JP2013191844A - Reversing device of substrate, reversing method, and processing device of substrate - Google Patents

Reversing device of substrate, reversing method, and processing device of substrate Download PDF

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JP2013191844A
JP2013191844A JP2013029270A JP2013029270A JP2013191844A JP 2013191844 A JP2013191844 A JP 2013191844A JP 2013029270 A JP2013029270 A JP 2013029270A JP 2013029270 A JP2013029270 A JP 2013029270A JP 2013191844 A JP2013191844 A JP 2013191844A
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substrate
support member
pair
movable
support
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JP6068181B2 (en
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Masaaki Furuya
正明 古矢
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Shibaura Mechatronics Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a reversing device which can reverse a substrate without scratching or damaging the substrate.SOLUTION: A reversing device comprises: first movable support bodies 26 which are driven in an approaching and separating direction; first support members 31 which are provided on opposing surfaces of the first movable support bodies 26, and support both end parts of one face of a substrate W by tip parts; second movable support bodies 27 which are arranged in such a state as not to interfere with the first movable support bodies 26, and are driven in the approaching and separating direction; second support members 32 which are provided on opposing surfaces of the second movable support bodies 27, and in which the tip parts face both end parts of the other face of the substrate W of which both end parts of one face are supported by the first support members 31 when the second movable support bodies 27 are driven in the approaching direction; and a plurality of fall-off prevention members 36 which move in a direction approaching the outer peripheral surface of the substrate W and prevent the substrate W from moving and deviating, when the substrate W supported by the first support members is reversed and is supported by the second support members.

Description

この発明は基板の反転装置、反転方法及びその反転装置が用いられた基板の処理装置に関する。   The present invention relates to a substrate reversing apparatus, a reversing method, and a substrate processing apparatus using the reversing apparatus.

半導体ウェーハ、液晶表示装置用のガラス基板、あるいは光ディスク用ガラス基板等の基板は処理装置によって種々の処理が行なわれる。例えば、基板の一方の面に回路パターンを形成した時、その基板は回路パターンが形成された一方の面だけでなく、他方の面にも汚れ等が付着残留するから、一方の面を洗浄した後、他方の面も洗浄するということが行なわれている。   A substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, or a glass substrate for an optical disk is subjected to various processes by a processing apparatus. For example, when a circuit pattern is formed on one surface of a substrate, dirt remains on the other surface as well as one surface on which the circuit pattern is formed. Later, the other side is also cleaned.

基板の一方の面と他方の面を洗浄処理する処理装置には、上記基板の一方の面を洗浄処理する第１の処理部と、第１の処理部で一方の面が洗浄された基板の他方の面を洗浄処理する第２の処理部を備えたものがある。   A processing apparatus for cleaning one surface of a substrate and the other surface includes a first processing unit for cleaning the one surface of the substrate, and a substrate having one surface cleaned by the first processing unit. Some have a second processing unit for cleaning the other surface.

上記処理装置における第１の処理部と第２の処理部に対する基板の出し入れは、ロボットによって行なわれる。すなわち、上記第１の処理部で一方の面が洗浄処理された基板は上記ロボットによって取り出されて反転装置に供給され、ここで基板の上下面が反転させられた後、その基板は上記ロボットによって上記反転装置から取り出されて上記第２の処理部に供給され、ここで上記基板の他方の面が洗浄処理されるようになっている。   A substrate is taken in and out of the first processing unit and the second processing unit in the processing apparatus by a robot. That is, the substrate whose one surface has been cleaned by the first processing unit is taken out by the robot and supplied to the reversing device. After the upper and lower surfaces of the substrate are reversed, the substrate is moved by the robot. The substrate is taken out from the reversing device and supplied to the second processing unit, where the other surface of the substrate is cleaned.

従来、上記反転装置としては、ロータリアクチュエータによって回転駆動される固定板を有する。この固定板の一方の面と他方の面には、基板を支持する支持ピンが突設されたものが知られている（例えば、特許文献１参照。）。   Conventionally, the reversing device has a fixed plate that is rotationally driven by a rotary actuator. It is known that a support pin for supporting a substrate protrudes from one surface and the other surface of the fixing plate (see, for example, Patent Document 1).

上記固定板の一方の面側には、この固定板の一方の面に対して接離する方向に駆動される第１の可動板が設けられ、上記固定板の他方の面側には、この固定板の他方の面に対して接離する方向に駆動される第２の可動板が設けられている。上記第１の可動板における、上記固定板の一方の面に対向する面、そして第２の可動板における、上記固定板の他方の面に対向する面のそれぞれには、上記固定板の一方の面と他方の面に設けられた支持ピンとで上記基板を支持する支持ピンが突設されている。   A first movable plate is provided on one surface side of the fixed plate, and is driven in a direction approaching and separating from the one surface of the fixed plate. There is provided a second movable plate that is driven in a direction in which the other surface of the fixed plate is in contact with or separated from the other surface. Each of the surface of the first movable plate facing the one surface of the fixed plate and the surface of the second movable plate facing the other surface of the fixed plate have one of the fixed plates. A support pin for supporting the substrate is projected from a surface and a support pin provided on the other surface.

つまり、上記構成の反転装置では、上記固定板の一方の面と上記第１の可動板によって保持された基板と、上記固定板の他方の面と上記第２の可動板によって保持された基板を一度に反転させることができるようになっている。   That is, in the reversing device having the above configuration, the one surface of the fixed plate and the substrate held by the first movable plate, the other surface of the fixed plate and the substrate held by the second movable plate It can be reversed at once.

特開２００８−１６６３６８号公報JP 2008-166368 A

ところで、上記構成の反転装置によって基板を反転させる場合、上記基板は、上記固定板の上下両面、上記第１の可動板、第２の可動板にそれぞれ設けられた、支持ピンによって保持された状態で上記固定板とともに回転させられる。   By the way, when the substrate is reversed by the reversing device having the above configuration, the substrate is held by the support pins provided on the upper and lower surfaces of the fixed plate, the first movable plate, and the second movable plate, respectively. And rotated together with the fixed plate.

しかしながら、このような構成によると、上記固定板とともに、第１の可動板及び第２の可動板を一体的に回転させたとき、基板の角度が水平から９０度に近づくにつれて基板と支持ピンとの間に滑りが生じ、基板がずれ動いたり、落下する虞がある。   However, according to such a configuration, when the first movable plate and the second movable plate are rotated together with the fixed plate, the angle between the substrate and the support pin increases as the angle of the substrate approaches 90 degrees from the horizontal. There is a risk of slippage between them, causing the substrate to shift and fall.

基板が支持ピンに対してずれ動くと、基板の位置決め状態が損なわれたり、基板の板面、特に回路パターンが形成されたデバイス面に傷を付けるということがあり、落下した場合には基板が破損する虞がある。   If the board moves relative to the support pins, the positioning of the board may be impaired, or the board surface of the board, particularly the device surface on which the circuit pattern is formed, may be damaged. There is a risk of damage.

基板が支持ピンに対してずれ動くのを防止するためには、支持ピンを基板の板面に強く圧接させて基板を支持することが考えられる。しかしながら、支持ピンを基板の板面に強く圧接させのでは、基板に局部的な大きな応力が加わることになるから、支持ピンが基板を傷つけたり、損傷させることになり、好ましくないということがある。   In order to prevent the substrate from moving with respect to the support pins, it is conceivable to support the substrate by strongly pressing the support pins against the plate surface of the substrate. However, if the support pins are strongly pressed against the plate surface of the substrate, a large local stress is applied to the substrate, which may be undesirable because the support pins may damage or damage the substrate. .

この発明は、基板を反転させるときに、基板に局部的な応力を加えることなく、基板がずれ動くことを防止することができるようにした、基板の反転装置、反転方法及びその反転装置を用いた処理装置を提供することにある。   The present invention uses a substrate reversing device, a reversing method, and a reversing device which can prevent the substrate from shifting when a substrate is reversed without applying local stress to the substrate. It is to provide a processing apparatus.

前記課題を解決し目的を達成するために、本発明の基板の反転装置、反転方法及びその反転装置を用いた処理装置は次のように構成されている。   In order to solve the above-described problems and achieve the object, a substrate reversing apparatus, a reversing method, and a processing apparatus using the reversing apparatus of the present invention are configured as follows.

（１）回転駆動源によって回転駆動される回転体と、この回転体の回転軸方向に沿って所定間隔で離間対向して配置され第１の駆動手段によって接離する方向に駆動される一対の第１の可動支持体と、上記一対の第１の可動支持体の対向する面に上記回転軸方向に対して直交する方向に設けられ先端部によって上記基板の一方の面の所定方向の両端部を支持する第１の支持部材と、上記回転体の回転軸方向に沿って所定間隔で離間対向し、かつ上記第１の可動支持体と干渉しない状態で配置されて第２の駆動手段によって接離する方向に駆動される一対の第２の可動支持体と、上記一対の第２の可動支持体の対向する面に上記回転軸方向に対して直交する方向に設けられ一対の上記第２の可動支持体が接近方向に駆動されたときに先端部が上記第１の支持部材によって一方の面の所定方向の両端部が支持された上記基板の他方の面の上記所定方向の両端部に対向する第２の支持部材と、上記回転体の回転軸方向に沿って所定間隔で離間対向し、かつ上記第１、第２の可動支持体と干渉しない状態で配置されて第３の駆動手段によって接離する方向に駆動される一対の第３の可動支持体と、上記一対の第３の可動支持体の対向する面に上記回転軸方向に対して直交する方向に設けられ、一対の上記第３の可動支持体が互いに接近する方向に駆動されることで、上記回転駆動源によって上記回転体を１８０度回転させ上記第１の支持部材に支持された基板を反転させて上記第２の支持部材によって支持するときに上記基板の上記所定方向の両端部の外周面に接近する方向に移動して上記基板が上記第１、第２の支持部材の間でずれ動くのを阻止する複数の抜出防止部材とを具備した。 (1) A pair of rotating bodies that are rotationally driven by a rotational driving source, and a pair of elements that are arranged to be spaced apart from each other at a predetermined interval along the direction of the rotational axis of the rotating body and are driven in the direction of contact and separation by the first driving means. The first movable support and the opposite ends of one side of the substrate in a predetermined direction provided on the opposing surfaces of the pair of first movable supports in a direction perpendicular to the rotation axis direction And a first support member that supports the first movable support member at a predetermined interval along the direction of the rotation axis of the rotating body and that does not interfere with the first movable support member and is in contact with the second driving means. A pair of second movable supports that are driven in a separating direction, and a pair of second movable supports that are provided on opposite surfaces of the pair of second movable supports in a direction perpendicular to the rotational axis direction. When the movable support is driven in the approach direction, the tip A second support member opposed to both end portions in the predetermined direction of the other surface of the substrate, wherein both end portions of the one surface in the predetermined direction are supported by the first support member; and a rotation axis direction of the rotating body. A pair of third movable supports that are spaced apart from each other at a predetermined interval and that are arranged in a state that does not interfere with the first and second movable supports and that are driven in the direction of contact and separation by the third driving means. And the pair of third movable supports are provided in opposite directions to the rotation axis direction and are driven in directions in which the pair of third movable supports are close to each other. When the rotating body is rotated 180 degrees by the rotation drive source and the substrate supported by the first support member is reversed and supported by the second support member, both ends of the substrate in the predetermined direction are reversed. Move in the direction approaching the outer peripheral surface Plate is provided with a plurality of draw-out prevention member for preventing the movement displacement between said first and second support members.

（２）基板の一方の面の所定方向の両端部を、接離する方向に駆動可能に設けられた左右一対の第１の支持部材によって支持する工程と、上記一対の第１の支持部材によって一方の面の所定方向の両端部が支持された上記基板の他方の面の上記所定方向の両端部に、接離する方向に駆動可能に設けられた左右一対の第２の支持部材を対向位置させる工程と、上記基板の上記所定方向の両端部の外面に上記基板が上記第１の支持部材と第２の支持部材の間でずれ動くのを防止する抜出防止部材を接近する方向に移動させる工程と、上記第１の支持部材、第２の支持部材及び上記抜出防止部材とともに上記基板を１８０度回転させてこの基板を反転させる工程とを具備した。 (2) A step of supporting both end portions of one surface of the substrate in a predetermined direction by a pair of left and right first support members provided so as to be able to be driven in and away from each other, and the pair of first support members. A pair of left and right second support members provided so as to be able to be driven in and away from the both ends in the predetermined direction on the other surface of the substrate on which both ends in a predetermined direction of one surface are supported are opposed to each other. And a step of moving an anti-extraction member that prevents the substrate from shifting between the first support member and the second support member to the outer surface of both end portions in the predetermined direction of the substrate. And a step of rotating the substrate 180 degrees together with the first support member, the second support member, and the extraction preventing member and inverting the substrate.

（３）基板の一方の面を処理してから、他方の面を処理する基板の処理装置であって、上記基板の一方の面を処理する第１の処理部と、一方の面が処理された基板を反転させる反転装置と、反転された基板の他方の面を処理する第２の処理部を具備し、上記反転装置は（１）記載の構成である。 (3) A substrate processing apparatus for processing one surface of a substrate and then processing the other surface, wherein a first processing unit for processing one surface of the substrate and one surface are processed. A reversing device for reversing the substrate and a second processing unit for processing the other surface of the reversed substrate, the reversing device having the configuration described in (1).

この発明によれば、基板の反転時、基板に局部的な応力を加えることなく、第１、第２の支持部材と基板間でのずれの発生を防止することができる。   According to the present invention, it is possible to prevent occurrence of displacement between the first and second support members and the substrate without applying local stress to the substrate when the substrate is reversed.

この発明の第１の実施の形態を示す、基板の処理装置の概略的構成を示す平面図。The top view which shows schematic structure of the processing apparatus of a substrate which shows 1st Embodiment of this invention. 図１の処理装置に用いられた反転装置が有する第１の支持部材に、基板が支持された状態を示す正面図。The front view which shows the state by which the board | substrate was supported by the 1st supporting member which the inversion apparatus used for the processing apparatus of FIG. 1 has. 第１の支持部材によって支持された基板の上面に、第２の支持部材を前進させた状態を示す正面図。The front view which shows the state which advanced the 2nd support member on the upper surface of the board | substrate supported by the 1st support member. 図２のＱ−Ｑ線に沿って一部断面した反転装置の平面図。FIG. 3 is a plan view of a reversing device partially cut along a line QQ in FIG. 2. 反転装置の回転体を図３に示す状態から１８０度回転させることで基板を反転させた状態の正面図。The front view of the state which reversed the board | substrate by rotating the rotary body of the inversion apparatus 180 degree | times from the state shown in FIG. 図５Ａに示す状態で、基板の上面側に位置する第２の支持部材を離反する方向である、後退方向に駆動した状態を示す反転装置の正面図。FIG. 5B is a front view of the reversing device showing a state in which the second support member located on the upper surface side of the substrate is separated in the state shown in FIG. 反転装置に組み込まれた第１，第２，第３の可動支持体、第１，第２の支持部材を分解して示す斜視図。The perspective view which decomposes | disassembles and shows the 1st, 2nd, 3rd movable support body integrated in the inversion apparatus, and the 1st, 2nd support member. 反転装置が有する第１の支持部材によって基板を支持してから、第２の支持部材と抜出防止部材を接近方向である前進方向に駆動する状態を、順次示した回転体の一端部の斜視図。After the substrate is supported by the first support member included in the reversing device, the state in which the second support member and the extraction preventing member are driven in the forward direction, which is the approaching direction, is sequentially shown in a perspective view of one end of the rotating body. Figure. 反転装置が有する第１の支持部材によって基板を支持してから、第２の支持部材と抜出防止部材を接近方向である前進方向に駆動する状態を、順次示した回転体の一端部の斜視図。After the substrate is supported by the first support member included in the reversing device, the state in which the second support member and the extraction preventing member are driven in the forward direction, which is the approaching direction, is sequentially shown in a perspective view of one end of the rotating body. Figure. 反転装置が有する第１の支持部材によって基板を支持してから、第２の支持部材と抜出防止部材を接近方向である前進方向に駆動する状態を、順次示した回転体の一端部の斜視図。After the substrate is supported by the first support member included in the reversing device, the state in which the second support member and the extraction preventing member are driven in the forward direction, which is the approaching direction, is sequentially shown in a perspective view of one end of the rotating body. Figure. 図７Ｃに示す状態から回転体を１８０度回転させることで基板を反転させた状態を示す斜視図。The perspective view which shows the state which reversed the board | substrate by rotating a rotary body 180 degree | times from the state shown to FIG. 7C. 反転された基板の上面側に位置する第２の支持部材を離反方向である、後退方向に駆動した状態を示す斜視図。The perspective view which shows the state which driven the 2nd supporting member located in the upper surface side of the reversed board | substrate to the retraction direction which is a separation direction. この発明の第２の実施の形態を示し、第１の支持部材によって基板を支持した状態を示す、回転体の一端部の斜視図、The perspective view of the one end part of a rotary body which shows the 2nd Embodiment of this invention and shows the state which supported the board | substrate with the 1st support member, 第１の支持部材によって支持された基板に対して第２の支持部材と脱落防止部材とを接近方向である、前進方向へ駆動した状態を示す斜視図。The perspective view which shows the state which driven the 2nd support member and the drop-off prevention member with respect to the board | substrate supported by the 1st support member to the advancing direction which is an approach direction.

以下、この発明の実施の形態を図面を参照しながら説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１乃至図８Ｂはこの発明の第１の実施の形態を示す。なお、これらの図において、図中矢印ＸＹＺは互いに直交する三方向を示し、矢印ＸＹは水平方向、矢印Ｚは鉛直方向を示している。図１は半導体ウェーハ等の基板Ｗの処理装置１を示す平面図であって、この処理装置１は本体２を備えている。この本体２のＸ方向（図１における左右方向）の一側には、基板Ｗの供給部が設けられる。この実施の形態では、４つの収納ケース３が上記Ｘ方向とは直交する幅方向（図１における上下方向）に沿って一列に配置されている。各収納ケース３は、複数の基板Ｗを上下方向に所定間隔で収納保持する。   1 to 8B show a first embodiment of the present invention. In these figures, arrows XYZ indicate three directions orthogonal to each other, arrow XY indicates a horizontal direction, and arrow Z indicates a vertical direction. FIG. 1 is a plan view showing a processing apparatus 1 for a substrate W such as a semiconductor wafer. The processing apparatus 1 includes a main body 2. On one side of the main body 2 in the X direction (left and right direction in FIG. 1), a substrate W supply unit is provided. In this embodiment, the four storage cases 3 are arranged in a line along the width direction (vertical direction in FIG. 1) perpendicular to the X direction. Each storage case 3 stores and holds a plurality of substrates W at predetermined intervals in the vertical direction.

上記本体２のＸ方向一端部の、上記収納ケース３と対向する部位には、上記本体２の幅方向に沿ってガイドレール５が設けられている。このガイドレール５には、回転方向に３６０度の範囲で駆動される第１のロボット４が上記ガイドレール５に沿って駆動可能に配置されている。この第１のロボット４は伸縮方向に駆動される第１のアーム４ａと第２のアーム４ｂを有する。両アーム４ａと４ｂは、上記収納ケース３に上下方向に所定間隔で収容された基板Ｗの間隔と同じ間隔で上下方向に設けられている。   A guide rail 5 is provided along the width direction of the main body 2 at a portion of the one end portion in the X direction of the main body 2 facing the storage case 3. On the guide rail 5, a first robot 4 that is driven in the range of 360 degrees in the rotation direction is disposed so as to be driven along the guide rail 5. The first robot 4 has a first arm 4a and a second arm 4b that are driven in the extending and contracting direction. Both arms 4a and 4b are provided in the vertical direction at the same interval as the interval of the substrates W accommodated in the storage case 3 in the vertical direction at a predetermined interval.

したがって、上記第１のロボット４が１つの収納ケース３に対向する位置に位置決めされた状態で、２つのアーム４ａ，４ｂを用いて収納ケース３から未処理の２枚の基板Ｗを同時に取り出したり、一方のアーム４ａによって収納ケース３から未処理の基板Ｗを取り出しながら、他方のアーム４ｂに保持された、後述するように洗浄処理された基板Ｗを上記収納ケース３に格納する等のことができるようになっている。なお、２つのアーム４ａ，４ｂの使用方法は種々選択することが可能である。   Accordingly, two unprocessed substrates W can be simultaneously taken out of the storage case 3 using the two arms 4a and 4b in a state where the first robot 4 is positioned at a position facing the single storage case 3. While the unprocessed substrate W is taken out from the storage case 3 by one arm 4a, the cleaned substrate W held by the other arm 4b as described later is stored in the storage case 3. It can be done. Note that the usage method of the two arms 4a and 4b can be variously selected.

上記本体２内の上記第１のロボット４が配置された箇所よりもＸ方向の他端側のＹ方向一端側には、一対の第１の処理部８が並んで配置され、この第１の処理部８と対向するＹ方向の他端側には一対の第２の処理部９が並んで配置されている。   A pair of first processing units 8 are arranged side by side on one end side in the Y direction on the other end side in the X direction from the place where the first robot 4 is disposed in the main body 2. A pair of second processing units 9 are arranged side by side on the other end side in the Y direction facing the processing unit 8.

この実施の形態では、上記第１の処理部８は未処理の基板Ｗのデバイス面である一方の面を洗浄処理し、上記第２の処理部９は上記第１の処理部８で一方の面が洗浄処理された基板Ｗの他方の面を洗浄処理するようになっている。   In this embodiment, the first processing unit 8 cleans one surface, which is the device surface of the unprocessed substrate W, and the second processing unit 9 uses one of the first processing unit 8 and the other processing surface. The other surface of the substrate W whose surface has been cleaned is cleaned.

上記一対の第１の処理部８と第２の処理部９との間には周方向に３６０度の範囲で回転駆動される第２のロボット１１が設けられている。この第２のロボット１１には上記第１のロボット４と同様、上下方向に所定の間隔で離間し、かつ伸縮方向に駆動される第１のアーム１１ａと第２のアーム１１ｂが設けられている。   Between the pair of first processing unit 8 and second processing unit 9, there is provided a second robot 11 that is rotationally driven in the range of 360 degrees in the circumferential direction. Similar to the first robot 4, the second robot 11 is provided with a first arm 11 a and a second arm 11 b that are spaced apart at a predetermined interval in the vertical direction and driven in the expansion / contraction direction. .

上記第１の処理部８と第２の処理部９の間で、しかも上記第１のロボット４と第２のロボット１１との間の部分には、反転装置１２が配置されている。この反転装置１２には、後述するように上記収納ケース３から上記第１のロボット４によって取り出された未処理の基板Ｗが供給される。   A reversing device 12 is disposed between the first processing unit 8 and the second processing unit 9 and between the first robot 4 and the second robot 11. The reversing device 12 is supplied with an unprocessed substrate W taken out from the storage case 3 by the first robot 4 as described later.

上記反転装置１２に供給された未処理の基板Ｗは、上記第２のロボット１１によって取り出されて上記第１の処理部８に供給される。上記第１の処理部８で一方の面が処理された基板Ｗは、上記第２のロボット１１によって取り出され、上記反転装置１２に供給される。   The unprocessed substrate W supplied to the reversing device 12 is taken out by the second robot 11 and supplied to the first processing unit 8. The substrate W whose one surface has been processed by the first processing unit 8 is taken out by the second robot 11 and supplied to the reversing device 12.

一方の面が処理された基板Ｗが上記反転装置１２に所定枚数供給されると、この反転装置１２が作動して後述するように基板Ｗをその上下面が逆になるよう１８０度回転させる。つまり、基板Ｗを反転させる。   When a predetermined number of substrates W on which one surface has been processed are supplied to the reversing device 12, the reversing device 12 operates to rotate the substrate W 180 degrees so that the upper and lower surfaces are reversed as described later. That is, the substrate W is inverted.

上記反転装置１２によって反転させられた基板Ｗは、上記第２のロボット１１によって取り出されて上記第２の処理部９に供給され、ここで上記基板Ｗの他方の面が処理される。   The substrate W reversed by the reversing device 12 is taken out by the second robot 11 and supplied to the second processing unit 9, where the other surface of the substrate W is processed.

上記第２の処理部９で処理された基板Ｗは、上記第２のロボット１１によって取り出されて上記反転装置１２に戻される。反転装置１２に戻された基板Ｗは、この反転装置１２によって反転させられ、第１の処理部８で処理された面（デバイス面）が上を向く状態とされ後、上記第１のロボット４によって取り出され、上記収納ケース３における未処理の基板Ｗが取り出された箇所に格納される。   The substrate W processed by the second processing unit 9 is taken out by the second robot 11 and returned to the reversing device 12. The substrate W returned to the reversing device 12 is reversed by the reversing device 12 so that the surface (device surface) processed by the first processing unit 8 faces upward, and then the first robot 4 is turned on. And is stored in the storage case 3 where the unprocessed substrate W is removed.

なお、上記第２の処理部９で処理され、そして上記反転装置１２に戻された基板Ｗは、その後、上記反転装置１２によって反転させられることなく、上記第１のロボット４によって取り出されて上記収納ケース３に格納される場合もある。また、基板Ｗの一方の面は処理せずに反転だけさせ、その後、他方の面だけを処理する場合もある。   The substrate W processed by the second processing unit 9 and returned to the reversing device 12 is then taken out by the first robot 4 without being reversed by the reversing device 12, and the substrate W is reversed. It may be stored in the storage case 3. Further, there is a case where one surface of the substrate W is merely inverted without being processed, and then only the other surface is processed.

上記第１、第２のロボット４，１１は、上述したように上下方向に所定間隔で離間した第１のアーム４ａ，１１ａと第２のアーム４ｂ，１１ｂを有する。そのため、各ロボット４，１１は、両面が処理された基板Ｗを一方のアーム４ａ，１１ａで搬送し、未処理の基板Ｗを他方のアーム４ｂ，１１ｂで搬送することも可能であり、その場合には、両面が処理された基板Ｗを上側に位置する一方のアーム４ａ，１１ａで搬送し、未処理の基板Ｗを下側に位置する他方のアーム４ｂ，１１ｂで搬送する。   As described above, the first and second robots 4 and 11 include the first arms 4a and 11a and the second arms 4b and 11b that are spaced apart at a predetermined interval in the vertical direction. Therefore, each robot 4 and 11 can also transfer the substrate W on which both sides have been processed by one arm 4a and 11a, and can transfer the unprocessed substrate W by the other arm 4b and 11b. In this case, the processed substrate W is transported by one arm 4a, 11a positioned on the upper side, and the unprocessed substrate W is transported by the other arm 4b, 11b positioned on the lower side.

それによって、処理された基板Ｗが未処理の基板Ｗから落下する汚れによって汚染されるのを防止することができる。   Accordingly, it is possible to prevent the processed substrate W from being contaminated by dirt that falls from the unprocessed substrate W.

なお、上記第２のロボット１１は、一対の第１の処理部８と第２の処理部９の対向面間において、本体２のＸ方向におけるほぼ中央に設置されている。それによって、上記第２のロボット１１が３６０度回転することにより、２つの第１の処理部８と２つの第２の処理部９に第１、第２のアーム１１ａ，１１ｂを出し入れできるようになっている。   Note that the second robot 11 is installed at a substantially central position in the X direction of the main body 2 between the opposing surfaces of the pair of first processing unit 8 and second processing unit 9. As a result, the second robot 11 rotates 360 degrees so that the first and second arms 11a and 11b can be taken in and out of the two first processing units 8 and the two second processing units 9. It has become.

図２と図３は上記反転装置１２の正面図で、図４は図２のＱ−Ｑ線に沿う一部断面した反転装置１２の平面図である。上記反転装置１２は、回転体１６を有する。この回転体１６は、図２と図３において、下側に位置する第１のベース板１７と、この第１のベース板１７の上方に上記第１のベース板１７とは所定間隔で離間し対向して配置された第２のベース板１８、上記第１、第２のベース板１７，１８のＸ方向一端を連結した第１の端板１９、上記第１、第２のベース板１７，１８のＸ方向他端に連結され、上記第１の端板１９に比べて長尺な第２の端板２１、及び上記第１、第２のベース板１７，１８のＹ方向両端側（図４における上下方向）の開口部分を閉塞した一対の側板２２（図４参照）によってＹ方向（所定方向）に対して長尺な箱型状に形成されている。   2 and 3 are front views of the reversing device 12, and FIG. 4 is a plan view of the reversing device 12 partially cut along the line QQ in FIG. The reversing device 12 has a rotating body 16. 2 and 3, the rotating body 16 is separated from the first base plate 17 located on the lower side by a predetermined interval above the first base plate 17. A second base plate 18 disposed opposite to the first end plate 19 connecting one end in the X direction of the first and second base plates 17, 18, the first and second base plates 17, 18 is connected to the other end in the X direction, and is longer than the first end plate 19, and is longer than the first end plate 19, and both end sides in the Y direction of the first and second base plates 17 and 18 (see FIG. 4 is formed in a box shape that is long in the Y direction (predetermined direction) by a pair of side plates 22 (see FIG. 4) that closes the opening portion in the vertical direction.

上記回転体１６の上記第２の端板２１の外面には、ロータリアクチュエータ等からなる回転駆動源２３の駆動軸２３ａが連結されている。この回転駆動源２３は、架台等の固定部２４に取り付け固定されている。   A drive shaft 23a of a rotary drive source 23 composed of a rotary actuator or the like is connected to the outer surface of the second end plate 21 of the rotating body 16. The rotation drive source 23 is fixedly attached to a fixing part 24 such as a gantry.

したがって、上記回転体１６は、図２と図３に示すように第１のベース板１７が下方に位置する第１の状態と、図５Ａと図５Ｂに示すように上記第１の状態から１８０度回転されて上記第１のベース板１７が上方に位置する第２の状態との間で回転駆動されるようになっている。   Therefore, the rotating body 16 is 180 degrees from the first state where the first base plate 17 is positioned below as shown in FIGS. 2 and 3 and from the first state as shown in FIGS. 5A and 5B. And the first base plate 17 is rotationally driven between the second state where the first base plate 17 is positioned above.

なお、上記回転体１６の長さ寸法が大きくなったり、高重量化するような場合には、この回転体１６のＸ方向一端側の第１の端板１９を上記第２の端板２１と同じ長さにし、この第１の端板１９の上記回転駆動源２３の駆動軸２３ａの軸芯と同じ高さ位置を回転可能に支持する構成とすれば、上記回転体１６が片持ち状態となって撓むのを防止することができる。   When the length of the rotating body 16 is increased or the weight is increased, the first end plate 19 on one end side in the X direction of the rotating body 16 is replaced with the second end plate 21. If the first end plate 19 is configured to rotatably support the same height position as the axis of the drive shaft 23a of the rotary drive source 23 of the first end plate 19, the rotary body 16 is in a cantilever state. And can be prevented from bending.

図２と図３には、上記回転体１６の回転中心となる回転軸、つまり上記回転駆動源２３の駆動軸２３ａの軸中心をＬで示す。上記回転体１６の回転軸Ｌ方向に沿うＸ方向の両端部には、図４に示すように上記回転体１６のＸ方向の寸法（図４における上下方向の寸法）の半分よりもわずかに小さな幅寸法を有する一対の第１の可動支持体２６と、一対の第２の可動支持体２７が上記回転体１６の幅方向に対して位置をずらして配置されている。   2 and 3, the rotation axis serving as the rotation center of the rotator 16, that is, the axis center of the drive shaft 23 a of the rotation drive source 23 is indicated by L. At both ends in the X direction along the rotation axis L direction of the rotating body 16, as shown in FIG. 4, it is slightly smaller than half of the dimension in the X direction of the rotating body 16 (the vertical dimension in FIG. 4). A pair of first movable support bodies 26 having a width dimension and a pair of second movable support bodies 27 are arranged with their positions shifted with respect to the width direction of the rotating body 16.

上記第１の可動支持体２６と第２の可動支持体２７は、上記回転軸Ｌに対して直交する方向、つまり上記回転体１６の第２のベース板１８の板面に対して直交する方向に、しかも下端を除く部分が上記第２のベース板１８の上方に突出するよう配置されている。   The first movable support body 26 and the second movable support body 27 are perpendicular to the rotation axis L, that is, perpendicular to the plate surface of the second base plate 18 of the rotary body 16. In addition, the portion excluding the lower end is arranged so as to protrude above the second base plate 18.

上記一対の第１の可動支持体２６は、上記第１のベース板１７の上面に配置された第１の駆動手段としての一対の第１のシリンダ２８のロッド２８ａに連結され、これら第１のシリンダ２８によって互いに接離する方向に駆動されるようになっている。   The pair of first movable supports 26 are connected to rods 28a of a pair of first cylinders 28 as first driving means disposed on the upper surface of the first base plate 17, and these first The cylinders 28 are driven so as to be in contact with and away from each other.

上記一対の第２の可動支持体２７は、上記第１のベース板１７の上面に上記第１のシリンダ２８と並設された第２の駆動手段としての一対の第２のシリンダ３９のロッド２９ａに連結され、これら第２のシリンダ２９によって互いに接離する方向に、しかも上記第１の可動支持体２６に干渉しないよう駆動されるようになっている。   The pair of second movable support bodies 27 are rods 29a of a pair of second cylinders 39 as second driving means arranged in parallel with the first cylinders 28 on the upper surface of the first base plate 17. And is driven by these second cylinders 29 so as to contact and separate from each other and so as not to interfere with the first movable support 26.

図６は、第１，第２，第３の可動支持体２６，２７，３４及び第１，第２の支持部材３１，３２を分解して示す斜視図である。   FIG. 6 is an exploded perspective view showing the first, second, and third movable supports 26, 27, and 34 and the first and second support members 31 and 32. As shown in FIG.

なお、上記第１、第２の可動支持体２６，２７は、下端部を上記第２のベース板１８に形成された長孔１８ａからこの第２のベース板１８の下面側に突出させ、その突出端部に第１、第２のシリンダ２８，２９のロッド２８ａ，２９ａが連結されている。   The first and second movable supports 26 and 27 have lower ends protruding from the long holes 18a formed in the second base plate 18 to the lower surface side of the second base plate 18, The rods 28a and 29a of the first and second cylinders 28 and 29 are connected to the projecting ends.

さらに、上記第１、第２の可動支持体２６，２７は、長孔１８ａによって上記第２のベース板１８に移動可能に支持される。それによって、上記第１、第２の可動支持体２６，２７は、上記第１、第２のシリンダ２８，２９によって接離する方向に円滑に駆動されるようになっている。   Further, the first and second movable supports 26 and 27 are movably supported by the second base plate 18 through the long holes 18a. As a result, the first and second movable supports 26 and 27 are smoothly driven in the direction of contacting and separating by the first and second cylinders 28 and 29.

上記一対の第１の可動支持体２６の内面、つまり互いに対向する面には、先端が上記基板Ｗの外周面と同じ円弧形状に形成された、複数（この実施の形態では５つ）の第１の支持部材３１が基端を連結して上下方向に設けられている。   A plurality (five in this embodiment) of the inner surfaces of the pair of first movable supports 26, that is, surfaces facing each other, are formed in the same arc shape as the outer peripheral surface of the substrate W. One support member 31 is provided in the vertical direction by connecting the base ends.

５つの第１の支持部材３１は、上記収納ケース３に収容された基板Ｗの上下方向の間隔と同じ間隔で設けられていて、その円弧形状の先端部の上面は、先端から基端側に向かって次第に厚くなる第１のテーパ面３１ａに形成されている。上記基板ＷのＹ方向における両端部の一方の面である下面は、上記第１のテーパ面３１ａによって端縁が線接触した状態で支持される。   The five first support members 31 are provided at the same interval as the interval in the vertical direction of the substrate W accommodated in the storage case 3, and the upper surface of the arc-shaped distal end portion extends from the distal end to the proximal end side. It is formed on the first taper surface 31a that gradually increases in thickness. The lower surface, which is one surface at both ends of the substrate W in the Y direction, is supported by the first tapered surface 31a in a state where the edge is in line contact.

上記一対の第２の可動支持体２７の内面、つまり互いに対向する面には、先端が上記基板Ｗの外周面と同じ円弧形状に形成された、複数（この実施の形態では５つ）の第２の支持部材３２が基端を連結して上下方向に設けられている。   A plurality (five in this embodiment) of the inner surfaces of the pair of second movable supports 27, that is, the surfaces facing each other, are formed in the same arc shape as the outer peripheral surface of the substrate W. Two support members 32 are provided in the vertical direction by connecting the base ends.

５つの上記第２の支持部材３２は、上記収納ケース３に収容された基板Ｗの上下方向の間隔と同じ間隔で設けられていて、先端部の下面が基端側に向かって次第に厚くなる第２のテーパ面３２ａに形成されている。   The five second support members 32 are provided at the same interval as the interval in the vertical direction of the substrate W accommodated in the accommodation case 3, and the lower surface of the distal end portion becomes gradually thicker toward the proximal end side. 2 taper surfaces 32a.

上記第２の支持部材３２は、上記第１の支持部材３１に支持された上記第１の上記基板Ｗの上面よりもわずかに上方に位置する高さで上記第２の可動支持体２７にその基端が連結固定されている。   The second support member 32 is disposed on the second movable support 27 at a height slightly above the upper surface of the first substrate W supported by the first support member 31. The base end is connected and fixed.

図２は一対の第１の可動支持体２６が第１のシリンダ２８によって接近方向に駆動され、一対の第２の可動支持体２７が離反方向に位置する状態を示している。一対の第１の可動支持体２６が接近方向に駆動された状態では、各第１の可動支持体２６に設けられた対向する高さにある一対の第１の支持部材３１の第１のテーパ面３１ａによって、上記基板ＷはそのＹ方向の両端部の端縁が線接触させた状態で支持される。   FIG. 2 shows a state in which the pair of first movable supports 26 are driven in the approaching direction by the first cylinder 28 and the pair of second movable supports 27 are positioned in the separation direction. In a state where the pair of first movable support members 26 are driven in the approaching direction, the first taper of the pair of first support members 31 provided at the opposing heights provided on each first movable support member 26. The substrate 31 is supported by the surface 31a in a state where the edges of both ends in the Y direction are in line contact.

その状態で、上記一対の第２の可動支持体２７が第２のシリンダ２９によって接近方向に駆動されると、図３に示すように、上記第２の支持部材３２の第２のテーパ面３２ａが、上記基板ＷにおけるＹ方向両端部の部分、つまり上記第１の支持部材３１の第１のテーパ面３１ａによって支持された部分の上方にわずかな間隔を有して対向するか、若しくは上記第２のテーパ面３２ａが、基板ＷのＹ方向の両端部の端縁に接触するようになっている。   In this state, when the pair of second movable support bodies 27 are driven in the approaching direction by the second cylinder 29, the second tapered surface 32a of the second support member 32 is shown in FIG. Are opposed to each other with a slight gap above the portions of the substrate W at both ends in the Y direction, that is, the portions supported by the first tapered surface 31a of the first support member 31, or the first The two tapered surfaces 32 a come into contact with the edges of both ends of the substrate W in the Y direction.

上記第１の支持部材３１の基端側は、図４に示すようにＹ方向における第２の可動支持体２７側の部分に階段状の切り欠き部３１ｂが形成されている。上記第２の支持部材３２の基端側は、図４に示すようにＹ方向における第１の可動支持体２６側の部分に階段状の切り欠き部３２ｂが形成されている。   On the base end side of the first support member 31, a stepped notch 31b is formed in a portion on the second movable support 27 side in the Y direction as shown in FIG. On the base end side of the second support member 32, a stepped notch 32b is formed in a portion on the first movable support 26 side in the Y direction as shown in FIG.

上記回転体１６には、回転軸Ｌに沿うＹ方向の両端部に、一対の第３の可動支持体３４が配置されている。この第３の可動支持体３４は、上記回転体１６の上記第１のベース板１７を除く部分を内部に収容する矩形枠状に形成されていて、Ｙ方向に沿って移動可能に設けられている。   A pair of third movable support bodies 34 are disposed on the rotating body 16 at both ends in the Y direction along the rotation axis L. The third movable support 34 is formed in a rectangular frame shape that accommodates a portion of the rotating body 16 excluding the first base plate 17 and is provided so as to be movable along the Y direction. Yes.

上記一対の第３の可動支持体３４における上記第２のベース板１８の下面側に位置する下端部には、上記第２のベース板１８の下面に設けられた第３の駆動手段としての第３のシリンダ３５のロッド３５ａが連結されている。   The pair of third movable supports 34 has a lower end portion located on the lower surface side of the second base plate 18 and a third driving means provided on the lower surface of the second base plate 18. The rods 35a of the three cylinders 35 are connected.

それによって、一対の第３の可動支持体３４は上記第１、第２の可動支持体２６，２７に干渉しない状態で、上記第３のシリンダ３５によって接離する方向に駆動されるようになっている。つまり、第１乃至第３の可動支持体２６，２７，３４は互いに干渉し合うことなく接離する方向に駆動可能に設けられている。   As a result, the pair of third movable supports 34 are driven in the direction of contacting and separating by the third cylinder 35 without interfering with the first and second movable supports 26 and 27. ing. That is, the first to third movable supports 26, 27, and 34 are provided so as to be able to be driven in the direction of contact and separation without interfering with each other.

なお、上記第３の可動支持体３４は、上記第２のベース板１８に対して長孔１８ａによって移動可能に支持されている。それによって、上記第３の可動支持体３４が上記第３のシリンダ３５によって駆動されたとき、接離する方向に対する移動が円滑に行なわれるようになっている。   Note that the third movable support 34 is supported by the long base 18 so as to be movable with respect to the second base plate 18. As a result, when the third movable support 34 is driven by the third cylinder 35, the movement in the contacting / separating direction is performed smoothly.

上記一対の第３の可動体３４の互いに対向する面には、図４、図７に示すように、上記第１、第２の支持部材３１，３２の両側に位置する一対の抜出防止部材３６が、上記第１の支持部材３１によって支持された上記基板Ｗの外周面と同じ高さで設けられている。   As shown in FIGS. 4 and 7, a pair of anti-extraction members located on both sides of the first and second support members 31 and 32 are provided on the surfaces of the pair of third movable bodies 34 facing each other. 36 is provided at the same height as the outer peripheral surface of the substrate W supported by the first support member 31.

各抜出防止部材３６の先端面は、図４に示すように、上記基板Ｗの外周面と同じ曲率の円弧状に形成されていて、一対の第３の可動体３４が上記第３のシリンダ３５によって接近方向に駆動されると、上記抜出防止部材３６の先端面は、上記基板Ｗの外周面に当接するようになっている。なおこの実施の形態において、上記基板Ｗに対する上記抜出防止部材３６の先端面の当接箇所は、上記基板ＷのＹ方向両端部における、上記第１の支持部材３１と第２の支持部材３２が対向する部位の両側に位置する外周面である。   As shown in FIG. 4, the leading end surface of each extraction preventing member 36 is formed in an arc shape having the same curvature as the outer peripheral surface of the substrate W, and a pair of third movable bodies 34 are formed by the third cylinder. When driven in the approach direction by 35, the leading end surface of the extraction preventing member 36 comes into contact with the outer peripheral surface of the substrate W. In this embodiment, the first support member 31 and the second support member 32 are in contact with the front end surface of the extraction preventing member 36 with respect to the substrate W at both ends in the Y direction of the substrate W. Are the outer peripheral surfaces located on both sides of the opposite part.

そのため、その状態で上記回転体１６が上記回転駆動源２３によって回転駆動されると、上記第１の支持部材３１の第１のテーパ面３１ａによって支持された基板Ｗの端縁がずれ動くのが上記抜出防止部材３６によって阻止された状態で、上記回転体１６と一体的に回転するようになっている。   Therefore, when the rotator 16 is rotationally driven by the rotational drive source 23 in this state, the edge of the substrate W supported by the first tapered surface 31a of the first support member 31 is displaced. The rotor 16 is rotated integrally with the rotating body 16 while being blocked by the extraction preventing member 36.

上記抜出防止部材３６は基板Ｗを保持するという機能だけでなく、第１、第２のロボット４，１１が上記基板Ｗを取り出すことができる位置に上記基板Ｗを位置決めするという機能もある。   The extraction preventing member 36 has not only a function of holding the substrate W but also a function of positioning the substrate W at a position where the first and second robots 4 and 11 can take out the substrate W.

また、一対の抜出防止部材３６がともに基板Ｗの外周面に当接する必要はなく、一方の抜出防止部材３６だけが基板Ｗの外周面に当接して、その基板Ｗの位置出し（センタリング）を行なうこともある。また、基板Ｗが最初から位置出しされた位置に保持されているならば、上記抜出防止部材３６を基板Ｗに当接させて位置出しをする必要はない。   Further, it is not necessary for both of the pair of anti-extraction members 36 to contact the outer peripheral surface of the substrate W, and only one of the anti-extraction members 36 contacts the outer peripheral surface of the substrate W to position the substrate W (centering). ). Further, if the substrate W is held at the position positioned from the beginning, there is no need to position the extraction preventing member 36 in contact with the substrate W.

なお、上記回転駆動源２３の駆動軸２３ａの回転軸Ｌの中心は、第１の可動体２６に設けられた５つの第１の支持部材３１の下から３つ目の支持部材３１に支持された基板Ｗの厚さ方向中央と同じ高さ位置になるよう設定されている。   The center of the rotation axis L of the drive shaft 23a of the rotation drive source 23 is supported by the third support member 31 from the bottom of the five first support members 31 provided on the first movable body 26. Further, the height of the substrate W is set to be the same as the center of the substrate in the thickness direction.

それによって、上記第１の支持部材３１が基板Ｗの下面を支持した状態から、上記回転体１６を１８０度回転させて第２の支持部材３２によって基板Ｗが支持される状態となっても、所定間隔で位置する上下５枚の基板Ｗの高さが反転前と同じになるようになっている。   Accordingly, even when the first support member 31 supports the lower surface of the substrate W, the rotating body 16 is rotated 180 degrees and the substrate W is supported by the second support member 32. The height of the upper and lower five substrates W positioned at a predetermined interval is the same as that before the inversion.

したがって、反転前と反転後の上記反転装置１２に保持された基板Ｗを、予め設定された５枚の基板Ｗの高さに基づいて、上記第１、第２のロボット４，１１の第１、第２のアーム４ａ，４ｂ及び１１ａ，１１ｂによって供給、搬出できるようになっている。   Therefore, the first and second robots 4 and 11 have the substrates W held by the reversing device 12 before and after reversal based on the preset heights of the five substrates W. The second arms 4a, 4b and 11a, 11b can be used for supply and unloading.

上記回転体１６に支持される基板Ｗの数は５枚以外の奇数或いは偶数であっても、基板Ｗを反転させるときの、反転前と反転後とにおいて複数の基板Ｗが回転軸Ｌを中心として上下対称となる高さとなるよう上記回転体１６の回転軸Ｌを設定すれば、複数の基板Ｗの反転前と反転後の上下方向の高さを同じにすることができる。   Even when the number of substrates W supported by the rotating body 16 is an odd number or even number other than five, when the substrate W is reversed, the plurality of substrates W are centered on the rotation axis L before and after the reversal. If the rotation axis L of the rotator 16 is set so as to have a vertically symmetric height, the vertical heights of the plurality of substrates W before and after inversion can be made the same.

なお、第１の可動支持体２６に設けられる第１の支持部材３１と、第２の可動支持体２７に設けられる第２の支持部材３２の数を１つにし、上記回転体１６に支持される基板Ｗの数を１つとしても差し支えない。   The number of first support members 31 provided on the first movable support 26 and the number of second support members 32 provided on the second movable support 27 is one, and is supported by the rotating body 16. One substrate W may be used.

上記回転体１６には、Ｙ方向に沿う一端部と他端部とに上記第１乃至第３の可動支持体２６，２７，３４を配置するようにしている。そのため、回転体１６のＹ方向の両端部を除く部分のＹ方向両側は、上記第１、第２のロボット４，１１によって上記第１の支持部材３１に基板Ｗを供給したり、上記第１の支持部材３１に支持された基板Ｗを搬出する際、各ロボット４，１１のアーム４ａ，４ｂ及び１１ａ，１１ｂが進退するのを邪魔する部材がない開放部３７（図４参照）となっている。   In the rotating body 16, the first to third movable support bodies 26, 27, and 34 are arranged at one end and the other end along the Y direction. For this reason, the first and second robots 4 and 11 supply the substrate W to the first support member 31 on both sides in the Y direction except for both ends in the Y direction of the rotating body 16, When the substrate W supported by the support member 31 is carried out, the open portion 37 (see FIG. 4) has no member that obstructs the arms 4a and 4b and the arms 11a and 11b of the robots 4 and 11 from moving forward and backward. Yes.

そのため、反転装置１２が反転前の上記第１の状態や反転後の第２の状態となることで、上記ロボット４，１１が対向する上記反転装置１２の側面が変わっても、その対向する側面から上記第１、第２の支持部材３１，３２への基板Ｗの供給や搬出を容易かつ確実に行なうことができる。   Therefore, even if the side surface of the reversing device 12 to which the robots 4 and 11 are opposed changes due to the reversing device 12 being in the first state before reversing or the second state after reversing, the facing side surfaces thereof Therefore, it is possible to easily and reliably carry out and supply the substrate W to and from the first and second support members 31 and 32.

上記構成の処理装置においては、第１のロボット４によって収納ケース３に収容された未処理の基板Ｗが取り出されて反転装置１２に供給載置される。このとき、反転装置１２の一対の第１の可動支持体２６は接近方向に駆動位置決めされていて（図７Ａ参照）、上記基板ＷはＹ方向の両端部が一対の第１の可動支持体２６の第１の支持部材３１に支持されるよう供給される（図７Ｂ参照）。   In the processing apparatus having the above configuration, the unprocessed substrate W stored in the storage case 3 is taken out by the first robot 4 and supplied and placed on the reversing device 12. At this time, the pair of first movable supports 26 of the reversing device 12 is driven and positioned in the approaching direction (see FIG. 7A), and the substrate W has a pair of first movable supports 26 at both ends in the Y direction. To be supported by the first support member 31 (see FIG. 7B).

上記反転装置１２の第１の支持部材３１に支持された基板Ｗは、第２のロボット１１によって２枚ずつ取り出されて第１の処理部８に供給され、ここで一方の面が洗浄処理される。上記第１の処理部８で一方の面が処理された基板Ｗは、第２のロボット１１によって取り出されて上記反転装置１２の図７Ａに示すように接近方向に駆動された第１の支持部材３１の第１のテーパ面３１ａに供給載置される。   The substrates W supported by the first support member 31 of the reversing device 12 are taken out two by two by the second robot 11 and supplied to the first processing unit 8, where one surface is cleaned. The The substrate W whose one surface has been processed by the first processing unit 8 is taken out by the second robot 11 and driven in the approaching direction as shown in FIG. 7A of the reversing device 12. The first taper surface 31 a of 31 is supplied and mounted.

一方の面が洗浄処理された所定枚数、この実施の形態では５枚の基板Ｗが上記反転装置１２に供給されると、図２と図７Ｂに示す状態から、第２のシリンダ２９によって一対の第２の可動支持体２７を接近方向に駆動する。それによって、上記第２の可動支持体２７に設けられた第２の支持部材３２の先端部の第２のテーパ面３２ａが、上記基板ＷのＹ方向両端部の上面に接触若しくはわずかな間隔を介して離間対向する。   When a predetermined number of substrates, one of which has been cleaned, in this embodiment, five substrates W are supplied to the reversing device 12, a pair of two cylinders 29 are used from the state shown in FIGS. The second movable support 27 is driven in the approaching direction. As a result, the second taper surface 32a at the tip of the second support member 32 provided on the second movable support 27 is in contact with or slightly spaced from the upper surface of both ends in the Y direction of the substrate W. And facing each other.

図３と図７Ｃに示すように、上記第２の可動支持体２７の接近方向への駆動と同時、或いは駆動後に第３のシリンダ３５を作動させ、一対の第３の可動支持体３４を接近方向へ駆動する。   As shown in FIGS. 3 and 7C, the third cylinder 35 is actuated simultaneously with or after the driving of the second movable support 27 in the approaching direction, and the pair of third movable supports 34 are approached. Drive in the direction.

それによって、一対の第３の可動支持体３４に設けられた抜出防止部材３６の先端の円弧面が、上記第１の支持部材３１に支持された、基板ＷのＹ方向一端部と他端部の外周面に当接するから、上記基板Ｗは左右一対の抜出防止部材３６によって、左右一対の第１の支持部材３１、つまり回転体１６に対してセンタリングされるとともに、第１、第２の支持部材３１，３２間でずれ動くのが阻止される。   As a result, the arc surface at the tip of the extraction preventing member 36 provided on the pair of third movable support members 34 has one end and the other end in the Y direction of the substrate W supported by the first support member 31. Since the substrate W is in contact with the outer peripheral surface of the portion, the substrate W is centered with respect to the pair of left and right first support members 31, that is, the rotating body 16 by the pair of left and right extraction preventing members 36, and the first and second Are prevented from moving between the support members 31 and 32.

このようにして、左右一対の第１の支持部材３１によってＹ方向の下面が支持された基板Ｗの上面に、第２の支持部材３２を対向位置させるとともに、上記基板Ｗにおける第１の支持部材３１によって支持された部分の両側に位置する外周面に抜出防止部材３６を当接させたならば、回転駆動源２３を作動させて図５Ａと図８Ａに示すように上記回転体１６を１８０度回転させる。   In this way, the second support member 32 is opposed to the upper surface of the substrate W whose lower surface in the Y direction is supported by the pair of left and right first support members 31, and the first support member on the substrate W is provided. If the anti-extraction member 36 is brought into contact with the outer peripheral surfaces located on both sides of the portion supported by 31, the rotary drive source 23 is actuated to move the rotary body 16 to 180 as shown in FIGS. 5A and 8A. Rotate degrees.

上記回転体１６を１８０度回転させると、第１の支持部材３１のテーパ面３１ａにＹ方向の両端部の一方の面が支持されていた基板Ｗは、反転前では上面だった他方の面が反転後では下面となり、反転により上方から下方に位置が変更された第２の支持部材３２のテーパ面３２ａにこの他方の面が支持された状態となる。   When the rotating body 16 is rotated 180 degrees, the substrate W on which one surface of both end portions in the Y direction is supported by the tapered surface 31a of the first support member 31 has the other surface which is the upper surface before reversal. After reversal, it becomes the lower surface, and the other surface is supported by the tapered surface 32a of the second support member 32 whose position is changed from the upper side to the lower side by reversal.

上記回転体１６を回転させるとき、上記基板Ｗは上記第１の支持部材３１のテーパ面３１ａに対してずれ動き、第１、第２の支持部材３１，３２の間からずれ落ちたり、ずれ動く虞がある。   When the rotator 16 is rotated, the substrate W moves with respect to the tapered surface 31a of the first support member 31, and the substrate W shifts or moves between the first and second support members 31 and 32. There is a fear.

しかしながら、上記構成の反転装置１２によれば、上記回転体１６を回転させるとき、上記基板ＷのＹ方向の両端部における、上記第１の支持部材３１によって支持された部分の両側に位置する外周面には抜出防止部材３６の先端の円弧面が当接している。   However, according to the reversing device 12 having the above-described configuration, when the rotating body 16 is rotated, the outer circumferences located on both sides of the portion supported by the first support member 31 at both ends in the Y direction of the substrate W. The arc surface at the tip of the extraction preventing member 36 is in contact with the surface.

そのため、上記回転体１６を回転させて上記基板Ｗを反転させるとき、上記基板Ｗは上記第１の支持部材３１と第２の支持部材３２との間でずれ動くのが阻止されるから、基板Ｗの板面が擦られて傷が付いたり、落下して損傷する等のことを確実に防止することができる。   Therefore, when the rotating body 16 is rotated to invert the substrate W, the substrate W is prevented from being displaced between the first support member 31 and the second support member 32. It is possible to reliably prevent the W plate surface from being rubbed and scratched, or dropped and damaged.

図５Ａと図８Ａに示すように基板Ｗが反転装置１２によって反転されると、第１のシリンダ２８によって図５Ｂと図８Ｂに示すように第１の可動支持体２６が離反方向に駆動される。それによって、反転された基板ＷのＹ方向両端部の上面側に位置する一対の第１の支持部材３１が基板Ｗの上面から径方向外方へ退避することになる。   When the substrate W is reversed by the reversing device 12 as shown in FIGS. 5A and 8A, the first movable support 26 is driven in the separation direction by the first cylinder 28 as shown in FIGS. 5B and 8B. . As a result, the pair of first support members 31 positioned on the upper surface side of the opposite ends of the substrate W in the Y direction are retracted radially outward from the upper surface of the substrate W.

上記第１の支持部材３１が基板Ｗの上面から退避して、抜出防止部材３６が基板Ｗの径方向外方へ退避したら、反転装置１２に支持された基板Ｗを１枚ずつ取り出して第２の処理部９へ供給する。   When the first support member 31 is retracted from the upper surface of the substrate W and the removal preventing member 36 is retracted outward in the radial direction of the substrate W, the substrates W supported by the reversing device 12 are taken out one by one. To the second processing unit 9.

上記反転装置１２の回転体１６を図３に示す第１の状態から図５Ａに示す第２の状態に１８０度回転させると、上記第２のロボット１１に対向する上記回転体１６の側面が一方から他方に変化する。   When the rotating body 16 of the reversing device 12 is rotated 180 degrees from the first state shown in FIG. 3 to the second state shown in FIG. 5A, the side surface of the rotating body 16 facing the second robot 11 is one side. From one to the other.

しかしながら、回転体１６は、Ｙ方向の両端部を除く部分の両側がそれぞれ基板Ｗの出し入れを邪魔することのない開放部３７となっている。そのため、上記回転体１６を回転させることで、上記第２のロボット１１に対向する上記回転体１６の側面が一方から他方に変化しても、上記第２のロボット１１によって上記回転体１６から基板Ｗを取り出して第２の処理部９に供給する作業に支障を来たすことがない。   However, in the rotating body 16, both sides of the portion excluding both ends in the Y direction are open portions 37 that do not obstruct the loading and unloading of the substrate W, respectively. Therefore, by rotating the rotating body 16, even if the side surface of the rotating body 16 facing the second robot 11 changes from one to the other, the second robot 11 removes the substrate from the rotating body 16. There is no hindrance to the work of taking out W and supplying it to the second processing unit 9.

上記第２の処理部９で他方の面が洗浄処理された基板Ｗは、上記第２のロボット１１によって取り出され、反転装置１２に供給載置される。このとき、図５Ｂに示すように、回転体１６の第２の支持部材３２は互いに接近方向に位置決めされていて、反転装置１２に供給された基板Ｗは、第２の支持部材３２の第２のテーパ面３２ａ上に載置される。   The substrate W whose other surface has been cleaned by the second processing unit 9 is taken out by the second robot 11 and supplied and placed on the reversing device 12. At this time, as shown in FIG. 5B, the second support members 32 of the rotating body 16 are positioned in the approaching direction, and the substrate W supplied to the reversing device 12 is the second of the second support members 32. Is placed on the tapered surface 32a.

所定枚数の基板Ｗが上記回転体１６に供給され終わると、左右一対の第１の可動支持体２６が接近方向に駆動されて第１の支持部材３１が上記基板ＷのＹ方向両端部の上面側に位置するとともに、左右一対の第３の可動支持体３４が接近方向に駆動されて、上記基板Ｗにおける、第２の支持部材３２に支持されたＹ方向両端部の両側に位置する外周面に抜出防止部材３６が当接し、基板Ｗが第２の支持部材３２の第２のテーパ面３２ａ上でずれ動くのが阻止される。   When a predetermined number of substrates W have been supplied to the rotator 16, the pair of left and right first movable supports 26 are driven in the approaching direction so that the first support members 31 are the upper surfaces of both ends of the substrate W in the Y direction. And the pair of left and right third movable supports 34 are driven in the approaching direction, and the outer peripheral surfaces of the substrate W are located on both sides of both ends in the Y direction supported by the second support member 32. The anti-extraction member 36 comes into contact with the substrate W to prevent the substrate W from moving on the second tapered surface 32 a of the second support member 32.

ついで、回転駆動源２３が作動して回転体１６を図３に示すように１８０度回転させて基板Ｗを反転させる。それによって、基板Ｗの回路パターンが形成された一方の面が上側になる。   Next, the rotation drive source 23 is operated to rotate the rotating body 16 by 180 degrees as shown in FIG. Thereby, the one surface on which the circuit pattern of the substrate W is formed is on the upper side.

その状態で、図２に示すように第２の支持部材３２を第２のシリンダ２９によって離反方向に駆動して第２の支持部材３２を基板Ｗの上面から退避させ、抜出防止部材３６を第３のシリンダ３５によって離反方向に駆動して退避させる。その後、上下両面が洗浄処理された基板Ｗを第１のロボット４によって反転装置１２より取り出して空の収納ケース３に格納することになる。   In this state, as shown in FIG. 2, the second support member 32 is driven away from the upper surface of the substrate W by driving the second support member 32 away from the upper surface of the substrate W by the second cylinder 29. The third cylinder 35 is driven in the separating direction and retracted. Thereafter, the substrate W whose upper and lower surfaces are cleaned is taken out of the reversing device 12 by the first robot 4 and stored in the empty storage case 3.

このように、上記構成の反転装置１２によれば、基板Ｗを反転させるとき、基板ＷのＹ方向の両端部が第１の支持部材３１と第２の支持部材３２との間でずれ動かないように基板Ｗを抜出防止部材３６によって支持するようにしたから、反転時に上記基板Ｗがずれ動いて傷が付いたり、落下して損傷するということが防止されて、確実に反転させることができる。   As described above, according to the reversing device 12 having the above-described configuration, when the substrate W is reversed, both end portions of the substrate W in the Y direction do not move between the first support member 31 and the second support member 32. Thus, the substrate W is supported by the extraction preventing member 36, so that the substrate W can be prevented from being displaced and damaged when it is turned over, or it can be prevented from falling and damaged, so that it can be turned over reliably. it can.

上記抜出防止部材３６は、基板Ｗの外周面に当接して反転時に基板Ｗがずれ動くのを防止するようにしている。そのため、上記抜出防止部材３６が基板Ｗの板面に当たることがないから、そのことによっても基板Ｗの板面、とくにデバイス面を傷つけることがないということがある。   The extraction preventing member 36 is in contact with the outer peripheral surface of the substrate W so as to prevent the substrate W from being displaced during reversal. Therefore, the extraction preventing member 36 does not hit the plate surface of the substrate W, and this may not damage the plate surface of the substrate W, particularly the device surface.

さらに、上記抜出防止部材３６を有することで、第１、第２のロボット４，１１に基板Ｗが保持された状態で、このロボット４，１１に対して上記基板Ｗを位置決めするということをせずに済むから、位置決めに要する時間が短縮され、生産性を向上させることができるということもある。   Further, by having the extraction preventing member 36, the substrate W is positioned with respect to the robots 4 and 11 while the substrate W is held by the first and second robots 4 and 11. Therefore, the time required for positioning can be shortened and productivity can be improved.

上記第１、第２の支持部材３１，３２は、基板Ｗを支持する部分がそれぞれテーパ面３１ａ，３２ａに形成されている。そのため、基板Ｗはその端縁が上記テーパ面３１ａ，３２ａに線接触して支持されることになる。このため、面接触させて支持する場合に問題となる、接触部分に多くの洗浄液が残留し、洗浄後の基板Ｗの汚れの原因になるのを防止することができる。   In the first and second support members 31 and 32, portions for supporting the substrate W are formed on the tapered surfaces 31a and 32a, respectively. Therefore, the edge of the substrate W is supported in line contact with the tapered surfaces 31a and 32a. For this reason, it is possible to prevent a large amount of cleaning liquid from remaining on the contact portion, which becomes a problem when the surface is brought into contact with the surface of the substrate W, and causing contamination of the substrate W after cleaning.

上記抜出防止部材３６は、基板Ｗの外周面に当接することで、基板の反転時に基板Ｗがずれ動くのを防止すると同時に、基板Ｗを回転体１６に対して位置決めする。つまり、基板Ｗは、上記抜出防止部材３６によって上記回転体１６にセンタリングされる。   The extraction preventing member 36 abuts on the outer peripheral surface of the substrate W, thereby preventing the substrate W from shifting when the substrate is reversed and positioning the substrate W with respect to the rotating body 16. That is, the substrate W is centered on the rotating body 16 by the extraction preventing member 36.

そのため、基板Ｗの反転前と反転後において、基板Ｗの中心位置がずれることがないから、予め設定された座標プログラムで駆動される第１、第２のロボット４，１１のアーム４ａ，４ｂ及び１１ａ，１１ｂに対して位置ずれすることがない。それによって、上記回転体１６からの基板Ｗの取り出しを確実に行なうことが可能となる。   Therefore, since the center position of the substrate W does not shift before and after the substrate W is inverted, the arms 4a and 4b of the first and second robots 4 and 11 driven by a preset coordinate program and There is no position shift with respect to 11a, 11b. As a result, the substrate W can be reliably removed from the rotating body 16.

上記回転体１６の両端部に設けられる第１の支持部材３１と第２の支持部材３２を、それぞれ第１の可動支持体２６と第２の可動支持体２７とによって接離する方向に駆動できる構成とした。   The first support member 31 and the second support member 32 provided at both ends of the rotating body 16 can be driven in a direction in which the first movable support body 26 and the second movable support body 27 are in contact with and separated from each other. The configuration.

そのため、基板Ｗの一方の面を上記第１の支持部材３１によって支持した状態で回転体１６を反転させたとき、上側に位置する第１の支持部材３１を離反する方向へ駆動して基板Ｗの他方の面から退避する位置へ移動させることができるから、反転された上記回転体１６の側方の開放部３７から第１のロボット４や第２のロボット１１によって基板Ｗを取り出したり、基板Ｗを供給することができる。   Therefore, when the rotating body 16 is reversed with one surface of the substrate W supported by the first support member 31, the first support member 31 positioned on the upper side is driven in a direction away from the substrate W. Since the first robot 4 or the second robot 11 can take out the substrate W from the open side 37 of the inverted rotating body 16, the substrate W can be moved away from the other surface of the substrate. W can be supplied.

つまり、上記回転体１６が１８０度回転された第２の状態にあっても、第１の状態にあるときと同様に、基板Ｗの出し入れを行なうことができる。   That is, even when the rotating body 16 is in the second state rotated 180 degrees, the substrate W can be taken in and out as in the first state.

図９Ａ及び図９Ｂはこの発明の第２の実施の形態を示す。図９Ａ及び図９Ｂは、回転体１６の回転軸Ｌ方向の一端部を示す斜視図である。この第２の実施の形態では、基板ＷのＹ方向の両端部に対応する位置に、第３の可動支持体３４Ａによって接離する方向に駆動される抜出防止部材３６Ａを配置した。そして、この抜出防止部材３６Ａの両側に、第１の可動支持体２６Ａによって接離する方向に駆動される一対の第１の支持部材３１Ａと、第２の可動支持体２７Ａによって接離する方向に駆動される一対の第２の支持部材３２Ａをそれぞれ設けるようにした。   9A and 9B show a second embodiment of the present invention. 9A and 9B are perspective views showing one end of the rotating body 16 in the rotation axis L direction. In the second embodiment, the anti-extraction member 36A that is driven in the direction of contact with and away from the third movable support 34A is disposed at positions corresponding to both ends of the substrate W in the Y direction. Then, a pair of first support members 31A driven in a direction to be contacted and separated by the first movable support body 26A and a direction of contact and separation by the second movable support body 27A on both sides of the extraction preventing member 36A. A pair of second support members 32 </ b> A that are driven by each other are provided.

図９Ａは、一対の第１の支持部材３１Ａによって基板ＷのＹ方向の一端部が支持されている状態を示す。図９Ｂは、第２の支持部材３２Ａと抜出防止部材３６Ａが接近方向に駆動された状態を示す。図９Ｂにおいて、上記第２の支持部材３２Ａは、上記第１の支持部材３１Ａによって一方の面のＹ方向の両端部が支持された上記基板の他方の面のＹ方向の両端部に対向する位置に位置決めされ、さらに上記抜出防止部材３６Ａは、一対の第１、第２の支持部材３１Ａ，３２Ａの間に位置する上記基板Ｗの外周面に当接した状態を示している。   FIG. 9A shows a state where one end of the substrate W in the Y direction is supported by the pair of first support members 31A. FIG. 9B shows a state where the second support member 32A and the extraction preventing member 36A are driven in the approaching direction. In FIG. 9B, the second support member 32 </ b> A is opposed to both end portions in the Y direction on the other surface of the substrate, where both end portions in the Y direction on one surface are supported by the first support member 31 </ b> A. Further, the extraction preventing member 36A is in contact with the outer peripheral surface of the substrate W located between the pair of first and second support members 31A and 32A.

このように、第１の支持部材３１Ａと第２の支持部材３２Ａの間に抜出防止部材３６Ａを配置する構造であっても、第１の実施の形態と同様、基板Ｗを反転させる際、基板Ｗがずれ動いたり、落下する等のことを防止することができる。   As described above, even when the extraction preventing member 36A is disposed between the first support member 31A and the second support member 32A, as in the first embodiment, when the substrate W is reversed, It is possible to prevent the substrate W from shifting or dropping.

なお、左右一対の第１の支持部材３１Ａと第２の支持部材３２Ａが取り付けられた第１の可動支持体２６Ａと第２の可動支持体２７Ａは、図９Ａ及び図９Ｂでは２つに分かれているように見えるが、これらはＵ字状に形成することで一体となっている。   The first movable support body 26A and the second movable support body 27A to which the pair of left and right first support members 31A and second support members 32A are attached are divided into two in FIGS. 9A and 9B. Although these appear to be, they are integrated by forming a U-shape.

上記各実施の形態では基板として半導体ウェーハを例に挙げて説明したが、基板としては液晶表示装置用のガラス基板、あるいは光ディスク用ガラス基板等であってもよく、要は、処理工程の中で、反転させることが要求される基板であれば、各実施の形態に示された反転装置を適用することができる。   In each of the above embodiments, a semiconductor wafer is described as an example of the substrate. However, the substrate may be a glass substrate for a liquid crystal display device, a glass substrate for an optical disk, or the like. As long as the substrate is required to be reversed, the reversing device described in each embodiment can be applied.

なお、本発明は前記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々変形実施可能であるのは勿論である。   Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

８…第１の処理部、９…第２の処理部、１２…反転装置、１６…回転体、２３…回転駆動源、２６…第１の可動支持体、２７…第２の可動支持体、２８…第１のシリンダ（第１の駆動手段）、２９…第２のシリンダ（第２の駆動手段）、３１…第１の支持部材、３２…第２の支持部材、３４…第３の可動支持体、３５…第３のシリンダ（第３の駆動手段）、３６…抜出防止部材、３７…開放部。   DESCRIPTION OF SYMBOLS 8 ... 1st process part, 9 ... 2nd process part, 12 ... Inversion apparatus, 16 ... Rotating body, 23 ... Rotation drive source, 26 ... 1st movable support body, 27 ... 2nd movable support body, 28 ... 1st cylinder (1st drive means), 29 ... 2nd cylinder (2nd drive means), 31 ... 1st support member, 32 ... 2nd support member, 34 ... 3rd movable Support body, 35... Third cylinder (third drive means), 36... Anti-extraction member, 37.

Claims (8)

回転駆動源によって回転駆動される回転体と、
この回転体の回転軸方向に沿って所定間隔で離間対向して配置され第１の駆動手段によって接離する方向に駆動される一対の第１の可動支持体と、
上記一対の第１の可動支持体の対向する面に上記回転軸方向に対して直交する方向に設けられ先端部によって上記基板の一方の面の所定方向の両端部を支持する第１の支持部材と、
上記回転体の回転軸方向に沿って所定間隔で離間対向し、かつ上記第１の可動支持体と干渉しない状態で配置されて第２の駆動手段によって接離する方向に駆動される一対の第２の可動支持体と、
上記一対の第２の可動支持体の対向する面に上記回転軸方向に対して直交する方向に設けられ一対の上記第２の可動支持体が接近方向に駆動されたときに先端部が上記第１の支持部材によって一方の面の所定方向の両端部が支持された上記基板の他方の面の上記所定方向の両端部に対向する第２の支持部材と、
上記回転体の回転軸方向に沿って所定間隔で離間対向し、かつ上記第１、第２の可動支持体と干渉しない状態で配置されて第３の駆動手段によって接離する方向に駆動される一対の第３の可動支持体と、
上記一対の第３の可動支持体の対向する面に上記回転軸方向に対して直交する方向に設けられ、一対の上記第３の可動支持体が互いに接近する方向に駆動されることで、上記回
転駆動源によって上記回転体を１８０度回転させ上記第１の支持部材に支持された基板を反転させて上記第２の支持部材によって支持するときに上記基板の上記所定方向の両端部の外周面に接近する方向に移動して上記基板が上記第１、第２の支持部材の間でずれ動くのを阻止する複数の抜出防止部材と
を具備したことを特徴とする基板の反転装置。 A rotating body that is rotationally driven by a rotational drive source;
A pair of first movable supports that are arranged to be spaced apart from each other at a predetermined interval along the rotation axis direction of the rotating body and are driven in a direction of contacting and separating by the first driving means,
A first support member provided on opposite surfaces of the pair of first movable supports in a direction orthogonal to the rotation axis direction and supporting both ends of the one surface of the substrate in a predetermined direction by a tip portion. When,
A pair of second driving members that are spaced apart from each other at a predetermined interval along the rotation axis direction of the rotating body and that do not interfere with the first movable support member and are driven in a direction of contacting and separating by the second driving means. Two movable supports;
When the pair of second movable supports are driven in the approaching direction, the tip portions are provided on the opposing surfaces of the pair of second movable supports in a direction orthogonal to the rotation axis direction. A second support member opposed to both end portions in the predetermined direction of the other surface of the substrate, wherein both end portions in one direction of the one surface are supported by one support member;
The rotating body is spaced apart and opposed at a predetermined interval along the rotational axis direction of the rotating body, and is arranged in a state where it does not interfere with the first and second movable support bodies, and is driven in a direction of coming into contact with and separating from the third driving means. A pair of third movable supports;
The pair of third movable supports are provided on opposite surfaces of the pair of third movable supports in a direction orthogonal to the rotational axis direction, and the pair of third movable supports are driven in directions approaching each other, thereby When the rotary body is rotated 180 degrees by a rotation drive source, the substrate supported by the first support member is reversed and supported by the second support member, and the outer peripheral surfaces of both ends of the substrate in the predetermined direction And a plurality of anti-extraction members that prevent the substrate from shifting between the first and second support members by moving in a direction approaching the substrate. 上記抜出防止部材は、上記基板の上記所定方向の一端部と他端部との外周面に当接することで、上記基板が上記第１、第２の支持部材の間で上記基板がずれ動くのを阻止するともに、上記基板を上記回転体に対して位置決めすることを特徴とする請求項１記載の基板の反転装置。   The extraction preventing member contacts the outer peripheral surface of one end and the other end of the substrate in the predetermined direction, so that the substrate moves between the first and second support members. The substrate reversing device according to claim 1, wherein the substrate is positioned with respect to the rotating body. 上記一対の第１の可動支持体、第２の可動支持体及び第３の可動支持体を、上記回転体に、この回転体の上記回転軸方向に沿って所定間隔で設けることで、上記回転体の上記回転軸方向と交差する方向の両側に上記第１の支持部材若しくは上記回転体が回転して下方に位置する上記第２の支持部材に上記基板を出し入れすることを可能とする開放部が形成されていることを特徴とする請求項１記載の基板の反転装置。   The pair of first movable support body, second movable support body, and third movable support body are provided on the rotating body at predetermined intervals along the rotational axis direction of the rotating body. An opening that allows the first support member or the rotary body to rotate on both sides in a direction intersecting the rotational axis direction of the body to allow the substrate to be taken in and out of the second support member positioned below. The substrate reversing device according to claim 1, wherein the substrate reversing device is formed. 上記回転体を回転させて上記第１の支持部材に支持された基板を上記第２の支持部材に支持された状態にしたとき、一対の上記第２の可動支持体を離れる方向に駆動して上記第１の支持部材を上記基板の一方の面の所定方向の両端部から退避させて上記基板を搬出可能とすることを特徴とする請求項１記載の基板の反転装置。   When the rotating body is rotated so that the substrate supported by the first supporting member is supported by the second supporting member, the pair of second movable supporting bodies are driven in a direction away from each other. 2. The substrate reversing device according to claim 1, wherein the first support member is retracted from both end portions of one surface of the substrate in a predetermined direction so that the substrate can be carried out. 上記第１の支持部材と上記第２の支持部材の先端部は、上記基板に円部と線接触するよう先端部から基端部に向かって高くなるテーパ面に形成されていることを特徴とする請求項１記載の基板の反転装置。   The front end portions of the first support member and the second support member are formed on a tapered surface that increases from the front end portion toward the base end portion so as to be in line contact with the circular portion of the substrate. The substrate reversing device according to claim 1. 上記回転軸方向に対して直交する方向に所定間隔で設けられたそれぞれ複数の上記第１の支持部材と上記第２の支持部材を備えていることを特徴とする請求項１記載の基板の反転装置。   The substrate inversion according to claim 1, further comprising a plurality of the first support members and the second support members provided at predetermined intervals in a direction orthogonal to the rotation axis direction. apparatus. 基板の一方の面の所定方向の両端部を、接離する方向に駆動可能に設けられた左右一対の第１の支持部材によって支持する工程と、
上記一対の第１の支持部材によって一方の面の所定方向の両端部が支持された上記基板の他方の面の上記所定方向の両端部に、接離する方向に駆動可能に設けられた左右一対の第２の支持部材を対向位置させる工程と、
上記基板の上記所定方向の両端部の外面に上記基板が上記第１の支持部材と第２の支持部材の間でずれ動くのを防止する抜出防止部材を接近する方向に移動させる工程と、
上記第１の支持部材、第２の支持部材及び上記抜出防止部材とともに上記基板を１８０度回転させてこの基板を反転させる工程と
を具備したことを特徴とする基板の反転方法。 A step of supporting both ends in a predetermined direction of one surface of the substrate by a pair of left and right first support members provided so as to be drivable in a contacting and separating direction;
A pair of left and right provided so as to be able to drive in the direction of contact with and away from both ends of the predetermined direction of the other surface of the substrate, where both ends of the one surface are supported by the pair of first support members. A step of opposing the second support member of
Moving the anti-extraction member that prevents the substrate from shifting between the first support member and the second support member to the outer surfaces of both ends of the substrate in the predetermined direction; and
And a step of rotating the substrate together with the first support member, the second support member, and the extraction preventing member by 180 degrees to reverse the substrate. 基板の一方の面を処理してから、他方の面を処理する基板の処理装置であって、
上記基板の一方の面を処理する第１の処理部と、
一方の面が処理された基板を反転させる反転装置と、
反転された基板の他方の面を処理する第２の処理部を具備し、
上記反転装置は請求項１記載の構成であることを特徴とする基板の処理装置。 A substrate processing apparatus for processing one surface of a substrate and then processing the other surface,
A first processing unit for processing one surface of the substrate;
A reversing device for reversing the substrate treated on one side;
A second processing unit for processing the other surface of the inverted substrate;
The substrate processing apparatus according to claim 1, wherein the reversing apparatus has the configuration according to claim 1.
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