4 External terminal 5 Annular recessed part 6 Insulating support 6a Bottom face (base part)
6b Support pillar and / or support wall 10 Aluminum electrolytic capacitor (electronic component)
14 Through hole 15 Recess 16 Component support space 20 Member

Claims (9)

An electronic component including an insulating support, including an insulating support that can be mounted on a member including an electric circuit, and an electronic component that is disposed upright on the support,
The support body is disposed at a position facing the base portion disposed in contact with the member and the electronic component, and extends at least two from the outer peripheral side surface of the base portion. With pillars and / or support walls,
The component support space for accommodating a part of one end of the electronic component defined by the support column and / or the support wall and the base is c, the diameter of the electronic component, and the length of the lower end of the component support space. Where s1 and the length of the upper end are s2, the condition of s1 <c <s2 is satisfied, and
The electronic component includes an annular recess below the center of its height, and when the diameter above the recess is c, the diameter d of the portion below the recess is smaller than the diameter c, and wherein the diameter of the lower end of the component support space before Symbol support less than s1, electronic component including an insulating support. The base of the support is provided with a through-hole for allowing the external terminal of the electronic component to pass through, and the external terminal is connected to the through-hole on the outer surface of the base that contacts the member. The electronic component according to claim 1, further comprising a concave portion for storing the electronic component. The concave portion provided on the outer surface of the base portion is a narrow groove portion having a depth that accommodates the external terminal when the external terminal is bent and has the side surface of the external terminal substantially the same surface as the outer surface of the base portion. The electronic component according to claim 2, wherein the electronic component is provided. The electronic component according to claim 2, wherein the concave portion further includes an auxiliary connection terminal extending along a length direction thereof. 5. The component support space is formed from a combination of a support column and a support column, a combination of a support column and a support wall, or a combination of a support wall and a support wall. Electronic components. 6. A combination of a support column and a support column, a combination of a support column and a support wall, or a combination of a support wall and a support wall satisfy the above-described condition of s1 <c <s2. Electronic components described in The portion of the electronic component above the annular recess is in contact with the inside of the support column and / or the support wall at a portion that is less than half the length of the upper portion. Item 7. The electronic component according to any one of Items 1 to 6 . The support posts and (or) the support wall, at a site which is joined to the base, an electronic component according to any one of claims 1 to 7, a side of the component support space, characterized in that it is chamfered . Electronic component according to any one of claims 1 to 8, wherein the electronic component is characterized in that it is a chip type aluminum electrolytic capacitor.

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