JP4287663B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal panel.In placeRelated.
[0002]
[Prior art]
For example, in a manufacturing process for forming a circuit pattern on a substrate such as a semiconductor substrate or a glass substrate used for a liquid crystal display panel, it is required to perform various processes on the substrate. Is required to be washed with high cleanliness.
[0003]
The cleaned substrate is handled by a robot apparatus or the like, stored in the carrier in units of a plurality of sheets, and transported between the processes. Therefore, if the substrate is cleaned only on the surface (device surface) on which the circuit pattern is formed, dirt such as particles adhering to the back surface during handling by the robotic device or during transportation is transferred to another substrate. is there. Therefore, in order to maintain the cleanliness of the substrate with high accuracy, it is required to clean not only the surface of the substrate but also the back surface.
[0004]
On the other hand, in order to improve the cleaning efficiency of a substrate, a cleaning processing apparatus having a plurality of processing units has been developed, and such a processing apparatus is disclosed in Technical Document 1. The processing apparatus shown in this technical document 1 is provided with a first robot for taking a substrate in and out of the carrier. A substrate is taken in and out of the plurality of processing units by the second robot. The transfer of the substrate between the first robot and the second robot is performed via a relay unit. This relay section is provided with two sets of board transfer units and two sets of reversing units above the transfer units.
[0005]
The unprocessed substrate is taken out of the carrier by the first robot and supplied to the transfer unit with the surface facing up. The substrate supplied to the transfer unit is supplied from the transfer unit to the processing unit by the second robot, and the surface is processed here.
[0006]
The substrate whose surface has been processed is transferred from the processing unit to the reversing unit by the second robot, so that the front and back are reversed and the back is up. The inverted substrate is supplied to the processing unit by the second robot, and after the back surface is processed here, it is taken out again by the second robot and supplied to the inversion unit. Since the back surface of the substrate is in an upper state, the substrate is reversed again so that the front surface is turned up. Then, the substrate is transported to the transfer unit by the second robot, and is accommodated in the carrier by the first robot.
[0007]
[Patent Document 1]
JP 2002-110609 A
[0008]
[Problems to be solved by the invention]
According to the processing apparatus having the above configuration, the reversing unit is provided above the delivery unit. For this reason, when the substrate is inverted by the reversing unit, dirt such as particles may fall from the substrate, so that the dirt enters the transfer unit located below the reversing unit and is cleaned on the transfer unit. There is a possibility of contaminating a new substrate.
[0009]
The unprocessed substrate accommodated in the carrier is first supplied to the delivery unit. In addition, the substrate whose front and back surfaces are cleaned is also placed in the carrier after being placed on the delivery unit. For this reason, the transfer unit has two upper and lower stages, and a dirty substrate and a clean substrate must be placed on separate transfer units.
[0010]
The substrate whose surface has been cleaned is reversed so that the back surface is up, and then placed on the support of the reversing unit. After the surface has been cleaned, the substrate whose back surface has been cleaned has its back surface facing up, so it is reversed again and placed on the support unit of the reversing unit with the surface up, and then delivered by the second robot. Supplied to the unit.
[0011]
Since the degree of cleanliness differs between a substrate cleaned only on the front surface and a substrate cleaned on both sides, the reversing unit has two upper and lower stages, and these substrates are reversed by separate reversing units and used as a support for each reversing unit. Place. Thereby, it is necessary to prevent the dirt from transferring in the reversing unit.
[0012]
Therefore, the processing apparatus shown in this technical document 1 is provided with two upper and lower stages, that is, two sets of transfer units and reversing units, and these must be arranged in the vertical direction. Will be invited.
[0013]
  In the present invention, even if dirt is removed from the substrate at the time of reversal, the dirt can be prevented from adhering to a clean substrate and causing contamination, and the configuration is not complicated or enlarged. Substrate processing equipmentPlaceIt is to provide.
[0014]
[Means for Solving the Problems]
  The present invention includes a processing unit for processing a substrate,
  A supply carry-out unit in which an unprocessed substrate is stored and a substrate that has been processed in the processing unit is stored;
  A first delivery means for supplying an unprocessed substrate to the processing unit and taking out a substrate processed by the processing unit;
  A second delivery means for taking out an unprocessed substrate from the supply / unloading unit and storing the substrate that has been processed in the processing unit in the supply / unloading unit;
  Of the substrates that are provided between the first delivery means and the second delivery means and are delivered between the delivery means, a lower holding unit that holds a substrate that has not been processed, and a substrate that has been processed. An upper holding part for holding and a relay part provided with a reversing mechanism for reversing the substrate held by the lower holding part.And
The lower holding portion has two sets of lower support pins that engage with the peripheral edge of the substrate, and the two sets of lower support pins are provided so as to be driven away from the state of supporting the substrate,
The reversing mechanism has a pair of clamping members that are driven in a contacting and separating direction and a rotating direction,
The clamping member is driven in the approaching direction with the substrate supported by the lower support pins to hold both ends along the radial direction of the substrate, and when the support state of the substrate by the support pins is released To rotate the substrateThe substrate processing apparatus is characterized by the above.
[0015]
The relay portion has a housing, and a first opening is formed on a side wall of the housing facing the first delivery means, and the first opening is formed on the side wall of the housing facing the second delivery means. It is preferable that a second opening is formed at a position corresponding to the opening, and the upper holding portion and the lower holding portion are provided to face the first and second openings.
[0018]
According to the present invention, the lower holding part that holds the substrate that has not been processed and the upper holding part that holds the substrate that has been processed are provided, and the substrate held by the lower holding part is reversed. Therefore, when the substrate is inverted, the contamination of the substrate can be prevented from adhering to a clean substrate.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below with reference to the drawings.
[0020]
FIG. 1 is a plan view showing a schematic configuration of a processing apparatus according to an embodiment of the present invention. The processing apparatus includes a plurality of processing units 1a to 1d in this embodiment. These processing units 1a to 1d are, for example, spin processing apparatuses for cleaning a semiconductor wafer W as a substrate to be described later.
[0021]
Of the four processing units, the second and third processing units 1b and 1c are juxtaposed in the horizontal direction. The direction in which the second and third processing units 1b and 1c are juxtaposed is defined as a horizontal direction. The first processing unit 1a is disposed in front of one end of the second processing unit 1b (in / out port side), and the fourth processing unit 1d is disposed in front of one end of the third processing unit 1c. ing. The fourth processing unit 1d has the front surface (in / out port) opposed to the first processing unit 1a. That is, the first to fourth processing units 1a to 1d are arranged so that the front surfaces thereof are substantially U-shaped.
[0022]
A first transfer robot 4 and a second transfer robot 5 constituting first transfer means are disposed in the space 3 surrounded by the first to fourth processing units 1a to 1d. Each delivery bot 4, 5 has a base 6 as shown in FIGS. The base 6 is provided with a movable body 7 that is driven in the vertical direction and the rotational direction.
[0023]
A plurality of links 8 are rotatably connected to the upper surface of the movable body 7 and a first arm body 11 and a second arm body 12 which are driven to extend and contract are provided. A lower hand 13 is provided at the tip of the first arm body 11, and an upper hand 14 positioned above the lower hand 13 is provided at the tip of the second arm body 12. Since the lower hand 13 and the upper hand 14 are positioned in the vertical direction, the hands 13 and 14 are prevented from interfering with each other when the arm bodies 11 and 12 are contracted.
[0024]
A first relay unit 16 and a second relay unit, which will be described later, are disposed at portions facing the second and third processing units 1b and 1c across the first and second delivery robots 4 and 5, respectively. 17 are juxtaposed in the horizontal direction.
[0025]
A third delivery robot 18 that constitutes a second delivery means is disposed on the opposite side of the first and second relay sections 16 and 17 from the first and second delivery robots 4 and 5. ing. The third delivery robot 18 is driven to reciprocate along rails 19 laid along the direction in which the first and second relay portions 16 and 17 are arranged side by side.
[0026]
The third delivery robot 18 includes a first arm body 11 and a second arm body 12 that are driven to extend and contract, similar to the first and second delivery robots 4 and 5. A lower hand 13 and an upper hand 14 are provided at the tip of the upper and lower positions by shifting their positions in the vertical direction.
[0027]
In the travel range of the third robot 18, uncleaned semiconductor wafers W supplied to the processing units 1a to 1d are accommodated at predetermined intervals in the vertical direction, and first and second carriers as supply units. 21a and 21b are arranged in the horizontal direction. On the sides of the first and second carriers 21a and 21b, the first semiconductor wafers W cleaned by the respective processing units 1a to 1d are stored so as to be supplied to the next process. 3 and 4th carriers 21c and 21d are arranged side by side along the traveling direction of the third delivery robot 18.
[0028]
The carrier is divided into a supply unit and an unloading unit, an unprocessed semiconductor wafer W is supplied from the supply unit, and the processed semiconductor wafer is stored in the carrier of the unloading unit. When the wafer is taken out from the carrier and cleaning is completed, the semiconductor wafer may be returned to the carrier taken out before cleaning. That is, the supply unit and the carry-out unit may be separated from each other, and the supply and carry-out unit may be provided.
[0029]
The first and second relay parts 16 and 17 have a box-shaped housing 23 as shown in FIG. A first opening 24 is formed in one side wall of the housing 23 facing the third delivery robot 18, and the first and second delivery robots 4, facing the one side wall 4. A second opening 25 is formed in the other side wall located on the 5 side.
[0030]
An upper holding portion 26 and a lower holding portion 27 for holding the semiconductor wafer W substantially horizontally are provided at portions of the housing 23 facing the first and second openings 24 and 25, respectively. In addition, a reversing mechanism 28 for reversing the semiconductor wafer W held by the lower holding portion 27 is provided.
[0031]
As shown in FIGS. 4 and 7, the upper holding portion 26 is an upper portion provided through the upper portions of a pair of side walls different from the side walls in which the first and second openings 24 and 25 are formed. A mounting shaft 31 is provided. A rear end portion of the upper mounting shaft 31 that protrudes outside the housing 23 is formed in an upper prism portion 32, and the upper prism portion 32 is attached and fixed to an upper support member 33 provided on the outer surface of the side wall.
[0032]
A prismatic upper horizontal member 34 is provided horizontally and perpendicular to the upper mounting shaft 31 at the tip of the upper mounting shaft 31 protruding into the housing 23. Two pairs of upper support pins 35 are provided on the upper surfaces of both ends of the pair of upper horizontal members 34. The upper end of each support pin 35 is formed in a conical shape. As a result, the semiconductor wafer W is detachably held by engaging the four portions of the peripheral portion with the two sets of support pins 35 provided on the pair of transverse members 34.
[0033]
The lower holding portion 27 has a lower mounting shaft 37 that slidably penetrates below the same side wall as the side wall on which the upper holding portion 26 is provided. A rear end of the lower mounting shaft 37 is formed in a lower prism portion 38. The lower prism portion 38 is fixedly attached to a movable member 39 provided on the outer surface of the side wall. The movable member 39 is movably provided on the fixed member 40 and is movable in the backward direction indicated by an arrow in FIG. A first opening / closing cylinder 41 (only one is shown) is provided between the movable member 39 and the fixed member 40, and the movable member 39 is driven in the direction of the arrow by the first opening / closing cylinder 41. ing.
[0034]
A lower lateral member 42 is provided at the tip of the lower prism portion 38 horizontally and at a right angle to the lower mounting shaft 37. Two pairs of lower support pins 43 are erected on the upper surfaces of both ends of the pair of lower lateral members 42.
[0035]
The upper end of the lower support pin 43 is formed in a conical shape like the upper support pin 35, and each pair of lower support pins 43 provided on the two lower lateral members 42 is in a position indicated by a solid line in FIG. Sometimes, the semiconductor wafer W is held at the upper ends of these two sets of lower support pins 43 with the peripheral edge engaged. The position of the lower support pin 43 at this time is defined as a closed position.
[0036]
When the pair of movable members 39 are driven by the first opening / closing cylinder 41, the lower support pin 43 moves to a position indicated by a chain line. At this time, the position of the lower support pin 43 is an open position. When the lower support pins 43 move from the closed position indicated by the solid line to the open position indicated by the chain line, the support state of the semiconductor wafer W by the two sets of lower support pins 43 is released.
[0037]
As shown in FIGS. 4 and 5, the reversing mechanism 28 has a pair of clamping members 45 disposed at substantially the same height as the semiconductor wafer W supported substantially horizontally by the lower support pins 43. Each clamping member 45 is fixed to the tip of the movable shaft 47. The movable shaft 47 is supported by a bearing portion 46 provided on the outer surface of each side wall so as to be rotatable and movable in the axial direction.
[0038]
The front end surface of the holding member 45 is formed into an arc surface having a curvature corresponding to the outer peripheral surface of the semiconductor wafer W, and a V-shaped engagement groove 45a that engages with the peripheral edge of the semiconductor wafer W is formed on the arc surface. Has been.
[0039]
A rear end portion of the movable shaft 47 protruding from the bearing portion 46 is formed in a spline shaft portion (not shown), and a first driven pulley 48 rotates integrally with the movable shaft 47 on the spline shaft portion. At the same time, the movable shaft 47 is provided so as to be movable in the axial direction.
[0040]
The portion of the movable shaft 47 that is more distal than the portion where the first driven pulley 48 is provided is rotatably engaged with an engagement groove 51 formed in the movable plate 49. A portion of the movable shaft 47 engaged with the engagement groove 51 is integrally provided with a pair of contact plates 50 that contact both side surfaces of the movable plate 49. The movable plate 49 is driven in the direction indicated by the arrow in FIG. Thereby, the movable plate 49 integrally drives the movable shaft 47 in the arrow direction by the contact plate 50.
[0041]
When the second opening / closing cylinder 52 is operated and the movable shaft 47 is driven by the movable plate 49, the pair of sandwiching members 45 are changed from the closed state in which the peripheral edge of the semiconductor wafer W is sandwiched to the opened state. The holding state of the semiconductor wafer W by the member 45 is released.
[0042]
As shown in FIG. 6, a drive pulley 55 is provided on the outer surface of the side wall of the housing 23 and obliquely below the first driven pulley 48. The drive pulley 55 is rotated by a rotary actuator 54 at a predetermined angle, for example, 180 degrees. A second driven pulley 56 is provided above the drive pulley 55 on the side wall. The drive pulley 55 is formed to have substantially the same diameter as the first driven pulley 48, and the second driven pulley 56 is formed to have a smaller diameter than the first driven pulley 48.
[0043]
One end and the other end of an interlocking shaft 57 provided through the housing 23 are connected and fixed to a pair of drive pulleys 55 provided on a pair of side wall outer surfaces. Of the pair of drive pulleys 55, only one drive pulley 55 is rotationally driven by the rotary actuator 54, and rotation is transmitted to the other drive pulley 55 by the interlocking shaft 57. Yes.
[0044]
A timing belt 58 is stretched around the first and second driven pulleys 48 and 56 and the driving pulley 55. As a result, when the drive pulley 55 provided on one side wall of the housing 23 is rotated about 180 degrees by the rotary actuator 54, the rotation is transmitted to the drive pulley 55 provided on the other side wall by the interlocking shaft 57. Therefore, the pair of movable shafts 47 provided on the pair of side walls of the housing 23 rotate about 180 degrees.
[0045]
Therefore, after the semiconductor wafer W is clamped by the pair of clamping members 45 provided at the tips of the pair of movable shafts 47, the support state of the semiconductor wafer W by the lower support pins 43 is released, and the clamping member 45 together with the movable shaft 47 is released. , The semiconductor wafer W sandwiched between the sandwiching members 45 can be rotated 180 degrees through the 90-degree rotated state shown by the chain line in FIG.
[0046]
Next, the uncleaned semiconductor wafer W accommodated in the first and second carriers 21a and 21b constituting the supply unit by the processing apparatus having the above-described configuration is subjected to a cleaning process to constitute the unloading unit. A procedure for collecting the carriers 21c and 21d will be described.
[0047]
First, when the unprocessed semiconductor wafer W is taken out from the first carrier 21 a by the lower hand 3 of the third delivery robot 18, the lower hand 3 is moved to the first of the casing 23 of the first relay unit 16. It enters from the opening 24 to the inside, is supplied to the lower holding part 27, and is horizontally supported by the lower support pins 43.
[0048]
Since the semiconductor wafer W is accommodated in the first and second carriers 21a and 21b with the surface facing up, the lower holding portion 27 of the first relay portion 16 by the third delivery robot 18 from the first carrier 21a. The semiconductor wafer W supplied to is held with its surface facing up.
[0049]
The semiconductor wafer W is required to have a higher degree of cleanliness on the front surface than on the back surface. Therefore, in order to prevent particles adhering to the back surface from adhering to the surface during the cleaning process, it is required that the back surface be cleaned before the surface is cleaned. In this embodiment, the back surface is also cleaned. Then clean the surface.
[0050]
Therefore, the semiconductor wafer W supplied to the lower holding unit 27 with the front side facing up is inverted so that the back side is now up. In order to reverse the semiconductor wafer W, first, the second opening / closing cylinder 52 is operated, and the movable shaft 47 is driven in the forward direction by the movable plate 49. As a result, the pair of clamping members 45 provided at the tips of the pair of movable shafts 47 are driven in the approaching direction, that is, in the closing direction, so that the pair of clamping members 45 move in the circumferential direction of the peripheral portion of the semiconductor wafer W. A portion shifted by 180 degrees is sandwiched.
[0051]
When the semiconductor wafer W is clamped by the pair of clamping members 45, the first opening / closing cylinder 41 is actuated so that the two sets of lower support pins 43 that support the peripheral edge of the semiconductor wafer W are closed positions shown by solid lines in FIG. To the open position indicated by the chain line, the support state of the semiconductor wafer W by the lower support pins 43 is released.
[0052]
When the support state of the semiconductor wafer W by the lower support pins 43 is released, the rotary actuator 54 is operated. Accordingly, the rotation of the drive pulley 55 is transmitted to the first and second driven pulleys 48 and 56 via the timing belt 58, and the rotation of the drive pulley 55 provided on one side wall is transmitted to the other by the interlocking shaft 57. Therefore, the pair of movable shafts 47 rotate about 180 degrees, and the rotation of the semiconductor wafer W sandwiched between the pair of sandwiching members 45 can be rotated 180 degrees. . That is, the semiconductor wafer W is inverted so that the back surface is on top.
[0053]
If the semiconductor wafer W is inverted, the first opening / closing cylinder 41 is operated to drive the two sets of lower support pins 43 in the closing direction, and the support pins 43 support the semiconductor wafer W with the back surface up. To do. Next, after the second opening / closing cylinder 52 is operated to release the holding state of the semiconductor wafer W by the pair of holding members 45, the lower hand 13 of the first delivery robot 4 is moved from the second opening 25 to the housing 23. The semiconductor wafer W supported by the lower holding part 27 is taken out.
[0054]
The semiconductor wafer W taken out from the lower holding unit 27 is supplied to the first processing unit 1a with the back surface up, and the back surface is cleaned here. When the cleaning process of the back surface of the semiconductor wafer W is completed, the lower hand 13 of the first delivery robot 4 is entered into the first processing unit 1a, the semiconductor wafer W whose back surface cleaning is completed is taken out, and the first wafer is removed. The back surface is supplied to the lower holding unit 27 of the relay unit 16.
[0055]
Subsequently, the semiconductor wafer W whose back surface has been cleaned and returned to the lower holding unit 27 is reversed by the reversing mechanism 28 so that the front surface is up. When the semiconductor wafer whose back surface is cleaned is reversed and the front surface is turned up, the lower hand 13 of the first delivery robot 18 enters the housing 23 from the second opening 25 and holds the semiconductor wafer W. Then, after retreating, it is supplied again to the first processing unit 1a. As a result, the front surface of the semiconductor wafer W whose back surface has been cleaned is cleaned.
[0056]
When the cleaning of both the front and back surfaces of the semiconductor wafer W is completed in this way, the upper hand 14 of the first delivery robot 4 is advanced into the first processing unit 1a, and the semiconductor wafer W whose front and back surfaces are cleaned is moved. It is taken out and supplied to and supported by the upper holding part 26 of the first relay part 4.
[0057]
When the cleaned semiconductor wafer W is supplied to the upper holding unit 26, the upper hand 14 of the third delivery robot 18 enters the housing 23 from the first opening 24 and is held by the upper holding unit 26. The obtained semiconductor wafer W is taken out and stored in the third carrier 21c constituting the unloading part.
[0058]
The cleaning of both the front and back surfaces of one semiconductor wafer W is completed through the above steps. The processing apparatus according to the present invention includes four processing units 1a to 1d. Therefore, when actually cleaning the semiconductor wafer W, the four processing units 1a to 1d, the first and second transfer robots 4 and 5 and the first and second relay units 16 constituting the first transfer unit. , 17 is performed at full operation.
[0059]
The number of delivery robots constituting the first delivery means, the number of relay parts, the number of third delivery robots constituting the second delivery means, and the number of carriers constituting the supply part and the carry-out part are a plurality of It is set so that the processing unit can be fully operated.
[0060]
In this embodiment, the first delivery robot 4 delivers the semiconductor wafer W to the first and second processing units 1a and 1b and the first relay unit 4, and the second The transfer robot 5 transfers the semiconductor wafer W to the third and fourth processing units 1c, 1d and the second relay unit 17.
[0061]
When the processing apparatus is fully operated, the semiconductor wafer W may be simultaneously held by the upper holding part 26 and the lower holding part 27 in the first and second relay parts 16 and 17. In that case, the cleaned semiconductor wafer W is held by the upper holding part 26 by cleaning both the front and back surfaces, and at the same time, only the both surfaces or the back surface is cleaned, and the unfinished semiconductor wafer W is held by the lower part. May be held by the unit 27.
[0062]
Therefore, even if dirt such as particles falls from the unwashed semiconductor wafer W, the dirt is attached to the semiconductor wafer W held above the unfinished semiconductor wafer W after washing is completed. Therefore, it is possible to reliably prevent the dirt adhering to the uncleaned semiconductor wafer W in the relay portions 16 and 17 from being transferred to the cleaned semiconductor wafer W.
[0063]
In the lower holding part 27 of the relay parts 16, 17, the peripheral edge of the semiconductor wafer W is supported by four lower support pins 43. Then, the semiconductor wafer W whose peripheral portion is supported by the lower support pins 43 can be sandwiched and reversed by the pair of sandwiching members 45 of the reversing mechanism 28.
[0064]
That is, even if both surfaces or one surface of the semiconductor wafer W is not cleaned, dirt on the uncleaned surface hardly adheres to and remains on the lower support pins 43 of the lower holding portion 27. Even if the back surface is cleaned and then supported by the lower support pins 43 of the relay portions 16 and 17 and then turned upside down, the dirt does not adhere to the cleaned back surface.
[0065]
The semiconductor wafer W whose front and back surfaces are cleaned is relayed by the upper support pins 35 of the upper holding portion 26 and then stored in the carry carriers 21c and 21d. That is, the semiconductor wafer W that has been cleaned by cleaning both the front and back surfaces is not supported by the lower support pins 43 to which the uncleaned semiconductor wafer W is relayed. Therefore, it is possible to prevent the contamination of the uncleaned semiconductor wafer W from being transferred to the cleaned semiconductor wafer W in the relay units 16 and 17.
[0066]
The relay portions 16 and 17 can be provided with a lower holding portion 27 and a reversing mechanism 28 for reversing the semiconductor wafer W at the same height position. When the semiconductor wafer W is reversed, the lower support pins of the lower holding portion 27 are provided. 43 can be used. Therefore, the height of the relay parts 16 and 17 can be reduced to reduce the size, and the configuration can be simplified.
[0067]
A first opening 24 is formed in the side wall facing the third delivery robot 18 in the casing 23 of the relay unit 16, 17, and the first opening 24 is formed on the side wall facing the first and second delivery robots 44, 5. Two openings 25 are formed.
[0068]
Therefore, since the first and second delivery robots 4 and 5 and the third delivery robot 18 can be arranged in the vertical direction with the relay units 16 and 17 interposed therebetween, the whole can be arranged compactly. .
[0069]
The first to third delivery robots 4, 5, and 18 include a lower hand 13 and an upper hand 14, and when the semiconductor wafer W that has not been cleaned is handled, the lower hand 13 is used to handle the semiconductor wafer W that has been cleaned. Sometimes it was done with the upper hand 14.
[0070]
Therefore, it is possible to prevent the dirt on the lower hand 13 from being transferred to the semiconductor wafer W that has been cleaned. That is, by transferring the unprocessed semiconductor wafer W with the lower hand 13, even if the lower hand 13 becomes dirty, it is possible to prevent the dirt from being transferred to the semiconductor wafer W that has been cleaned and transferred by the upper hand 14. .
[0071]
The present invention can be variously modified. For example, the number of processing units, the number of delivery robots of the first delivery means, and the number of relay units are not limited, and these may be at least one or more. In addition, the number of delivery robots of the second delivery means is not limited to one, and there may be a plurality of delivery robots. In the case of a plurality of delivery robots, traveling in the direction in which a plurality of carriers are juxtaposed as in the above embodiment. It is possible to cope even if it is not.
[0072]
Further, the supply unit and the carry-out unit are not limited to the carrier, and a transfer conveyor or the like may be used. In short, an unprocessed semiconductor wafer can be supplied to the relay unit, and the cleaned semiconductor wafer is stored and stored in the next process. Any material can be used as long as it can be conveyed.
[0073]
The substrate is not limited to a semiconductor wafer, and the present invention can be applied to a glass substrate constituting a liquid crystal display panel. Furthermore, the process in the processing unit is not limited to the cleaning process, and may be a process using a chemical solution.
[0074]
【The invention's effect】
As described above, according to the present invention, the substrate that has not been processed is held at the first position, the substrate that has been processed is held at the second position above the first position, and the first By reversing the substrate held at the position, both the front and back surfaces of the substrate were processed.
[0075]
For this reason, even if dirt is removed when the substrate is inverted, the dirt can be prevented from adhering to a clean substrate that has been processed, so that both the front and back surfaces of the substrate can be treated cleanly.
[Brief description of the drawings]
FIG. 1 is a plan view showing a schematic configuration of an arrangement state of processing apparatuses according to an embodiment of the present invention.
FIG. 2 is a side view of a delivery robot.
FIG. 3 is a plan view of a delivery robot.
FIG. 4 is a perspective view of a relay unit.
FIG. 5 is a front view showing only the reversing mechanism with the upper and lower holding portions of the relay portion removed.
FIG. 6 is a side view of a relay unit.
FIG. 7 is a front view showing the upper holding part and the lower holding part by removing the reversing mechanism of the relay part.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1a-1d ... Processing part, 4 ... 1st delivery robot, 5 ... 2nd delivery robot, 16 ... 1st relay part, 17 ... 2nd relay part, 18 ... 3rd delivery robot, 21a, 21b ... Carrier (supply part), 21c, 21d ... Carrier (unloading part), 23 ... Housing, 24 ... First opening, 25 ... Second opening, 26 ... Upper holding part, 27 ... Lower holding part, 28 ... reversing mechanism, 35 ... upper support pin, 43 ... lower support pin, 45 ... clamping member.

Claims (2)

A processing unit for processing a substrate;
A supply carry-out unit in which an unprocessed substrate is stored and a substrate that has been processed in the processing unit is stored;
A first delivery means for supplying an unprocessed substrate to the processing unit and taking out a substrate processed by the processing unit;
A second delivery means for taking out an unprocessed substrate from the supply / unloading unit and storing the substrate that has been processed in the processing unit in the supply / unloading unit;
Of the substrates that are provided between the first delivery means and the second delivery means and are delivered between the delivery means, a lower holding unit that holds a substrate that has not been processed, and a substrate that has been processed. An upper holding part to hold and a relay part provided with a reversing mechanism for inverting the substrate held by the lower holding part ;
The lower holding portion has two sets of lower support pins that engage with the peripheral edge of the substrate, and the two sets of lower support pins are provided so as to be driven away from the state of supporting the substrate,
The reversing mechanism has a pair of clamping members that are driven in a contacting and separating direction and a rotating direction,
The clamping member is driven in the approaching direction with the substrate supported by the lower support pins to hold both ends along the radial direction of the substrate, and when the support state of the substrate by the support pins is released An apparatus for processing a substrate, wherein the substrate is inverted by being rotated .   The relay portion has a housing, a first opening is formed in a side wall of the housing facing the first delivery means, and the first opening is formed on a side wall of the housing facing the second delivery means. A second opening is formed at a position corresponding to the opening, and the upper holding portion and the lower holding portion are provided to face the first and second openings. The substrate processing apparatus according to claim 1.

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